Abstract: An arrangement and method for placing a frequency converter in a cabinet, wherein the frequency converter is fitted in an instrument cabinet having a frame and walls, wherein the frame (101) of the instrument cabinet is of modular construction, and wherein the frequency converter is integrated in the instrument cabinet to form one or more frequency converter modules, each of which comprises a frame part and electric components in such manner that the electric components of the frequency converter are ready installed in the instrument cabinet frame at least mainly before being brought to the site of utilization.

Abstract: A cabinet having a pair of vertically stacked chassis separated by a central, vertically extending region. A pair of laterally spaced, vertically extending panels is disposed in the central region, the panels forming: a pair of outer compartments for receiving air exiting a corresponding one of the pair of laterally spaced vertically stacked chassis; and an inner compartment for receiving air exiting the pair of vertically stacked chassis. The panels have therein an array of openings in a lower portion thereof for passing portions of air in the outer compartments into the inner compartment. An upper portion of the panels inhibits portions of air in the outer compartments from passing into the inner compartment. The openings extend in rows horizontally across the panel. The number of opening in lower ones of the rows is greater than the number of opening in upper ones of the rows.

Abstract: A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.

Abstract: A tool is disclosed, for measuring the important thermal characteristics of a unit of electronic equipment, which obtains air flow and temperature readings at both air inlet and air outlet openings of the unit without disturbing cable or wiring connections or otherwise interrupting device operation. The tool pressure sensing element is rotatable between detented positions to permit the tool to be used at both air inlet and air outlet openings. The tool air duct portion may be formed of separate duct portions to enable a single duct portion including the sensing instrumentation to be used with multiple duct portions that conform to electronic device air inlet and outlet openings to impart added flexibility to the tool.

Abstract: A movable data center comprising a portable enclosure in which a data processing module is operatively disposed. The data processing module is assembled onto a rack located in the enclosure that is movable between and operative position and a service position. A heat exchange module is arranged in the enclosure in air flow communication with the data processing module on the rack. The rack may be moved from the operative position in which the rack is in air flow communication with the heat exchange module to the service position in which the rack is not in air flow communication with the heat exchange module.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: A DC to AC inverter used in a solar cell power system can include an improved structure for cooling itself and increasing power output.

Abstract: The present invention provides an inverter or other electronically controlled power source for transforming electrical energy into electrical energy of predetermined voltage and/or current comprising: an inner housing for housing the main circuitry of the inverter, a cover connected to the inner housing, covering at least part of the inner housing, defining at least one cover channel between the inner housing and the cover for air to flow through that channel for cooling of the inverter, whereby the cover channel is adapted to facilitate natural convection of the air. The present invention further proposes an inverter according to any of the preceding claims, additionally comprising at least one ventilator to enhance an air flow through the channel. According to the invention the cooling properties of an inverter are to be improved.

Abstract: The invention relates to cooling techniques for portable devices such as, for example, mobile telephones. In one implementation, a portable device comprises one or more printed circuit boards (“PCBs”) supporting multiple heat-generating components, an airflow generator adapted to generate an airflow internally in the portable device, and a heat sink element thermally connected to the heat-generating components, wherein the heat sink element is adapted to receive heat from the heat-generating components for dissipation by the airflow.

Abstract: A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.

Abstract: A fire resistant and water resistant enclosure for an operable computer digital data storage device is provided. The enclosure has walls made of gypsum or concrete and, in one embodiment, has two small ventilation openings which remain open during normal operation of the digital data storage device and during the presence of fire. This embodiment has no moving parts. In the presence of fire, air and superheated steam from inside the enclosure expand and flow outwardly through the ventilation passageways. As those gases flow outwardly, they simultaneously block or prevent the transfer of heat from the exterior fire inwardly through those passageways. A water resistant pouch or coating surrounding the storage device prevents damage from flood, water, steam generated by the insulation or smoke from passing through said passageways and damaging the storage device.

