Abstract: A method for manufacturing an LED module includes following steps: providing a SMT apparatus having a CCD image sensor, providing a PCB having an LED mounted on, and fixing the PCB in the SMT apparatus; providing a lens, the CCD image sensor imaging the lens, and then the SMT apparatus obtaining a location of the lens relative to the LED, and the SMT apparatus positioning the lens on the PCB to cover the LED; providing an optical diffusing board located above the lens, and electrifying the LED for emitting light towards the optical diffusing board; providing a luminance colorimeter to measure luminance and chroma of light exited from the optical diffusing board, and obtaining a light-emitting data; calculating the light-emitting data, and the SMT apparatus adjusting a position of the lens relative to the LED; and fixing the lens on the PCB.

Abstract: A defibrillator includes: a housing; a discharge module disposed on a first portion of a printed circuit board and positioned within the housing; an energy storage module disposed on a second portion of the printed circuit board; and a controller module disposed on a third portion of the printed circuit board. The energy storage module is operatively connected to the discharge module by a first flexible member. The controller module is operatively connected to the energy storage module by a second flexible member. The first flexible member is folded such that the first portion of the printed circuit board is positioned substantially parallel to the second portion of the printed circuit board and the second flexible member is folded such that the third portion of the printed circuit board is positioned substantially perpendicular to the first and second portions of the printed circuit board.

Abstract: A component mounting method includes: detecting feeder ID information of a parts feeder, which individually specifies a parts feeder, after a second parts feeder is attached to an attaching position of the feeder base having a feeder address, and confirming whether the second parts feeder is the same as a first parts feeder which was attached to and then detached from the attaching position; and calculating an attaching/detaching time from detachment of the first parts feeder to attachment of the second parts feeder if it is confirmed that the second parts feeder is the same as the first parts feeder. If the calculated attaching/detaching time is a given time or shorter, the mounting work is performed without performing a component checking operation which determines whether a kind of an electronic component accommodated in the second parts feeder is proper.

Abstract: A method and apparatus for composite socket probing for a mobile memory interface. An embodiment provides an integrated circuit package that includes a memory supported by an interposer. The interposer is also removably coupled to a package controller through a first socket. A clamp operates to provide clamping force to couple the interposer and the package controller with the first socket and also with a second socket.

Abstract: A method for producing a lighting device may include: providing a first mount, fastening a second mount to the first mount, at least partially severing the second mount into at least two parts after fastening of the second mount to the first mount, and fastening at least two luminescence diode chips to that side of the second mount which is remote from the first mount.

Abstract: A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the substrate board in at least one local zone free of the face which is free of metal portions of the electrical connection network.

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials in the cross-sectional shape of the Z-directed component to form an extruded object with the plurality of materials arranged relative to each other in their operative positions for the Z-directed component. The extrusion of a first portion of at least one of the materials in the extruded object is staggered relative to the extrusion of a second portion of the at least one of the materials in the extruded object. At least a segment of the extruded object is fired. The fired segment forms the Z-directed component insertable into a mounting hole in a printed circuit board.

Abstract: A package structure includes a printed circuit board (PCB), a duplexer, a first dam, a second dam and a cover. The duplexer includes a transmission filter and a reception filter and is electrically connected with the PCB. The first dam is located on a surface of the PCB, and in cooperation with the PCB forms a first receptacle receiving the transmission filter. The second dam is located on the surface of the PCB, and in cooperation with the PCB forms a second receptacle receiving the reception filter. The cover is fixed with top parts of the first dam and the second dam to seal the transmission filter and the reception filter. A method of manufacturing plural such package structures is also provided.

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.

Abstract: A light emitting device includes a light emitting element, a ceramic substrate including a mounting surface on which the light emitting element is mounted, and a non-mounting surface opposite to the mounting surface and on which the light emitting element is not mounted, and a metal reflection film formed on the non-mounting surface. The metal reflection film reflects light from light emitting element that has passed through the ceramic substrate.

Abstract: A control device includes a first circuit carrier with electrical components that are electrically conductively connected to one another and a second circuit carrier with electrical components that are electrically conductively connected to one another. The first circuit carrier and the second circuit carrier are electrically conductively connected to one another. The second circuit carrier is fixedly connected in thermally conductive fashion to a fluid-tight thermally conductive carrier element. The second circuit carrier and the carrier element are arranged in a cutout of the first circuit carrier. The carrier element has better thermal conductivity than the first circuit carrier and can be thermally conductively connected to a heat sink. The carrier element is integrated in fluid-tight fashion in an internal region of the first circuit carrier.

Abstract: Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames. In another aspect, a socket with a with socket cover coupled to a socket housing is disclosed. The socket housing includes a support structure to support a portion of the socket cover.

