Abstract: Provided is a plasma display panel that includes a panel assembly forming an image; a chassis base combined with the panel assembly and separated into pieces; and a plurality of driving circuit units combined with the chassis base and including circuit elements transferring an electrical signal to the panel assembly using signal transfer units, which more effectively transfers heat generated from the panel assembly or the signal transfer units, thereby improving a thermal dissipation function.

Abstract: In a cooling device of an image forming apparatus, a space is formed between a flat surface of a sheet metal attached on a circuit board attached part and a power source circuit board. A duct is formed by a shielding member formed in a U shape surrounding the space, and on the lower part of the flat surface of the sheet metal, a tubular part as an air outlet is formed so as to be elongated to the side of a main body. On the upper part of the sheet metal arranged in a vertical direction, a fan motor is mounted, which sends cooled air into the power source circuit board and the duct. The cooled air cools the power source circuit board and also cools a power source unit in the main body via the tubular member.

Abstract: Embodiments disclosed herein include an apparatus that includes an component capable of generating heat, an external wall with an interior surface, an air mover to be positioned to generate airflow between the interior surface of the external wall and the component. A vent may then be formed within the external wall to provide for a volume of air for the air mover to create airflow between the interior surface and the component. In some embodiments, the vent may be positioned in relation to the air mover to deflect at least a portion of the heat from the component from reaching the external wall. In some embodiments, a louvered portion may be included; and may be formed on the air mover or at the vent in the external wall. Other embodiments are described.

Abstract: In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.

Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.

Abstract: An electronic device includes an enclosure (30), a circuit board (40), and an airflow guiding duct (10). The enclosure includes a bottom wall (31) and a rear wall (32) perpendicular to the bottom wall. The circuit board is mounted on the bottom wall of the enclosure. The circuit board includes a first heat generating element (41) and a second heat generating element (42) near to the first heat generating element. The airflow guiding duct includes two side panels (11) and a connecting panel (13) connecting a pair of side edges (112) of the two side panels. A first opening (17) is defined by a lower edge (131) of the connecting panel and lower edges (111) of the two side panels and corresponding to the first heat generating element. The lower edges of the two side panels and the lower of the connecting panel are in the same plane. The first opening is a predetermined distance from the circuit board and the airflow guiding duct is capable of allowing air flow from different directions.

Abstract: A diaphragm air pump comprises a pump chamber, a diaphragm and one or more piezoelectric beams or bimorphs. Fluid flows into the pump chamber and then flows out of it, the diaphragm is provided within the pump chamber, and one or more central openings are formed in the diaphragm. One or more central check valves are provided in the central openings. The diaphragm is just bonded with piezoelectric beams, not fixed to the lower housing of the pump chamber in order to get large displacement. With the provided diaphragm air pump, it is possible to actively adjust the air quantity according to the requirement for fuel cell or a part-to-be-cooled, and it is also possible to reduce noise and power consumption compared with a conventional fan type cooler or air pumps.

Abstract: The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.

Abstract: A method for controlling operation of a heat exchanger system comprises providing a heat exchanger system mountable to a rear door of a rack mounted computer system, circulating a heat transport medium through the heat exchanger system, detecting leaks in the heat exchanger system by comparing a first flow rate in an inflow line to a second flow rate in a return flow line, emitting a leakage alert and ceasing further circulation of the heat transport medium through the heat exchanger system when the first flow rate exceeds the second flow rate by a predetermined flow amount, optimizing operation of the rack mounted computer system by monitoring an interior temperature of the rack mounted computer system in a plurality of vertical zones, and optimizing operation of the heat exchanger system by comparing a second temperature measured by a second temperature sensor in the return flow line with a predetermined maximum return flow temperature value.

Abstract: A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. The convection bridge is clamped between the VME electronics module and the modified chassis, requiring no modifications to the VME electronics module. For enhanced performance, additional features may include having any individual or combination of fin orientation on the convection bridge, interstitial material such as grease or indium foil can be inserted between the convection bridge and the VME electronics module, and compatible air-moving appliances such as a fan as part of the modified VME chassis.

Abstract: A method, apparatus, and system are described for an ionic wind generator. The ionic wind generator may have a first electrode that is elevated off a surface of a device that the ionic wind generator is intended to cool. A first surface of the first electrode is in contact with a first surface of a first post that elevates the first electrode off the surface of the device that the ionic wind generator is intended to cool. The ionic wind generator causes a generation of ions that are then drawn through an interstitial atmosphere from the first electrode to a second electrode to affect a velocity of local flow over the surface of the device between the first electrode and the second electrode. The flow from a forced flow device also affects the velocity of local flow over the surface of the device between the first electrode and the second electrode.

