Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat Patents (Class 165/104.11)
  • Patent number: 6506317
    Abstract: A cooling medium and a cooling device for optical equipment using the same, which cooling medium has a refractive index in a specific range, hardly causes the problem to dissolve or swell plastic lens and other component parts, and is flame retardant. The cooling medium comprises a cyclic aliphatic hydrocarbon having at least one cross linkage and has a flash point of 120° C. or above and a melting point of −20° C. or below. The space between a pair of transparent optical members of a cooling device for optical equipment, is filled with the cooling medium.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: January 14, 2003
    Assignees: Nippon Petrochemicals Company, Limited, San-Petrochemicals Co., Ltd.
    Inventors: Hiroyuki Hoshino, Takashi Kiyota
  • Patent number: 6498899
    Abstract: A method of controlling a temperature of a semiconductor device during testing is used with a system including a heater and a heat sink and a temperature control system. The semiconductor device is thermally coupled to the heater, which is thermally coupled to a heat sink. The heat sink defines a chamber, and the chamber is adapted to have a liquid flowing through the chamber. The temperature control system is coupled to the heater and the heat sink. In the method, the temperature of the semiconductor device is moved to approximately a first set point temperature. The temperature of the semiconductor device is moved to approximately a second set point temperature, from approximately the first set point temperature, by changing a temperature of the heater and maintaining the liquid flowing into the chamber at a substantially constant temperature.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: December 24, 2002
    Assignee: Delta Design, Inc.
    Inventors: Mark F. Malinoski, Thomas P. Jones, Brian Annis, Jonathan E. Turner
  • Publication number: 20020144811
    Abstract: A heat transfer system is presented for managing thermal transients, thus providing engineers greater flexibility in designing thermal solutions for applications subject to transient heat-generation. A heat reservoir device for managing a heat input subject to transient conditions includes a heat transfer subsystem having a first end and a second end, where the first end is thermally coupled to the heat input; a heat storage subsystem coupled to the second end of the heat transfer subsystem, where the heat storage subsystem comprises a phase change material responsive to the transient conditions. The excess heat load during transient operation is temporarily absorbed by the latent heat of fusion when the phase change material changes its phase from solid to liquid. Subsequently, the absorbed heat can be released back to the ambient via a heat rejection subsystem. This allows engineers to design smaller heat sinks capable of accommodating given transient conditions.
    Type: Application
    Filed: January 23, 2002
    Publication date: October 10, 2002
    Inventors: Der Jeou Chou, Daniel Todd Nelson
  • Publication number: 20020124995
    Abstract: A heat pipe having a woven-wire wick and a straight fine-wire wick is disclosed. The heat pipe can be easily manufactured and improve a thermal performance of the heat pipe. The heat pipe includes a pipe container; a straight fine-wire wick located in the pipe container, wherein the straight fine-wire wick has a porosity; a woven-wire wick having a plurality of groups of wires spirally woven to form a substantially cylindrical wick, for contacting the straight fine-wire wick to an inner wall of the pipe container, wherein when the woven-wire wick is forced radially and inwardly in order for the woven-wire wick to be inserted into the pipe container, the woven-wire wick has restoration forces in a radial and outward direction from axis of the woven-wire wick and is tightly contact with the inner wall of the pipe container, and wherein ends of the straight fine-wire wick and the woven-wire wick are fixed to ends of the pipe container.
    Type: Application
    Filed: March 8, 2002
    Publication date: September 12, 2002
    Inventors: Seok-Hwan Moon, Ho Gyeong Yun, Gunn Hwang, Tae Goo Choy, Joong Moo Park
  • Publication number: 20020121359
    Abstract: The invention relates to a method of installing a heat source on a micro heat pipe module and to a micro heat pipe module. The micro heat pipe module (1) has micro heat pipes (3) for dissipating the thermal energy generated by the heat source (2) generating thermal energy, and the micro heat pipe module (1) has a side (4) on which the heat source (2) generating thermal energy is installed. The side (4) of the micro heat pipe module (1), on which the heat source (2) generating thermal energy is installed, is coated with a coating (5) made of a heat conducting material, which coating (5) is arranged to conduct the heat generated by the heat source (2) generating thermal energy away from the heat source (2) generating thermal energy along said side (4) of the micro heat pipe module (1) and to the micro heat pipe module (1).
