Abstract: A method for reversibly attaching plastic decorations or other articles to upright or horizontally disposed headstones is described. A commercially available adhesive putty has been found to be effective for attaching polymer composite resin-encapsulated decorations or articles to granite, marble and bronze areas on headstones, or to any other stone material used in headstone manufacture, located out of doors and exposed to snow, rain, hail, wind, and sun, at temperatures exceeding 100° F. as well as at subzero temperatures, whereas removal of the decoration or article for headstone maintenance, replacement or substitution, as examples, will not mar or otherwise damage the surfaces. The adhesive putty may be reworked and reused subsequent to removal of the article from the headstone.

Abstract: The invention relates to a protective coating for a mechanically stabile, in particular mineral and/or metallic base, comprising an inorganic polysilicate-cohesion adhesive layer which is uniformly distributed, essentially, on the base. A coating made of a glass film material having a thickness of less than 2 mm, preferably, less than 0.3 mm, is applied to the polysilicate cohesion adhesive layer prior to the hardening thereof, which covers the polysilicate-cohesion adhesive layer. According to the method for producing the protective coating, initially, the inorganic polysilicate-cohesion adhesive and the glass film material are prepared, then the cohesion adhesive is applied to the base which is to be coated and/or one side of the glass film material, and the glass film material is applied to the base which is to be coated prior to hardening of the polysilicate-cohesion adhesion layer, such that the glass film material covers the cohesion adhesion layer. Subsequently, the cohesion adhesion layer is hardened.

Abstract: There is provided a bonding material composition for obtaining a joined body by unitarily joining two or more members to be joined by means of a bonding material layer, wherein the bonding material composition contains flat particles, non-flat particles, smectite-based clay, and an inorganic adhesive as main components. The bonding material composition costs little, can relax thermal stress generated in the joined body without using fibers which may do harm to a human body, and can reduce defects such as a crack and a void upon drying or a thermal treatment.

Abstract: The present invention discloses a polymeric resin-based veneer laminating system, associated article and method for producing, for maintaining a mating edge profile of top and edge applied laminates secured to a rigid substrate material, and without compromise to fit and finish in response to temperature and humidity variations existing between the materials. A first (typically PVA) adhesive is applied between the top laminate and associated top surface of the substratum according to a first application, a second adhesive (typically EVA) being applied to the adjoining side surface of the substratum and prior to application of the edgeband according to a further expedited heat and/or pressure application.

Abstract: A covering apparatus (10) includes a cutter (12), an applicator (14) and a continuous length of removable cover material (16). The cutter (12) is adapted to cut off a discrete section (50) of cover material, and the applicator (14) applies the discrete section (50) to a printed media/ticket substrate (52). The covering apparatus (10) may be mounted adjacent to a printer (108) and creates a complete, covered ticket in response to a ticket substrate (52) being ejected from the printer (108) into the covering apparatus.

Abstract: An adhesive is provided for bonding to a first surface, a second surface or both. The adhesive typically includes a foam tape with a curable resin.

Abstract: The present invention encompasses a leaf packet useful in forming a spiral filtration module, wherein the fold area of the leaf packet is reinforced with a UV cured adhesive. The invention further encompasses a spiral filtration module wherein the fold line, side seams and/or axial seams of the membranes utilized in the module are reinforced with a UV curable adhesive. The present invention further encompasses the method for making such leaf packet and such spiral filtration modules.

Abstract: A method is disclosed for manufacturing a multi-part component that dampens vibration and noise caused by forces acting on the component. A pre-formed first part is treated for application of a resilient material. The material is dissolved in a solvent and is selectively applied to areas of the first part that are subject to strong forces. A second part is mechanically attached to the first part, and the entire component is cured so that the resilient material is cured, the solvent is evaporated and the parts are bonded together.

Abstract: The invention relates to a textile label in which the chip (5) of the transponder arrangement is completely embedded in adhesive, which not only provides the connection to the textile base layer (2) and to a similarly textile top label (7), or to the piece of clothing itself, but also provides a highly effective sealing. The adhesive of the adhesive layers (3, 4) is well-absorbed into the tissue structure by the textile base layer (2) and optionally into the further textile layers to give a flexible and resistant material composite which does not tend to delaminate or warp under mechanical, thermal and/or chemical stress. It is of advantage with regard to the long-life and reliability of the transponder arrangement to seal the same completely with adhesive, in other words, not just the chip (5).

