Particular Adhesive Patents (Class 156/325)
  • Publication number: 20040074598
    Abstract: The present invention provides a method of bonding an adherend to a substrate
    Type: Application
    Filed: February 10, 2003
    Publication date: April 22, 2004
    Inventors: Katsuhiro Ando, Junji Takase, Fumio Kawakubo
  • Patent number: 6699341
    Abstract: A method for fabricating composite light-weighted glass ceramics, suitable for use as, e.g. mirror blanks or microlithography stages, at low temperatures is disclosed. Component pieces are polished then joined at low temperature using a silicate-containing joining liquid. Assembly is then performed in such a way that the joining liquid forms an interface between each component. After a period of low or slightly elevated temperature curing, rigid joints are formed throughout and the composite is dimensionally, vibrationally, and temperature stable and can withstand tensile stresses >4000 psi. The room-temperature cured composite can be heat treated using a slow, systematic temperature increase to dehydrate the joints. A sealing coating may optionally be provided to prevent excess dried joining liquid from flaking off the formed joint.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: March 2, 2004
    Assignee: Schott Glas
    Inventors: Samuel David Conzone, Alexander J. Marker, III
  • Patent number: 6676795
    Abstract: A method of preparing a bonded assembly of two substrates at least one of which is transparent or translucent to UV or visible light, comprises a) applying, to at least one of the substrates, a photo/anaerobic dual cure composition comprising: i) a (meth)acrylate-capped urethane oligomer, ii) at least one (meth)acrylate diluent monomer, iii) an anaerobic curing system, and iv) a free-radical photoinitiator; b) joining the two substrates c) irradiating the adhesive through said transparent or translucent substrates with light of a wavelength effective to activate the photoinitiator for a time sufficient to at least fixture the adhesive, and then d) allowing the assembly to further cure at ambient conditions without for at least 24 hrs without subjecting the fixtured assembly to substantial peel stresses.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: January 13, 2004
    Assignee: Henkel Loctite Corporation
    Inventor: Susan Levandoski
  • Patent number: 6670442
    Abstract: Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly-&agr;-olefins.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: December 30, 2003
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Angela Rossini, Francesco Meda
  • Publication number: 20030234074
    Abstract: A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which component B) commences softening is less than the curing temperature of component A). A thermal interface material is prepared by: 1) interposing the composition between an electronic component and a heat spreader to form a bondline, 2) heating the composition to a temperature higher than the temperature at which component B) commences softening but less than the curing temperature of component A) and optionally applying pressure to the composition, and 3) heating the composition to a temperature greater than or equal to the curing temperature of component A). The average particle size of component B) is greater than or equal to the bondline thickness.
    Type: Application
    Filed: June 25, 2002
    Publication date: December 25, 2003
    Inventor: Dorab Edul Bhagwagar
  • Publication number: 20030232956
    Abstract: A moisture-reactive hot-melt adhesive composition is provided. Particularly, a composition that includes a polyisocyanate and at least two polyols, one of which is a fatty polyol. Also provided is a method for bonding substrates using the adhesive.
    Type: Application
    Filed: May 15, 2003
    Publication date: December 18, 2003
    Inventor: Larry Frank Brinkman
  • Publication number: 20030221778
    Abstract: Aqueous polymer dispersions based on polychloroprene, and a process for their preparation and use. The aqueous polymer dispersions are produced from a polychloroprene dispersion having an average particle size of from 60 to 220 nm, and an aqueous silicon dioxide dispersion having an SiO2 particle diameter of from 1 to 400 nm.
    Type: Application
    Filed: May 29, 2003
    Publication date: December 4, 2003
    Inventors: Rudiger Musch, Knut Panskus, Dietrich Pantke
  • Patent number: 6652970
    Abstract: The present invention is directed toward compositions that are chemically different after application to a substrate as compared to the composition prior to its application. A method of the invention comprises a method of transitioning a crosslinked polymer composition from a first chemical state to a second chemical state. Advantageously, compositions of the invention are relatively stable after transformation to their altered, or second, chemical state.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: November 25, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Albert I. Everaerts, Charles M. Leir, Roger A. Mader, Peter A. Stark
  • Publication number: 20030209319
    Abstract: The present invention relates to a method of joining two or more pieces of wood based materials, comprising the steps of providing at least two pieces of wood based material; separately applying an adhesive composition (A), comprising a curable resin, and a composition (B), comprising a gel forming substance, onto at least one of said at least two pieces; joining the two pieces together to form an assembly having the compositions (A) and (B) situated between the pieces; pre-pressing the obtained assembly, with no curing of the resin; and then, hot-pressing the assembly to cure the resin. It also relates to wood based products made by the method.
