Abstract: A heatsink comprises a base (110, 210, 310), a fin (120, 220, 320) attached to the base, and a piezoelectric patch (130, 230, 330) attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin surface. This airflow disturbs the boundary layer near the fin and dramatically increases the heat transfer from the fin to air compared to a non-oscillating fin, even for the same bulk flow rate.

Abstract: A thermal module includes a base for contacting with a heat-producing element, a radiating fin assembly consisting of a plurality of stacked radiating fins, a heat pipe having an end connected to the base and the other end extended through the radiating fin assembly, and a fan mounted to one side of the radiating fin assembly. Each of the radiating fins includes a flat main body having a first and a second transverse edge, and at least one projected portion provided on at least one of the first and the second transverse edge. Positions on the first and/or the second transverse edge without the projected portion are open portions. The projected portions on two adjacent radiating fins are staggered, so that a plurality of expanded heat dissipating spaces can be formed on the radiating fin assembly to enable smooth flowing of heat-carrying airflows and upgraded heat dissipating efficiency.

Abstract: The present invention provides a simply usable shield cover capable of enhancing the mechanical strength of a set even if a display device is decreased in thickness. In a video display apparatus including a base chassis on a front surface of which a displaying member is arranged and on a back surface of which a unit for driving and controlling the display device is arranged, and a plurality of frames arranged on the back surface of the base chassis in parallel with each other, a shield cover is attached to the plurality of frames to extend over those to form a crosslink structure.

Abstract: A synthetic jet includes an inner wall configured to surround a heat-generating component, a plurality of walls coupled to the inner wall, the inner wall and the plurality of walls configured to enclose a volume surrounding the inner wall, an actuator coupled to one of the plurality of walls and the inner wall. The inner wall has a plurality of orifices formed therein configured to direct a fluid toward the heat-generating component upon activation of the actuator.

Abstract: In a power supply unit disposed below a floor behind a seat, battery modules are disposed in a lower position, and a DC/DC converter and a motor driving inverter are disposed side by side in a vehicle width direction above the battery modules. Thus, cooling air flowing from the front side to the rear side of a vehicle body is divided into upper and lower portions to cool in parallel the DC/DC converter and the motor driving inverter on the upper side and the battery modules on the lower side. Thus, it is possible to simplify a passage of the cooling air to reduce the size of the entire power supply unit, and improve mountability of the power supply unit on the vehicle body. Also, it is possible to apply low temperature cooling air, before heat exchange, to the battery module, the DC/DC converter, and the motor driving inverter.

Abstract: A modular high-density computer system has an infrastructure that includes a framework component forming a plurality of bays and has one or more cooling components. The computer system also has one or more computational components that include a rack assembly and a plurality of servers installed in the rack assembly. Each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the site.

Abstract: A thermal management system improves thermal property of the speaker system by promoting air circulation to cool the speaker system. The thermal management system includes a speaker frame, an air guide formed on the speaker frame for guiding the air, a ventilation slit formed on the air guide which penetrates through the speaker frame for air communication, and a spider mounting ring for mounting a spider of the speaker system on the speaker frame. The spider mounting ring has a cut-out at its upper edge which positionally match the air guide. The cut-out is curved sharply at its upper surface while a lower edge of the spider mounting ring is gently curved, thereby creating an air passage of directional property.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A stacked heat-transfer interface structure for dissipating heat from a circuit board is disclosed to include a heat plate affixed to the circuit board, and relatively thinner first heat transfer devices and relatively thicker second heat transfer devices respectively attached to first and second heat generating electronic devices of the circuit board that have different heights for transferring heat from the first and second heat generating electronic devices of the circuit board to the heat plate for dissipation.

Abstract: A heat sink includes a rib section and a plurality of radiating fins spaced on a top face of the rib section. The radiating fins are perpendicularly protruded from the top face of the rib section and orthogonally extended across the rib section with a near middle bottom portion of each of the radiating fins in contact with the top face of the rib section, such that two lateral portions of each of the spaced radiating fins are outward protected from two opposite sides of the rib section to define two comb-shaped air paths. Cold air can flow to spaces below the comb-shaped air paths, and hot air carrying the heat radiated from the radiating fins can upward flow through the comb-shaped air paths and diffused outward as a result of natural air convection around the heat sink. Therefore, the heat sink can have largely upgraded heat dissipation efficiency.

