Holder For A Removable Electrical Component Patents (Class 206/701)
  • Patent number: 5988391
    Abstract: An electronic parts casing which can be easily formed, which allows a reduction in size and which resists deformation. The electronic parts casing is composed of a frame member, an inner cover and an outer cover, and is divided into two chambers by a partition provided inside the frame member. On the outer side surfaces of the frame member, there are provided ridges for the engagement of the outer cover, and, in the periphery of the outer cover, there are provided detents to be engaged with the outer ridges of the frame member. On the top surface of the inner cover, there are provided outwardly convex draw surfaces, and, on the top surface of the outer cover, there is provided an outwardly convex draw portion, which has on its inner side an inwardly convex draw surface. The inner cover is placed in contact with the upper edges of the inner cover and of the partition.
    Type: Grant
    Filed: February 18, 1997
    Date of Patent: November 23, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masanori Tsubono
  • Patent number: 5984102
    Abstract: The invention provides a sealed package system for housing at least two medical electrode devices and for enabling the periodic testing thereof, comprising a thin, generally flat flexible envelope constructed and arranged to form an interior cavity for enclosing a conductive gel contact surface of each of the electrode devices. A conductive liner is disposed between conductive gel contact surface of each of the electrode devices.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: November 16, 1999
    Assignee: SurVivaLink Corporation
    Inventor: Sew-Wah Tay
  • Patent number: 5950837
    Abstract: A shipping kit assembly is disclosed for use in transporting circuit packs installed in electronic bays. The assembly kit includes a pair of spaced, upper and lower channel members which, together with a vertical band strap received in and retained thereby, are adapted to secure and support a plurality of circuit packs which are installed in shelf units or sub-racks for shipping or transporting therein. The bottom channel member incorporates a supporting bracket at each end therefor for securing and locating an attached circuit pack in a predetermined location in the shelf unit or sub-rack. One or more horizontal band straps may be used to secure the packs against movement in the shelf unit.
    Type: Grant
    Filed: July 7, 1998
    Date of Patent: September 14, 1999
    Assignee: Northern Telecom Limited
    Inventor: Robert John Barber
  • Patent number: 5927503
    Abstract: An apparatus for processing an integrated circuit device comprises at least one insert having at least one beveled hole therein, the insert adapted to receive at least one semiconductor device. The apparatus further includes a tray having a pocket for receiving the insert and a slot, a deformable segment on the insert, and at least three posts on the insert. Further included is at least one tab on the deformable segment with one of the slots receiving the tab. The slot in the tray and the tab on the insert movably attaches the insert to the tray, the insert being self-aligning to a processing apparatus thereby in conjunction with the posts and allowing for removal of the insert from the pocket.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: July 27, 1999
    Assignee: Micron Technology, Inc.
    Inventors: Leland R. Nevill, William C. Layer, Steven L. Hamren, Gregory A. Barnett
  • Patent number: 5924266
    Abstract: An apparatus, means and system are described for providing a load center container apparatus for use with a load center, in which a container is adapted to receive a load center, wherein the container has a plurality of sides, an open top and a closed bottom, and a cover adapted to cover said open top of the container, wherein the container apparatus has a removable load center protector that is adapted for mounting on a load center. A method is also described for providing a method for protecting a load center using a load center packaging assembly having a load center protector.
    Type: Grant
    Filed: August 19, 1997
    Date of Patent: July 20, 1999
    Assignee: Siemens Energy & Automation, Inc.
    Inventor: Reynoldo Salvador
  • Patent number: 5911326
    Abstract: The object of the present invention is to provide a tray for inspecting the surfaces of semiconductor wafers, which can enhance the success at visually identifying flaws on the edge of the semiconductor wafer and can reduce the irregular reflection occurring in the tray. According to this invention, the tray for inspecting the surfaces of semiconductor wafers of this invention includes a panel-shaped tray body 1; and a support frame 3 installed on the surface of the tray body vertically, capable of loading a semiconductor wafer 5 in a manner elevated from and parallel with the tray body 1.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: June 15, 1999
    Assignee: Komatsu Electronic Metals Co., Ltd.
