Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat Patents (Class 165/104.11)
  • Publication number: 20080302512
    Abstract: A thermal dissipating device includes a base, at least a heat pipe, a plurality of fins and a fan. The heat pipe is fixed on the base and has an end extending outwards. The fins are fitted to the heat pipe. The fan has an airflow entering side and an airflow exiting side along an airflow path. The fan is provided beside the fins and has the airflow entering side or the airflow exiting side facing gaps between the fins. The fins have hollow portions on edges proximal to the fan, and a buffer space is formed between the fins and the fan. Therefore, the buffer space increases a distance between the fins and the fan to reduce the resistance on the airflow entering the fins that may reduce the noise of the airflow of the fan.
    Type: Application
    Filed: August 27, 2007
    Publication date: December 11, 2008
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Chin-Chun Liao, Meng-Hung Ko
  • Publication number: 20080277096
    Abstract: The invention relates to a method of optimising heat exchanges between (i) a thermally-conductive absorbent plate (1) which is exposed to thermal radiation and a heat-transfer fluid (3) circulating in at least one thermally-conductive conduit tube (2) that is in thermal contact with the plate (1) and (ii) within the heat-transfer fluid (3). The invention is characterised in that, in order to promote heat exchanges, the method uses zones of the aforementioned plate (1) in order to form part of the wall of the conduit tube (2), such that the heat-transfer fluid (3) is in direct contact with the plate (1) so as to reduce the thermal resistance between the plate (1) and the heat-transfer fluid (3) circulating inside the conduit tube (2), said conduit tubes (2) being disposed on the two faces of the plate (1) and being interconnected by means of holes (4) that provided on the plate.
    Type: Application
    Filed: March 20, 2006
    Publication date: November 13, 2008
    Inventors: Roland Vilmart, Vincent Vilmart
  • Publication number: 20080248344
    Abstract: A ceramic microreactor for carrying out reactions having a large heat of reaction which has at least three interior spaces, with at least one interior space having internal buffers whose shape, number and positioning ensure homogeneous flow, is described. The microreactor is built up as a monolith from at least seven plate-shaped layers of inert ceramic material, preferably aluminium oxide, which form an upper heating/cooling space, a central reaction space and a lower heating/cooling space. One interior space has a coating of a catalyst comprising noble metal. The shape, number and positioning of the internal buffers is determined by means of flow simulation calculations; the internal buffers preferably have a lozenge shape. The microreactor displays very good selectivity in reactions having a large heat of reaction, in particular in heterogeneous gas-phase reactions, and is used in particular for hydrogen production and/or hydrogen purification in fuel cell technology.
    Type: Application
    Filed: January 26, 2006
    Publication date: October 9, 2008
    Inventors: Carsten Schmitt, David Agar, Frank Platte, Beate Pawlowski, Peter Rothe, Hans-Georg Reitz, Matthias Duisberg
  • Publication number: 20080245508
    Abstract: The cooling means of the linear motor is formed of an assembly of plate parts adapted to dimensions of linear motor stator element plates on which magnets are disposed, piping, and bonding material for securing the plate parts and the piping to each other. Opposite ends of the plate parts are bent to form piping housing portions. The stator element plates and the plate parts are mounted to the machine while overlaid on each other. The piping is passed through the piping housing portions at the opposite ends of the plate parts. Thus, mounting of the cooling means is completed.
    Type: Application
    Filed: March 13, 2008
    Publication date: October 9, 2008
    Inventors: Yoshifumi Shimura, Masami Kimijima
  • Patent number: 7429720
    Abstract: The present invention relates to an electric radiating pipe capable of enhancing a heating efficiency in such a manner that a mixture of a porous operation medium and a volatile operation fluid is filled in a radiation pipe, and a porous operation medium is fast heated based on a viscosity difference, and a densely filled operation fluid is phase-changed to a high temperature vapor or a high temperature liquid based on a heated operation medium. In a radiating pipe that includes a certain shaped pipe body, and a heat wire passing through to the interior of the pipe body wherein both ends of the pipe body are sealed by a plugging cap, there is provided an electric radiating pipe that includes a porous non-flammable operation medium and volatile operation fluid being mixed and being filled into the interior of the pipe body.
