Depositing Predominantly Alloy Coating Patents (Class 205/238)
  • Patent number: 5525206
    Abstract: A brightening agent for use in tungsten alloy electroplating baths to replace hexavalent chromium plating or other hard lubrous coatings. Baths of the present invention comprise an effective amount of tungsten ions; an effective amount of a metal ion compatible with tungsten; one or more complexing agents; and an effective amount of a bath soluble alkoxylated hydroxy alkyne for providing brightening of a tungsten alloy electroplate.
    Type: Grant
    Filed: February 1, 1995
    Date of Patent: June 11, 1996
    Assignee: Enthone-OMI, Inc.
    Inventors: Walter J. Wieczerniak, Sylva Martin
  • Patent number: 5525207
    Abstract: The present invention relates to a novel composition of matter, and a process for its use as an electroplating additive for enhancing the performance of a plating bath. Polyalkylene glycol bis-phenyl-A-Sulfopropyl diether compounds and their salts are proposed and their usefulness as plating bath additives is disclosed.
    Type: Grant
    Filed: July 28, 1995
    Date of Patent: June 11, 1996
    Assignee: Mac Dermid, Incorporated
    Inventor: Donald H. Becking
  • Patent number: 5514261
    Abstract: Silver-tin alloys can be deposited by the galvanic method from a cyanide-free bath which is prepared using silver as the nitrate or diammine complex, tin as the soluble tin(II) or tin(IV) compound and mercaptoalkane-carboxylic acids and -sulfonic acids, Uniform and adhering coatings of silver-tin alloys with a silver content of approximately 20 to 99 weight % can be deposited from said bath. Silver-tin alloys are electrodeposited from said bath at a pH of 0 to 14 and a current density of 0.1 to 10 A/dm.sup.2.
    Type: Grant
    Filed: January 30, 1995
    Date of Patent: May 7, 1996
    Assignee: W. C. Heraeus GmbH
    Inventors: Gunter Herklotz, Thomas Frey, Wolfgang Hempel
  • Patent number: 5501786
    Abstract: A method of making the compound CuInSe.sub.2 (CIS) by depositing a precursor of the compound at least partly electrolytically on a substrate and forming CuInSe.sub.2 by thermal reaction.
    Type: Grant
    Filed: February 3, 1995
    Date of Patent: March 26, 1996
    Assignee: Yazaki Corp.
    Inventors: Francois Gremion, Jean-Paul Issartel, Klaus Mueller
  • Patent number: 5496463
    Abstract: In an electroplating container in which at least one portion of an inside surface of the container is formed from a metal material serving as cathode or anode and an anode or cathode is placed in the container, a composite electroplating liquid containing metal ions and fine solid particles is introduced into a bottom portion of the container in such a manner that the introduced composite electroplating liquid spouts downward against an inside bottom surface of the container and is allowed to flow upward through a flow path formed between the anode and the cathode, and an electric current is applied between the anode and cathode so as to form a composite electroplating layer including the fine solid particles evenly distributed in a metal matrix on a surface of the cathode or anode facing the flow path.
    Type: Grant
    Filed: December 7, 1994
    Date of Patent: March 5, 1996
    Assignee: Nihon Parkerizing Co., Ltd.
    Inventors: Seiki Mori, Yasutoshi Ohtoh, Masaaki Beppu
  • Patent number: 5492615
    Abstract: A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so that an inclusion compound of the organic metal finishing additive in the cyclodextrin is formed, and then dissolving the inclusion compound in an aqueous metal treating bath. Aqueous metal treating baths having dissolved therein inclusion compounds of organic metal finishing additives in cyclodextrins are also described.
    Type: Grant
    Filed: November 22, 1994
    Date of Patent: February 20, 1996
    Assignee: LeaRonal Inc.
    Inventor: John Houman
  • Patent number: 5486282
    Abstract: A tool and process for electroetching metal films or layers on a substrate employs a linear electrode and a linear jet of electrolyte squirted from the electrode. The electrode is slowly scanned over the film by a drive mechanism. The current is preferably intermittent. In one embodiment a single wafer surface (substrate) is inverted and the jet is scanned underneath. In another embodiment wafers are held vertically on opposite sides of a holder and two linear electrodes, oriented horizontally and on opposite sides of the holder, are scanned vertically upward at a rate such that the metal layers are completely removed in one pass. The process is especially adapted for fabricating C4 solder balls with triple seed layers of Ti-W (titanium-tungsten alloy) on a substrate, phased Cr-Cu consisting of 50% chromium (Cr) and 50% copper (Cu), and substantially pure Cu. Solder alloys are through-mask electrodeposited on the Cu layer. The seed layers conduct the plating current.
