Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A heat-dissipating structure for the expansion board architecture is provided. A fixing element disposed on the heat-absorbing substrate fixes the motherboard and the first expansion board. The heat-generating elements on the motherboard or the first expansion board are directly in touch with the heat-absorbing surface of the heat-absorbing substrate to absorb their heat. The heat-dissipating board extended from the side of the heat-absorbing substrate then dissipates the heat absorbed by the heat-absorbing substrate. The structure thus solves the problems that existing heat-dissipating structures occupy larger space and therefore cannot be effectively used in an expansion board architecture to dissipate heat produced by the heat-generating elements between the motherboard and the expansion board and that it is likely to have assembly tolerance. Using the structure can reduce the space and the assembly tolerance, but effectively enhance heat dissipation in the expansion board architecture.

Abstract: Systems and method for cooling computer systems are provided. A rack system for housing a plurality of computers is provided, the rack system including: a rack assembly configured to support a first stack of computers and a second stack of computers; and at least one fan assembly configured to create an airflow through the first stack of computers and into the second stack of computers. A method of cooling a plurality of computers in a rack system is provided, including: supporting a first stack of computers and a second stack of computers in a rack assembly; and effectuating an airflow through the first stack of computers and into the second stack of computers.

Abstract: A personal computer has a central air plenum straddled by opposed drive bays, and memory modules in the plenum are covered by a shroud that increases the air flow over the memory modules. The plenum establishes a first pathway for air flow and parallel to the plenum is a second pathway for air flow past cards such as graphics and network cards.

Abstract: A device (103) is provided which comprises (a) a housing (115) equipped with a viewing window (253); (b) a diaphragm (301), visible through said viewing window; (c) an actuator (126) adapted to vibrate said diaphragm at an operating frequency; and (d) a strobe light (121).

Abstract: A display device includes: a display unit which displays an image; a casing which supports the display unit; a pair of supporting members which are respectively combined at peripheral areas of a backside of the display unit and are supported by the casing; and a connecting member which has higher heat resistance than the supporting members and interconnects the supporting members.

Abstract: Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.

Abstract: A fan noise control apparatus is provided to facilitate the reduction of noise. According to the preferred embodiments, an acoustically transparent portion is provided to permit noise from one source to pass through to interact and cancel with another noise.

Abstract: An electronic device including a base and a pluggable unit is provided. The base includes a first heat sink having a first heat-transfer contacting surface. The pluggable unit includes a second heat sink and a heat source. The second heat sink has a second heat-transfer contacting surface. When the pluggable unit is plugged in the base, the first heat-transfer contacting surface gets in contact with the second heat-transfer contacting surface.

Abstract: An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure.

Abstract: A transit container, such as a rack-mount style container, includes a temperature control system for maintaining a desired temperature within the container such that any cargo within the container remains operational at selected times and possibly in selected locations. The temperature control system includes support or mounting brackets, a temperature control assembly, shock isolation devices for shock attenuation of the temperature control assembly, exhaust assemblies that include exhaust fans and exhaust/intake louvers, and a mounting plate attachable to a lid of the transit container. The temperature control assembly and the aforementioned components may be arranged to have a low-height profile or envelope, which in turn permits the temperature control system to be located in a cavity or chamber of the lid.

Abstract: A telecommunications cabinet in which active equipment can be mounted. The cabinet including an airflow ducting arrangement located in the interior region of the cabinet. The airflow ducting arrangement accommodating thermal cooling of active equipment having internal side-to-side air cooling arrangements.

Abstract: A dust-proofing method is for use in an electronic device having a housing, a heat-generating component, and a dust-proofing mechanism. The housing includes an air vent. The dust-proofing mechanism includes a shielding plate for shielding or opening the air vent, and an actuating unit for driving movement of the shielding plate. The dust-proofing method includes: causing the actuating unit to drive movement of the shielding plate to open the air vent upon detecting that the temperature of the heat-generating component has risen to a first preset temperature; and causing the actuating unit to drive movement of the shielding plate to shield the air vent upon detecting that the temperature of the heat-generating component has dropped to a second preset temperature lower than the first preset temperature. Thus, dust accumulation in the electronic device can be effectively reduced, and heat dissipation efficiency can be enhanced.

Abstract: A flat-panel display apparatus comprises a display panel, a circuit board, and a cover. The circuit board includes a first and second circuit boards. The first circuit board is arranged above the second circuit board so that, on the back side of the display panel, a mounting surfaces of the first and second circuit boards are approximately in parallel with a display surface of the display panel and do not overlap each other. Each of the first and second circuit boards have a primary mounting surface on which a large number of electrical components are mounted, and a secondary mounting surface that is opposite the primary mounting surface. The primary mounting surface of the first circuit board is arranged in an inverted orientation to the primary mounting surface of the second circuit board. A radiator with fins is provided on the secondary mounting surface side of the first circuit board.