    Type: Grant
    Filed: January 12, 2004
    Date of Patent: September 30, 2008
    Inventor: Hyung-Gon Kim
  • Publication number: 20080192430
    Abstract: An electronic device is provided having a bimetallic fluid circulator for circulating fluid coolant in relation to electrical circuitry to provide enhanced heat exchange. The fluid circulator includes a first thin sheet exhibiting a first coefficient of thermal expansion and the second thin sheet dissimilar from the first thin sheet and exhibiting a second CTE that is substantially different than the first CTE. The first and second thin sheets are bonded together. The first and second thin sheets expand and contract at different rates based on changes in temperature such that the first and second thin sheets change shape to create a fanning motion to circulate the fluid and thus cool the electrical device.
    Type: Application
    Filed: February 9, 2007
    Publication date: August 14, 2008
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: Scott D. Brandenburg, Suresh K. Chengalva
  • Patent number: 7410597
    Abstract: A thermally conductive material includes a supercritical fluid and a number of carbon nanotubes incorporated in the supercritical fluid. The supercritical fluid may be selected from a group consisting of carbon dioxide, water, ammonia, ethane, ethane, nitrous oxide, propane, butane, pentane, and so on. The carbon nanotubes may be selected from the group consisting of single-wall carbon nanotubes, double-wall carbon nanotubes, mult-wall carbon nanotubes, or other kinds of carbon nanotubes. The carbon nanotubes have an average length of less than 1 micron and an average diameter of less than 100 nanometers. The supercritical fluid has dual characteristices of a liquid and a gas, and the carbon nanotubes have excellent thermal conductivity. As a result, the thermally conductive material becomes a nano-super heat conductor with excellent thermal conductivity and high efficiency of thermal conductivity, and is suitable for heat dissipation of various heat sources.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: August 12, 2008
    Assignee: Hon Hai Precsision Industry Co., Ltd.
    Inventor: Ga-Lane Chen
  • Publication number: 20080179046
    Abstract: In a cooling apparatus, a heating element is thermally connected to a container that defines a first channel through which a coolant flows. A porous block having a large number of pores is accommodated in the container so as to block the first channel. The porous block has second channels formed in the porous block along the first channel and each having an opening on an upstream side of the first channel. Further, third channels are formed in the porous block along the first channel, each have an opening on an upstream side of the first channel, and communicate with the second channels via the pores.
    Type: Application
    Filed: September 20, 2007
    Publication date: July 31, 2008
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Katsumi Hisano, Hideo Iwasaki, Tomonao Takamatsu
  • Publication number: 20080149303
    Abstract: A heat sink for a shaft-type linear motor is detachably positioned on a mover and is interiorly defined with a space. A plurality of coolant-receiving channels is formed in a wall between the space and an outer surface of the heat sink, and each of the coolant-receiving channels includes at least one inlet and one outlet. A plurality of concave and convex radiation fins is formed on an outer surface of the mover. Such an arrangement is suitable for modular production, so as to facilitate replacement and design of the product. Further, the radiation fins cooperate with the liquid cooling effect to enable the motor to produce the maximum pushing force.
    Type: Application
    Filed: December 25, 2006
    Publication date: June 26, 2008
    Inventors: CHIA-MING CHANG, Fang-Fang Tai, Lieh-Feng Huang
  • Publication number: 20080127652
    Abstract: There is described a heat shield element comprising a wall that is provided with a hot face which can be impinged upon by a hot medium and a cold face located opposite the hot face. The heat shield element further comprises a coolant distribution system which is assigned to the cold face. In order to convectively cool the heat shield element in a particularly effective manner, a plurality of cooling ducts which extend along the hot face are provided within the wall. Said cooling ducts are fluidically connected to the distribution system such that the coolant can be distributed to the individual cooling ducts with the aid of the distribution system. The convectively cooled heat shield element can be used in a particularly advantageous fashion for the heat-resistant lining of a combustion chamber, especially a combustion chamber of a gas turbine system.
    Type: Application
    Filed: December 15, 2005
    Publication date: June 5, 2008
    Inventor: Heinrich Putz
  • Publication number: 20080115508
    Abstract: Systems and methods for heating a cryogenic fluid are provided. A cryogenic fluid can be heated to provide a partially cryogenic vaporized fluid having a first temperature. The partially vaporized cryogenic fluid can be partially vaporized to provide a second partially vaporized fluid having a second temperature. At least a portion of the second, partially vaporized, cryogenic fluid can be used to heat the cryogenic fluid to the first temperature. The second, partially vaporized, cryogenic fluid can be partially vaporized to provide a substantially vaporized cryogenic fluid having a third temperature.