Abstract: In one embodiment, an apparatus includes a card chamber, an air intake, an airway, an exhaust plenum, and at least one fan. At least one electronics card can be supported in the card chamber. Ambient air from outside the apparatus can flow into the card chamber via the air intake. The airway is located across the card chamber from the air intake. Air flows substantially linearly across the card chamber from the intake to the airway. The exhaust plenum is located adjacent the card chamber and the airway. The fan is operable to draw air from the airway into the exhaust plenum.

Abstract: A blocking device adapted in a blade server and a blade server are provided. The blade server includes a chassis and a plurality of blocking devices. The chassis includes an opening, a plurality of connecting interfaces and a plurality of convection holes. The connecting interfaces are placed in parallel to connect respective CPU blades. Each convection hole corresponds to a connecting interface. Each of the blocking devices corresponds to a convection hole and includes two blocking plates and a pushing object. The two blocking plates block the convection hole and include a hinge and a torsion spring. When a CPU blade is connected to the connecting interface, the pushing object displaces to make the two blocking plates rotate about a respective hinge to expose the convection hole. When the CPU blade is removed, the torsion springs make the two blocking plates rotate back to block the convection hole.

Abstract: A cooling unit to cool the display apparatus including a heat generating unit to generate heat and a casing to accommodate the heat generating unit, the cooling unit includes a cooling fan to generate air flow; a duct which is coupled with the casing and forms a cooling path to connect the cooling fan and the heat generating unit; an inlet portion which is provided to one side of the casing to communicate with the duct; an inlet grill which is provided in the inlet portion to guide air to be inhaled in a direction inclined to a rear surface of the casing; an outlet portion which is provided to an other side of the casing to communicate with the duct, being spaced from the inlet portion; and an outlet grill which is provided in the outlet portion to guide air to be exhaled in a direction inclined to a rear surface of the casing, wherein the exhaled direction provided by the outlet grill is different from the air-inhaling direction provided by the inlet grill.

Abstract: A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively. The heat exchange structure includes an exterior heat exchange surface and interior heat exchange surfaces, in which the exterior heat exchange surface is configured to receive thermal energy from heat generators that are mounted on the exterior heat exchange surface, and the exterior heat exchange surface dissipates a portion of the thermal energy received from the heat generators and transfers another portion of the thermal energy to the interior heat exchange surfaces. The interior heat exchange surfaces are in the elongated air ducts and configured to exchange thermal energy with air flowing in the air ducts, enhancing air flow in the air ducts by buoyancy of heated air.

Abstract: An information handling center includes an information handling system (IHS) rack configured to receive cooled fluid from a pressurized plenum. The IHS rack includes at least one ventilator that is operable to cause cooled fluid to be drawn from the pressurized plenum into the IHS rack. A cooling fluid supply unit is coupled to the pressurized plenum and operable to cool a fluid passing through the cooling fluid supply unit and direct that cooled fluid into the pressurized plenum. A fluid flow control is located in the cooling fluid supply unit and coupled to a pressure sensor that is operable to determine a pressure in the pressurized plenum. The fluid flow control is operable to adjust the flow rate of the fluid passing through the cooling fluid supply unit based on the pressure determined by the pressure sensor.

Abstract: The present invention provides a display apparatus including a display panel, and a plurality of adjustment mechanisms respectively arranged for a plurality of areas on a rear surface of the display panel and configured to adjust a temperature of the display panel for each of the areas, each of the plurality of adjustment mechanisms including a heat radiating unit mounted on a rear surface of the display panel and configured to form a gas flow passage on the rear surface of the display panel, and a changing unit configured to change a flow rate of a gas flowing into the gas flow passage in accordance with a temperature of an area on the rear surface of the display panel which corresponds to the heat radiating unit.

Abstract: Methods and devices for multi-chip stacks are shown. A method is shown that assembles multiple chips into stacks by stacking wafers prior to dicing into individual chips. Methods shown provide removal of defective chips and their replacement during the assembly process to improve manufacturing yield.