    Inventor: Hiroshi Ikeda
  • Patent number: 5909812
    Abstract: A container for storing and transporting articles, such as leadframes. The container includes a base with a planar wall having an upwardly facing surface defined by a peripheral edge, and at least two upwardly extending, opposite posts secured to the upper surface of the planar wall. The posts are spaced interiorly from the peripheral edge of the upwardly facing surface wherein each post has an outwardly facing surface and an inwardly facing surface that is tapered outwardly from the top of the post to the bottom of the post. The articles are positioned between the inwardly facing surfaces of the posts. A cover is releasably securable to the planar wall of the base. The cover includes a top wall and a peripheral, downwardly extending wall formed to the outer periphery of the top wall. The peripheral wall is positioned adjacent the peripheral edge of the upwardly facing surface of the base and outwardly with respect to the posts of the base when securing the cover to the base.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: June 8, 1999
    Assignee: Plastic Development, Inc.
    Inventor: Normand Thibaudeau
  • Patent number: 5884772
    Abstract: A portable electronic device (100) includes a housing cover (110) having a faceplate location (145), an electronic circuit (115), and a first faceplate (140). The location comprises a generic controls cutout (135) and a generic display cutout (130). The electronic circuit includes a specific set of controls (125) fitting within the generic controls cutout and a specific display (120) fitting within the generic display cutout. The first faceplate (140) is mounted in the faceplate and has a specific controls cutout (155) that is conformal to the set of specific controls (125) and a specific display lens (150) that is conformal to the specific display (120) and is one of a set of faceplates, wherein the first faceplate (140) is incompatible with another faceplate in the set of faceplates.
    Type: Grant
    Filed: September 4, 1997
    Date of Patent: March 23, 1999
    Assignee: Motorola, Inc.
    Inventors: Michael Richard Floyd, Rebecca Lynn Parsons
  • Patent number: 5885676
    Abstract: A plastic tube and a method and apparatus for forming it in which a strip of relatively thin plastic sheet material is cut from a roll of the material and wound around a mandrel. Overlapping ends of the strip are sealed to form the tube. The edge of the strip is inwardly bent to form an inwardly extending lip. When used in the manufacture of a capacitor, the tube is placed in a can on top of the disc of insulating material and a capacitor roll is placed in the tube. The edge of the sheet material can be pre-creased so that when folded inwardly, darts of the material form the lip.
    Type: Grant
    Filed: July 6, 1995
    Date of Patent: March 23, 1999
    Assignee: Magnetek, Inc.
    Inventors: Edward M. Lobo, Raymond H. Vanwagener
  • Patent number: 5881883
    Abstract: A protective package is disclosed, in particular a package for transporting electrosensitive contents such as electronic components. The package includes a folded inner sheet disposed within a folded outer sheet. The two sheets are sealed together forming an inner pouch and at least one outer pouch. The inner pouch, which is used to contain the primary contents of the package, is defined by the folded inner sheet and the outer pouch, which is used to contain supporting documentation and material, is defined by both the inner and outer folded sheets. The inner sheet is made of a material, such as a laminate, which provides the contents of the inner pouch with additional protection from environmental factors such as static electricity, electromagnetic radiation or electric fields.
    Type: Grant
    Filed: May 23, 1997
    Date of Patent: March 16, 1999
    Inventor: Burt A. Siegelman
  • Patent number: 5853079
    Abstract: A chip feed apparatus capable of permitting a chip feed casing to be used for storage and transportation of chips in a distribution channel as well and preventing a weight of chips from being applied to a chip storage space of a hopper, resulting in positive separation and feeding of chips by the hopper. The chip feed apparatus includes a chip feed casing formed on a side surface thereof with a chip outlet, a hopper formed on a side surface thereof with a chip inlet and connected to the chip feed casing while enabling vertical movement of the hopper, a chip separating and aligning pipe inserted into a hole communicating with the chip storage space, and a chip feed path of which one end communicates with the chip separating and aligning pipe and the other end is defined at a chip pick-up position. The chip outlet of the chip feed casing is open at a lowermost end of a chip receiving space or below the lowermost end.