Abstract: A fireproof container with heat activated panel is presented. The invention includes a fireproof container and panel, compression pins, and heat sensitive pin. Fireproof panel is disposed adjacent to vent holes located along the fireproof container and separated there from so as to allow airflow into the container. Compression pins are disposed between and attached to both container and panel so as to apply a mechanical load onto the panel directed towards the container. Heat sensitive pin is disposed between and attached to both container and panel so as to oppose the mechanical load applied by the compression pins when the temperature of the surrounding environment is below a threshold temperature. Heat sensitive pin yields to the mechanical load when the surrounding environment exceeds the threshold temperature, thereby enabling contact between panel and container so as to interrupt airflow into the enclosure.

Abstract: A computer housing shock absorber device for a vibration source frame, which includes: a computer housing provided with a U-shaped holding space; an inner fixing frame fixed within the U-shaped holding space; an outer fixing frame; The shock absorber elements mounted on circumferential edge walls of the connecting holes of the inner fixing frame. Upper and lower portions of each of the recessed circular grooves of the shock absorber elements are respectively provided with a cylindrical body, and one of the cylindrical bodies of each of the shock absorber elements lies between the upper surface of the outer fixing frame and the upper surface of the inner fixing frame. Accordingly, the vibratory moment on the outer fixing frame produced by rotation of the fans is absorbed by the shock absorber elements.

Abstract: A computer device cooling system comprising a heat exchanger comprising an airflow face and a plurality of cooling fans disposed to form an airflow face, the cooling fan airflow face sized to correspond to a size of the heat exchanger airflow face.

Abstract: A display device comprising a display panel for displaying an image, a chassis base coupled to the display panel to support the display panel, the chassis base having at least one chassis base hole, and at least one reinforcing member formed on the chassis base such that the at least one reinforcing member covers the at least one chassis base hole.

Abstract: An oven observing equipment capable of observing the inside of an oven turned to a high temperature precisely includes: a housing 13 having an intake part for cooling air, and a discharging part for discharging the cooling air after being used for cooling; and an imaging device 20 contained in this housing 13 near the discharge part. This imaging device 20 is composed of integrated combination of an image sensor 16; plate-like thermoelectric cooling elements 18a to 18d arranged in a state that their heat-absorbing faces surround the periphery of a body of the image sensor; thermoconductive blocks 17a to 17d embedded in the gaps between the image sensor body and the thermoelectric cooling elements 18a to 18d; and cooling fins 19a to 19d formed on the heat-radiating faces of the thermoelectric cooling elements 18a to 18d are integrated with each other.

Abstract: A cooling apparatus for use in electronic equipment, being small in sizes and simple in the structures thereof, for achieving an increasing cooling capacity, comprises: a heat receiving member, which is thermally connected with a heat generating body, and which is configured to receive heat by means of a coolant flowing within an inside thereof; and a heat radiating member, which is configured to radiate the heat received within the heat receiving member, wherein the heat receiving member has a plate-like heat receiving base body, which is thermally connected with the heat generating body, and a heat receiving case body, which covers over the heat receiving base body, wherein the body members are joined with, so as to define a sealed space for running the coolant therein.

Abstract: A method and incorporated automatic air blockage assembly door is provided. The assembly comprises an air blockage door secured to a frame, capable of moving from a first to a second position via a pivot block and a shaft. The movement of the door is enabled by securing the door via the pivot block to an arm mechanism. The mechanism includes a pivot member and an activation pin. The activation and deactivation of the pin causes the movement of the door.

Abstract: A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top surface, and a side surface rising from the base toward the top surface. The base is disposable adjacent the heat generating component to facilitate transfer of heat from the heat generating component to the base. The input and output ports are each disposed on the side surface of the body. The channel is encapsulated within the module body and extends from the input port to the output port to define a flow path. The channel is operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component.

Abstract: A heat transfer apparatus for a memory module with a heat spreader that includes a channel being attachable on top of the memory module, and further includes attachment parts that are in thermal communication with the channel to engage with the heat spreader.

Abstract: An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow arrester includes a collapsible panel sized and configured to reside above the electronics rack, and when operatively positioned above the electronics rack, to extend vertically above the electronics rack and at least partially block airflow from passing over the electronics rack between the air outlet and air inlet sides of the rack. The track mechanism is sized and configured to reside above the electronics rack, and the airflow arrester is slidably engaged with the track mechanism. Positioning of the airflow arrester at a desired location above the electronics rack is facilitated by the airflow arrester slidably engaging the track mechanism.

