Abstract: In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract: A manufacturing method of touch display device includes steps of: providing a liquid crystal display unit and disposing at least one printed circuit layer on a display surface of the liquid crystal display unit; electrically connecting multiple transmitters and multiple receivers onto the printed circuit layer; positioning the liquid crystal display unit in a receiving space of a case; and providing a frame body and mounting the frame body onto the case to cover the printed circuit layer. The printed circuit layer is directly formed on the display surface of the liquid crystal display unit so that the cost for the circuit boards is saved. In this case, the manufacturing cost of the touch display device is lowered. Moreover, the total thickness of the touch display device is reduced and the installation is facilitated.

Abstract: A method for manufacturing an electronic device includes a through electrode forming step of forming a through electrode on an insulating base substrate; an electronic element mounting step of mounting an electronic element on one surface of the base substrate; a cover body placing step of bonding a cover body accommodating the electronic element; a conductive film forming step of forming a conductive film on the other surface of the base substrate and on an end face of the through electrode exposing on the other surface; an electrode pattern forming step of forming an electrode pattern on the end face of the through electrode and on the surface of the periphery of the end face while leaving the conductive film; and an external electrode forming step of forming an external electrode by accumulating an electroless plated film on the surface of the electrode pattern by an electroless plating method.

Abstract: An electronic device includes a glass substrate, an electronic element mounted on one surface of the glass substrate, a cover body covering the electronic element and bonded to the glass substrate and a through electrode penetrating from one surface to the other surface of the glass substrate. The through electrode is composed of an iron-nickel based alloy and; and a nickel film is formed on an end face of the through electrode exposing on the other surface of the glass substrate and on the other surface of the glass substrate located in the vicinity of the end face.

Abstract: The purpose of the present invention is to improve the heat dissipation propert(ies) of the circuit board and/or an optical module while securing a sufficient mounting area of a circuit board. An optical transmitter/receiver apparatus includes a case including a base and a cover, a circuit board and an optical module. The circuit board is housed in the case and is fixed to the base. The optical module is housed in the case, is arranged on a side opposite to the base relative to the circuit board, and is fixed to the cover.

Abstract: A mounting method for a circuit board. The circuit board is formed with pilot holes that are placed onto pilot pins of a tool such that the pilot pins protrude through and beyond the circuit board. Then the tool is displaced toward a circuit board holder of the housing whereupon the pilot pins engage with a form fit in corresponding centering holes of the circuit board holder. After fixing the circuit board in the housing, the tool is withdrawn by detaching the pilot pins from the pilot holes, the circuit board remaining in the circuit board holder. The tool has an upper plate with associated pilot pins and a lower plate with a housing holder for positioning the housing. The circuit board, with the pilot pins engaging the pilot holes, is displaced by moving the upper plate toward the lower plate.

Abstract: An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate (13) is carried in from the substrate distributing unit (M3B) into conveyors (10A, 10D) which are closest to the component supplying units (20A, 20B) among the conveyors (10A, 10B, 10C, 10D).

Abstract: A transformer assembly includes a first circuit board, a transformer electrically coupled to the first circuit board, and a terminal block moveably connected to the transformer and moveable relative to the transformer in at least a first direction. The terminal block includes a terminal. The transformer includes a magnetic core and a winding having a winding wire extending from the winding. The winding wire is electrically coupled to the terminal of the terminal block. The transformer assembly further includes a second circuit board electrically coupled to the terminal of the terminal block. Example embodiments and related methods of manufacturing a transformer assembly are also disclosed.

Abstract: A lighting module includes a ribbon-like containment body with a web wall having a first and a second face opposite to each other and a pair of side walls extending sidewise of the first face of the web wall to define a channel-like shape of the containment body, a ribbon-like mounting board for mounting light radiation sources, the mounting board being arranged in the channel-like shape of the containment body with a mounting surface facing away from the first face of the web wall of the containment body, and a light radiation source mounted on the mounting surface of the board for projecting light radiation from the channel-like shape of the containment body. The lighting module includes a pair of hook-like profiles protruding from and along the second face of the web wall of the containment body to permit mounting of the lighting module by hooking to a mounting element.