    Type: Grant
    Filed: November 30, 1994
    Date of Patent: January 23, 1996
    Assignee: IBM Corporation
    Inventors: Madhav Datta, Ravindra Shenoy
  • Patent number: 5433797
    Abstract: A process for producing nanocrystalline materials, and in particular nanocrystalline nickel having an average grain size of less than about 11 nanometers and ternary and quaternary nickel-iron alloys, such as NiFeCr and NiFeCrMn alloys, having a grain size less than about 100 nm is described. The nanocrystalline nickel is electrodeposited onto the cathode in an aqueous acidic electrolytic cell by application of a pulsed D.C. current. The ternary and quaternary Nickel-Iron alloys and other binary, ternary and quaternary alloys may be produced by D.C. electroplating or by pulsed D.C. electroplating. The cell electrolyte also contains a stress reliever, such as saccharin, which helps to control the grain size. The novel products of the invention find utility as wear resistant coatings, hydrogen storage materials, magnetic materials and as catalysts for hydrogen evolution.
    Type: Grant
    Filed: January 18, 1994
    Date of Patent: July 18, 1995
    Assignee: Queen's University
    Inventors: Uwe Erb, Abdelmounam M. El-Sherik, Cedric K. S. Cheung, Martin J. Aus
  • Patent number: 5421987
    Abstract: A precision high rate electroplating cell comprising a rotating anode/jet assembly (RAJA) immersed in the electrolyte and having high pressure electrolyte jets aimed at the substrate (cathode). The high pressure jets facilitate efficient turbulent agitation at the substrate's surface, even when it consists of complex shapes or mask patterns. High aspect ratio areas receive similar degree of agitation (and replenishment) as areas of lower aspect ratios. As a result, thickness and composition micro-uniformities are substantially improved while utilizing significantly higher current densities and plating rates.
    Type: Grant
    Filed: August 30, 1993
    Date of Patent: June 6, 1995
    Inventors: George Tzanavaras, Uri Cohen
  • Patent number: 5314608
    Abstract: A dense, smooth, ductile, hard, highly reflective, corrosion-resistant, temperature resistant, and wear-resistant crystalline alloy of nickel, cobalt and boron. The alloy is epitaxially electrodeposited on an activated substrate using a pulsed square wave current. The epitaxial deposition occurs in an electrolytic bath containing nickel ions, cobalt ions, complexing agents, and an amino borane compound at a moderately low pH level and moderate temperature. An insoluble, solid catalyst, preferably palladium, causes the alloy to diffuse into the surface of the substrate and become bonded by a polar-covalent bond to it. Implements coated with the alloy, as well as plating solutions and methods for making the alloy are also disclosed.
    Type: Grant
    Filed: April 9, 1993
    Date of Patent: May 24, 1994
    Assignee: Diamond Technologies Company
    Inventor: Luis X. Caballero
  • Patent number: 5277789
    Abstract: A novel method for making metals and homogeneous metal alloys comprises the steps of (a) providing a polymetallic complex of the general formula(.mu..sub.4 -0)L.sub.4 M'M"M'"M""X.sub.nwherein L is a ligand selected from the group consisting of organic and inorganic ligands, wherein M', M", M'", and M"" are metal atoms two or more of which may be the same, wherein X is a halogen atom, and wherein n is an integer ranging from 4 to 6; and (b) electrochemically depositing at least one of the metals from said polymetallic complex.
    Type: Grant
    Filed: June 29, 1992
    Date of Patent: January 11, 1994
    Assignees: Tufts University, Northeastern University
    Inventors: Samuel P. Kounaves, Albert Robbat, Jr., Geoffrey Davies
  • Patent number: 5232575
    Abstract: Acid, electroplating baths having consistent leveler activity contain levelers which are quaternized near-monodisperse polymers of acrylic or methacrylic trialkyl amine esters. The polymers may contain hydroxyalkyl acrylate or methacrylate ester components, unquaternized acrylic or methacrylic amine component as well as other polymeric components.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: August 3, 1993
    Assignee: McGean-Rohco, Inc.
    Inventor: John R. Dodd
  • Patent number: 5203931
    Abstract: A process for preparing an indium-thallium alloy which exhibits shape memory transformation at a temperature greater than that temperature at which shape memory transformation would occur for a thermally prepared alloy of the same composition. The process includes providing an article for use as a cathode, providing an electrolyte which comprises indium and thallium ions, and electrodepositing an indium-thallium alloy having between about 21 and about 35 atomic percent thallium onto the article. A process for preparing an article constructed of an electrodeposited indium-thallium alloy which exhibits shape memory effect. An electrodeposited indium-based shape memory alloy.
    Type: Grant
    Filed: September 20, 1991
    Date of Patent: April 20, 1993
    Assignee: University of Missouri
    Inventor: Thomas J. O'Keefe
  • Patent number: 5182009
    Abstract: Plating is achieved by selecting such a pH value that an increase of the weight composition of a metal to be plated and a decrease of the weight composition of said metal to be plated upon plating are compensated each other, and employing a plating solution of said selected pH value for plating.
    Type: Grant
    Filed: January 23, 1991
    Date of Patent: January 26, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Sigeyuki Matumoto
  • Patent number: 5171419
    Abstract: The present invention disclosed metal-coated fibers and metal matrix composites made therefrom comprising metal-coated carbon or graphite fiber which have a layer of CoW or NiW alloy interposed between the fiber and its outer metal layer.
    Type: Grant
    Filed: January 18, 1990
    Date of Patent: December 15, 1992
    Assignee: American Cyanamid Company
    Inventors: Nea S. Wheeler, David S. Lashmore