Abstract: An electrolytic processing method makes it possible to preferentially process a diffusion barrier layer while suppressing processing of an interconnect metal, thereby enabling omission of CMP or a lowering of processing pressure in CMP. The electrolytic processing method comprises: bringing a surface of a substrate (W) into contact with an electrolytic solution (48) comprising an organic solvent, such as propylene carbonate, and an electrolyte, such as lithium hexafluorophosphate, dissolved into the organic solvent, and optionally an inhibitor composed of a heterocyclic compound; and applying an electric potential, for example, a positive electric potential which is controlled at a value less than the decomposition voltage of the organic solvent, to the surface of the substrate (W) to carry out electrolytic processing of the substrate surface.

Abstract: A wear-, erosion- and chemically-resistant material containing tungsten alloyed with carbon, the carbon being present in an amount of 0.01 wt % up to 0.97 wt % of the total weight, wherein the material preferably comprises a matrix of metallic tungsten with dispersed tungsten carbide nanoparticles having a particle size not greater than 50 nanometres, preferably not greater than 10 nanometres. The material is optionally also alloyed with fluorine, the fluorine being present in an amount of 0.01 wt % up to 0.4 wt % of the total weight. The material is extremely hard and tough.

Abstract: The present invention relates to gallium (Ga) electroplating methods and chemistries to deposit uniform, defect free and smooth Ga films with high plating efficiency and repeatability. Such layers may be used in fabrication of electronic devices such as thin film solar cells. In one embodiment, the present invention provides a solution for application on a conductor that includes a Ga salt, a complexing agent, a solvent, and a Ga-film having submicron thickness is facilitated upon electrodeposition of the solution on the conductor. The solution may further include one or both of a Cu salt and an In salt.

Abstract: Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.

Abstract: Bipolar current electrodeposits a nanocrystalline grain size. Polarity Ratio relates the absolute value of time integrated amplitude of negative polarity and positive polarity current. Grain size can be controlled in alloys of two or more components, one of which being a metal, and one of which being most electro-active. Typically the more electro-active material is preferentially lessened in the deposit during negative current. The deposit is relatively crack and void free. Grain size is typically a function of deposit composition, which is typically a function of Polarity Ratio. Specified grain size can be achieved by selecting a corresponding Polarity Ratio. Coatings can be in layers, each having a grain size, which can vary layer to layer and also in a graded fashion. A finished article may be built upon a substrate of electro-conductive plastic, or metal, including steels, aluminum, brass. The substrate may remain, or be removed.

Abstract: The invention relates to a method for producing a superconductive element to be used as a wire-in-channel superconductor in magnetic resonance imaging (MRI) and in nuclear magnetic resonance (NMR) applications, which superconductive element contains a superconductive wire and a copper component having a longitudinal groove and the superconductive wire being positioned in the groove. In order to produce the wire-in-channel superconductive element by a mechanical contact between the superconductive wire and a wall of the groove in the copper component, at least one contact surface is coated with a lead free solder material before having the mechanical contact. In order to enhance the thermal and electrical conduction and to create a bond between the said components the soldering material is fused in annealing process step.

Abstract: The invention concerns a method for electrolytic coating of materials with aluminum, magnesium or aluminum and magnesium alloys. The method is characterized in that the material is pretreated by being immersed in an electrolytic solution, where it is anodized, the electrolytic coating being performed immediately after in the same electrolytic solution.

Abstract: An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a plurality of individual features, the delamination force at any location on the plating field is greatly reduced. Thus, a film with a large stress, such as a high moment film, may be plated to a greater thickness than is possible with conventionally plated films.

Abstract: An object comprising a conductive body part, a layer comprising a refractory metal (e.g. tantalum), and a layer comprising a precious metal (e.g. platinum or gold). A metallurgical bond has been formed between the layers. Thereby oxidation of the refractory metal layer, and thereby passivation of the object, can be avoided even with small amounts of precious metal. This lowers the material costs while ensuring desired corrosion resistant properties. The object is suitable for an electrode to be used in a corrosive environment, in particular when a large conductivity is needed. Also a method of manufacturing the object. The metallurgical bond is provided by heating the object.

Abstract: A method of making an integrated circuit including composition of matter for electrodepositing of aluminium is disclosed. One embodiment includes a bath having a solution of selected aluminium salts in a substantially anhydrous organic solvent, to uses of certain aluminium salts for electrodepositing and to processes for electrodepositing aluminium.