Abstract: A photovoltaic module includes an encapsulated photovoltaic element and an infrared transmissive decorative overlay simulating conventional roofing.

Abstract: Assemblies or structures of carbon foam pieces connected with carbon char and methods for preparing such assemblies or structures are described. In certain embodiments an assembly may include two or more pieces of carbon foam bonded together by carbon char. The carbon char is derived from a carbonizable binder. A carbon foam assembly may be prepared by bonding at least one piece of carbon foam to at least one other piece of carbon foam with a carbonizable binder to provide an initial carbon foam assembly, and carbonizing the carbonizable binder of the initial carbon foam assembly to produce a carbon char and provide a carbon foam assembly.

Abstract: A method for preventing osmotic blistering in spirally-wound elements of semipermeable membrane sheet material (14) by applying an effective coating of a sealant (41, 43, 45) to the upstream surface of such membrane material in regions where such potential for blistering exists and thereby preventing the permeation of liquid into the surface of the semipermeable membrane in these regions.

Abstract: The present invention provides an electroconductive adhesive having a heme protein mixed in a very small amount thereby exhibiting electrical conductivity without deteriorating adhesion, which is used on the surface of electronic parts or a label thereby preventing and eliminating static electricity and improving the efficiency of heat dissipation, as well as an adhesive article using the same. A heme protein having a porphyrin complex whose iron ion is divalent is added to an adhesive to confer electrical conductivity. At least one member selected from an electroconductive polymer, an electrolytic metal, and a pigment molecule is mixed with the resultant electroconductive adhesive.

Abstract: A pressure-sensitive self-adhesive composition capable of compensating for substrate unevennesses comprises a base adhesive and an additive, wherein the additive is a microparticulate additive which is insoluble in the base adhesive, does not crosslink with the base adhesive and has a bulk density in the range from 0.05 g/cm3 to 0.25 g/cm3 and an averaged particle diameter in the micrometer range. Adhesive coatings and self-adhesive sheet structures formed from the pressure-sensitive self-adhesive composition are also disclosed.

Abstract: The invention seals, unseals and/or bonds plastics, waxes and resins via a thermal metal strip or wire coated with liquefiable substances that melt to open or separate and cool to congeal, seal, vulcanize or bond together when the wire or strip is energized in a shorted state (to heat) or not energized (to cool). Electronic switch modalities and sealing applications are optionally taught for security and tamper detection. In one modality, a unique signal is sent to the gate leg of a micro-processing chip (e.g. an SCR switch) where firmware recognizes the signal and permits current through a thermal wire. This innovation is optionally employed for Homeland Security.

Abstract: Hydrogenated triglycerides having melting temperature above about 50° C. are substituted for paraffin as a coating material for the surface of paper products and the resulting paper products have improved wet strength and moisture resistance in addition to being repulpable thereby providing a distinct environmental advantage over paraffin coated products.

Abstract: A cold seal adhesive comprising a multi-stage polymer having a low-Tg first stage and a high-Tg second stage.

Abstract: An electromagnetic-wave shielding and light transmitting plate 1 having an antireflection film 3, an electromagnetic-wave shielding film 10, a transparent substrate 2, and a near-infrared ray blocking film 5, laminated and united by using intermediate adhesive layers 4A, 4B and a pressure-sensitive adhesive 4C, the peripheries thereof covered by a conductive sticky tape 7. The film 10 has a conductive foil 11 formed by pattern etching on a substrate film 13, is processed for antireflection by forming a light absorbing layer 12 on the conductive foil 11, and is subjected to matting to form small irregularities by roughening the surface of the light absorbing layer 12. A display panel is manufactured by bonding this film 10 to the front surface of a plasma display panel body.