Abstract: A component aligning apparatus includes a component aligning jig, in which electronic components to be aligned have a rectangular parallelepiped shape whose length dimension is L, width dimension is W, and thickness dimension is T, the component aligning jig includes electronic component accommodating recesses opening on a surface, the depth Z of the accommodating recesses is shorter than the length L of the electronic components so that a single electronic component is held in each of the electronic component accommodating recesses while partially projecting upwards from each of the recesses with the WT surface on one side facing up, and letting s be the shortest separation that is larger than the thickness T and is the narrowest distance between opposing inside surfaces of each of the accommodating recesses when each of the accommodating recesses is seen in plan view, W>S>T.

Abstract: A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the insulating layer, and conductors are formed in via holes that pass through the insulating layer and the adhesive layer so that the conductor circuit is partially exposed therefrom; an electronic component electrically connected to the conductor circuit by allowing electrodes of the electronic component to be connected to the conductors; an embedding member arranged around the electronic components so that the electronic component is embedded therein; and a second substrate having an adhesive layer laminated to face the adhesive layer of the first substrate and sandwich the electronic component and the embedding member, wherein each of the electrodes of the electronic component is continuous with the conductor circuit through two or more of the conductors.

Abstract: Disclosed herein is an apparatus for depositing viscous material on an electronic substrate. The apparatus comprises a frame, an assembly material applicator coupled to the frame and configured to apply assembly material to the electronic substrate, a substrate support assembly, coupled to the frame, configured to support and secure the electronic substrate in a print position, and a transport system, coupled to the frame, to shuttle electronic substrates to and from the substrate support assembly, the transport system including a first track and a second track, the first track being mounted on a first displacement mechanism and the second track being mounted on a second displacement mechanism configured to laterally move the second track relative to the first track, the second displacement mechanism configured to raise the first track relative to the second track.

Abstract: A method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein.

Abstract: A cold plate is manufactured by obtaining a base plate with a top surface, a bottom surface, and an edge. An inlet trough and an outlet trough are machined in the top surface. Fins are cut into the base plate with a tool that contacts the base plate in either the inlet trough and the outlet trough and then exits the base plate in the other of the inlet trough and the outlet trough. An inlet nozzle indent is machined from the inlet trough to the edge of the base plate, and an outlet nozzle indent is machined from the outlet trough to the edge of the base plate. A cover covers the inlet and outlet nozzle indents, and an inlet nozzle and outlet nozzle are secured to the inlet and outlet nozzle indents.

Abstract: A lighting device in which a heat sink and a cover are formed by co-extrusion and a manufacturing method for the same are provided. The heat sink and the cover may be co-extruded. A shape control portion may be formed at the heat sink to control a shape of a seating portion to seat a circuit substrate during extrusion of the heat sink. In addition, a light characteristic control portion may be provided between a light emitting diode (LED) and the cover to control characteristic of light generated from the LED.

Abstract: An embedded printed circuit board and a method of manufacturing the same. The embedded printed circuit board includes: an insulating layer on which a cavity is formed; a chip mounted on the cavity; and a circuit layer formed on the insulating layer, wherein the insulating layer is made of photosensitive compositions including photosensitive monomer and photoinitiator. As a result, the cavity can be formed by selectively using only the insulating layer, thereby making it possible to secure a degree of freedom in the design of the embedded printed circuit board.

Abstract: A fastener includes a head portion and a shank portion that extends from the head portion. The shank portion has a distal end that is distal from the head portion and that is formed with at least two bendable anchor segments. The fastener is used to fasten a base plate of a light emitting bar to a base of a light source module.

Abstract: According to the present invention there is provided a method of manufacturing a MEMS micro mirror assembly (250), comprising the step of mounting a PCB board (205) on a metallic plate (206), mounting a MEMS device (240) on the PCB board (205), wherein the MEMS device (240) comprises a MEMS die (241) and a magnet (230).

Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.

Abstract: A method for creating laboratory-scale reactive distillation apparatus from provided modular components is described. At least two types of modular distillation column stages are provided. A first type of modular stage comprises two physical interfaces for connection with a respective physical interface of another modular stage. A second type modular stage comprises one such physical interface. At least one type of tray is provided for insertion into the first type of modular stage. A clamping arrangement is provided for joining together two modular stages at their respective physical interfaces for connection to form a joint. The invention provides for at least three modular stages can be joined. At least one sensor or sensor array can be inserted into each modular stage. At least one controllable element can be inserted into each modular stage. The invention provides for study of traditional, advanced, and photochemical types of reactive distillation.

Abstract: The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to the integrated circuit and a localized interconnect interface, the interface being configured for connecting the integrated circuit to at least one of the substrate and a second integrated circuit of the assembly. The method further includes curing the coating. Further, the integrated circuit may be a device which is available for at least one of sale, lease and license to a general public, such as a Commercial off the Shelf (COTS) device. Still further, the coating may promote corrosion resistance and reliability of the integrated circuit assembly.