Abstract: Disclosed are methods and compositions for aqueous electrodeposition of rare earth-transitiona metal alloys (e.g., samarium-cobalt alloys). Also disclosed are nanostructured magnetic coatings comprising a magnetic alloy of a rare earth metal (e.g., samarium) and a transition metal (e.g., cobalt). This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: A surface treatment with a zirconium ion that enables sufficient throwing power, and superior anti-corrosion properties to be exhibited when thus surface treated metal base material is subjected to cation electrodeposition coating is provided. A metal surface treatment liquid for cation electrodeposition coating includes zirconium ions and tin ions, and has a pH of 1.5 to 6.5, in which: the concentration of zirconium ions is in the range of 10 to 10,000 ppm; and the content of the tin ions to the zirconium ions is 0.005 to 1 on a mass basis. Furthermore, a polyamine compound, copper ions, fluorine ions, and a chelate compound may also be included.

Abstract: Bipolar wave current, with both positive and negative current portions, is used to electrodeposit a nanocrystalline grain size deposit. Polarity Ratio is the ratio of the absolute value of the time integrated amplitude of negative polarity current and positive polarity current. Grain size can be precisely controlled in alloys of two or more chemical components, at least one of which is a metal, and at least one of which is most electro-active. Typically, although not always, the amount of the more electro-active material is preferentially lessened in the deposit during times of negative current. The deposit also exhibits superior macroscopic quality, being relatively crack and void free.

Abstract: A method for manufacturing a ferroelectric film includes the steps of causing, in a solution containing sol-gel raw materials, hydrolysis and polycondensation to the sol-gel raw materials to form a liquid containing particulate gels dispersed therein, and forming a ferroelectric film by a migration electrodeposition method, using the liquid containing particulate gels, through electrodepositing the particulate gels on an electrode.

Abstract: An electrode for an electrical-discharge surface-treatment method is molded with a metallic powder or a metallic compound powder having an average grain diameter of 6 micrometers to 10 micrometers. A coat on a surface of a workpiece is formed with a material constituting the electrode or a substance that is generated by a reaction of the material due to a pulse-like electrical discharge. The coat is built up with a material containing metal as a main constituent under conditions of a width of a current pulse for the pulse-like electrical discharge in a range of 50 microseconds to 500 microseconds and a peak of the current pulse equal to or less than 30 amperes.

Abstract: Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.

Abstract: Designs, fabrication and applications of nanostructures made of an alloy of two or more different metal elements to provide a unique identification code based on the composition of the alloy. Such compositionally encoded nanostructures can be in various geometries including but not limited to nanoparticles, nanowires and nanotubes. In one example, a single-step electroplating process may be used to form alloy nanowires without separate electroplating steps.

Abstract: There is provided a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate, the composite plated product having a large content of carbon and a large quantity of carbon particles on the surface thereof and having a low coefficient of friction and an excellent wear resistance. Carbon particles treated by an oxidation treatment and a silver matrix orientation adjusting agent are added to a silver plating solution for electroplating a substrate to adjust the orientation of a silver matrix to form a coating of a composite material, which contains the carbon particles in a silver layer, on the substrate.

Abstract: The invention relates to a method for production of a surface-structured substrate, comprising the steps: (i) production of a first substrate, nanostructured with inorganic nanoclusters on at least one surface, (ii) application of a substrate material for a second substrate, different from the first material to the nanostructured surface of the first substrate as obtained in step (i) and (iii) separation of the first substrate from the second substrate of step (ii), including the inorganic nanoclusters to give a second substrate nanostructured with the nanoclusters.

Abstract: Disclosed is a biaxially oriented multilayer film comprising at least two layers A-B, wherein A and B represent separate layers at least one of which layers comprises a polyimide having a Tg of greater than about 200° C., wherein the film has a CTE of less than 35 ppm/° C., and wherein A comprises 60 wt. %-100 wt. % of amorphous polymer with 0 wt. %-40 wt. % of crystallizable polymer, and B comprises 60 wt. %-100 wt. % crystallizable polymer with 0 wt. %-40 wt. % amorphous polymer, the relative thicknesses of layer A to layer B are in a ratio in a range of between 1:5 and 1:100, and the thickness of the film is in a range of between 5 ?m and 125 ?m. Also disclosed is a biaxially oriented monolithic film comprising a polyimide with structural units formally derived from 3,4-diaminodiphenylether and 4,4-oxydiphthalic anhydride. Laminates comprising the films and methods for making film and laminate are also disclosed. Articles comprising a film or laminate of the invention are also disclosed.