Abstract: A cooking appliance for cooking a foodstuff over a period of time including a shell having a heating cavity and a heating element to heat the heating cavity. A container is removably positionable within the heating cavity and includes a food cavity for receiving the foodstuff. A temperature probe is removably insertable into the foodstuff and a controller is mounted to the shell. The controller controls operation of the cooking appliance in a probe mode wherein the temperature probe is inserted into the foodstuff and transmits foodstuff temperatures to the controller for controlling the heating of the foodstuff, a program mode wherein the controller actuates the heating element to heat the container at a temperature for a selected amount of time and subsequently at a lower temperature and a manual mode wherein the controller actuates the heating element to heat the container at a selected temperature.

Abstract: An electric drive is disclosed which includes at least a choke unit, a power step unit, and a capacitor unit for implementing power supply to an electricity-consuming device. A cooling arrangement is disclosed for cooling the choke unit, the power step unit, and the capacitor unit. The choke unit, the power step unit, and the capacitor unit can be distributed into at least two separate and separately coolable entities, and the cooling arrangement can include parallel cooling apparatuses for cooling the at least two separate and separately coolable entities.

Abstract: A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks.

Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.

Abstract: A solar inverter assembly has a first housing part, which is used as a heat sink, and a second housing part for holding electronic components of the solar inverter. The first housing part has a first air inlet opening, a first air outlet opening and a first air channel connecting the air inlet and air outlet openings. Air flows on the basis of natural convection through the first air channel. The second housing part has a second air inlet opening, a second air outlet opening, and a second air channel which connects the second air inlet opening to the second air outlet opening. Air flows on the basis of natural convection through the second air channel. At least one electronic component, which is insensitive to dust, of the solar converter, for example a transformer or an inductor, is mounted in the second housing part in direct thermal contact with the first housing part and within the second air channel.

Abstract: A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors.

Abstract: An aircraft electronics housing assembly maintains the electronics unit at given ambient conditions despite changes in conditions outside the housing during the aircraft flight cycle.

Abstract: A double sliding-type portable communication apparatus, in which one housing slidably moves relative to the other housing through double-sliding motions, which includes a main housing extending in a longitudinal axis and a sliding housing moving in said longitudinal and also lateral directions across the main housing whose upper surface faces away from the main housing to allow the sliding housing may become displaced away from the main housing and also slidably return to overlap the main housing, wherein said housings are aligned parallel to each other in the longitudinal axis or a lateral direction across the main housing to expose predetermined regions of an upper surface of the main housing with keys provided thereon.

Abstract: There is provided a digital broadcasting receiver apparatus in which a temperature in the area surrounding a removable HDD does not become a high temperature during an operation regardless of whether it is disposed horizontally or vertically. A component with a large heat generating quantity and a component with a small heat generating quantity are installed in respective spaces inside a case. An adapter of the removable HDD is mounted to dispose the removable HDD in a space in which a component with a small heat generating quantity is mounted, thereby preventing the temperature in the area surrounding the removable HDD from becoming a high temperature.

Abstract: The invention relates to a casing for electrical and/or electronic components, in particular computer equipment, with an improved cooling. The casing comprises a frame and a number of walls in which suction openings and outlet openings for the cooling air are formed, and wherein the suction opening is provided with filter material. The casing is provided with a number of fans placed between the suction openings and the outlet openings, whereby a flow with a radial or centrifugal component is generated. Each fan can be connected to an associated electrical and/or electronic component via a connecting part and/or a hose, while a cooling block can further be connected to each electrical and/or electronic component. The invention further relates to a fan, a cooling block and a connecting part for use in such a casing.

Abstract: A filter assembly includes a sleeve coupled to an external surface of an electronic device and disposed at least partially over an airflow vent of the electronic device, the sleeve configured to receive insertion of a filter element therein.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: A circuit board (1) has a top face (2) for positioning an electronic component and a bottom face (4) used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) provide heat transfer from the top face (2) to the bottom face (4). The heat transfer holes (12) are unevenly or non-uniformly distributed on the top face (2) in such a way that the top face (2) is provided with several free sectors (14) which are free of heat transfer holes (12) in order to connect the electronic component to the circuit board (1). The free sectors (14) are configured as columns or lines. A plurality of heat transfer holes (12) are placed at least along the long sides of the free sectors (14). The circuit board has a low thermal resistance between the electronic component and the heat-dissipating base.