Abstract: An induction heating system used on web manufacturing processes has one or more workcoils each with an associated power module. The power modules are cooled using water. In one embodiment the power modules and the workcoils are in physical contact with a full width water cooled support beam. In another embodiment the key heat generating elements of the power modules are mounted against a thermally conductive power module frame which is then mounted against the thermally conductive wall of an un-perforated water header.

Abstract: A computer enclosure includes a fan, a base and a cover. The base includes a support plate. The support plate defines a plurality of air vents. The fan is located on a bottom side of the support plate, and a plurality of operating components is mounted on a top side of the support plate. The cover is mounted on the top side of the support plate to enclose the plurality of operating components. The cover includes a top plate. The top plate defines a plurality of air vents cooperating with the air vents of the support plate to form an air flowing channel.

Abstract: A display device includes: a frame that holds a display panel having a thin member and a light source that irradiates the display panel with light; and a cover that covers the frame. The display device further includes: a heat sink situated in the central portion in the width direction of the display panel in the frame and extending in and out of the frame; and a heat dissipation component provided in the cover and being in contact with the heat sink at a position outside the frame.

Abstract: An air containment system includes a plurality of panel assemblies configured to be arranged in side-to-side relation to form a ceiling. In one embodiment, each panel assembly includes a flexible panel having a first end, a second opposite end, a first side and a second opposite side, a first end connector configured to secure the first end of the flexible panel to one of a rack and a wall, and a second end connector configured to secure the second end of the flexible panel to one of a rack and a wall. Other embodiments of the air containment system and related methods are further disclosed.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: Electrical units are effectively cooled, even if the longitudinal length of the cover member in which the electrical units to be cooled are accommodated is short, by easily guiding a flow of air during operation toward the electrical units. A second cover member which constitutes at least a part of a body cover together with a first cover member is positioned ahead of the first cover member which accommodates an electrical unit to be cooled. Inlets which let a flow of air during operation into the second cover member are disposed in the second cover member. An outlet for discharging a flow of air during operation out of the first cover member is provided in the first cover member.

Abstract: A frame-type computer cooling device for installation in a host computer is provided. The host computer has a heat-generating source and a slot compartment. The slot compartment communicates with the inside of the host computer and the outside of the host computer. The frame-type computer cooling device includes a frame and a cooling circulation device. The frame is insertedly disposed in the slot compartment and includes a receiving recess. The cooling circulation device includes an evaporator, a compressor, a condenser, and an expansion valve connected to one another by a pipeline filled with a coolant. The compressor, the condenser, and the expansion valve are received in the receiving recess. The evaporator adjoins the heat-generating source. Accordingly, the cooling circulation device is easy to install, and heat dissipation of the heat-generating source is swift and efficient.

Abstract: An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device.

Abstract: The disclosure describes an active network interface device (NID) enclosure having a modular construction that provides flexibility to a vendor and permits independent access to technician-accessible connections and subscriber-accessible connections while promoting resistance to environmental and security threats. The active NID enclosure includes an electronics enclosure and an access enclosure. The electronics enclosure contains active electronic components for conversion of data carried on a network signal carrier into services for delivery to subscriber devices. The access enclosure includes two separate access compartments, having separate covers, for independent access to either network terminals or subscriber terminals.

Abstract: According to one embodiment, an electronic apparatus is provided with a case, a printed circuit board which is contained in the case and includes a first surface and a second surface formed on the side opposite from the first surface, a first heating element mounted on the first surface, a second heating element mounted on the second surface, a first cooling fan used to cool the first heating element, and a second cooling fan used to cool the second heating element. A thickness of the second cooling fan is smaller than a thickness of the first cooling fan. The second cooling fan is mounted so as to overlap the first cooling fan in a direction parallel to the first surface of the circuit board and be situated within a range of the thickness of the first cooling fan.