Abstract: A control panel for an appliance is provided. The control panel can be produced by providing a dielectric substrate having a front surface and a back surface, printing a conductive ink onto the back surface of the dielectric substrate, curing the conductive ink such that the conductive ink forms a plurality of capacitive sensors on the back surface of the dielectric substrate, and positioning the dielectric substrate on the appliance such that the front surface of the dielectric substrate faces outwardly.

Abstract: An XMR-sensor and method for manufacturing the XMR-Sensor are provided. The XMR-sensor includes a substrate, a first contact, a second contact and an XMR-structure. The substrate includes a first main surface area and a second main surface area. The first contact is arranged at the first main surface area and the second contact is arranged at the second main surface area. The XMR-structure extends from the first contact to the second contact such that an XMR-plane of the XMR-structure is arranged along a first direction perpendicular to the first main surface area or the second main surface area.

Abstract: A multi-chip socket includes multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. The different heights may be based on a height of a first component to be disposed in the first cavity and a height of a second component to be disposed in a second cavity.

Abstract: A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.

Abstract: The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device.

Abstract: A supplementary element sized and shaped to fit between a back side of a handheld device and a handheld device cover. The supplementary element comprises a board having at least one electronic component which are permanently assembled, the board is sized and shaped to fit between a back side of a handheld device and a handheld device cover while the handheld device cover is tightly coupled to a lateral side of the handheld device, the lateral side having an opening of a lateral female connector, a connector element having a male connector that is electronically connected to the at least one electronic component and configured to be connected to the lateral female connector, and a lateral mount mechanically connected to the board and fixates a tip of the male connector to face the lateral female connector when the board is placed over and in parallel to the back side.

Abstract: An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture.

Abstract: The present invention relates to an area-saving driving circuit for a display panel, which comprises a plurality of digital-to-analog converting circuits convert input data, respectively, and produce a pixel signal. A plurality of driving units are coupled to the plurality of digital-to-analog converting circuits, respectively. They produce a driving signal according to the pixel signal and transmit the driving signal to the display panel for displaying. A plurality of voltage booster units are coupled to the plurality of driving units, respectively, and produce a supply voltage according to a control signal. Then the supply voltage is provided to the plurality of driving units. Thereby, by providing the supply voltage to the plurality of driving units of the display panel by means of the plurality of voltage booster units, the area of the external storage capacitor is reduced. Alternative, the external storage capacitor can be even not required.

Abstract: Various approaches discussed herein provide a display screen that integrates both capacitive touch sensing and a light guide onto a single optically clear substrate. The substrate can be integrated into a portable device, such as an electronic reader (e-reader) device having a reflective display in order to both illuminate content displayed on the e-reader device and to provide touch sensing input to the device. The capacitive sensors can be fabricated on one side of the optically clear substrate, while the light guide can be fabricated on the opposite side of the substrate.

Abstract: The present invention relates to a driving circuit of a display panel. A plurality of driving units produce a reference driving voltage according to a gamma voltage of a gamma circuit, respectively. A plurality of digital-to-analog converting circuits receive the reference driving voltages output by the plurality of driving units, and select one of the plurality of reference driving voltage as a data driving voltage according to pixel data, respectively. The plurality of digital-to-analog converting circuits transmit the plurality of data driving voltages to the display panel for displaying images. A voltage boost circuit is used for producing a first supply voltage and providing the first supply voltage to the plurality of digital-to-analog converting circuits. At least a voltage boost unit is used for producing a second supply voltage and providing the second supply voltage to the plurality of driving units.

Abstract: A device including a port barrel, a ball spring, a first enclosure part, and a mounting plate disposed adjacent to the first enclosure part is disclosed. The mounting plate includes a mounting hole. The port barrel is arranged to extend through the mounting hole, and the ball spring is arranged between an inner surface of the mounting hole and an exterior surface of the port barrel.

Abstract: An electronic circuit component is provided with shielding for electromagnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied.

Abstract: A component mounting apparatus including: plural spindles respectively including nozzles, each spindle rotating about a first pivot and each nozzle picking up a component; a head body rotating about a second pivot substantially parallel to a first pivot and rotatably supporting the spindles; and a controller controlling the spindles and the head body to perform: a pickup operation in which the spindle rotates about the first pivot from an initial orientation to a pickup orientation, the nozzle picks up the component, and the spindle rotates from the pickup orientation to the initial orientation so that the component is oriented to a mounting orientation at which the component is to be mounted on a substrate; and a mounting operation in which the picked-up component is transferred to a mounting position of the substrate during which each spindle is retained at the initial orientation.