    Type: Application
    Filed: November 1, 2007
    Publication date: May 22, 2008
    Inventors: Heinz J. Kotzot, Felix J. Fernandez de la Vega, Joseph H. Cho, Charles Durr, Robert Burlingame
  • Publication number: 20080110596
    Abstract: A heat exchange system for use in operating equipment having a plurality of subsystems in each of which one of a plurality of working fluids is utilized to provide selected operations with there being an air and working fluid heat exchanger providing controlled cooling to cool at least one of the plurality of working fluids in its corresponding subsystem. In addition, a coupling heat exchanger is also provided connected to two of the subsystems to pass there working fluids therethrough, including the subsystem with the air and working fluid heat exchanger, to allow one of the connected subsystems to aid in cooling the other.
    Type: Application
    Filed: November 9, 2006
    Publication date: May 15, 2008
    Applicant: United Technologies Corporation
    Inventors: Frederick M. Schwarz, Jorn A. Glahn
  • Publication number: 20080104985
    Abstract: A method of cooling including providing a fluid flow at a predetermined temperature, and adjusting at least one cooling parameter of at least one cooling device to maintain the predetermined temperature of the fluid flow when a desired mass flow of the fluid flow changes. A cooling system and further embodiments are also disclosed.
    Type: Application
    Filed: November 3, 2006
    Publication date: May 8, 2008
    Applicant: American Power Conversion Corporation
    Inventor: Peter Ring Carlsen
  • Publication number: 20080099186
    Abstract: A flexible heat pipe (10) includes a casing (12), a wick structure (20) arranged in the casing, and a working medium saturated in the wick structure. The casing includes an evaporation section (122), a condensation section (126), and a flexible adiabatic section (124) connecting the evaporation section with the condensation section. The wick structure includes a first portion (21), a second portion (23) and a third portion respectively disposed in the evaporation, the condensation and the adiabatic sections of the casing. The adiabatic section of the casing further accommodates a supporting member (30) therein for supporting the third portion of the wick structure to have an intimate contact with an inner surface of the adiabatic section.
    Type: Application
    Filed: March 15, 2007
    Publication date: May 1, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Fang-Xiang Yu, Yeu-Lih Lin
  • Publication number: 20080099185
    Abstract: The present invention relates to a method and equipment for recovering heat from exhaust gas removed from an industrial process, such as an electrolysis process for the production of aluminium. Heat is recovered by means of an extraction/suction system, where the exhaust gas contains dust and/or particles. The heat is recovered as the exhaust gas is brought into contact with heat-recovery elements. Flow conditions and the design of the heat recovery elements are such that the deposits of the dust and/or particles on the surfaces stated are kept at a stable, limited level. In preferred embodiments, the heat-recovery elements have a circular or an extended, elliptical cross-section and may be equipped with fins or ribs.
    Type: Application
    Filed: July 15, 2005
    Publication date: May 1, 2008
    Inventors: Erling Naess, Otto Kristian Sonju, Torbjorn Slungaard, Bjorn Petter Moxnes
  • Publication number: 20080085672
    Abstract: An air treatment system for a vehicle includes a first compressor selectively coupled to a first power source of the vehicle. A second compressor is selectively coupled to a second power source of the vehicle. A first heat exchanger communicating with an interior space is defined in the vehicle. A second heat exchanger communicates with an environment exterior to the vehicle. A valve member is provided which, in a first position, couples an inlet of each of the first and second compressors to an outlet of the first heat exchanger and an outlet of each of the first and second compressors to an inlet of the second heat exchanger. In a second position, the valve member couples the outlets of the first and second compressors to an inlet of the first heat exchanger and the inlets of each of the first and second compressors to an outlet of the second heat exchanger. A controller is provided that selectively actuates at least one of the first and second compressors and the valve member.
    Type: Application
    Filed: October 9, 2007
    Publication date: April 10, 2008
    Inventors: John L. Creed, Steven G. Skinner
  • Patent number: 7329030
    Abstract: In an assembling structure for LED road lamp and heat dissipating module, the LED road lamp includes a partition board, an upper casing, a light transmitting lens and an LED lamp set. The upper casing and the light transmitting lens are set separately on upper and lower sides of the partition board. Each LED lamp set is contained in a space enclosed by the partition board and the light transmitting lens. The partition board has a plurality of through holes, and the LED lamp set includes a frame body and an LED module. The heat dissipating module includes a heat dissipating body, a heat pipe and an isothermal board. The heat dissipating body is set in a space enclosed by the partition board and the upper casing, and the heat pipe has a heat discharging end passing through and connecting the partition board and the heat dissipating body and a heat receiving end forming the bottom of the partition board.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: February 12, 2008
    Assignee: Augux., Ltd.