Abstract: Disclosed is a method for forming a high-Re-content alloy film, such as a Re-based film containing Re at 98% or more by atomic composition, or an alloy film containing Re in the range of 65 to less than 98% by atomic composition and at least one of Ni, Fe and Co. The method comprises performing an electroplating process using an electroplating bath containing an aqueous solution which includes a perrhenate ion, at least one ion selected from the group consisting of Ni, Fe, Co and Cr ions, and at least one of a Li ion and a Na ion. The present invention allows a high-Re-content alloy film usable as a corrosion-resistant alloy coating for a high-temperature component or the like to be formed through an electroplating process using an aqueous solution, so as to provide heat/corrosion resistances to the component, even if it has a complicated shape, in a simplified manner at a low cost.

Abstract: The invention is a method for the production of a composite multilayer material having a backing layer, a bearing metal layer of a copper alloy or an aluminum alloy, a nickel intermediate layer and an overlay consisting of about 0-20 wt. % copper and about 0-20 wt. % silver, the combined maximum wt. % of copper and silver being about 20 wt. %, the rest being bismuth, and the layer thickness of the nickel layer amounts to more than 4 ?m by electrodeposition, in which the overlay is deposited from methyl sulphonic acid-based electrolyte.

Abstract: The present invention relates to a method for preparing a multi-metals/activated carbon composite, more particularly to a method for preparing a multi-metals/activated carbon composite, which is prepared by electrochemical electroplating of an alloy plate comprising at least two metals and activated carbons fixed on a conductive support under a predetermined condition. The multi-metals/activated carbon composite prepared in accordance with the present invention has improved adhesion force and specific surface area than those of a conventional composite obtained by continuously plating activated carbons, in which metal salts are impregnated, or metals and good reactivity due to the introduction of pure metals. Since the composition and content of metals can be controlled accurately, the multi-metals/activated carbon composite is useful as an active material for filters for removing gaseous or liquid pollutants, secondary cells, fuel cells, capacitors, hydrogen storage electrodes, etc.

Abstract: The invention relates to the regeneration of an electrolysis bath for the production of I-III-VI<SB>Y</SB> compounds in thin layers, where y is approaching 2 and VI is an element including selenium, whereby selenium is regenerated in the form Se(IV) and/or with addition of oxygenated water to reoxidise the selenium in the bath to give the form Se(IV).

Abstract: Disclosed herein is a method for manufacturing metal/carbon nanotube nano-composite using electroplating, more particularly, to a method for manufacturing metal/carbon nanotube nano-composite comprising: adding carbon nanotubes and cationic surfactants in metal plating solution including metal or metal salt and performing electroplating in the cathode. According to the present invention, the method for manufacturing metal/carbon nanotube nano-composite using electroplating comprises: immersing carbon nanotubes in acid solution and filtering the solution and carrying out heat treatment; adding the heat treated carbon nanotubes and cationic surfactants in metal plating solution including metal or metal salt and dispersing the carbon nanotubes; and providing a cathode and an anode in the metal plating solution including the carbon nanotubes and the cationic surfactant, to which current is applied and carrying out electroplating in order to obtain metal/carbon nanotube nano-composite(complex material).

Abstract: A method for electrochemically plating tin or tin alloy onto a workpiece to provide a tin or tin alloy deposit on said workpiece having a stress differential and workpieces characterized by a tin or tin alloy deposit having a stress differential.

Abstract: An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate metals without the need to add plating metal ions to the solution in the form of metal salts, chelates or complexes.

Abstract: Electrochemical plating polymer additives and method which reduces metal overburden in an electroplated metal while optimizing gap fill capability are disclosed. The polymer additives are provided in an electrochemical plating bath solution and may include low cationic charge density co-polymers having aromatic and amine functional group monomers. The low cationic charge density polymers may include benzene or pyrollidone functional group monomers and imidazole or imidazole derivative functional group monomers.

Abstract: This invention relates to a process for electroplating a selected surface area of a component with a crushable zinc alloy, the method comprising utilizing a relatively low current density in an alkaline solution during the electroplating process to provide a crushable coating of said zinc alloy on said selected surface area.