    Type: Grant
    Filed: February 9, 1996
    Date of Patent: December 29, 1998
    Assignee: TDK Corporation
    Inventors: Tsuyoshi Ito, Tetsuro Ito, Masayoshi Kobayashi
  • Patent number: 5850920
    Abstract: The invention provides a sealed package system for housing at least one medical electrode apparatus and for enabling the periodic testing thereof, comprising a thin, generally flat flexible envelope constructed and arranged to form an interior cavity for enclosing a conductive gel contact surface of an electrode apparatus, the envelope having at least one continuous layer of a homogeneous, non-conductive, polymeric material, the envelope further having first and second sides; and a structure for conducting current across the envelope to the interior cavity, the conductive structure being electrically connectible to the electrode conductive contact surface.
    Type: Grant
    Filed: September 11, 1996
    Date of Patent: December 22, 1998
    Assignee: SurVivaLink Corporation
    Inventors: Byron L. Gilman, Karl J. F. Kroll
  • Patent number: 5837934
    Abstract: A shock insulated container for a disk drive features a plastic enclosure having a top hingedely secured to a bottom. The enclosure is formed of anti-static materials. A foam liner is provided to surround the hard drive. The drive and liner are encapsulated in the container, which is secured, using press fit projections. The package may then be mounted to a commercial type video game machine.
    Type: Grant
    Filed: December 2, 1996
    Date of Patent: November 17, 1998
    Assignee: Midway Games Inc.
    Inventors: Theodore N. Valavanis, Keith A. Novak
  • Patent number: 5811184
    Abstract: A particle getter is presented for protecting electronic circuitry from damage caused by particles or debris. An adhesive film is used to capture and retain particles, such as solder balls and wire trimmings, that pose a danger to the functioning of electronic circuitry, and thereby prevent short circuits and other malfunctions. The particle getter does not interfere with access to the circuitry, and thus may be used when conformal coating is not practicable. The particle getter is particularly useful for protecting electronic circuitry aboard a spacecraft, since particles that can cause a circuit malfunction float freely in the zero-gravity environment, where they can be captured and retained by the getter. The preferred adhesive film is space-qualified, and has outgassing properties that are within limits imposed by NASA specifications. The particle getter has applications in many places where debris is present, both in space and earthbound.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: September 22, 1998
    Assignee: Hughes Electronics Corporation
    Inventors: Edward A. Anderson, Mitchell T. Hatai, Mehrdad Mohtasham
  • Patent number: 5779055
    Abstract: An environmentally sensible package for delicate items comprises a base and a cover. The package is enclosed by a container such as a corrugated box for shipping. The base of the preferred embodiment comprises a central component cavity suspended by a perimeter portion comprising a cover interlock, a flexible surface, a sloped wall and four independent flanges. The perimeter portion provides necessary vertical and lateral flexibility to the component cavity and provides the vertical clearance required for displacement of the component cavity. The independent flanges reduce transmitted shock to the component cavity by flexing upon impact without transmitting the shock to adjacent flanges through the corner portion.The package is made of a rigid plastic such as PVC to reduce bulk and make recycling more economical compared to expanded foam packaging. The use of a clear material allows viewing of the protected component when enclosed by the package.
    Type: Grant
    Filed: March 5, 1997
    Date of Patent: July 14, 1998
    Assignee: Stephen Gould Paper Co., Inc.