    Inventor: Pei-Choa Wang
  • Patent number: 7306750
    Abstract: The application of carboxylate salts for storing thermal energy is disclosed. The invention is directed to methods for the storage and use of thermal energy comprising contacting mixtures of alkali metal salts or alkali earth metal salts of carboxylic acids, storing the thermal energy in the mixture, containing the mixture in a suitable heat exchange system and using the stored thermal energy in the heat exchange system.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: December 11, 2007
    Assignee: Texaco Inc.
    Inventors: Jean-Pierre Maes, Serge Lievens, Peter Roose
  • Patent number: 7013954
    Abstract: A thermosiphon which can be manufactured easily at low costs, having excellent resistance to pressure, without the circulation of a working fluid being hindered. A condenser 3 includes a condensing section 4 composed of extruded members in which a plurality of fine pores 7 are formed, a branching section 5 provided on an upstream side of the fine pores 7 to supply a gaseous working fluid returned from a gas pipe 12 into each of the fine pores 7, and a collecting section 6 provided on a downstream side of the fine pores 7 to collect the working fluid condensed inside the fine pores 7 and then supply the same into a liquid pipe 9. The gas pipe 12 is connected to an upper portion of the branching section 5 and the liquid pipe 9 is connected to a lower portion of the collecting section 6.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: March 21, 2006
    Assignee: Twinbird Corporation
    Inventor: Kazuya Sone
  • Patent number: 7011765
    Abstract: The invention concerns a heat transfer fluid comprising a monobenzyl-1,2,3,4-tetrahydronaphthalene or a mixture of mono-and polybenzyl-1,2,3,4-tetrahydronaphthalene and/or a mixture of partly hydrogenated polyphenyls and at least a polyphenylmethane composition.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: March 14, 2006
    Assignee: Arkema
    Inventor: Raymond Commandeur
  • Patent number: 7004240
    Abstract: A system includes a heat transfer system and a priming system coupled to the heat transfer system. The heat transfer system includes a main evaporator having a core, a primary wick, and a secondary wick, and a condenser coupled to the main evaporator by a liquid line and a vapor line. A heat transfer system loop is defined by the main evaporator, the condenser, the liquid line, and the vapor line. The priming system is configured to convert fluid into a liquid capable of wetting the primary wick of the main evaporator. The priming system includes a priming evaporator coupled to the vapor line, and a reservoir in fluid communication with the priming evaporator and coupled to the secondary wick of the main evaporator by a secondary fluid line.
    Type: Grant
    Filed: June 24, 2003
    Date of Patent: February 28, 2006
    Assignee: Swales & Associates, Inc.
    Inventors: Edward J. Kroliczek, James Seokgeun Yun
  • Patent number: 6992381
    Abstract: An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.
    Type: Grant
    Filed: October 31, 2003
    Date of Patent: January 31, 2006
    Assignee: Intel Corporation
    Inventors: Sarah E. Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat T. Vu, Ravi Prasher, Ravi Mahajan, Gilroy Vandentop
  • Patent number: 6942016
    Abstract: This invention provides a heat pipe including a plurality of pipe parts for performing at least one of absorption of heat and radiation of heat through an outer surface, which are adjacent toward one direction, a flat part including a heat transfer plane created in a flat form for performing at least one of absorption of heat from and radiation of heat into outer space, created on a part of the outer surface of each of the plurality of pipe parts to be integrated with each of the pipe parts, and a fin in a flat form continuing without an uneven part from the heat transfer plane included in the flat part for providing an heat transfer plane further extended from the heat transfer plane toward an adjacent pipe part.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: September 13, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takashi Kobayashi, Takehide Nomura
  • Patent number: 6889754
    Abstract: A capillary pump two phase heat transport system that combines the most favorable characteristics of a capillary pump loop (CPL) with the robustness and reliability of a loop heat pipe (LHP). Like a CPL, the hybrid loop has plural parallel evaporators, plural parallel condensers, and a back pressure flow regulator. Unlike CPLs, however, the hybrid system incorporates elements that form a secondary loop, which is essentially a LHP that is co-joined with a CPL to form an inseparable whole. Although secondary to the basic thermal management of the system thermal bus, the LHP secondary loop portion of the system provides for important operational functions that maintain healthy, robust and reliable operation. The LHP secondary loop portion provides a function of fluid management during start-up, steady state operation, and heat sink/heat source temperature and power cycling.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: May 10, 2005
    Assignee: Swales & Associates, Inc.