Abstract: An equipment assembly includes a core cooling slot to manage thermal effects brought about by the generation of heat from components therein. The cooling slot is positioned within the equipment assembly so that only air that is external to the equipment assembly passes through the cooling slot to provide external convection-based cooling for components in a core section inside the equipment assembly. The cooling slot also acts as a thermal barrier for redistributing heat generated by the one or more components inside the equipment assembly.

Abstract: A heat dissipation module includes a heat sink, a wind-guiding element and a pivot. The wind-guiding element is disposed on the heat sink, and the pivot is connected between the heat sink and the wind-guiding element to allow the wind-guiding element to rotate relative to the heat sink via the pivot. The wind-guiding element can change a direction of airflow to provide an optimal heat dissipation effect. Additionally, an electronic device using the heat dissipation module is also provided. The heat dissipation module can provide superior heat dissipation effect to an electronic component on the electronic device and maintain a normal operation of the electronic component.

Abstract: A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.

Abstract: Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face, and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: An electronic device is provided that includes a first component generating heat, a second component to be heated, a heating part configured to heat the second component, and a case containing the first component, the second component, and the heating part. The second component is heated with the heating part and the heat generated by the first component.

Abstract: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and a plurality of adjustable filler panel assemblies. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. The plurality of adjustable filler panel assemblies selectively block portions of the air inlet opening in order to create a custom-fit air inlet opening for a particular piece of equipment so that exhaust air from the equipment does not flow back into the enclosure after entering the exhaust duct.

Abstract: A air channeling sub-system may include a mechanical cooling section and a direct evaporative cooling section. The direct evaporative cooling section may be downstream from the mechanical cooling section. Cooling air is channeled through the air channeling sub-system and into the room. If a first set of control conditions is met, the air channeling sub-systems is operated in an adiabatic mode. The adiabatic mode includes channeling cooling air through the direct evaporative cooling section to evaporate water into the cooling air. If a second set of control conditions is met, the air channeling sub-system is operated in a hybrid mode. The hybrid mode includes channeling cooling air through the mechanical cooling section to remove heat from the cooling air and channeling the cooling air through the direct evaporative cooling section to evaporate water into the cooling air.

Abstract: An enclosure comprises first and second sections formed of a transparent material, a plurality of wall sections, a plurality of vent holes, a hinge, a cable access and a lock. The wall sections are joined to the first section to form the enclosure. The vent holes are formed in the wall sections to provide thermal flow through the enclosure. The hinge connects the second section to one of the plurality of wall sections to form a door in the enclosure. The cable access is located to allow authorized power and data connections within the enclosure when the door is in an open position, and sized to prevent unauthorized data connections within the enclosure when the door is in a closed position. The lock secures the enclosure by locking the door in the closed position.

Abstract: An image reading device, and more particularly an image reading device having a cooler capable of preventing introduction of impurities and reducing vibration and noise. The image reading device includes a body having a reading unit, and a cooler disposed in the body cooling the reading unit. The cooler includes a housing, a cooling unit disposed in the body and moving air into the body, a filter member disposed apart from the cooling unit and removing dust contained in the air, and a damper member having one side supported by the filter member and the other side supported by the cooling unit.

Abstract: A passively cooled computer includes two or more components arranged in a housing frame 41, wherein each of these components is associated with a cooling body for dissipating waste heat of the component when the component is in operation. The cooling bodies each include a cooling surface, and these cooling surfaces are arranged to oppose one another with their cooling surfaces and thereby define an air channel leading vertically through the inside of the housing frame. The cooling bodies substantially separate the air channel from the remaining volume inside the housing frame.

Abstract: In an exemplary apparatus for cooling an electronic component, a housing defines an inlet port and an exhaust port and a foam member is disposed within the housing. The foam member has a shape that conforms to a shape of at least one surface of an electronic component such that the foam member is receivable thereon in thermal communication. The foam member has a pore size of no more than around 50 micrometers and a porosity of at least around 80 percent. The foam member is arranged within the housing such that coolant is flowable through the foam member. Pore size may be around 35 micrometers and porosity may be around 90 percent. Foam may be a ceramic foam that includes silica, aluminum oxide, and aluminum borosilicate fibers. In an application, at least one exemplary apparatus may be received in thermal communication on an upper case of an electronic chip.

Abstract: An audio-integrated apparatus has a body casing attached in an instrument panel of a vehicle. The body casing contains a media reader, a circuit board having a CPU, a CPU fan for cooling the CPU, and an exhaust fan. A media loading slot is in a front face of the body casing for inserting a media. A movable display section is in front of the body casing to be movable in a back-and-forth direction. A display movement mechanism can move the movable display section in the back-and-forth direction to thereby change an inclination against the front face of the body casing. A gear motor can detect a position of the movable display section. According to the detected position of the movable display section, rotational frequencies of the CPU fan and the exhaust fan are controlled.