    Type: Application
    Filed: February 6, 2003
    Publication date: November 13, 2003
    Inventor: David Almqvist
  • Patent number: 6646076
    Abstract: Disclosed are internally blocked borates useful for polymerizable compositions, and polymerizable adhesives made therewith. The internally blocked borates have general structures: wherein X represents —CHR6—, oxygen or sulfur; n is an integer; R1, R2, R3, R4, R5, and R6 are independently selected, for example, from unsubstituted and substituted C1-C10 alkyl, alkylene groups, or aryl groups, including other embodiments further defined, and M is a counter ion with positive charge m.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: November 11, 2003
    Assignee: Lord Corporation
    Inventors: Jonathan L. Kendall, Robin F. Righettini, Kirk J. Abbey
  • Patent number: 6632319
    Abstract: A process for producing a rubber-based composite material including steps of laminating a rubber compound onto a substrate, with a bonding layer of metal or metal compound interposed therebetween, and subsequently vulcanizing the rubber compound, characterized in that vulcanization is carried out by controlling the composition of the rubber compound and the amount of metal in the bonding layer such that the following equation is established: x−19≧y≧0.2x−12 wherein x is the amount (atom %) of metal in the bonding layer, and y is the slope (kgf·cm/min) of the vulcanization curve of the rubber compound. The rubber based composite material retains good bond strength even when used in such a way that its bond interface is in contact with water. In addition, it has good adhesion to a substrate treated by conversion treatment.
    Type: Grant
    Filed: April 10, 1998
    Date of Patent: October 14, 2003
    Assignee: Bridgestone Corporation
    Inventors: Masato Yoshikawa, Nobuko Kato
  • Patent number: 6622378
    Abstract: The invention relates to a handling module for at least one component (12) for mounting on and removal from a component carrier (14), having a holding device (22) which has at least one receptacle which is matched to the component (12), having a coil (42) which is arranged at an end of the holding device (22) which faces towards the component (22), is energized when the holding device (22) is being at least partially positioned with respect to the at least one component (12) and positions the at least one component (12) with respect to the holding device (22) by means of magnetic holding force.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: September 23, 2003
    Inventor: Helmut Fischer
  • Patent number: 6620282
    Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: September 16, 2003
    Assignee: Seiko Epson Corporation
    Inventors: Yoshiaki Mori, Yasutsugu Aoki, Takuya Miyakawa
  • Patent number: 6620488
    Abstract: A skin material which can be precisely and easily bonded to a cushion main body while preventing the working atmosphere from becoming worse due to solvent volatilization; a skinned cushion excellent in air permeability and cushioning properties in the seating area; and a process for producing the skinned cushion are described. The skin material comprises an air-permeable sheet and an adhesive layer formed on the back side of the sheet by applying a melt of a hot-melt adhesive in such a manner as to form scattering dots of the melt or to leave scattering uncoated dot areas and hardening the melt.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: September 16, 2003
    Assignee: Inoac Corporation
    Inventors: Tsunenori Oguri, Hiroshi Fujii, Tsutomu Yano
  • Publication number: 20030165305
    Abstract: An adhesive for bonding an optoelectronic device within a hermetically sealable package comprising a low outgassing adhesive selected to limit the outgassing of organic molecules in a cured state.
    Type: Application
    Filed: March 4, 2002
    Publication date: September 4, 2003
    Inventors: Joseph L. Dallas, Angelique X. Irvin, Robert W. Irvin, Ralph S. Jameson, William A. Mamakos
  • Patent number: 6610353
    Abstract: A spray method of applying liquid adhesive to surfaces of components of an electrochemical cell. The adhesive is applied by spraying through a nozzle, preferably activated by a piezoelectric transducer. The nozzle can be an elongated resilient tube terminating in an outlet opening. The adhesive is preferably sprayed in a pulsed stream of droplets. The liquid adhesive is desirably dispensed in fine droplets at a rate of between about 500 and 5000 droplets per second. The method is effective in applying adhesive to narrow width or difficult to reach surfaces of cell components in a precise, consistent and reproducible manner. In a specific application the adhesive can be applied to the narrow recessed step surrounding the terminal portion of the cathode casing of a zinc/air button cell. In such application the adhesive provides a tight seal between the cathode casing and cathode assembly, thereby preventing leakage of electrolyte from the cell.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: August 26, 2003
    Assignee: The Gillette Co.