    Inventor: Curtis R. Lacy, III
  • Patent number: 5759649
    Abstract: The packaging container according to the invention for receiving filled product can be used as a self-supporting container or as an in-liner or insert container in supporting outer containers such as corrugated paperboard boxes, wooden cases, box pallets with mesh panels, or drums. The packaging container comprises a multilayered composite film combination which is made up of a polymer film with barrier layer properties, acting as the outer layer of the container, an intermediate layer made of an electrically conductive material and also a further polymer film, forming the inner layer of the packaging container. According to the invention, the further polymer film, forming the inner layer of the packaging container, bears a perforation pattern and the electrically conductive intermediate layer is in connection with a grounding system via electric contact points. The polymer film forming the inner layer of the packaging container is preferably a heat-sealable monofilm or a coextruded film.
    Type: Grant
    Filed: August 30, 1995
    Date of Patent: June 2, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Peter Dinter, Joachim Nowotnick
  • Patent number: 5735408
    Abstract: A cassette storing electronic components, which is employed for supplying a plurality of electronic components to an apparatus for mounting electronic components, comprises a plurality of electronic components and a case having a storage space provided in its interior for storing the electronic components and a discharge port communicating with the storage space for discharging the electronic components. In this cassette storing electronic components, the case is provided with a plurality of plate type baffle walls for partially blocking the storage space. Consequently, movement of the electronic components in the case can be suppressed by the baffle walls even if the cassette is extremely moved in a state attached to a mounting machine. Thus, the electronic components as well as the case can be inhibited from reduction in quality, while the number of reusable times of the case can be increased.
    Type: Grant
    Filed: April 4, 1997
    Date of Patent: April 7, 1998
    Assignee: Murata Manufacturing Co, Ltd.
    Inventors: Kenichi Fukuda, Toshikuni Hisaki
  • Patent number: 5715143
    Abstract: A carrier system for an integrated circuit carrier assembly composed of a carrier member supporting an integrated circuit. The carrier system enables a number of carrier assemblies to be flexibly and sequentially interconnected, so as to form a flexible and continuous chain of carrier assemblies. The carrier system is characterized by interconnecting the carrier assemblies with a single tape that facilitates accurate alignment and placement of the carrier assemblies within the carrier system, and minimizes the risk of an adhesive buildup on the equipment used to handle the carrier system and separate the carrier assemblies from the carrier system.
    Type: Grant
    Filed: July 22, 1996
    Date of Patent: February 3, 1998
    Assignee: Delco Electronics Corporation
    Inventors: John W. McHugh, Patricia Louise Jones
  • Patent number: 5697955
    Abstract: A package of defibrillator electrodes having a date indication element and a circuit for determining a date of manufacture of medical electrodes within the package is provided. Specifically, by the circuit and package design of the present invention, the presence of a fresh package of electrodes can be detected. A circuit detectable package of medical electrodes is provided including first and second electrodes within the package. An electrical interconnection means is provided between the first and second electrodes for electrically completing a circuit connecting the lead wire of the first electrode to the lead wire of the second electrode, and includes a date identification element which when subjected to an applied voltage by way of the lead wires generates a measurable affect representative of the manufacturing period of the defibrillator electrodes. The date identification element may comprise a passive element, a value of which represents a date and can be measured.
    Type: Grant
    Filed: May 10, 1996
    Date of Patent: December 16, 1997
    Assignee: SurVivaLink Corporation
    Inventor: John F. Stolte
  • Patent number: 5651821
    Abstract: The battery disposal and collection apparatus includes a terminal connection having a terminal electrode pressed by a pressing structure on an upper cover, a battery guide case having a battery container to which the terminal electrode is inserted when the upper cover is closed, and which contains batteries, a rotary plate having an electrode terminal and a battery dropping hole on the plane of a rotary plate under the battery guide case. The electrode terminal contacts the terminal of a battery at the side opposite to the one at the terminal electrode when the terminal of the battery contained in the battery container contacts the terminal electrode. A battery discharger discharges current flowing between the terminal electrode contacting the terminal of the battery contained in the battery container and the electrode terminal. A battery receiver stores the battery which is discharged by the battery discharger and dropped through the battery dropping hole of the rotary plate.