    Type: Application
    Filed: December 27, 2001
    Publication date: September 5, 2002
    Inventors: Timo Heikkila, Carl Kabrell, Reijo Lehtiniemi, Jukka Rantala
  • Publication number: 20020117292
    Abstract: The invention relates to an arrangement for dissipating thermal energy generated by a heat source (1), which arrangement comprises a heat conductor element (2) for conducting thermal energy generated by the heat source (1) away from the heat source (1), the heat conductor element (2) having at least one micro heat pipe module (3) attached to it for distributing thermal energy generated by the heat source (1) in the heat conductor element (2). The heat source (1) is attached to an element (4) which is made of a heat conducting material and which is in thermal contact with the heat conductor element (2) and which is arranged to conduct thermal energy from the heat source (1) to the heat conductor element (2) by means of the heat conducting ability of said heat conducting material.
    Type: Application
    Filed: December 27, 2001
    Publication date: August 29, 2002
    Inventors: Timo Heikkila, Reijo Lehtiniemi, Carl Kabrell, Jukka Rantala
  • Publication number: 20020112847
    Abstract: In a cooling device for a heat source according to the present invention, header is arranged on the downstream side of an inlet port i.e. on the side of holes opposite to that of the heat source, a heat source is arranged on the outside face of a heat sink and holes are provided that spray fluid towards the back face of the heat sink, outlet ports being provided fewer than the number of holes. Thanks to the arrangement of header on the side of holes opposite to that of the heat source, no large differences are generated in the flow rate of the holes; thus, the heat conduction rate when the flow from holes collides with the back face of the heat sink is practically uniform and the cooling performance of the heat sink, with which the flow collides, at the back of the heat source is practically uniform.
    Type: Application
    Filed: February 8, 2002
    Publication date: August 22, 2002
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Takafumi Nakahama
  • Publication number: 20020079090
    Abstract: A cooling body-conductor strips arrangement for electrical devices has a cooling body for withdrawing heat to a surrounding area, a base plate composed of an electrically insulating material and provided with a first conductor strip unit which is embedded in the material of the base plate, the base plate being flatly connected with the cooling body.
    Type: Application
    Filed: November 9, 2001
    Publication date: June 27, 2002
    Inventors: Henning Stilke, Thomas Bilsing
  • Patent number: 6408633
    Abstract: Efficient apparatus and methods are disclosed for interfacing active thermal stores, or cooling loops, to a secondary water loop for decreasing the temperature of an airflow by providing a continuously regenerating water loop that directs chilled water onto a thermally conductive heat exchanger, said loop further comprising supplying water for the loop by collecting water from the heat exchanger.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: June 25, 2002
    Assignee: Instatherm Company
    Inventor: Peter Carr
  • Publication number: 20020074106
    Abstract: The invention relates to a method for controlling a total energy apparatus comprising a high-pressure vapor reservoir and a condenser reservoir provided with a heat exchanger. The high-pressure vapor reservoir is connected via a first fluid connection with the condenser reservoir.
    Type: Application
    Filed: December 17, 2001
    Publication date: June 20, 2002
    Inventor: Geuko van der Veen
  • Patent number: 6402982
    Abstract: A phase change composition is provided which includes a nucleating agent to reduce supercooling of the composition. The phase change composition may comprise a eutectic mixture of water and sodium chloride. The nucleating agent may comprise calcium oxide, calcium hydroxide, or pentaerythritol. The phase change composition may also include silica particles such that it is provided in the form of a gel or powder. The phase change composition may be used in a variety of applications including thermal shipping containers.
    Type: Grant
    Filed: April 2, 2001
    Date of Patent: June 11, 2002
    Assignee: Energy Storage Technologies Inc.