    Inventors: Daniel W. Gibbons, Michael Kolb, Ilya Nizker, Leo White
  • Publication number: 20030154886
    Abstract: In order to provide a high temperature resistant adhesive based on water glass which is particularly suited for sticking metal substrates and which remains gas-tight and does not lose its electrical insulating properties even at high operational temperatures, it is proposed that the adhesive should comprise an additive in the form of boron nitride.
    Type: Application
    Filed: March 7, 2002
    Publication date: August 21, 2003
    Inventors: Thomas Anhorn, Peter Schenk, Hans-Rainer Zerfass
  • Patent number: 6607631
    Abstract: A polymerizable monomer adhesive composition includes a 1,1-disubstituted ethylene monomer and at least one slip additive, where the slip additive causes a polymer film formed from the monomer to have a lower coefficient of friction than in an absence of the slip additive. The slip additive can be selected from, inter alia, fluorinated monomers or polymers, fluorinated additives, siloxane-containing monomers or polymers, siloxane-containing additives, fluorinated siloxanes, and long chain fatty acid esters. The slip additive can also form a second phase in a resultant polymer film, where the second phase is soluble in the monomer but is insoluble or substantially insoluble in the polymer.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: August 19, 2003
    Assignee: Closure Medical Corporation
    Inventors: Ibraheem T. Badejo, Wendy Y. Su, Keith R. D'Alessio, Jerry Jonn, Julian A. Quintero, Michelle Knotts, Timothy P. Hickey, Lawrence H. Mainwaring, Upvan Narang
  • Patent number: 6599388
    Abstract: The invention concerns a method for making a binder, especially for mineral wool products comprising the steps of dissolving a particulate mineral material having a glassy amnorphous structure in an aqueous solution, nucleating and stabilizing the so obtained solution to form a sol having the desired particle size, and optionally adjusting the dry matter content of the sol. The invention also concerns a method for the production of a mineral wool product using the said binder for binding the fibers.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: July 29, 2003
    Assignee: Paroc Group Oy AB
    Inventors: Michael Perander, Bob Talling, Jean Le Bell
  • Patent number: 6586496
    Abstract: A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (A) a compound having oxetane ring, (B) a photoinitiator for cationic polymerization and (C) a silane coupling agent, wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: July 1, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yasushi Takamatsu, Kei Nagata, Masahiro Ota, Yasushi Mizuta, Yoshio Kikuta
  • Publication number: 20030102080
    Abstract: This invention discloses a method for labeling an item wherein a sheet of polymer film is adhered to the item with a layer of water-based adhesive. The invention also discloses a label that includes a sheet of polymer film and a water-based adhesive, and a package that includes an item and a label adhered to the item. The item can be a product container such as a beverage bottle. The polymer film has a water vapor transmission rate of at least about 100 gm/m2/24 hours, and is also less than about 10,000 gm/m2/24 hours. The polymer film is also ink receptive to printing. A particularly suitable polymer film is polylactide (PLA) polymer 4040D. The sheet of polymer film has a thickness from about 0.001 to about 0.003 inches and is substantially transparent. The water-based adhesive can be a natural or synthetic adhesive, and can further include a contact sublayer and a tie sublayer.
    Type: Application
    Filed: September 20, 2002
    Publication date: June 5, 2003
    Inventor: Donald W. Mallik
  • Publication number: 20030087569
    Abstract: An ultraviolet-resistant laminate includes a first substrate, a second substrate, and adhesive including an uncompounded amorphous polyolefin polymer. The adhesive secures the first substrate to the second substrate so as to form a bond. The resulting laminate is resistant to ultraviolet exposure. A method of forming a laminate includes providing a first substrate, providing a second substrate, applying an adhesive including an uncompounded amorphous polyolefin polymer to at least one of the first substrate and the second substrate, and securing the first substrate to the second substrate with the adhesive so as to form a bond. The laminate produced is resistant to ultraviolet exposure. The laminate may be used in outdoor products, such as awnings, umbrellas, table cloths, tarpaulins, transportation packaging, signs, banners, coverings for outdoor furniture, and coverings for vehicles.