Abstract: A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.

Abstract: A frontal structure of an information processing apparatus, includes a plurality plate-like members, each member having a plurality of perforations opened at predetermined intervals therebetween, each perforation having a predetermined size and shape, and a light-emitting unit for emitting light toward the plate-like members. The plate-like members run in parallel and are arranged with one behind another and an entire or part of frontmost one of the plate-like members serves as an entire or part of front of a casing of the information processing apparatus.

Abstract: A heat sink unit includes: a cooling member including a metal plate having a plurality of attachment holes on edges thereof, a first surface of the metal plate adjoining a heat-producing electronic component, and a second surface of the metal plate having a plurality of cooling fins erected on an area other than the attachment holes. The heat sink unit further includes: an attachment member including an opening in which the cooling fins are disposed when the cooling member is installed and a plurality of threaded bosses protruding from the first surface to be inserted into each of the attachment holes; and coil springs into which the bosses are respectively inserted. The coil springs are interposed between the attachment member and the metal plate, and the bosses are inserted into the attachment holes to fix the cooling member by screws.

Abstract: A waterproof casing for a power supply has a lower casing, an upper casing, an inlet cover and an outlet cover. The lower cover contains electronic components. The upper casing is mounted on the opening of the lower casing and has an inlet cavity, at least one inlet, an outlet cavity and at least one outlet. The at least one inlet and outlet are formed through the upper casing and respectively communicate with the inlet cavity and outlet cavity. The inlet cover and outlet cover respectively seal the inlet cavity and the outlet cavity, communicate the inlet cavity and the outlet cavity with the lower casing to allow the air to flow inside the casing and to keep the water from flowing in the inlet cavity and the outlet cavity. Structure of the waterproof casing is simplified, so benefits manufacturing.

Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.

Abstract: An energy storage cell pack cradle assembly for holding multiple rows of energy storage cells oriented along a dominant axis of vibration includes a first cradle member including a plurality of energy storage cell body supporting structures including respective holes; a second cradle member including a plurality of energy storage cell body supporting structures including respective holes; and one or more fasteners connecting the first cradle member and the second cradle member together. The energy storage cell body supporting structures are configured to structurally support the energy storage cells, with the energy storage cells oriented along a dominant axis of vibration, by energy storage cell bodies of the energy storage cells with respective electrically conductive terminals extending through the respective holes without structural support of the electrically conductive terminals by the cradle members.

Abstract: A pedestal style electronics enclosure provides an upright housing for enclosing electronic components. Installed at the top of the housing can be a hollow enclosure cap that defines an internal air gap. The air gap can be located between an upper, dome-like shield plate exposed to the exterior and a lower, contoured guide plate exposed to the interior of the enclosure. The air gap can help buffer the enclosure from solar radiation impinging upon the exterior shield plate. The interior contoured guide plate can help direct heated air rising in the interior of the enclosure to one or more vent panels located about the periphery of the cap. The hollow enclosure cap can be comprised of thermoplastic material and can be made as a single piece, monolithic structure produced by, for example, a blow molding process.

Abstract: Systems and methods for Venturi fan-assisted cooling of electrical equipment are provided. In one embodiment, a cooling unit for an enclosure housing electronics is provided. The cooling unit comprises: a fan shroud having at least one electrical fan; and a Venturi chamber having a first inlet for receiving a heated airflow from a heatsink, a second inlet for receiving an airflow from a surrounding environment, and an outlet coupled to the fan shroud, the fan drawing air from the Venturi chamber via the outlet when the fan is on. The Venturi chamber comprises a wall for directing the airflow air from the surrounding environment in from the second inlet and across the heated airflow from the heatsink in a manner to as to draw the heated airflow through the heatsink using a Venturi effect, when the fan is on.

Abstract: A method of cooling at least one electronic component that is configured to generate a predetermined waste heat includes providing a first fluid channeling sub-system that has a first fluid source and at least one controller. The method also includes channeling at least a portion of the first fluid towards the electronic component. The method further includes configuring the at least one controller to facilitate substantially maintaining at least a portion of the first fluid channeling sub-system at a predetermined pressure.

Abstract: An upper lid forming an upper portion of a casing is formed by a metal (an aluminum alloy or the like) having a high heat radiation performance. The upper lid serves as a heat sink (a heat radiation member) radiating heat generated from electronic components within the casing to an external portion. A plurality of flat plate-shaped heat radiation fins are provided in an upper surface of the heat sink. A groove forming each of the heat radiation fins is open in a side surface of the heat sink without forming a step.