Abstract: A method of producing a retro-reflective heat transfer film includes heat-joining a PET release film and a transparent TPU sheet; forming a sticky-adhesive layer or a hot melt adhesive layer on the surface of the transparent TPU sheet; fixing glass beads made of beads with a refractive index of 2.2 to the semi-finished sheet; coating a thin film of transparent resin on the surface of the glass beads, and then forming an aluminum vacuum-coating layer on the coated thin film and forming a reflective resin layer transparent, colored or with graphics on the surface of the aluminum vacuum-coating layer and then producing a transfer sheet by forming a transparent hot melt resin layer on the surface of the reflective resin layer of the semi-finished sheet subject.

Abstract: The invention provides a curable composition for a heat conductive material, having an excellent durability, a satisfactory heat conductive property and a high productivity with easily controllable surface tackiness, a heat conductive material obtained from such curable composition and a method for controlling the surface tackiness of the composition after curing. The curable composition for the heat conductive material is formed by a curable composition of heat curable type based on crosslinking by a hydrosilylation reaction and including a saturated hydrocarbon polymer containing at least an alkenyl group in a molecule, a curing agent containing at least two hydrosilyl groups in a molecule and a hydrosilylation catalyst, to which a heat conductive filler is incorporated, thereby providing a flexible elastomer with a satisfactory heat conductivity and with an easily controllable surface tackiness.

Abstract: The present invention is a laminate comprising at least one layer of an polyallylamine-based coating that is and in direct contact with at least one other polymeric layer.

Abstract: Nanofibrous articles can be manufactured by a process that includes preparation of a surface of a substrate to provide an adhesion mechanism for securing the nanofibers to the surface. The nanofibers can be dispersed in an area near the substrate for the purpose of being adhered to the surface. If an ordered arrangement of nanofibers is required, an electric field can be provided in the area where the nanofibers are dispersed to selectively control an ordering of the nanofibers as they are adhered to the surface by the adhesion mechanism.

Abstract: A method of preparing an IC card, which comprises a first sheet material and a second sheet material and an adhesive agent layer between the first sheet material and the second sheet material, the adhesive agent layer having therein an IC module fixed with a moisture hardenable adhesive agent, the method comprising: a pasting step to paste the first sheet material and the second sheet material while providing the IC module between the first sheet material and the second sheet material with the moisture hardenable adhesive agent to form a pasted sheet; a first storing step to store the pasted sheet under a temperature of 10 to 30° C. and a relative humidity of 20 to 80%; and a second storing step to store the pasted sheet under a temperature of 20 to 50° C. and a relative humidity of 40 to 100% after the first storing step.

Abstract: A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.

Abstract: An article comprises a semiconductor substrate and a coating mixture on the semiconductor substrate. The coating mixture Is comprised of adhesion promoter and photopolymer. The adhesion promoter contains ?-amino propyltriethoxysilane in organic solution.

Abstract: The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.

Abstract: The present invention relates to a method of producing a fiber board characterized in that it comprises the following processes (a)–(f): (a) a separating process of a bast portion, (b) a fiberizing process by defibrating the bast portion of the kenaf, (c) a preparing process of a mat comprising the kenaf fibers having an average length of 10–200 mm and an average diameter of 10–300 ?m, (d) a supplying process of an adhesive agent into the fiber mat, (e) a drying process of the adhesive agent, and (f) a molding process by heating said fiber mat under pressure to form a fiber board having a density of 600–900 kg/m3.

Abstract: The present invention is directed to reducing the build up or accretion of adhesive, alone or in combination with other materials, on the surfaces of equipment used to ultrasonically treat a workpiece (e.g., ultrasonically bonding various components or pieces to one another.) Thus the invention encompasses composites, absorbent products, and methods of making said composites and products where an adhesive composition having certain identified properties is used to reduce the build up or accretion of the adhesive on ultrasonic bonding equipment. In one embodiment of the invention, a composite includes an adhesive having a capillary-viscosity value of about 7 Pas·sec or greater and a Shore-OO-Hardness value of about 65 or greater, whereby the relative accretion value is less than about 1, and more particularly less than about 0.5.