    Inventors: Edward J. Kroliczek, David A. Wolf, Sr., James Seokgeun Yun
  • Patent number: 6885555
    Abstract: A cooling system for an electronic device includes an air flow conduit for causing air outside a housing of the device to flow through a heat dissipation device. The conduit is configured to prevent substantial transfer of heat from air contained within the conduit and air in the remainder of the housing. The conduit walls include thermal and/or acoustic insulation. One or more fans in the conduit draw outside air into the conduit and expel air in the conduit to outside the housing.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: April 26, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: David Greco
  • Patent number: 6860322
    Abstract: The invention concerns a heat transfer device comprising an insulating module (12) designed to be inserted between a first wall (14) and a second wall (16) to define a closed loop wherein flows a heating medium (FC) which comprises a first channel (28) extending substantially vertically along the first wall (14) and a second channel (30) extending substantially vertically along the second wall (16), the first channel and the second channel being mutually offset in the vertical direction to define a low channel and a high channel, as well as an upper channel (32) and a lower channel (34) linking the first channel and the second channel, such that heating medium (FC) flows freely or is blocked naturally in the loop when on the basis of the respective temperatures of the high channel and the low channel. The invention is particularly useful for heating or cooling buildings.
    Type: Grant
    Filed: September 20, 2000
    Date of Patent: March 1, 2005
    Inventor: Eugeniusz Rylewski
  • Patent number: 6853803
    Abstract: A high-performance water heater is constructed to include a heat absorber, the heat absorber defining an oil chamber that holds an oil, a heat guide defining a water chamber, the heat guide having a cold water pipe adapted to guide cold water into the water chamber and a hot water pipe adapted to guide hot water out of the water chamber, a plurality of heat conducting members connected between the heat absorber and the heat guide and adapted to transfer heat energy from the oil in the oil chamber to water in the water chamber of the heat guide, and a heating device adapted to heat the heat absorber.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: February 8, 2005
    Inventors: Ming Hsien Chen, Steven Chuang
  • Patent number: 6848498
    Abstract: A temperature control apparatus where it is easy to replace a heat exchange unit to enhance the maintainability and the space efficiency and which can absorb the thermal expansion/shrinkage of a heat exchanger is provided. The temperature control apparatus has a heat exchanger 11 with a passage 31 for passing a fluid; a connecting pipe 21 connected to the passage of the heat exchanger; a passage block 16 with a passage for passing the fluid to the heat exchanger; a relay block 15 for forming a passage between the passage of the passage block and the connecting pipe; and sealing means 14 for connecting the connecting pipe movably to the passage of the relay block. In the temperature control apparatus, the length of the connecting pipe 21 is made substantially equal to or slightly shorter than the spacing between the heat exchanger 11 and the passage block 16.
    Type: Grant
    Filed: August 8, 2001
    Date of Patent: February 1, 2005
    Assignee: Komatsu Ltd.
    Inventors: Masanobu Seki, Mineo Tokuda
  • Publication number: 20040261979
    Abstract: A heat sink structure suitable for a chip-packaging unit is provided. The heat sink structure includes a heat spreader and at least one arcuate spring. The heat spreader has a top surface and a bottom surface and the bottom surface covers over the chip-packaging unit. The arcuate spring is disposed between the bottom surface of the heat spreader and the chip-packaging unit, such that the arcuate spring is in contact with the back surface of a chip of the chip-packaging unit.
    Type: Application
    Filed: June 30, 2004
    Publication date: December 30, 2004
    Inventor: Meng-Jen Wang
  • Publication number: 20040261978
    Abstract: Ceramic materials are converted to materials with anisotropic thermal properties by forming the ceramics into composites with carbon nanotubes dispersed therein and uniaxially compressing the composites in a direction in which a lower thermal conductivity is desired.
    Type: Application
    Filed: June 26, 2003
    Publication date: December 30, 2004
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, a California corporation
    Inventors: Guodong Zhan, Joshua D. Kuntz, Amiya K. Mukherjee
  • Publication number: 20040250998
    Abstract: The fumes from gas turbine TG are cooled by heat exchangers E1, E2, E01, E02 and E03 and compressed by compressors C1 and C2. The cold and high-pressure fumes are depleted in carbon dioxide in treating plant 10. The carbon dioxide can be injected into an underground reservoir. The fumes depleted in carbon dioxide are heated by heat exchangers E1 and E2, and expanded by turbines T2, then T1. In particular, after expansion in turbine T2 and before expansion in turbine T1, the fumes are heated using the heat of the fumes from compressor C2.