Abstract: A power supply device for a motor vehicle, in particular a passenger vehicle or a motorcycle, includes a plurality of electrochemical storage cells and/or double-layer capacitors. The electrochemical storage cells and/or double-layer capacitors have a casing surface and, in an axial direction, a base surface and a cover surface which are connected by the casing surface, and each include electrodes. Adjacent to the casing surface of at least one of the storage cells and/or double-layer capacitors, a heat-conducting cooling apparatus is disposed which, although electrically insulated from the at least one storage cell and/or double-layer capacitor, is in thermal contact with a first circumferential section of the casing surface and dissipates the heat energy introduced by the casing surfaces of the at least one storage cell and/or the double-layer capacitor.

Abstract: In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.

Abstract: A method and apparatus for an electronic equipment enclosure that provides directed airflow only to those volumes within the enclosure that require the airflow. The electronic equipment enclosure further provides protection from contaminants such as falling dirt, rain, sleet, snow, windblown dust, splashing water, hose-directed water, and ice. A pedestal may be coupled to the electronic equipment enclosure that facilitates movement of the electronic equipment enclosure via a pallet jack, forklift, front loader, or similar jacking device. A sidecar may also be coupled to one or more sides of the electronic equipment enclosure to facilitate vertically mounted equipment within the sidecar.

Abstract: An electronic device having an exhaust opening configured to exhaust air outside, the electronic device includes a door part configured to close the exhaust opening when the electronic device has a predetermined temperature, wherein the door part is rotated based on the own weight of the door part and a wind pressure of the air taken in the electronic device and exhausted outside the electronic device, so that the exhaust opening is closed.

Abstract: According to one embodiment, an electronic device includes a casing at least a part of which is made of metal, an in-casing member which is housed in the casing and becomes warm when the electronic device is in operation, and a boss member formed separately from the casing and made of resin. The boss member is attached to the metal part of the casing and is interposed between the casing and the in-casing member.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract: Device with integrated electronic components, that comprises a board forming a support for the said components, a cover mounted on the said board to cover the said components, and a separating partition which extends from the cover to the board substantially perpendicularly to the latter, the said partition separating two distinct zones of the board, wherein it comprises an overcover covering the cover and defining an internal space between the cover and the overcover in which are provided cooling gas division means delimiting two distinct secondary spaces in the internal space, an upstream secondary space into which cooling gas is able to be injected and a downstream secondary space into which cooling gas is able to be discharged so that cooling gas injected into the upstream zone of the board is directed toward the downstream secondary space of the internal space and that cooling gas injected into the upstream secondary space of the internal space is directed toward the downstream zone of the board.

Abstract: A motherboard includes a mounting area, a number of first mounting holes, and a plurality of second mounting holes. The mounting area is configured to support an electronic component. The first mounting holes are configured to mate with a first fan. The second mounting holes are configured to mate with a second fan having a greater size than the first fan. The first and second mounting holes are located surrounding an exterior of the mounting area, a first distance between each of the first mounting holes and a center point of the mounting area is longer than a second distance between one of the second mounting holes and the center point of the mounting area. The first and second fans are configured to cool the electronic component.

Abstract: A cooling system is provided for enclosed volumes having payloads of electronic or other equipment that are susceptible to failures when overheated. One particularly useful application of the present invention is in a cooling system for a turreted gimbaled system (i.e. a gimbal) that includes electronic and optical equipment typically used for surveillance, but many other applications will become apparent to those skilled in the art after being taught by the present disclosure. According to one aspect of the invention, a cooling system includes a pair of reciprocal openings between a gimbal sphere and yoke allowing for passage of air therethrough and a pair of fans for circulating the air between the sphere and yoke, thereby expanding the surface area available for heated air from the interior to conduct into the exterior air. In another example, a heat exchanger is provided in the yoke to allow further cooling of the circulated air.

Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

Abstract: An auxiliary heat dissipation device for a liquid crystal display includes a housing having an internal space for receiving a liquid crystal display module, and a cover plate assembled to cover a front of the housing. The housing has a plurality of air inlets at a bottom thereof and a plurality of air outlets at a top thereof. A plurality of discharge fans each is mounted at the corresponding air outlet in the housing. A plurality of intake fans each is mounted at the corresponding air inlet in the housing, wherein a central axis of each of the intake fans keeps an appropriate included angle with respect to a central axis of the corresponding air inlet, so as to be able to efficiently dissipate the heat generated from the liquid crystal display module to the outside of the housing.

Abstract: A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.

Abstract: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. Each adjustable filler panel assembly selectively blocks a portion of the air inlet opening in order to prohibit air exhausted into the duct from flowing back into the enclosure.