Abstract: An airflow arrester is provided and configured to reside between electronics racks disposed in a row within a data center. The airflow arrester includes a panel, which when operatively disposed, has a first vertical end, a second vertical end, and a central vertical hinge located intermediate the first and second vertical ends. The airflow arrester further includes an attachment mechanism at the first vertical end and at the second vertical end, and when operatively disposed between a first and second structures, the airflow arrester has a single V-shaped configuration, and is sized and constructed to block airflow from passing therebetween. The single V-shaped configuration provides operational stability to the airflow arrester by translating net twisting forces applied to the airflow arrester to normal forces applied to the first and second structures at the attachment points of the airflow arrester to the first and second structures.

Abstract: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. Each adjustable filler panel assembly selectively blocks a portion of the air inlet opening in order to prohibit air exhausted into the duct from flowing back into the enclosure.

Abstract: An electronic device. The electronic device includes a housing, a passage, and a plurality of first fans. The housing has an inner space, with the passage disposed therein. The plurality of first fans is disposed in the passage in series. The electronic device further comprises a second fan, the housing comprising an inlet, wherein the second fan is disposed in the vicinity of the inlet.

Abstract: An airflow-guiding device (40) is secured at one side of a row of fans (20) in a computer chassis (10) and is capable of allowing air to flow therethrough in one direction only. The airflow-guiding device includes a bracket (42) and a plurality of shielding plates (44). The bracket is secured in the chassis and defines a plurality of guideways (428) therein. The shielding plates are pivotably secured in the guideways with shafts (442) thereof, respectively. The shaft of each of the shielding plates separates the corresponding plate into two portions. One of the two portions is larger and weightier than the other of the two portions.

Abstract: A wind velocity measuring device is used in an electronic apparatus including cooled objects and cooling fans for cooling the cooled objects and measures a wind velocity of air blown to the cooled objects. The wind velocity measuring device includes a wind velocity measuring unit that measures a wind velocity of air, and an air circulating unit that circulates a portion of the air blown to the cooled objects. The air circulating unit includes barrier portions that extend to cross a circulation direction of the air at a front stage side of the circulation direction of the air, and an exhaust port that discharges inner air to the outside and is formed at a rear stage side of the circulating direction of the air, and the wind velocity measuring unit measures a wind velocity of the air between the barrier portions and the exhaust port in the air circulating unit.

Abstract: Flow solutions for cooling one or more microelectronic device(s) are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat sink base coupled with a plurality of fins includes a first pathway for a fluid to flow across one or more of the fins and a second pathway for a fluid to flow across one or more fins in a direction substantially opposite the fluid in the first pathway.

Abstract: An electronic device includes a housing configured to enclose an electronic component mounted to an inner portion of the housing. A thermally conductive gap-filler is in thermal contact with the electronic component. A heat sink is in thermal contact with the thermally conductive gap-filler and a thermally conductive plate is in thermal contact, at a first side, with the heat sink through an opening in the housing, and affixed, at the first side, to an outer portion of the housing surrounding the opening.

Abstract: A heat sink includes a thermally conductive base, a plurality of thermally conductive fins extending from the base, and a guiding member. The base has a top surface from which the fins extend, and a bottom surface for being attached onto a heat-generating electronic component. A channel is formed between every two fins. Each of the fins is generally rectangular with the top edge being shorter than the bottom edge. Each of the fins comprises an upright side edge perpendicular to the top surface of the base, and an opposite streamlined side edge. The upright side edges and the streamlined side edges cooperate with the channels to form an air inlet for airflow flowing into the channels and an air outlet for airflow flowing out of the channels, respectively. The guiding member is attached at the streamlined side edges of the fins for guiding airflow flowing out of the channels.

Abstract: According to an aspect of an embodiment, a cooling unit includes a first heat dissipating fin member including first heat dissipating fins extending along parallel planes, respectively, the first heat dissipating fins coupled to one another through a first heat conductive member, and a second heat dissipating fin member including second heat dissipating fins extending along parallel planes, respectively, the second heat dissipating fins coupled to one another through a second heat conductive member, the tip ends of the second heat dissipating fins opposed to the first heat dissipating fin member at a predetermined interval.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.