    Type: Application
    Filed: July 1, 2002
    Publication date: May 8, 2003
    Inventor: Philip Edward Harris
  • Patent number: 6558765
    Abstract: A fiber reinforced composite wood board is designed particularly for use in the flooring of truck trailers which experience adverse operating conditions such as from heavy loads of lift trucks on the top side and water spray during rainy periods on the bottom side. The composite wood board comprises an edge-glued laminated wood member composed of wood segments with end joints. The wood member is underlaid with a thin layer of fiber reinforced plastic. The top surface of the composite wood board is the same as that of the laminated wood. The fiber reinforced plastic underlay is composed of glass and/or carbon fibers embedded in a polymeric resin such as epoxy, phenolic, vinyl ester, polyester, polypropylene or polyamide resin. Further, the fiber reinforced plastic underlay is substantially bonded to the wood member with a reactive hotmelt adhesive.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: May 6, 2003
    Assignee: Havco Wood Products L.L.C.
    Inventor: Gopalkrishna Padmanabhan
  • Patent number: 6548176
    Abstract: A method of bonding substrates by hydroxide-catalyzed hydration/dehydration involves applying a bonding material to at least one surface to be bonded, and placing the at least one surface sufficiently close to another surface such that a bonding interface is formed between them. A bonding material of the invention comprises a source of hydroxide ions, and may optionally include a silicate component, a particulate filling material, and a property-modifying component. Bonding methods of the invention reliably and reproducibly provide bonds which are strong and precise, and which may be tailored according to a wide range of possible applications. Possible applications for bonding materials of the invention include: forming composite materials, coating substrates, forming laminate structures, assembly of precision optical components, and preparing objects of defined geometry and composition. Bonding materials and methods of preparing the same are also disclosed.
    Type: Grant
    Filed: June 4, 1999
    Date of Patent: April 15, 2003
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventor: Dz-Hung Gwo
  • Publication number: 20030047268
    Abstract: A method for repairing fuel tanks having detected leaks comprises (1) filling the detected leaks by applying an adhesive over the detected leaks and allowing the adhesive to cure to seal the detected leaks or (2) providing a fuel tank having a surface with detected leaks, providing a patch having a surface to be attached to the fuel tank surface having detected leaks, coating one or both surfaces with an adhesive, applying the patch over the detected leak(s) such that the adhesive is interposed between the patch surface and the tank surface, pressing the patch against the tank and allowing the adhesive to cure to bond the two surfaces together.
    Type: Application
    Filed: August 23, 2001
    Publication date: March 13, 2003
    Inventors: Gregory J. Korchnak, Kenneth J. Ritzema, Steven B. Swartzmiller
  • Publication number: 20030047278
    Abstract: A method for preparing compression molded or pressed lignocellulosic articles is disclosed. The method involves forming a binder resin by combining a polyisocyanate component with a parting agent and preferably a synergist. The parting agent is the reaction product of an isocyanate compound and an isocyanate-reactive compound of the general structure R—(ao)n—Y where: R is a hydrophobic group containing alkyl, alkaryl, polyaryl, or siloxane moieties; (ao) is an alkylene oxide or mixture of alkylene oxides; n is from 1 to 25; and Y represents a monofunctional isocyanate-reactive group. A resinated lignocellulosic mixture is formed by combining the binder resin with lignocellulosic particles. Then a compression molded or pressed lignocellulosic article is formed by compressing the resinated lignocellulosic mixture at an elevated temperature and under pressure.