Abstract: A multiple layer fiber reinforced material and method of constructing the same including the provision of a first layer of a roll lofted glass material. Optional variants include the pre-application of plywood, OSB or fiber reinforced cement board materials prior to the first glass layer. A layer of a rolled fiber reinforced material is applied over the rolled glass material, with or without backing board material, and at least a second layer of the roll lofted glass material is applied over the rolled fiber reinforced material. A layer of a second rolled glass material is applied over the subsequent layer of the first glass material and a urethane resin syrup is intermixed with said layers of glass material and the fiber reinforced material. An application of heat and pressure results in the formation of the reinforced material. A flexural, closed cell foam material may also be applied to provide acoustical insulating properties to the multi-layer fiber material.

Abstract: There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 ?m, and the specular gloss was made to be 250 or more when the incident angle is 60°.

Abstract: A method is provided for preserving a perishable product contained in a sealed package. The package is adapted for being opened by a consumer to access the product and subsequently re-closed by the consumer for further storage of unused product remaining in the package. The method includes the step of, using a handheld applicator, applying a releasable contact adhesive to an area of the package adjacent to an opening therein formed by the consumer. The package is then folded at the opening such that a portion of the package contacts the adhesive to temporarily re-close the opening, thereby preserving the unused product inside the package.

Abstract: A structure made of a fluoropolymer layer and directly attached to one of its sides a tie layer based on a polyamide which results from the condensation of at least one diacid and at least one diamine of the following formula (1): in which R1 represents H or -Z1-NH2 and Z1 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms and R2 represents H or -Z2-NH2 and Z2 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms, it being possible for R1 and R2 to be identical or different. The tie resin may also be a copolymer having polyamide blocks and polyether blocks, the polyamide blocks resulting from condensation of at least one diacid and at least one diamine of formula (1). The invention also relates to a structure comprising a fluoropolymer layer, the tie layer and a substrate layer, respectively, as well as to a structure comprising a tie layer, respectively.

Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.

Abstract: In order to provide a high temperature resistant adhesive based on water glass which is particularly suited for sticking metal substrates and which remains gas-tight and does not lose its electrical insulating properties even at high operational temperatures, it is proposed that the adhesive should comprise an additive in the form of boron nitride.

Abstract: In a paper/film composite structure, the film is made of a low substituted cellulose ether having a molar degree of substitution with alkyl and/or hydroxyalkyl groups in the range of 0.05 to 1.3. The paper/film composite structure can be delivered to the waste paper recycling process without previously removing the film portion. The strength of film is increased without adding to the manufacturing cost. The paper/film composite structure is inexpensive and eliminates the risk of film rupture during the working, transporting and use stages.

Abstract: The invention is a paper/plastic laminate suitable for use in office, midrange and high-speed traditional laser and digital copiers and digital printers, and other like equipment using heat set fuser toner adhesion as the method for fusing/bonding an ink to a paper. The paper/plastic laminate comprises a paper web laminated to a plastic film using 100% solids, or solventless, adhesives. The plastic film includes at least one printed image thereon. Employing solventless adhesive technology in the laminating process yields a more dimensionally stable paper/plastic laminate when the laminate is re-exposed to heat and the ability to make lighter paper/plastic laminates than otherwise possible using solvated or waterborne adhesives.

Abstract: A laminate composite that includes a phosphoric acid anodized metal layer that includes an anodic film of from between about 0.005 mils to about 0.015 mils thick as measured through standard acid dissolution testing; an adhesive layer; a top layer adhered to the metal layer at least in part by the adhesive layer; and wherein the metal includes a metal chosen from the group that includes an aluminum and an aluminum alloy.

Abstract: The present invention provides a heat-sealable polyester composition having an amorphous processing window ranging from a Tg in the range of about 40° C. to about 70° C., to a Tcg in the range of about 70° C. to about 150° C. The composition preferably contains a mixture of poly(ethylene terephthalate) homopolymer or copolymer and poly(trimethylene terephthalate) homopolymer or copolymer, either as a physical blend or as a copolyester oligomer or polymer prepared from the respective monomers. The resulting composition is heat-sealable at low temperatures, retains barrier properties and is non-flavor-scalping.

