Characterized By Shape Of Container Or Parts, E.g., Caps, Walls (epo) Patents (Class 257/E23.181)

E Subclasses

Container being hollow construction having no base used as mounting for semiconductor body (epo) (Class 257/E23.182)
Container being hollow construction and having conductive base as mounting as well as lead for the semiconductor body (epo) (Class 257/E23.183)
Container being hollow construction and having insulating or insulated base as mounting for semiconductor body (epo) (Class 257/E23.188)
  • Electrically isolated and thermally conductive double-sided pre-packaged component
    Patent number: 7095098
    Abstract: An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable copper material are directly bonded to the inner and outer surfaces of the substrate members.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: August 22, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Erich William Gerbsch, Ralph S. Taylor
  • Electrically isolated and thermally conductive double-sided pre-packaged component
    Patent number: 6812553
    Abstract: An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable cooper material are directly bonded to the inner and outer surfaces of the substrate members.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: November 2, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: Erich William Gerbsch, Ralph S. Taylor