    Type: Application
    Filed: June 8, 2004
    Publication date: December 16, 2004
    Inventor: Yves Charron
  • Publication number: 20040177946
    Abstract: A heat pipe wherein a condensable liquid phase working fluid is encapsulated in a container sealed in air-tight condition; wherein the wick composed of the porous body for refluxing the liquid phase working fluid by a capillary pressure is provided in the container; wherein a part of the container functions as an evaporating part for evaporating the working fluid by means of inputting the heat from outside; and wherein another part of the container functions as a condensing part for condensing a vapor of the working fluid by means of radiating the heat to the outside; comprises a direct reflux flow passage for flowing the liquid phase working fluid to the evaporating part, which has a flow cross-sectional area greater than that of a cavity formed in the porous body.
    Type: Application
    Filed: February 13, 2004
    Publication date: September 16, 2004
    Applicants: FUJIKURA LTD., INTERNATIONAL BUSINESS MACHINES CORP.
    Inventors: Youji Kawahara, Masataka Mochizuki, Koichi Mashiko, Fumitoshi Kiyooka, Hiroaki Agata
  • Patent number: 6768781
    Abstract: Methods and apparatuses are provided for removing thermal energy from a nuclear reactor, which are fault tolerant. The apparatus includes at least one heat pipe configured to absorb thermal energy produced by the nuclear reactor. In addition, the apparatus includes a first compartment thermally coupled to the at least one heat pipe. The first compartment is configured to contain a first gas. Furthermore, the apparatus includes a second compartment thermally coupled to the at least one heat pipe. The second compartment is configured to contain a second gas and configured to isolate the second gas from the first gas.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: July 27, 2004
    Assignee: The Boeing Company
    Inventor: Michael P. Moriarty
  • Patent number: 6767665
    Abstract: The invention relates to a method for producing molten salts and their mixings, using an extruder. The starting materials are melted and reacted and the products of the reaction are then guided via a column with alkali salt.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: July 27, 2004
    Assignee: BASF Aktiengesellschaft
    Inventors: Hans-Leonhard Ohrem, Susanne Brzezinski
  • Publication number: 20040140084
    Abstract: A heat dissipating device (1) comprises a heat-conductive container (10), a heat sink (20), and an electric pump (30). The container defines a containing channel therein, a first inlet (17) and a first outlet (16) at opposite ends of the containing channel. The heat sink comprises a plurality of fins (21) and a heat pipe (23) extending through the fins. One end of the heat pipe is connected to the first outlet. The electric pump (30) has a second inlet (32) and a second outlet (34). The second inlet is connected to an opposite end of the heat pipe. The second outlet is connected to the first inlet. Thereby a hermetic loop is formed. Liquid coolant (not shown) is received in the hermetic loop and flows under driving force of the pump. Further, a fan is mounted to a side of the heat sink to provide forced convection.
    Type: Application
    Filed: August 6, 2003
    Publication date: July 22, 2004
    Inventors: Hsieh Kun Lee, Lei Li, Cheng-Tien Lai
  • Publication number: 20040129409
    Abstract: The invention provides a structural principle wherein a combination fan-heatsink type cooling device transfers a large amount of heat into an ambient while producing minimal acoustic noise. The fan-heatsink has top and bottom cover members with a central power shaft between them, the shaft has fins that rotate around the shaft between the covers to move ambient. The ambient enters the fan-heatsink through inlets through the covers near the central power shaft and is forced out through louvers that make up the peripheral of the fan-heatsink housing. The fan-heatsink cooling device is positioned so that heat radiating from the heat source such as a chip enters the housing through the inlets near the central shaft and heat pipes are arranged to carry heat from the chip source to and through the louvers so that the ambient forced through the louvers absorbs heat transferred to the louvers at the place where it is immediately carried out of the fan-heatsink structure.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 8, 2004
    Inventor: Lawrence Shungwei Mok
  • Publication number: 20040089442
    Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.