Abstract: The invention provides modular air management devices for directing or diverting air flow within an equipment cabinet or enclosure to provide adequate cooling for non-“front to back” breathing electronic devices, and include a scoop assembly, a tray assembly, a vertical mount assembly, and a shroud assembly. The air management devices are designed to direct air flow to and from “side to side” breathing and “side inlet, rear exhaust” electronic equipment. The assemblies may be mounted inside or outside enclosure rails and may be augmented with fan assemblies.

Abstract: A luminaire system having an elongated throughway utilizing a thermal chimney effect. The thermal chimney effect within the throughway circulates air to remove heat generated from the electrical components of the system. Dissipating heat into the throughway from the electrical components can increase the life expectancy of the lamp and the output of the lamp. The electrical components of the system being entirely sealed and isolated from the throughway results in a permanent air, dust, and water tight seal. The permanent seal can minimize damage to the electrical components of the system as well as prevent the build up of moisture and dust within these sealed components.

Abstract: An improved system for cooling a power supply of a welding or plasma cutting system, and an improved configuration of a power supply. The system cools achieves the improvement in configuration and cooling by mounting electrical components to a circuit board and then to a heat sink. Electrical components are also mounted to a common panel that improves the circulation of air. A central panel supporting the power supply heat sink and components allows a smaller and more compact design while maintaining proper temperatures. Electromagnet cooling is improved by modifying electromagnetic cores to conduct heat to the heat sink, and by the use of thermally conducting polymers.

Abstract: An outdoor apparatus that incorporates a heat sink and has a box-shaped casing, having a plurality of aligned ventilation holes formed on an upper plate and a lower plate so as to oppose the heat sink, and wherein inter-hole portions that are portions of the upper plate between adjacent ventilation holes are recessed downward with respect to other portions of the upper plate.

Abstract: A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes a plurality of heat generators that are distributed on the exterior heat exchange surface along an elongated direction of the air ducts, in which air flowing in the air duct is heated successively by heat from the heat generators, and air flow in the air duct is enhanced by buoyancy of heated air.

Abstract: The invention relates to an electronic appliance (1), provided with a cooling assembly (10) for cooling a module (4) that during use can be inserted in the appliance (1) by a consumer. The cooling assembly (10) comprises a cooling body (12) and sliding means (8A, 8B). The sliding means are arranged to engage the module with a low frictional contact surface, so as to facilitate insertion of the module. The sliding means are furthermore arranged to form a thermally conductive bridge between the module and the cooling body. At least one of the cooling body and the sliding means is resiliently deflectable, thereby allowing the sliding means to be pushed out of the way by the module, when this module is being inserted or removed.

Abstract: An electrical enclosure assembly comprises an enclosure having walls defining an interior space for housing electrical components and having a front flange surrounding a front opening. A cover is hingedly mounted to the enclosure for selectively closing the front opening. The cover comprises a front wall larger than the front opening and a rearwardly extending peripheral rim. Cooling structure is integrally formed on an interior surface of the cover proximate the peripheral rim. The cooling structure comprises a plurality of spaced apart cooling ribs each having a shoulder engaging the enclosure front flange when the cover is in a closed position to provide an air flow path between the interior space and outside of the enclosure through spaces between the cooling ribs.

Abstract: An electronic device includes a housing, an active fan installed in the housing, and an airflow reversal prevention assembly. The assembly includes a fixed rack secured to the housing opposite to the active fan, a movable rack, a passive fan, a curtain shelter, a shaft, and a resilient member. The curtain shelter is attached between the fixed rack and the movable rack. The shaft is fixedly passed through the movable rack and the passive fan to be rotatably secured to the fixed rack. The passive fan is driven by air from the active fan to rotate, thereby driving the movable rack to rotate relative to the fixed rack by the shaft to allow the curtain shelter being folded up. The resilient member can urge the movable rack to rotate back to allow the curtain shelter being spread open.