    Type: Application
    Filed: August 20, 2002
    Publication date: March 13, 2003
    Applicant: BASF Corporation
    Inventors: Donald C. Mente, Li-Mei Lu, David D. Peters, Joe C. Wilson, Anthony G. Schaefer
  • Patent number: 6531209
    Abstract: A suspension adhesive comprised of a matrix material and a particulate filler material is useful for bonding, sealing, repairing, and modifying ceramic, glass, and powdered metal components in a light source. A method for making the suspension adhesive includes the selection of a filler material and a volume percentage of the filler material. Additionally, a matrix material is selected and the filler material is dispersed throughout the matrix material. The suspension adhesive is used to bond and seal components to form, for example, an arc tube for a light source.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: March 11, 2003
    Assignee: General Electric Company
    Inventors: Daniel Polis, Vishal Gauri
  • Patent number: 6524690
    Abstract: Disclosed is a process of forming a prepreg material having substantially no voids. According to the process of the invention, the reinforcing material is heated to a temperature above the temperature of the impregnating resin. The prepreg formed has substantially no voids and does not require lengthy consolidation when formed into useful articles.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: February 25, 2003
    Inventor: Joel A. Dyksterhouse
  • Publication number: 20030034127
    Abstract: The present invention provides a method of manufacturing a circuit board module for connecting a circuit conductor (2) of a first circuit board (1) to a circuit conductor (4) of a second circuit board (5) using at least one selected from the group consisting of an anisotropic conductive film (6), an anisotropic conductive paste and an adhesive resin, wherein a difference in a pattern width between the circuit conductor of the first circuit board and that of the second circuit board is in a range of 5 &mgr;m to 50 &mgr;m. In such a method of manufacturing a circuit board module, connection of a connecting conductor with a narrow pitch can be realized, and poor connection can be reduced, thus providing a method of manufacturing a circuit board module having higher reliability.
    Type: Application
    Filed: August 27, 2002
    Publication date: February 20, 2003
    Inventor: Shigetoshi Segawa
  • Patent number: 6517899
    Abstract: A composition and method for improving the adhesion properties of catalytic and adsorptive compositions to a substrate through the addition of clay and/or silicone binder is disclosed. Preferably, the composition includes manganese dioxide and attapulgite clay and/or a silicone polymer which is adhered to a metal substrate, such as a motor vehicle radiator.
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: February 11, 2003
    Assignee: Engelhard Corporation
    Inventors: Jeffrey B. Hoke, Ronald M. Heck
  • Publication number: 20030024640
    Abstract: Methods for securing wood members together are disclosed. The methods include the use of an adhesive that quickly cures without heating. Adhesives may be impingement sprayed or splattered onto a contact surface. The methods may be used to form high-strength bonds between wood and/or plastic members in short processing times.
    Type: Application
    Filed: March 12, 2001
    Publication date: February 6, 2003
    Inventor: David A. Hill
  • Publication number: 20030015285
    Abstract: A conductive polymer composition comprising 100 parts by weight of a crystalline polymer (A) and 5 to 150 parts by weight of a conductive powder (B) dispersed in the crystalline polymer (A) is disclosed. The crystalline polymer (A) shows crystal transition, thereby the conductive polymer composition exhibits PTC characteristics.
    Type: Application
    Filed: June 28, 2002
    Publication date: January 23, 2003
    Inventors: Yasumasa Iwamoto, Tadatoshi Aridomi, Yoichi Okubo
  • Publication number: 20030008092
    Abstract: Water-resistant fibrous air duct insulation products and methods for making such products. The products may include a duct board or a duct tube including a first layer of resin-bonded fibrous mat having a second layer of durable, preferably non-woven, facing material adhered thereto, wherein the facing material defines the air stream surface for the board or tube. The duct board or tube is preferably rendered water-repellent at the air stream surface by incorporating a hydrophobic agent into the adhesive used to adhere the second layer to the first layer.
    Type: Application
    Filed: August 14, 2002
    Publication date: January 9, 2003
    Inventors: Murray S. Toas, John O. Ruid
  • Publication number: 20030000624
    Abstract: A method is disclosed for temporarily bonding reinforcing sheet metal pieces or other metal pieces to a sheet metal blank for forming at an elevated temperature such as is employed in superplastic forming of suitable aluminum, magnesium, stainless steel or titanium alloys or the like. The pieces are bonded to the blank in locations in which the piece will acquire a desired shape from co-formation with the blank. Suitable water suspendible sodium silicate compositions, such as water glass bond the piece to the blank during high temperature forming and permit removal after forming.
    Type: Application
    Filed: June 29, 2001
    Publication date: January 2, 2003
    Inventors: Paul Edward Krajewski, Georg M. Barton
  • Patent number: 6461462
    Abstract: This invention relates to a method of manufacturing multilayer garments with the use of temporary fusible adhesives, wherein the adhesive has a molecular weight of less than 5000.