Abstract: According to one embodiment, an electronic device includes a housing including an opening, a partition wall which partitions an interior part of the housing into a first chamber and a second chamber which is opened to the outside through the opening, first and second heat generating parts mounted in the first chamber, a first heat radiation member located in the second chamber, a heat transfer member which transfers heat generated by the first heat generating part, a cooling fan which draws outside air and exhausts the air against the first heat radiation member, a second heat radiation member which is exposed to the outside of the housing and is thermally connected to the second heat generating part, and a cover covering the opening and the second heat radiation member. The cover forms a gap between the cover and the housing. The gap communicates with the second chamber.

Abstract: An apparatus for extending an operator panel away from an electronic device. An opening in a side of a housing for the electronic device is covered with an air intake grill to provide airflow for cooling at least one electronic component within the electronic device. The operator panel that controls operation or displays a status of the electronic device is attached to a mounting element. The mounting element defines an air gap of a predetermined distance between the operator panel and the opening in the side of the housing to provide increased airflow into the housing for optimal heat dissipation for the electronic device. Then, the mounting element is connected to the housing and the operating panel is coupled to the electronic device.

Abstract: The present invention is to provide a housing structure of an electronic device, which comprises a housing including a slot on a top surface; a plate member mounted in the slot and including a plurality of first ventilation holes formed along a periphery, the first ventilation holes being in communication with inside of the housing; and a cap mounted on the plate member and spaced from the top surface of the housing by a peripheral gap formed between the cap and the plate member; wherein the first ventilation holes are concealed by the cap. By utilizing the present invention, hot air inside the housing can be quickly removed via the first ventilation holes and the gap so as to achieve the purpose of heat dissipation, and the housing's appearance can be preserved since the first ventilation holes are concealed by the cap.

Abstract: A display device, and a blower thereof are disclosed. The display device includes an axial flow fan within a case, which has a display panel encased therein. The axial flow fan is provided in a width direction within the case, so that, while being rotated within the case, the axial flow fan generates forced air flow suitable to the case. The forced air flow is generated in a forward direction along with air flow by natural convection within the case.

Abstract: A mounting assembly includes a chassis having a plurality of opposite receiving tabs thereon, and a plurality of bracket subassemblies slidably mounted to the chassis along the receiving tabs of the chassis. Each bracket subassembly secures a fan therein and includes a bracket having a rear wall and two opposite sidewalls, a positioning member, and a lift-out apparatus attached to the bracket. The lift-out apparatus includes a clasping member fixed to the bracket, a sliding member slidably sandwiched between the sidewall of the bracket and the clasping member, and an elastic member. A locking structure is formed on the sliding member and the sidewall of the bracket. When the locking structure is unlocked, the sliding member is lifted out due to rebounding of the elastic member. The sliding member is then pulled to urge the bracket subassembly to disengage from the chassis.

Abstract: An electronic device includes a cooling apparatus having: a primary cooling unit which is disposed in close proximity with an electronic device so as to face a surface thereof; an auxiliary cooling unit which is disposed in close proximity with the electronic device so as to face a surface thereof; and a controller which drives at least one of the primary cooling unit and the auxiliary cooling unit so as to cool the electronic device.

Abstract: A cabinet system comprises a chassis having a plurality of openings, a plurality of modular doors, and at least one radio frequency system. Each opening has removably attached chassis-hinge portions on one of two edges. Each modular door comprises an outside surface, an inside surface opposing the outside surface, and door-hinge receptacles on at least two edges. The door-hinge receptacles receive door-hinge portions. Each door-hinge portion is positioned in a respective door-hinge receptacle on one edge of the plurality of modular doors and is configured to mate with a respective chassis-hinge portion on the one edge of one of the plurality of openings so the mated chassis-hinge portion and door-hinge portion form a hinge to rotatably attach the modular door to the one of the openings. The radio frequency system comprises electronic components attached to the inside surface of at least one of the plurality of modular doors.

Abstract: The present invention provides an electric power converter in which a tip portion of a cooling fin on an air flow inlet side is limited to flow a large quantity of air around a connection portion, where the fin efficiency is high, of a base surface of the cooling fin and the fin so that the cooling efficiency of the cooling fin can be improved. By providing the limiting member, air or atmosphere flowing into the cooling fin is directed to flow toward the fin near the base surface. Further, by providing the limiting member, an area of a portion from which the air or atmosphere flows into the cooling fin is also limited so that the velocity of the air or atmosphere flow becomes high. By these functions and the like, the cooling efficiency of the cooling fin can be increased as compared to the prior art.