Abstract: An electronic device may include a substrate, and an integrated circuit over the substrate. The substrate may be provided with an electrical connection network including electrical links for linking the integrated circuit to another electrical device. Some of the electrical links may include an impedance-compensating inductor.

Abstract: The invention relates to a circuit carrier (11), comprising a digital circuit, which contains at least two components (12, 14) that are electrically connected to each other (19, 21, 20). Additionally, an electric shield (24) is provided. According to the invention, the electric shield (24) and a conducting path (21) for electrically connecting the components (12, 14) are realized by means of a single layered composite (18). In particular, the electric shield (24) and the conducting path (21) are formed by the same electrically conductive layer, wherein a hole (25) ensures complete electrical insulation of the conducting path (21) from the shield (24). The invention further relates to a method for producing such a circuit carrier.

Abstract: A method for manufacturing an embedded package comprises the steps of: coupling at least one first embedded body including at least one connection port with a first circuit substrate and packaging the first embedded body and the first circuit substrate to form a package; and exposing the connection port of the package on an outer side of the package for other electronic carriers to couple with. The invention can overcome the disadvantage of the conventional System in Package manufacturing process which integrally packages multiple ICs in a same package to result in discard of the entire package because of failure of a single IC. The method of the invention makes assembly simpler, expansion, test and replacement of IC components easier, and also can reduce manufacturing time and accumulated heat, lower the cost and improve yield rate.

Abstract: An active plug connector (100; 300) adapted to plug into a receptacle includes a shell (11; 21; 31) defining a receiving room (114; 314), a pair of printed circuit boards (12, 13; 22, 23; 32, 33) received in the receiving room and disposed horizontally and spaced apart from each other along a vertical direction, an active element mounted on one of the two printed circuit boards, and a connecting member (14; 24; 34) electrically connected with the two printed circuit boards to share the active element. A method for assembling the active plug connector comprises inserting the connecting member into the receiving room to electrically connect with the conductive pads of the printed circuit boards to share the active element.

Abstract: A neural prosthetic device can selectively deliver light to different cortical layers, at different depths, in the brain. The device includes LEDs and corresponding waveguides that can extend into the brain. At least two of the waveguides have different lengths. The neural prosthetic device or other devices can be manufactured by changing the hydrophilicity or lyophilicity of a portion of a substrate layer, then depositing uncured polymer on the treated portion of the substrate layer. The uncured polymer flows under the influence of surface tension to form a volume. The volume is shaped as a dome that extends laterally to a boundary between the treated and untreated portions. The polymer is cured in discrete regions through the substrate layer. The discrete regions extend longitudinally from the substrate layer to a curved surface of the dome. The uncured portion of the polymer is removed. The cured regions form the waveguides.

Abstract: A printed circuit board comprised of a plurality of interconnected elements, wherein at least two elements to be connected of the printed circuit board are mechanically connected, particularly bonded or glued, with one another on at least one peripheral region thereof, while keeping a distance and being supported on a carrier element.

Abstract: Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.

Abstract: A method for manufacturing a printed wiring board includes preparing a core substrate having a first surface and a second surface on the opposite side of the first surface, forming on the first-surface side of the substrate a first opening portion tapering from the first toward second surface, forming on the second-surface side of the substrate a second opening portion tapering from the second toward first surface, forming a third opening portion such that a penetrating hole formed of the first opening portion, the second opening portion and the third opening portion connecting the first and second opening portions is formed in the substrate, forming a first conductor on the first surface of the substrate, forming a second conductor on the second surface of the substrate, and filling a conductive material in the penetrating hole such that a through-hole conductor connecting the first and second conductors is formed.

Abstract: An environmentally sealed electrical housing assembly with an integrated connector and a method for manufacturing same is presented. The assembly includes a non-accessible electrical component, such an electromechanical relay, and a plurality of terminals connected to a circuit board. A dielectric housing encases the non-accessible electrical component. The housing is in intimate contact with the non-accessible electrical component, thereby sealing it from the environment. The housing defines an integral perimeter wall that surrounds the terminals, forming a connector shroud. Removable electrical components, such as fuse assemblies, may be attached to the terminals inside the shroud. When a sealed mating connector is attached to the housing, the removable components are also sealed from the environment. The assembly allows distribution of power switching functions and circuit protection to be distributed to a location near the electrical load instead of a central location, such as a bussed electrical center.