    Type: Application
    Filed: June 27, 2003
    Publication date: May 13, 2004
    Applicant: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evely Ning-Yi Wang, Shulin Zeng, Lian Zhang
  • Patent number: 6725907
    Abstract: A thermosiphon which can be manufactured easily at low costs, having excellent resistance to pressure, without the circulation of a working fluid being hindered. A condenser 3 includes a condensing section 4 composed of extruded members in which a plurality of fine pores 7 are formed, a branching section 5 provided on an upstream side of the fine pores 7 to supply a gaseous working fluid returned from a gas pipe 12 into each of the fine pores 7, and a collecting section 6 provided on a downstream side of the fine pores 7 to collect the working fluid condensed inside the fine pores 7 and then supply the same into a liquid pipe 9. The gas pipe 12 is connected to an upper portion of the branching section 5 and the liquid pipe 9 is connected to a lower portion of the collecting section 6.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: April 27, 2004
    Assignee: Twinbird Corporation
    Inventor: Kazuya Sone
  • Publication number: 20030164231
    Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.
    Type: Application
    Filed: March 10, 2003
    Publication date: September 4, 2003
    Applicant: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evelyn Ning-Yi Wang, Shulin Zeng, Lian Zhang
  • Publication number: 20030151030
    Abstract: An enhanced conductivity nanocomposite having reduced conductivity path directionality dependence as a means for enhancing the electrical and thermal conductivity. The composition comprises a synergistic blend of metal (and their derivatives) and carbon (preferably nanotubes) powder both average particle sizes in the nanometer to micron size range. The carrier medium is selected from the group of interpolymers, polymers, gaseous and liquid fluids, and phase change materials. The synergistic nanocomposite, when mixed with a conductive medium, exhibits enhanced heat transfer capacity, and electrical and thermal conductivity, stable chemical composition, faster heat transfer rates, and dispersion maintenance which are beneficial to most thermal or electrical transfer systems.
    Type: Application
    Filed: March 18, 2003
    Publication date: August 14, 2003
    Inventor: Michael H. Gurin
  • Publication number: 20030085024
    Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for control including venting or recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. A gas permeable membrane removes and vents electrolytic gasses generated within the fluid chamber of the electroosmotic pump to ambient. A catalyst can be used to recombine electrolytic gases to form a vapor product that can be vented or condensed into a liquid state.
    Type: Application
    Filed: October 16, 2002
    Publication date: May 8, 2003
    Inventors: Juan G. Santiago, Shulin Zeng
  • Patent number: 6554061
    Abstract: A recuperative and conductive heat transfer system (10, 10′) that is operative to effect therewith the heating within the second portion (20, 20′) of the heat transfer system (10, 10′) of a “working fluid” flowing through the heat s transfer surfaces (32, 32′) as a consequence of the transfer thereto by conduction of heat from a multiplicity of regenerative solids (24, 24′). The multiplicity of regenerative solids (24, 24′) derive their heat from a recuperation thereby within the first portion (12, 12′) of the heat transfer system (10, 10′) from either an internally generated or an externally generated source of heat (22, 22′).
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: April 29, 2003
    Assignee: Alstom (Switzerland) Ltd
    Inventors: Glen D. Jukkola, Paul R. Thibeault, Michael S. McCartney
  • Publication number: 20030066627
    Abstract: The present heat dissipation device is provided with a fan frame and a blade structure. The fan frame includes an air inlet, an air outlet, and a curved portion. The air inlet has a non-circular indentation in the vicinity of the curved portion corresponding to the airflow passage. This indentation effectively increases the airflow amount and static pressure of the airflow expelled from the heat dissipation device.
    Type: Application
    Filed: October 28, 2002
    Publication date: April 10, 2003
    Applicant: Delta Electronics Inc.
    Inventors: Tsu-Liang Lin, Bor Haw Chang, Yu-Hung Huang, Wen-Shi Huang
  • Publication number: 20030062149
    Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.
