Of Group Iii-v Compound (epo) Patents (Class 257/E21.289)
  • Patent number: 7939454
    Abstract: A method for packaging solar cell module. The method includes providing a first substrate member and forming a plurality of thin film photovoltaic cells overlying the surface region of the first substrate member. A first connector member and a second connector member having a second thickness are operably coupled to each of the plurality of thin film photovoltaic cells. A first spacer element and a second spacer element overly portions of the surface region of the first substrate member. The method provides a laminating material overlying the plurality of thin film photovoltaic cells, the spacer elements, and the connector members. A second substrate member overlies the laminating material. A lamination process is performed to form the solar cell module by maintaining a spatial gap occupied by the laminating material between an upper surface regions of the connector members and the second substrate member using the spacer elements.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: May 10, 2011
    Assignee: Stion Corporation
    Inventor: Chester A. Farris, III