Abstract: A system is provided and includes a system chassis through which an airflow is defined, including a set of receiving units, a set of 3.5? HDDs, each being disposed in a receiving unit of a portion of the set, and each having a profile that blocks a first quantity of the airflow, a set of 2.5? HDDs, each being disposed in a receiving unit of a remaining portion of the set, and each having a profile that blocks a second quantity of the airflow, and a set of airflow blockage devices, each being respectively disposed within each of the receiving units of the remaining portion of the set, to each have a cavity defined therein in which the corresponding 2.5? HDD is secured with a third quantity of the airflow traversing a surface thereof and a profile that blocks a fourth quantity of the airflow through the corresponding receiving unit.

Abstract: A fan device includes a connector, a fan, and an attachment assembly. The fan is configured to provide cooling to circuitry when the fan receives a power signal through the connector. The attachment assembly is configured to control attachment of the fan device to a chassis within an air duct defined by the chassis. The fan defines (i) a near side which faces the circuitry, (ii) a far side which faces away from the circuitry, (iii) an airflow axis which extends from the near side to the far side along an airflow direction, and (iv) a fan profile which is substantially perpendicular to the airflow axis. The fan is disposed substantially between the electronic circuitry and the attachment assembly when the fan device attaches to the chassis within the air duct. The attachment assembly has a width which closely mirrors that of the fan profile.

Abstract: A method and incorporated automatic air blockage assembly door is provided. The assembly comprises an air blockage door secured to a frame, capable of moving from a first to a second position via a pivot block and a shaft. The movement of the door is enabled by securing the door via the pivot block to an arm mechanism. The mechanism includes a pivot member and an activation pin. The activation and deactivation of the pin causes the movement of the door.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: Disclosed are scalable computing pods that may be embodied in trailers, storage containers, or other portable structures that optimize computing, power, cooling and building infrastructure. The pods integrate required power and cooling infrastructure to provide a standalone turnkey computing solution. A user connects the pod to utility AC power and a data pipe. The scalable computing pods utilize liquid cooling, eliminate coolant conversions, and eliminate unnecessary power conversion to drastically improve efficiency.

Abstract: An electro-optic apparatus includes an electro-optic panel, a wiring board, and an integrated circuit unit. The integrated circuit unit including a heat radiating member arranged so as to overlap at least partly with the integrated circuit unit.

Abstract: An assembly that facilitates the use of modules requiring orthogonal airflow in a chassis providing normal airflow. Partitions within the housing direct ambient airflow from the front air inlet, through the modules, and out the rear air exhaust. The housing and partitions define first and second vertically and horizontally offset slots for receiving first and second orthogonal airflow modules, and also define separate first and second airflow pathways. The first airflow pathway provides airflow through a front air inlet, under the second module, orthogonally through the first module and out the rear air exhaust. Similarly, the second airflow pathway provides airflow through a front air inlet, over the first module, orthogonally through the second module and out the rear air exhaust. Both airflow pathways both draw ambient air into the housing and exhaust warm air from the rear of the housing, while keeping the two airflow pathways separated.

Abstract: A heat dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted on a chip carrier. A heat sink is mounted on the chip, and includes an insulating core layer, a thin metallic layer formed on each of an upper surface and a lower surface of the insulating core layer and a thermal via hole formed in the insulating core layer. A molding process is performed to encapsulate the chip and the heat sink with an encapsulant to form a package unit. A singulation process is performed to peripherally cut the package unit. A part of the encapsulant above the thin metallic layer on the upper surface of the heat sink is removed, such that the thin metallic layer on the upper surface of the heat sink is exposed, and heat generated by the chip can be dissipated through the heat sink.

Abstract: Weather cover for electronic equipment designed to be mounted on towers, hanged on masts, towers or mono-poles, which weather cover (10) comprises: a housing (1) that can be opened for service or the like thereof, said housing (1) comprising at least one side (2) that can be opened, which side (2) comprises at least one access door (2a), mounted (hinged) in the housing (1) such that it provides an opening of, or closes the housing (1), between electronic equipment (3) mounted therein, which weather cover (10) further comprises mounting means for hanging said weather cover (10).

Abstract: A thermal energy storage transfer system that is adapted to transfer heat from an electronics enclosure. The thermal energy storage system includes a thermal energy storage unit that is positioned within the electronics enclosure. The thermal energy storage unit contains a phase change material that stores heat created by electronics stored within the electronics enclosure and transfers the heat to outside of the electronics enclosure by use of a heat pipe and condenser.