Abstract: The present application relates to apparatus (100) for cooling a light valve device (103), the apparatus comprising an array of elongate members (119), the elongate members (119) each having a tip (131) for contacting the light valve device (103). The apparatus (100) is suitable for cooling a digital micro-mirror device (103). A duct (117) may be provided for directing a flow of air from a fan to the light valve device (103).

Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.

Abstract: A computer system includes a rack, a computer module and an interface-dedicated module to be mounted therein, and an intra-rack management module. The rack has a rear panel for power supply to and signal connection among modules, and the modules permit plug-in mounting onto the rear panel of the rack. The computer module has behind the computer a dedicated adapter which makes possible plug-in mounting of the computer onto the rack and coordinates signals between the computer and the rear panel.

Abstract: A memory module has a good heat sinking effect. Each chip on the memory module has a surface exposed in the air. Or, a thermal pad can further adhere to the surface of the chips. Thus, the heat sinking effect of the memory module is improved; and an easy and convenient producing method is obtained.

Abstract: A waterproof panel comprises a front wall, a back wall, a front baffle assembly and a back baffle. A cavity is defined between the front wall and the back wall, the front baffle assembly and the back baffle are received in the cavity. The front wall defines a first hole array and a second hole array, the back wall defines a third hole array in same height with the second hole array. The front baffle assembly fixed on one side of the second hole array near the third hole array comprises a main baffle. The back baffle fixed on one side of the third hole array near the second hole array is on one side of the main baffle near the second hole array. The back wall comprises a plurality of protruding strips, which can rebound water entering through the third hole array back.

Abstract: A system and method are disclosed for enclosing electronic equipment in a noiseproofed and ventilated enclosure. This includes supplying air to an enclosure and removing air from the enclosure through acoustic chambers attached to the enclosure. The acoustic chambers can be constructed of materials or be treated with materials that have noise-absorbing or noise-abating properties. In addition, the acoustic chamber for exhausting air from the enclosure can contain baffles that help to prevent noise that has entered the acoustic chamber from leaving the chamber. And, the system and method can use a cable egress port that allows cables and wiring to pass through the egress port while blocking the transmission of noise through the egress port.

Abstract: In order to ensure waterproofing between a resin enclosure case and a heat sink, a canopy structure is provided in a portion, in which water is likely to penetrate, so as to prevent the water from entering the portion, thereby directing the water flow to the outside of the enclosure. This makes it easy to install and remove an electronic unit, so that an electronic component integrally formed with the heat sink can be easily replaced.

Abstract: Electrical units are effectively cooled, even if the longitudinal length of the cover member in which the electrical units to be cooled are accommodated is short, by easily guiding a flow of air during operation toward the electrical units. A second cover member which constitutes at least a part of a body cover together with a first cover member is positioned ahead of the first cover member which accommodates an electrical unit to be cooled. Inlets which let a flow of air during operation into the second cover member are disposed in the second cover member. An outlet for discharging a flow of air during operation out of the first cover member is provided in the first cover member.

Abstract: A venting system is described for use with electrical enclosures in which hot gasses may be generated by certain types of fault. The venting assembly may be mounted to a surface of the enclosure, such as adjacent to an aperture formed in the enclosure door. The vent assembly includes a series of louvers that divert all gasses flowing from the enclosure and provide no direct path for gas. The vent assembly thus provides unimpeded flow of hot gasses during a fault event to divert and cool the gasses before exiting the enclosure. The vent assembly may be configured as a cartridge-type insert mounted either inside or outside the enclosure.

Abstract: A module assembly includes a component housing having a plurality of walls forming a cavity. At least one of the walls includes an opening therethrough open to the cavity. The heat transfer plate is mounted within the opening of the component housing and his exposed on an exterior of the component housing. The heat transfer plate forms at least a portion of a mounting surface of the component housing.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.