    Type: Application
    Filed: January 19, 2002
    Publication date: April 3, 2003
    Inventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae-Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evelyn Ning-Yi Wang, Shulin Zeng, Lian Zhang
  • Patent number: 6539733
    Abstract: A thermosiphon is provided of low cost and simple construction and having a condenser which can reliably discharge a condensed working fluid from an outlet pipe even if the apparatus is somewhat inclined. A thermosiphon 1 comprises a condenser 2 connected to a cold part B of a refrigeration apparatus A, and a capillary 3a and a large diameter pipe 3b connected to the condenser 2 and which can pass a working fluid thereinside. The condenser 2 comprises; an attachment part 4 attached to the cold part B for conducting cold from the cold part B, and a condensing part 5 provided at an end of the attachment part 4 for condensing the working fluid. The condensing part 5 has a cavity portion 6 thereinside, and an inside bottom part 6a of the cavity portion 6 is formed descending towards an outlet hole 12 communicating with the capillary 3a for the working fluid.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: April 1, 2003
    Assignee: Twinbird Corporation
    Inventor: Kazuya Sone
  • Publication number: 20030024686
    Abstract: Improved systems, methods, apparatus and compositions for generating, extracting and distributing the renewable heat energy produced by microbial decomposition of organic biomass within a contained and controlled environment. This heat energy is preferably transferred and distributed, preferably by the use of heat pipes, to the interior of a greenhouse or other structure to be heated, either directly or via heat exchange apparatus such as hot water heating systems. In one embodiment heat transfer and distribution mechanism customized to the application requirements of a greenhouse heating batch-type process is disclosed, along with a recipe for a readily available biomass material composition that will slowly decompose while it generates a substantial quantity of usable heat energy to be consumed in the elevation of temperature in a separated greenhouse basement confinement area.
    Type: Application
    Filed: July 8, 2002
    Publication date: February 6, 2003
    Inventor: Joseph P. Ouellette
  • Publication number: 20030019612
    Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating the heat of the boiled and vaporized refrigerant. The radiator has an inflow return chamber provided with a small-diameter opening having a diameter smaller than that of the inflow return chamber. The liquid refrigerant of the gas-liquid mixed refrigerant is dammed by the small-diameter opening of the inflow return chamber and the dammed liquid refrigerant is returned through a return passage to the refrigerant tank. Since the liquid refrigerant contained in the gas-liquid mixed refrigerant is suppressed from flowing by means of the small-diameter opening, the gaseous refrigerant can transfer heat directly to the walls of the radiating passages, so that the deterioration of the radiating performance can be prevented.
    Type: Application
    Filed: September 9, 2002
    Publication date: January 30, 2003
    Inventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki
  • Patent number: 6506317
    Abstract: A cooling medium and a cooling device for optical equipment using the same, which cooling medium has a refractive index in a specific range, hardly causes the problem to dissolve or swell plastic lens and other component parts, and is flame retardant. The cooling medium comprises a cyclic aliphatic hydrocarbon having at least one cross linkage and has a flash point of 120° C. or above and a melting point of −20° C. or below. The space between a pair of transparent optical members of a cooling device for optical equipment, is filled with the cooling medium.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: January 14, 2003
    Assignees: Nippon Petrochemicals Company, Limited, San-Petrochemicals Co., Ltd.
    Inventors: Hiroyuki Hoshino, Takashi Kiyota
  • Patent number: 6498899
    Abstract: A method of controlling a temperature of a semiconductor device during testing is used with a system including a heater and a heat sink and a temperature control system. The semiconductor device is thermally coupled to the heater, which is thermally coupled to a heat sink. The heat sink defines a chamber, and the chamber is adapted to have a liquid flowing through the chamber. The temperature control system is coupled to the heater and the heat sink. In the method, the temperature of the semiconductor device is moved to approximately a first set point temperature. The temperature of the semiconductor device is moved to approximately a second set point temperature, from approximately the first set point temperature, by changing a temperature of the heater and maintaining the liquid flowing into the chamber at a substantially constant temperature.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: December 24, 2002
    Assignee: Delta Design, Inc.
    Inventors: Mark F. Malinoski, Thomas P. Jones, Brian Annis, Jonathan E. Turner
  • Publication number: 20020144811
    Abstract: A heat transfer system is presented for managing thermal transients, thus providing engineers greater flexibility in designing thermal solutions for applications subject to transient heat-generation. A heat reservoir device for managing a heat input subject to transient conditions includes a heat transfer subsystem having a first end and a second end, where the first end is thermally coupled to the heat input; a heat storage subsystem coupled to the second end of the heat transfer subsystem, where the heat storage subsystem comprises a phase change material responsive to the transient conditions. The excess heat load during transient operation is temporarily absorbed by the latent heat of fusion when the phase change material changes its phase from solid to liquid. Subsequently, the absorbed heat can be released back to the ambient via a heat rejection subsystem. This allows engineers to design smaller heat sinks capable of accommodating given transient conditions.
    Type: Application
    Filed: January 23, 2002
    Publication date: October 10, 2002
    Inventors: Der Jeou Chou, Daniel Todd Nelson