    Type: Grant
    Filed: February 3, 2000
    Date of Patent: October 8, 2002
    Assignee: William Clark & Sons Limited
    Inventors: Peter Thomas Judd, Robert Graffin McCord
  • Patent number: 6461504
    Abstract: In a fluid filter, magnetic filtration of ferrous particles is provided by an adhesive having magnetic properties which is placed within a filter assembly in either a structural or nonstructural capacity.
    Type: Grant
    Filed: May 9, 2000
    Date of Patent: October 8, 2002
    Assignee: Honeywell International Inc.
    Inventors: Jerry A. Bolser, Edmond H. Cote, Jr., Richard J. Berkey
  • Patent number: 6451155
    Abstract: A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.
    Type: Grant
    Filed: October 24, 1996
    Date of Patent: September 17, 2002
    Assignee: International Business Machines Corporation
    Inventors: Hilton T. Toy, David L. Edwards, Da-Yuan Shih, Ajay P. Giri
  • Patent number: 6451143
    Abstract: A method for manufacturing a highly productive key pad with rigid resin key top, wherein the key top adhesion surface 2, 6 of the key pad 1, 5 or a portion thereof is surface altered by at least one method selected from short wavelength UV irradiation treatment, corona discharge treatment, flame treatment and plasma treatment and can be adhered with reactive hardening resin 3, 7 such as urethane base resin, epoxy base resin, amino base resin, acrylic base resin, cyanoacrylate base resin and photo reactive hardening resin, thereby reducing adhesion operation time, without fear of dislocation during the adhesion.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: September 17, 2002
    Assignee: Polymatech Co., Ltd.
    Inventor: Kengo Nishi
  • Patent number: 6447626
    Abstract: A novel method for joining aluminum nitride-series substrates to each other is provided in the substantial absence of an intervening third layer at the joining interface between the substrates. In the method, the aluminum nitride-series substrates are joined to each other by interposing a joining agent between the substrates heating the substrates and the joining agent to a first temperature range of at least the melting point of the joining agent to melt the joining agent and liquefy particles of the aluminum nitride at the neighborhood of the interfaces between the melted joining agent and the substrates, and then heating the joining agent and the substrates to a temperature range higher than the temperature range of the first process but lower than the melting point of the substrates to exhaust the joining agent from between the substrates.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: September 10, 2002
    Assignee: NGK Insulators, Ltd.
    Inventor: Tsuneaki Ohashi
  • Patent number: 6440566
    Abstract: This invention relates to a method for molding or curing a resin material using a multilayer release film as a barrier at the surface of the resin material. In one embodiment, the method comprises the surface of the resin material being in contact with the release film at a temperature of at least about 350° F. (about 180° C.). Here, the release film is non-oriented and comprises: (1) an enhancement layer which comprises a thermoplastic material; and (2) a first release layer which has a composition that is different from the enhancement layer, comprises a polymeric material, and is releasable from the resin material after the resin material is molded or cured. This invention also relates to a release film that may be used, for example, with the above method.
    Type: Grant
    Filed: October 1, 1999
    Date of Patent: August 27, 2002
    Assignee: Airtech International, Inc.
    Inventors: John Maligie, Thomas Malter
  • Patent number: 6436223
    Abstract: A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: August 20, 2002
    Assignee: International Business Machines Corporation
    Inventors: David L. Edwards, Enrique C. Abreu, Ronald L. Hering, David C. Olson
  • Patent number: 6419783
    Abstract: A dual container wherein two chambers are secured together by at least two different adhering agents to maintain integrity over a range of temperatures. The adhering agents may be used to adhere other objects together as well. Preferably, the adhering agents are hot melts.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: July 16, 2002
    Assignee: Unilever Home & Personal Care USA
    Inventors: Dean Rainey, James Lynn Turbett
  • Publication number: 20020069964
    Abstract: A method for producing a bonded article composed of a first substrate, a second substrate, and a bonding layer through which the first and second substrates are bonded is disclosed. This method includes the steps of interposing a water-based bonding agent between the first and second substrates, and forming the bonding layer by heating the water-based bonding agent. The water-based bonding agent contains an alkali metal element, and has a water-soluble compound dissolved therein. The water-soluble compound produces a composite oxide by heating.