Abstract: The present invention uses multiple global cooling chambers for providing liquid cooling to a plurality of electronic components. The global cooling chambers utilize a non-electrically conductive fluid which is in direct contact with the components to be cooled. The system provides very effective heat transfer rates, environmental isolation of the electronics components and can be deployed in a wide range of applications. Multiple global cooling chambers allows for the hot swapping of cards during operation of the system. Valves provide the ability to minimize the amount of interaction between the cooling fluid and air outside the chambers.

Abstract: A mount module for an inverter includes a housing element with a recess being open to the front face, for holding a single inverter. The upper face and the lower face of the housing element are complementary to one another, and/or the right side and the left side of the housing element are complementary to one another, and/or the rear face of the housing element is complementary to itself. The respective side or sides and face or faces of the housing element each have at least one connection device. A relatively large number of the mount modules can be disposed one above the other, alongside one another, and/or with their rear faces against one another and can be connected to one another in order, for example, to form a central inverter unit for large photovoltaic installations.

Abstract: An enclosure for electrical system includes a side plate and an adjusting piece movably attached to the side plate. The side plate includes a heat dissipating part in which a plurality of heat dissipating holes is defined. The adjusting piece is movable with respect to the heat dissipating part for covering portions of at least some of the heat dissipating holes. The enclosure provides a function of adjusting of heat dissipation and noise suppression of an electrical system.

Abstract: A computer enclosure includes a chassis, an airflow-guiding device, and a mounting mechanism. The chassis includes a mounting bracket. The mounting bracket defines a receiving slot therein. The airflow-guiding device is mounted to the chassis adjacent to the mounting bracket. The mounting mechanism is installed on the airflow-guiding device. The mounting mechanism includes a hook received in the receiving slot and configured to mount the airflow-guiding device to the chassis. The mounting mechanism is configured to slide on the airflow-guiding device to disengage the hook from the receiving slot.

Abstract: A switching power supply includes: a coil; and a pedestal fixed to the coil, the pedestal includes a supporting member configured to support the coil in such a manner as to form a space through which air flows on a surface of the coil attached to the pedestal.

Abstract: A heat dissipating member, a heat dissipating mechanism, and an information processing apparatus capable of improving the cooling efficiency without increasing the size of the apparatus are disclosed. In the information processing apparatus, it becomes possible to effectively transfer heat from a unit such as a memory disposed in an inner space of the apparatus to the outside regardless of the layout position of the unit by using the heat dissipating mechanism fixed to a unit and a heat dissipation surface so that the heat is transferred from the unit to the heat dissipation surface.

Abstract: A computer system comprises a chassis, an electronic component disposed within the chassis, and a cooling fan that comprises a motor support fixed to a housing that is coupled to the chassis and a hub disposed within the housing. A plurality of blades extend radially from the hub. A motor is disposed within a motor enclosure formed by the motor support and the hub. The hub is rotatably coupled to the motor such that the plurality of blades generates a flow of air around the motor enclosure. The system comprises a motor cooler comprising a flow path through the motor enclosure, where the flow path has a first opening and a second opening, and where the second opening is disposed within an area of lowered downstream pressure so as to develop a differential pressure between the first and second openings and generate a flow of air through the motor enclosure.

Abstract: A fan docking collar for sealing between a fan housing of a fan and an enclosure wall to improve fan performance by preventing flow recirculation. The docking collar includes a pliable body that defines an opening for air flow. The body has a seal for mating with the fan housing and a rim for sealing against the enclosure wall.

Abstract: A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.

Abstract: A device associates an enclosing capsule in which will be fitted electronic equipment requiring dehumidification, and a medium-to-low voltage converter to recharge electronic equipment. Heat energy released by the coil in the converter will lead to a free thermal exchange of air between the inside and the outside of the capsule, produced by the natural convection from vent holes located in the lower part of the device through which air will be sucked from the outside and vent holes located in the upper part of the device through which warm air thus produced will escape. The circulation of unsaturated warm air around the electronic equipment has the effect of removing the water molecules on the components by saturating the ambient air in the confinement zone, this air being evacuated through vent holes located in the upper part of the device.

Abstract: A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed duct portion and a removable duct portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the fixed and removable duct portions such that the block can be secured at least partially to each of the fixed duct portion and the removable duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.