Abstract: A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.

Abstract: A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.

Abstract: A workstation with a housing having a upright window and a horizontal window includes a printed circuit board having at least two imaging sensors thereon located in the housing, and a controller operative to read a barcode in a captured image. The workstation also includes a chassis firmly mounted on the printed circuit board, and two inserts each configured to hold steadily one of at least two lens assemblies. At least one of the two inserts includes multiple slots for attaching such insert to the chassis at a position that is laterally adjustable.

Abstract: A method comprising coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF), wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz. An apparatus comprising, an opto-electronic package comprising a plurality of first electrodes, and a circuit comprising a plurality of second electrodes, wherein at least one of the first electrodes is coupled to at least one of the second electrodes via an ACF, and wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 GHz to about 40 GHz.

Abstract: Disclosed herein is a printed circuit board including: a base substrate in which a connection pad is formed; a solder resist layer formed on the base substrate and comprising a trench exposing a surface of the base substrate; and a dam formed on the solder resist layer and burying the inside of the trench.

Abstract: A mechanism is described for facilitating and employing a magnetic grid array according to one embodiment. A method of embodiments may include engaging, via magnetic force of a magnet, magnetic contacts of a magnetic grid array to substrate lands of a package substrate of an integrated circuit package of a computing system, and disengaging, via a removal lever, the magnetic contacts from the substrate lands.

Abstract: The present invention relates to a BAW filter operating with bulk acoustic waves, which has a multilayer construction, wherein functional layers of a BAW resonator operating with bulk acoustic waves are realized by the multilayer construction, and wherein an interconnection of passive components is furthermore formed by the multilayer construction, said interconnection forming a balun, wherein the balun has at least one inductance (L1, L2, L3) and at least one capacitance (C1, C2) which are formed from structured functional layers of the BAW resonator. Furthermore, the invention relates to a method for producing the BAW filter.

Abstract: A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on a surface of the first build-up insulating layer.

Abstract: Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers.

Abstract: Disclosed are methods and systems to reduce voltage noise on a printed circuit board (PCB) through a co-layout of multilayer ceramic capacitors. In one or more embodiments, this surface mounted layout comprises a first co-layout of multilayer ceramic capacitors mounted on a first corner of a rectangular footprint of a bottom side of the PCB; a second co-layout of multilayer ceramic capacitors mounted on a second corner of the rectangular footprint diagonal to the first corner; and a first solid electrolytic polymer capacitor and a second solid electrolytic polymer capacitor mounted on the remaining corners, respectively, of the rectangular footprint. The rectangular footprint of the PCB is a footprint of a high-speed processing unit mounted on the PCB. The high-speed processing unit is mounted on a top side of the PCB opposite the bottom side comprising the first co-layout of multilayer ceramic capacitors and the second co-layout of multilayer ceramic capacitors.

Abstract: A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of the second surface of the first insulating layer to the outside. The second wiring layer includes electrical contact pads. The conductive blind vias are formed in the first insulating layer. Each electrical contact pad is electrically connected to an end of the corresponding conductive blind via. The other ends of the conductive blind vias are adjacent to the first surface. A filling through hole is formed in the double-sided wiring board. The conductive pastes are respectively electrically connected to the conductive blind vias. The electronic component is adhered to and electrically connected to the conductive paste.

Abstract: There are provided a 3D touch control liquid crystal lens grating, a manufacturing method thereof and a 3D touch control display device. The 3D touch control liquid crystal lens grating comprises: a lower substrate, including a lower transparent substrate and a plane electrode formed on the lower transparent substrate; an upper substrate, which is cell-assembled with the lower substrate and includes an upper transparent substrate and strip-shaped electrodes formed on the upper transparent substrate; and liquid crystal, filled between the plane electrode and the strip-shaped electrodes, wherein at least one touch control electrode is disposed between the upper transparent substrate and the strip-shaped electrodes, and a transparent spacer layer is disposed between the touch control electrode and the strip-shaped electrodes.