Abstract: A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyte. If the cloud point is greater than the electrodeposition temperature, an anion is also present in an amount sufficient to lower the cloud point of the polymer suppressor to a temperature approximately no greater than the electrodeposition temperature.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: The invention relates to a dip comprising an acid aqueous solution having no ammonium ion, fluoroborate ions or citrate ion and containing per liter: between 10 and 60 g of Zn2+ ions and between 20 and 100 g of Mn2+ ions. The invention is characterised in that it comprises a buffer agent that maintains the pH at a value of between 3 and 7, preferably between 4.5 and 6 or better still between 4.8 and 5.5, and another agent, different from the buffer agent, which is used to bring together the deposition potentials of couple Zn/Zn2+ and couple Mn/Mn2+. The inventive dip used to deposit a Zn and Mn alloy by electrolysis.

Abstract: Disclosed is a method for forming a Re—Cr alloy film consisting of Re in the range of 60 to 90% by atomic composition. The method comprises performing an electroplating process using an electroplating bath containing an aqueous solution which includes a perrhenate ion and a chromium (VI) ion. The present invention allows a Re—Cr alloy film usable as a corrosion-resistant alloy coating for a high-temperature component or the like to be formed through an electroplating process using an aqueous solution, so as to provide heat/corrosion resistances to the component, even if it has a complicated shape, in a simplified manner at a low cost.

Abstract: The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of the clad layer a plated layer of nickel-tin alloy, such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and have a composition with the proviso that the mol-ratio of Ni:Sn is in the range of 10:(0.5 to 9).

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: Disclosed is a method for forming: a Re—Cr alloy film consisting of Re in the range of greater than 0 (zero) to less than 98% by atomic composition, and the remainder being Cr except inevitable impurities; a Re-based film consisting of 98% or more, by atomic composition, of Re, with the remainder being Cr and inevitable impurities; or a Re—Cr—Ni alloy film consisting of Re in the range of 50 to less than 98% by atomic composition, Cr in the range of 2 to less than 45% by atomic composition, and the remainder being Ni except inevitable impurities. The method comprises performing an electroplating process using an electroplating bath containing an aqueous solution which includes a perrhenate ion and a chromium (III) ion.

Abstract: The battery electrode plate includes a core member (1) which is densely coated with a mixture paste chiefly including an active material (2). The core member (1) is made of a metal sheet (3), which is formed with rows (8) of first and second bowed portions (4, 7) arranged along one direction (X) of the metal sheet so as to protrude alternately on the front and back sides of the metal sheet, the rows (8) of bowed portions arranged along the direction (Y) orthogonal to the direction (X) with flat parts (9) of a predetermined width interposed between each two rows. The battery electrode plate is produced by any of a reciprocating type continuous press method, a rotary type molding method, and an electrolytic deposition method.

Abstract: A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum, palladium, rhodium, ruthenium and iridium. The protective coating is typically heat treated to increase homogeneity of the coating and adherence with the substrate. The component typically further comprises a ceramic thermal barrier coating overlying the protective coating. Also disclosed are methods for forming the protective coating on the turbine engine component by electroplating the platinum group metals.

Abstract: An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited copper foil for a printed circuit board, comprising electrolytically treating the copper foil in an electrolytic solution containing pyrophosphoric acid potassium of about 10 g/l to about 200 g/l, Zn of about 0.1 g/l to about 20 g/l, Co of about 0.1 g/l to about 20 g/l and As of about 0.05 g/l to about 5 g/l, is provided. Further, the electrolytic solution remains at the temperature of about 20° C. to about 50° C. and a pH of about 9 to about 13. The copper foil is electrolytically treated for about 2 seconds to about 20 seconds at a cathode current density of about 0.5 A/dm2 to about 20 A/dm2.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: The invention concerns a method wherein the substrate (5) to be coated is immersed in an autocatalytic chemical deposit bath (4), for example nickel, contained in a stainless steel vessel (1) and wherein can be optionally mixed a suspended MCrAlY alloy, so as to form a metal deposit (nickel) wherein are optionally included powder particles. The invention is characterised in that, to provide a prolonged operation of the bath, it consists in measuring with a voltmeter (8) the difference of potential between the substrate (5) and a reference electrode (6) immersed in the bath (4), and in imposing between the substrate (5) and the vessel (1) an electric current produced by a generator (10), said current being adjusted by a regulator (11) so as to maintain said potential difference at a selected value.

Abstract: A method of producing metal hydride misch-metal composite powders comprising providing to a rotary flow-through electrodeposition apparatus a powder whose particles comprise one or more lanthanide alloy metals selected from the group consisting of titanium lanthanide alloy metals and nickel lanthanide alloy metals; and electrodepositing one or more non-lanthanide metals on the powder via the apparatus. Also the resulting compositions of matter and metal hydride misch-metal powders.