    Type: Application
    Filed: December 6, 2001
    Publication date: June 13, 2002
    Applicant: NGK Insulators, Ltd.
    Inventors: Ken-ichi Noda, Tatsuo Kawaguchi
  • Patent number: 6402869
    Abstract: The invention relates to a method of gluing veneers to form LVL and plywood boards from veneers laid one over the other in several layers by curing the adhesive placed between the single layers in a heated press. The invention consists in the fact that the gluing and pressing of the outer layers of a veneer pack to form LVL and plywood boards is performed by high-temperature adhesive and the inner layers by low-temperature adhesive, so that the amount of heat to be put into the veneer pack decreases from the outside in.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: June 11, 2002
    Assignee: Maschinenfabrik J. Dieffenbacher GmbH & Co.
    Inventor: Gernot von Haas
  • Publication number: 20020066519
    Abstract: A suspension adhesive comprised of a matrix material and a particulate filler material is useful for bonding, sealing, repairing, and modifying ceramic, glass, and powdered metal components. A method for making the suspension adhesive includes the selection of a filler material and a volume percentage of the filler material. Additionally, a matrix material is selected and the filler material is dispersed throughout the matrix material. The suspension adhesive is used to bond and seal components to form, for example, an arc tube for a light source.
    Type: Application
    Filed: December 1, 2000
    Publication date: June 6, 2002
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Daniel Polis, Vishal Gauri
  • Patent number: 6383655
    Abstract: Low odor polymerizable compositions comprise monomer blends having a average monomer fluorophilicity of at least 3.25, an average boiling point of at least about 160° C., and wherein the monomer blend is polymerizable to a polymer having a glass transition temperature of at least about −20° C. The polymerizable compositions are useful in kits further comprising an aerobic initiator. Also disclosed are bonding compositions, polymerized compositions, coated substrates, and methods of bonding in which the polymerizable compositions are especially useful.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: May 7, 2002
    Assignee: 3M Innovative Properties Company
    Inventor: Dean M. Moren
  • Patent number: 6358349
    Abstract: The bond strength between a pre-cured elastomeric member and a metal surface is increased by applying a phosphate coating to the metal surface. This is particularly suitable for use in formation of torsional vibration dampeners wherein an elastomeric member is compression fitted between an outer annular ring and a hub thereby decreasing slippage between the annular weight and the hub.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: March 19, 2002
    Assignee: Eagle-Picher Industries, Inc.
    Inventors: Bruce Christenson, Gary Veselica
  • Patent number: 6355358
    Abstract: A thermoplastic multilayer composite, and articles made therefrom, which has at least one layer I of a thermoplastic molding composition, at least one layer II of a further thermoplastic molding composition, bonded together with at least one layer of an adhesion promoter disposed between at least one layer I and at least one layer II. The adhesion promoter is at least 5% by weight of a graft copolymer prepared from 0.5 to 25% by weight, based on the total amount of graft copolymer, of a polyamine having at least 4 nitrogen atoms and having a number average molecular weight Mn of at least 146 g/mol, and polyamide-forming monomers selected from lactams, &ohgr;-aminocarboxylic acids, equimolar mixtures of diamines and dicarboxylic acids, and their mixtures.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: March 12, 2002
    Assignee: Degussa AG
    Inventors: Michael Böer, Guido Schmitz, Georg Oenbrink, Harald Häger, Ralf Richter
  • Publication number: 20020028327
    Abstract: A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.
    Type: Application
    Filed: July 23, 2001
    Publication date: March 7, 2002
    Inventors: Charles H. Perry, Mark G. Courtney, Lewis S. Goldman, Gregory R. Martin
  • Patent number: 6350344
    Abstract: Solvent-free and water-free radiation-curable primers based on hydroxy-functional prepolymers and cycloaliphatic epoxides or based on hydroxy-functional prepolymers and olefinically unsaturated compounds or based on epoxides and vinyl ethers together with cationic or free-radical initiators may be applied in the same manner as conventional commercial solvent-free laminating adhesives and, for many coatings, allow subsequent in-line coating without there being any need to evaporate solvent or water from the primer coating.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: February 26, 2002
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Hans-Georg Kinzelmann, Michael Drobnik