Abstract: An optical module apparatus and method operates at high temperatures. The apparatus has a first printed circuit board with optoelectronics and electronics located on a thermoelectric cooler. The thermoelectric cooler is located on a second printed circuit board that also has electronics that control the thermoelectric cooler separately mounted thereon. The optical module operates at substantially higher temperatures by placing the optoelectronics and the electronics, not including the thermoelectric cooler controller, on the thermoelectric cooler. The electronics controlling the thermoelectric cooler only require relatively simple, low-speed electronics that are implemented in integrated circuit technologies. The integrated circuit electronics may operate at very high temperatures (200° C. or higher) thereby making control of the thermoelectric cooler with uncooled electronics possible.

Abstract: A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component.

Abstract: A fabricating process for a multi-layer printed circuit board containing embedded passive components is provided. The method includes a calibration step wherein a calibration measurement is taken of the geometry or at least one electrical parameter of an arrangement of calibration test points for a circuit forming process, such as masking, etching and/or lamination. A process control step is performed during the process, wherein a process control measurement is taken of at least one electrical parameter at one or more process control test points along one or more axes outside areas in which a circuit is to be formed. An analysis is performed of at least the calibration measurement and the process control measurement to calculate a CAD geometry change required to improve precision of embedded passive components to be printed on the multi-layer printed circuit board.

Abstract: A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

Abstract: A method for manufacturing a printed circuit board including providing a first resin substrate having a resin plate and a circuit pattern formed on a surface of the resin plate, providing a second resin substrate having a resin plate and an accommodation portion formed in the resin plate of the second substrate, connecting an electrode of a capacitor to the circuit pattern of the first substrate with a bonding material such that the capacitor is mounted to the first substrate, attaching the second substrate to the resin substrate through a bonding resin layer such that the capacitor on the first substrate is accommodated in the accommodation portion of the second substrate, and forming a via hole in the first substrate such that the via hole is electrically connected to the electrode of the capacitor in the accommodation portion of the second substrate.

Abstract: Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.

Abstract: Disclosed herein is a printed circuit board, including: a base substrate; a non-photosensitive insulating layer formed on the base substrate; a circuit pattern formed on the base substrate and having an upper portion protruded from an upper portion of the non-photosensitive insulating layer; and a dam made of a photosensitive material and formed on the upper portion of the non-photosensitive insulating layer of an outer side of the base substrate.

Abstract: A main board, comprising a first set of memory slots, the first set of memory slots comprising a first channel and a second channel disposed in parallel with each other, and each of the first channel and the second channel comprising a first type of slot and a second type of slot respectively, wherein the first type of slot and the second type of slot of the first channel are disposed at a first side and a second side of the first channel respectively, the first type of slot and the second type of slot of the second channel are disposed at a first side and a second side of the second channel respectively, and the first side of the first channel is adjacent to the first side of the second channel.

Abstract: A light is provided and a method is provided for manufacturing a light, with a carrier element, an illuminating device disposed on the carrier element with a circuit board and an illuminant mounted on the circuit board, and an optic. The one of the optics and the carrier element comprises at least one positioning element, which passes through an opening in the circuit board and engages in a recess in the other of the optics and the carrier element.

Abstract: The present disclosure provides techniques for decreasing vertical crosstalk in a stripline. An apparatus may include a conductor bracketed by ground layers. The conductor may have a horizontal crosstalk. A vertical component may be coupled to the conductor. The vertical component may have a vertical crosstalk cancelled by the horizontal crosstalk.

Abstract: Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.

Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.

Abstract: A flexible display comprises a display panel that includes a flexible substrate and subpixels formed in a display area defined on a surface of the flexible substrate. A data driver is mounted to a data driver area defined on the surface of the flexible substrate. The flexible display can have a connector mounted to a connector area defined on the surface of the substrate. A bent portion of the flexible substrate is between the display area and the connector area and causes the connector area to be bent back towards an other surface of the flexible substrate. A system board can further be electrically connected to the connector mounted on the connector area through a cable.

Abstract: A socket is provided that is configured to be secured to a surface of a host circuit board by solder using a solder reflow process. The solder reflow process that is used for this purpose may be the same solder reflow process that is used to make electrical connections between the array of electrical contacts disposed on the lower surface of the socket and the array of electrical contacts disposed on the upper surface of the host CB. Because the solder reflow process is an automated process, the process of securing the socket to the surface of the host CB does not have to be performed manually, but can be performed automatically as part of a typical automated surface mount technology (SMT) process of the type that is typically used to mount components on a PCB.