Abstract: A method for manufacturing an inkjet head, which jets, by shear deformation of a partition wall, an ink in an ink flow path. The method includes the steps of: forming a metal electrode on a surface of the partition wall; coating an adhesive agent on the cover board; superposing the cover board onto an upper end surface of the partition wall under a condition wherein the hardness of the adhesive agent is not less than 105 dyne/cm2, so that the ink flow path is formed with the partition wall and the cover plate; and pressing the channel board and the cover board under the hardness condition wherein the hardness of the adhesive agent is not less than 105 dyne/cm2 and not greater than 109 dyne/cm2.

Abstract: We have found a novel spray-on adhesive composition made from components including a high melt index polymer and a high melt tackifier that interact to produce a composition that can form a low odor, light color, non-tacky, hot melt adhesive material that can be used in disposable article manufacture. The adhesive is thermally stable at hot melt application conditions, is low in cost, is easily applied and produces high quality disposable articles.

Abstract: This invention relates to a method of manufacturing a thermal laminate by laminating a first substrate film layer and a second substrate film layer through an adhesive resin layer, which comprises

Abstract: The present invention relates to activatable webs having fibrous substrates coated with activatable adhesive and methods of forming the webs into articles by indirectly activating the adhesive using microwave energy. The activatable web may further include a protective coating of a material that is compatible with the adhesive. One or more activatable webs can be formed into the shape of an article such as by wrapping the activatable webs around a mandrel. The activatable webs can be subjected to microwave energy shortly before being formed into the shape of the article or while they are held in the appropriate shape. The microwave energy is absorbed by moisture retained within the fibrous substrate, which becomes heated. The heated moisture activates the adhesive, causing it to bond to any webs in which the activatable web has been brought into contact and to stiffen.

Abstract: The present invention relates to silane adducts having a relatively higher adhesive strength as expressed formula X3SiR1, and manufacturing method thereof. wherein X is a hydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolic, and R1 is selected from one of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-[2-(2-aminoethylamino)ethylamino]propyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N, N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.

Abstract: Disclosed are composite structures prepared using a hemicellulose-based adhesive. In a preferred embodiment, a laminate composed of plural laminae which have been bonded to one another using a hemicellulose-based adhesive is provided. The laminate is useful as a separator or partition in a shipping vessel. Most preferably, the hemicellulose-based adhesive contains one or more bonding agents and water., the hemicellulose being present in an amount of at least 10% by dry basis weight of the bonding agents.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: A hollow core composite assembly 10 is provided, including a hollow core base 12 having an open core surface 14, a polyetherketoneketone film 22 applied to the hollow core base 12, and an adhesive layer 24 positioned between the polyetherketoneketone film 22 and the open core surface 14. The resultant hollow core composite assembly 10 can be cured to provide a structure suitable for use within a liquid molding process.

Abstract: A hermetic package having connectors, such as optical fibers or electrical leads, connected and bonded thereto with a bonding material such as epoxy resin, has the bonding material coated with a single layer or multiple layers of sealing material, such as chromium, copper, gold, tungsten, titanium, nickel, or aluminum, to prevent outgased material from the bonding material from entering the hermetic package enclosure. The bonding material may be recessed prior to coating of the sealing material to permit the sealing material to be polished from the optical element and the optical element polished flush with the inside of the package while leaving the sealing material covering the bonding material.

Abstract: The present invention encompasses a leaf packet useful in forming a spiral filtration module, wherein the fold area of the leaf packet is reinforced with a UV cured adhesive. The invention further encompasses a spiral filtration module wherein the fold line, side seams and/or axial seams of the membranes utilized in the module are reinforced with a UV curable adhesive. The present invention further encompasses the method for making such leaf packet and such spiral filtration modules.

Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.

Abstract: The invention provides bonding compositions and reactive two-part bonding compositions that are useful, for example, in bonding low surface energy substrates (e.g., polyethylene, polypropylene and polytetrafluoroethylene). Bonding compositions of the invention include an organoborane, a polymerizable monomer, and a metal salt which modifies the cure kinetics of the bonding composition to provide a favorable balance of long bonding composition worklife and fast rate of strength build.