    Type: Grant
    Filed: June 27, 1995
    Date of Patent: July 29, 1997
    Assignee: Ricoh Company, Ltd.
    Inventor: Shirou Uchida
  • Box
    Patent number: 5621387
    Abstract: A box for covering components or the like and for preventing unwanted access thereto. The box comprises a mounting panel having a pair of opposed sides, a top portion, a bottom portion and a back portion. The back portion is adapted to receive a fastener for mounting the mounting panel to a mounting surface. A cover fastener is received within the mounting panel. A slot is formed in the mounting panel and a corresponding tang is located within the cover which is adapted to receive an alarm device therein and removably envelop the mounting panel. A second opening is located in the cover for receiving the cover fastener when said mounting panel is enveloped within the cover.
    Type: Grant
    Filed: August 8, 1995
    Date of Patent: April 15, 1997
    Assignee: Elk Products, Inc.
    Inventors: Kirk B. Phillips, Patrick K. Strong, J. Michael McRee, David C. Steele
  • Patent number: 5590787
    Abstract: A structure for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die atop an ultra-violet (UV) light penetratable plate using a UV light sensitive adhesive layer. Once the structure reaches its destination, prior to removal of the die, the adhesive layer is exposed to ultraviolet light. This exposure reduces the adhesiveness or coefficient of friction of the layer, thereby facilitating die removal from the structure. The UV sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and a modified die-pac having a UV light penetratable window.
    Type: Grant
    Filed: January 4, 1995
    Date of Patent: January 7, 1997
    Assignee: Micron Technology, Inc.
    Inventor: Joe Hodges
  • Patent number: 5579919
    Abstract: The invention provides a sealed package system for housing at least one medical electrode apparatus and for enabling the periodic testing thereof, comprising a thin, generally flat flexible envelope constructed and arranged to form an interior cavity for enclosing a conductive gel contact surface of an electrode apparatus, the envelope having at least one continuous layer of a homogeneous, non-conductive, polymeric material, the envelope further having first and second sides; and a structure for conducting current across the envelope to the interior cavity, the conductive structure being electrically connectible to the electrode conductive contact surface.
    Type: Grant
    Filed: March 27, 1995
    Date of Patent: December 3, 1996
    Assignee: SurVivaLink Corporation
    Inventors: Byron L. Gilman, Karl J. F. Kroll
  • Patent number: 5577617
    Abstract: High voltage circuitry often requires assembling an array of high voltage devices that are electrically isolated from one another. A lead frame that fits within conventional plastic packaging has been designed that will allow electrical isolation of the substrates of two or more transistors mounted together in a single package.
    Type: Grant
    Filed: December 29, 1995
    Date of Patent: November 26, 1996
    Assignee: Xerox Corporation
    Inventors: Mohammad M. Mojarradi, Dennis W. Sandstrom, Tuan A. Vo, Abdul Elhatem
  • Patent number: 5545494
    Abstract: An environmental protector for electronics devices in outside terminal boxes. The protector has a laminate wall which provides a moisture barrier, penetration resistant surface and EMI shield. The protector may be flexible or substantially rigid and is in the form of an open-ended container for receiving an electronics device. The container is sealed at the open end around a connector unit of the device with outgoing terminals accessible for connection purposes. The device may be potted within the container. Conveniently, the EMI shield is connected to ground by a ground element in the connector unit.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: August 13, 1996
    Assignee: Northern Telecom Limited
    Inventors: William P. Trumble, Mark R. Harris, Adrianus P. Van Gaal
  • Patent number: 5524766
    Abstract: A packaging system is disclosed for storing and handling electrical connector components and the like. The system employs a plurality of elongated component-containing tubes. Each tube has an aperture near at least one end thereof. An assembly rod passes through aligned apertures of a plurality of generally parallel juxtaposed tubes to hold the tubes in a generally stacked array. A stopper plug is adapted for insertion into the one end of each tube to retain the components therein. The assembly rod interengages each stopper plug, whereby all of the stopper plugs are held in their respective tubes by the assembly rod, and removal of the rod from the tubes pulls the stopper plugs out of the one ends of the tubes.