Abstract: The corrosion resistance of an aluminum or aluminum alloy component is enhanced by immersing an aluminum alloy to act as a cathode and an oxygen-evolving anode in an electrolyte comprising water, cerium ions, and an additive selected from among animal gelatin, derivatives of animal gelatin, and amino acids, then passing an electrical current through the electrolyte to deposit a cerium-based coating onto the aluminum-based component.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: A relatively simple and inexpensive process for plating precious alloyed metals, such as AuSn, AuSnIn, AgSn, AuIn and AgIn. Anodes are formed from each of the metal components in the alloy and disposed in a conducting solution. The mass of each metal components is determined by Faraday's law. The target is also disposed in the conducting solution. Plating current is independently applied to each anode. The plating is conducted under an ultraviolet light sources to optimize the process. The plating alloys can be used for various purposes including attaching a semiconductor die to a substrate. Since the process does not involve exposure of the semiconductor die to a relatively high temperature for a relatively long time, the process does not pose a risk of contamination of the semiconductor by the adhesive or wax used to hold the die in place on the carrier during processing.

Abstract: Steel sheet for porcelain enameling capable of realizing excellent enamel adhesion with the steel sheet by direct-on enameling once is provided by using a Ti-added steel sheet; there are also a method for producing the same, as well as a porcelain enamel product and the method for producing the same. A steel sheet for porcelain enameling is produced by providing a Ni—Mo alloy plating film on a Ti-added steel sheet containing 0.01% by weight (wherein, % represents “% by weight” hereinafter) or less of C, 0.5% or less of Mn, 0.04% or less of P, 0.04% or less of S, 0.01 to 0.50% of Ti, and balance Fe accompanied by unavoidable impurities, and by then performing heat treatment thereto to control the content of Ni, Mo, and Fe present in the surface of the steel sheet in a predetermined range, porcelain enamel is applied once and fired.

Abstract: An alloy that is suitable for coating a nickel orifice plate of an ink-jet printhead so as to allow the orifice plate to adhere to an intermediate layer of the ink-jet printhead and to improve the non-wetting characteristics of the nickel orifice plate is disclosed. This alloy is made up of a precious metal and a polymer material. According to a one embodiment, the precious metal is gold and the polymer is Teflon. An orifice plate for an ink-jet pen that can be coated with the alloy typically has a plate that has an inner surface and an outer surface. The orifice plate has an orifice that extends through the plate between the inner surface and outer surface. At least a portion of the outer surface surrounding the orifice is coated with the precious metal-polymer alloy.

Abstract: A reactive solution with an amount of 250 mL is made of distilled water and LiOH·H2O (4M) melted in the distilled water. Then, the reactive solution is put in a flow-type reactor, and is flown in between an anode electrode and a cathode electrode set in the flow-type reactor at a given temperature and a given flow rate. Then, a given voltage is applied between the anode electrode and the cathode electrode with dropping an oxidizer of hydrogen peroxide (H2O2) into the reactive solution to form a lithium-cobalt oxide thin film on the anode electrode.

Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

Abstract: Electroplating electrolyte compositions including CA.(nAl(C3H7)3(2-n)AlR3) where n is 0 and less than or equal to 2; C is Li, Na, K, Rb, Cs, NR′4, or mixtures thereof wherein R′ is H, CH3, C2H5, C3H7, C4H9, C5H11, C6H13, C7H15, C8H17, or mixtures thereof; A is H, F, Cl, Br, or mixtures thereof; R is H, halogen, CH3, C2H5, C3H7, C4H9, C5H11, C6H13, C7H15, C8H17, or mixtures thereof; and an aromatic hydrocarbon, aliphatic hydrocarbon, or mixtures thereof are described. Aluminum and magnesium/aluminum electroplating compositions including C.(nAl(C3H7)4(1−n)AlR4) where n is 0 and less than or equal to 1, where C is a cation such as, li, Na, K, Rb, Cs, or mixtures thereof; R is H or an alkyl such as, CH3, C2H5, C3H7, C4H9, C5H11, C6H13, C7H15, C8H17, or mixtures thereof are also described. The aluminum and magnesium/aluminum electroplating compositions formulation can include a solvent such as, an aromatic hydrocarbon, aliphatic hydrocarbon, or mixtures thereof.