    Inventor: Ival O. Salyer
  • Patent number: 6370908
    Abstract: A low-cost and thermodynamically efficient implementation of a two-stage refrigeration system applied to a retail refrigerator. The invention includes a simple and easily manufactured thermally efficient and low-cost evaporation unit. The invention further includes a thermal energy storage module and an energy efficient control protocol to maintain steady temperatures in the fresh and frozen food sections, to permit energy efficient defrosting of the heat exchange surfaces in the freezer section, and minimize losses associated with condensing unit on-and-off cycling.
    Type: Grant
    Filed: January 6, 2000
    Date of Patent: April 16, 2002
    Assignee: TES Technology, Inc.
    Inventor: Timothy W. James
  • Publication number: 20020020518
    Abstract: A supportive wick structure of a planar heat pipe is provided having two panels and a supportive body with a plurality of low guides and through holes. The supportive body provides flow channels for a working fluid of the heat pipe in two directions. The flow guides formed by flow guide projections enhance structural strength and provide channels for the working fluid.
    Type: Application
    Filed: October 24, 2001
    Publication date: February 21, 2002
    Inventor: Jia Hao Li
  • Patent number: 6279354
    Abstract: A cooler of an optical fiber draw tower, situated below a melting furnace for melting a preform for an optical fiber, for cooling the optical fiber drawn from the preform melted in the melting furnace, includes at least one heat exchanger installed with a predetermined length surrounding the optical fiber drawn from the melting furnace, for cooling the drawn optical fiber. The heat exchanger is formed of a thermoelectric cooler (TEC) for taking electrical energy through one heat absorbing surface to emit heat to the other heat emitting surface and has a tubular shape in which the heat absorbing surface of the TEC surrounds the optical fiber drawn from the melting furnace along the drawing direction by a predetermined length, and the drawn optical fiber is cooled as it passes through the tubular TEC. Also, the cooler further includes an auxiliary cooler attached to the heat emitting surface of the TEC, for cooling the emitted heat.
    Type: Grant
    Filed: January 13, 1999
    Date of Patent: August 28, 2001
    Assignee: SamSung Electronics Co., Ltd.
    Inventors: Un-Chul Paek, Sung-Koog Oh, Man-Seok Seo, Kyu-Hwan Hwang
  • Patent number: 6257322
    Abstract: In a heat-exchange unit 1a constituting a chief portion of an indirect heat exchanger 1, the streams of hot medium that flow through many small flow passages 20 in the flat tubes 2 in the upstream heat-exchange set 5, meet together in the tubular headers 4 for each of the flat tubes 2 and, then, flow again into many small flow passages 20 in the flat tubes 2 in the downstream heat-exchange set 6. Even in case some of the small flow passages 20 are clogged or constricted, all the small flow passages 20 from the upstream common header 71 to the downstream common header 72 do not become incapable of exchanging heat and do not lose the function for exchanging heat, and most of the area of the upstream side and of the downstream side can be normally used.
    Type: Grant
    Filed: July 25, 2000
    Date of Patent: July 10, 2001
    Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
    Inventors: Keiji Toh, Hidehito Kubo
  • Publication number: 20010004934
    Abstract: A compressed mesh wick prepared by bending for plurality of times at least one sheet of band type mesh wire to form a prescribed shape, thus preparing a bent layered mesh body, and pressing the bent layered mesh body.
    Type: Application
    Filed: December 21, 2000
    Publication date: June 28, 2001
    Inventors: Masaaki Yamamoto, Tatsuhiko Ueki, Masami Ikeda
  • Patent number: 6183855
    Abstract: A highly flexible composite material having a flexible matrix containing a phase change thermal storage material. The composite material can be made to heat or cool the body or to act as a thermal buffer to protect the wearer from changing environmental conditions. The composite may also include an external thermal insulation layer and/or an internal thermal control layer to regulate the rate of heat exchange between the composite and the skin of the wearer. Other embodiments of the PCM composite also provide 1) a path for evaporation or direct absorption of perspiration from the skin of the wearer for improved comfort and thermal control, 2) heat conductive pathways within the material for thermal equalization, 3) surface treatments for improved absorption or rejection of heat by the material, and 4) means for quickly regenerating the thermal storage capacity for reuse of the material.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: February 6, 2001
    Inventor: Theresa M. Buckley