    Type: Grant
    Filed: June 27, 1995
    Date of Patent: June 11, 1996
    Assignee: Molex Incorporated
    Inventors: Kyle J. Marchek, Timothy R. McClelland
  • Patent number: 5499717
    Abstract: An embossed carrier tape system includes a carrier tape having formed therein a number of pockets spaced at equal intervals longitudinally of the carrier tape for accommodating surface mountable electronic parts. A cover tape extends along the length of the carrier tape in superposition thereover on the side where the pocket opening is provided. The cover tape is provided with an engagement wall adapted to be in contact engagement with the inner walls of the corresponding pockets, and is further provided with a buffer (8) expandable longitudinally of the cover tape and extending transversely of the length of the cover tape at locations over the web portions of the carrier tape between adjacent pockets, whereby the need for adhesively bonding the cover tape and the carrier tape is eliminated.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: March 19, 1996
    Assignee: Yayoi Corporation
    Inventor: Toshisumi Hayashi
  • Patent number: 5477963
    Abstract: An ink tank cartridge is provided removably mountable onto an ink supply needle of the ink-jet type recording apparatus body. The cartridge has a housing provided with an ink supply port extending through and projecting from a wall of the housing and into the chamber of the housing. A porous member having ink impregnated thereon is positioned inside the chamber of the housing abutting against the ink supply port. A filter is mounted on the inner end opening of the ink supply port. The ink tank cartridge is further provided with a packing member for resiliently abutting against the outer periphery of the ink supply needle and is positioned adjacent one end of the ink supply port. The outer opening of the ink supply port is sealed with a sealing member through which the ink supply needle penetrates.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: December 26, 1995
    Assignee: Seiko Epson Corporation
    Inventors: Seiji Mochizuki, Kuzuhisa Kawakami, Masahiro Nakamura, Keiichi Ohshima, Masanori Yoshida
  • Patent number: 5476174
    Abstract: An IC carrier comprising first and second blocks, the second block is relatively movably engaged in the second block; first and second side regulation portions formed on the first and second blocks, respectively, and adapted to pressure contact opposite side faces of an IC in the sense of a lateral direction of the IC, respectively; a bottom regulation portion formed on at least one of the first and second side regulation portions and adapted to support a bottom face of the IC captured between the first and second side regulation portions; and a spring disposed between the first and second blocks such that the first and second blocks are normally biased and relatively slid, by a resilient force of the spring, in a direction reducing a distance between the first and second side regulation portions, so that the first and second side regulation portions are brought into pressure contact with the opposite side faces of the IC when the IC is inserted into the carrier.
    Type: Grant
    Filed: March 11, 1994
    Date of Patent: December 19, 1995
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Kazumi Uratsuji
  • Patent number: 5462157
    Abstract: An electrode package in which one or more adhesively-applied skin electrodes may be sealed has an envelope that includes a sheet of material and a releasable seal joining portions of the envelope to provide a sealed first compartment in which an electrode may be isolated from an external environment. The envelope includes a first wall that defines a first interior surface facing the interior of the sealed first compartment. The first interior surface includes an electrode mounting surface for direct attachment of an adhesive portion of an electrode. The envelope is releasably sealed so that, when the envelope is sealed, the first interior surface is isolated from an external environment and, when the envelope is unsealed, the first interior surface is not isolated from the external environment.
    Type: Grant
    Filed: October 28, 1993
    Date of Patent: October 31, 1995
    Assignee: ZMD Corporation
    Inventors: Gary A. Freeman, Ward M. Hamilton