Abstract: A method, and apparatus resulting from the method, for fabricating a circuit board suitable for mounting electronic components. The method includes drilling a plurality of through-holes in a plurality of dielectric sheets, forming a conductive film on at least one side of each of the plurality of dielectric sheets, and substantially filling each of the plurality of through holes with a conductive material. The conductive material is both electrically and thermally uninterrupted from a first face to a second face of each of the plurality of dielectric sheets. The plurality of dielectric sheets are then sequentially mounted, one atop another, to form the circuit board. The sequential mounting step is performed after the steps of drilling the plurality of through-holes, forming the conductive layer, and substantially filling the plurality of through-holes.

Abstract: It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.

Abstract: A component mounting apparatus includes two board transfer devices each for transferring boards, at least one component supply device for supplying plural kinds of components to be mounted on the boards, and a component placing device including at least one component placing head for picking up the supplied components to mount the picked-up components on the boards and at least one head moving mechanism for moving the at least one component placing head in at least two directions parallel to a surface of the board. The apparatus also includes a controller that operates one component placing head to mount components alternately on two boards transferred by the two board transfer devices to respective component mounting positions and operates two component placing heads to mount components in parallel on two boards transferred by the two boards transfer devices to the respective component mounting positions.

Abstract: A wiring board includes a first insulating layer; a first wire that is provided at a first surface of the first insulating layer and transmits a first signal; and a second wire that is provided at a second surface of the first insulating layer that is opposite to the first surface, includes a first portion that is parallel to at least a portion of the first wire, and transmits a first component of the first signal that is transmitted through the first wire.

Abstract: Various embodiments relate to an illuminating device may include a circuit board carrying a light-emitting element, a driver and a heat sink arranged between the circuit board and the driver, wherein the heat sink has a non-conductive base and at least one pair of conductive connectors which embedded in the non-conductive base, respective connector having a first end extending from one side of the non-conductive base to hold the circuit board and a second end extending from the other side of the non-conductive base to hold the driver, wherein the circuit board and the driver are electrically connected by means of the connectors. Various embodiments further relate to a method for manufacturing the illuminating device.

Abstract: It is recognized that, because of its unique properties, graphene can serve as an interface with biological cells that communicate by an electrical impulse, or action potential. Responding to a sensed signal can be accomplished by coupling a graphene sensor to a low power digital electronic switch that is activatable by the sensed low power electrical signals. It is further recognized that low power devices such as tunneling diodes and TFETs are suitable for use in such biological applications in conjunction with graphene sensors. While tunneling diodes can be used in diagnostic applications, TFETs, which are three-terminal devices, further permit controlling the voltage on one cell according to signals received by other cells. Thus, by the use of a biological sensor system that includes graphene nanowire sensors coupled to a TFET, charge can be redistributed among different biological cells, potentially with therapeutic effects.

Abstract: Several embodiments of stacked-die microelectronic packages with small footprints and associated methods of manufacturing are disclosed herein. In one embodiment, the package includes a substrate, a first die carried by the substrate, and a second die between the first die and the substrate. The first die has a first footprint, and the second die has a second footprint that is smaller than the first footprint of the first die. The package further includes an adhesive having a first portion adjacent to a second portion. The first portion is between the first die and the second die, and the second portion being between the first die and the substrate.

Abstract: A method of forming solder-less printed wiring boards includes attaching a electronic components to a workpiece using an adhesive material. A mold material is added to partially cover the electronic components to form a sub-assembly including the electronic components attached to the mold material and a planar surface on the workpiece side. At least tops of the electronic components extend beyond a height of the mold material. The adhesive material is removed to separate the workpiece and sub-assembly. A first prepreg dielectric is attached to the planar surface of the mold material. First vias are formed in the first prepreg dielectric to expose bondable contacts of the electronic components. The first vias are filled with electrically conductive plugs to provide connections to the bondable contacts of the electronic components. A circuit layer is formed on a surface of the first prepreg dielectric to provide contact to the first plugs.

Abstract: A circuit layer manufacturing method is applied to a portable computer. The portable computer includes a front bezel, a display module, and a back cover. The front bezel is connected to the back cover for containing the display module. The front bezel includes a metal portion. The metal portion has a flat region corresponding to a side of the back cover. The circuit layer manufacturing method includes forming at least one control circuit layer assembly on the flat region, grounding the control circuit layer assembly to the flat region, and forming a protection layer on the control circuit layer assembly. The control circuit layer assembly includes an insulation layer and a control circuit layer. The control circuit layer is electrically connected to the display module. The insulation layer is formed between the control circuit layer and the flat region for being alternately stacked with the control circuit layer.

Abstract: Methods and structures for controlling wafer curvature during fabrication of integrated circuits caused by stressed films. The methods include controlling the conductor density of wiring levels, adding compensating stressed film layers and disturbing the continuity of stress films with the immediately lower layer. The structure includes integrated circuits having compensating stressed film layers.

Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.

Abstract: Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction.

Abstract: In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board including cut-outs and input and output connections for inserting a radio frequency device and further including locating holes for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.

Abstract: An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.

Abstract: The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.