Abstract: An embodiment of the present invention is directed to a memory module connector having a pivotable air baffle that controls airflow at the memory module connector. When the memory module connector is occupied by a memory module, the air baffle may rest on an upper edge of the memory module, substantially parallel to the system board and in general alignment with the airflow. When the memory module has been removed, the air baffle may be pivoted downward toward the connector base and into the airflow, to offset the reduction in airflow impedance caused by the removal of the memory module from the memory module connector.

Abstract: A plasma display device that includes a plasma display panel adapted to display images on a front side thereof, a chassis base including conductive material and arranged behind the plasma display panel, a plurality of circuit boards adapted to drive the plasma display panel, the plurality of circuit boards being fixed on the chassis base with a gap between each of the plurality of circuit boards and the chassis base and a driving circuit portion including a plurality of cables and adapted to electrically connect the circuit boards, wherein the chassis base includes at least one holding unit that is adapted to hold the plurality of cables on one side of the chassis base. The holding unit being adapted to attenuate EMI before it reaches the cables within.

Abstract: An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.

Abstract: A heat-dissipating device includes a housing having a housing wall that defines an inner space and that is formed with first and second openings. A heat source is disposed inside the inner space. A heat-conductive set is in heat-communication with the heat source inside the inner space. A heat-exchange member is in heat-communication with fins of the heat-conductive set, and includes an inner tunnel that extends from the first opening to the second opening through the inner space so as to open to ambient air. The inner tunnel is free of fluid communication with the inner space, and ambient air can flow through the inner tunnel for heat exchange.

Abstract: A combined-natural-and-forced-convection heat sink system including a plurality of fins protruding from a first surface of a conductive material, a plurality of air channels formed between the first surface and an opposing second surface of the conductive material and at least one fan. The plurality of fins forms a natural-convection heat sink. The plurality of air channels forms a forced-convection heat sink. The natural-convection heat sink and the forced-convection heat sink form a combined-natural-and-forced-convection heat sink. Each air channel has an input end opening on an input surface of the conductive material and each air channel has an output end opening on an output surface of the conductive material. The at least one fan is configured to generate an air flow through the air channels when at least one of the fans is operating.

Abstract: A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment below the valve tray. Each valve tray has a plenum formed above it to provide a separate chamber that is a source of cooling air. Each valve tray has a plurality of valves, one over each of a number openings in the tray. Each opening overlies an integrated circuits or device under test on the burn-in-board below the valve tray. The valves control the flow of air for cooling the integrated circuits. The flow of air through the valves is the only path for cooling airflow to the integrated circuits on the burn-in-boards.

Abstract: An anti-turbulent casing includes a plate and an airflow guiding element. The plate has a first surface and a second surface opposite to the first surface. The first surface faces outward, and the second surface faces an interior of an electronic device. In addition, the plate has an opening passing through the first surface and the second surface. The airflow guiding element is disposed on the plate and has a curved surface and two sidewall surfaces connected between the curved surface and the second surface, and the curved surface protrudes out of the second surface and extends on top of the opening. The airflow guiding element makes the cooling airflow in a state of laminar.

Abstract: A method and incorporated assembly is provided to enhance structural integrity and prevent interface deflection in a computer rack having a midplane and capable of housing a plurality of nodes. The assembly comprises at least one structural filler book capable of being disposed above or below said midplane where any node may be disposed having geometry and material properties to resist and counteract the plugging force of said node an causing a cancellation effect. The filler book have at least two horizontal supports being connected to one another via a vertical support and a plenum an air for directing air flow. The filler book is being secured to said rack or midplane via an engagement component disposed on one of its horizontal supports.

Abstract: A server chassis is provided for receiving a functional module therein. The server chassis includes a base with an opening defined in an end thereof for the functional module inserted therethrough, and an air flap apparatus engaging with the base. The air flap apparatus includes a shielding panel pivotably attached to the base, and a resilient member connected to the base and the shielding panel to urge movement of the shielding panel.

Abstract: A power control system may use power semiconductor devices such as insulated gate bipolar transistors (IGBT's) in a switching unit to provide motor control. The IGBT's may be cooled with a system that is configured and sized to provide proper cooling at steady-state operating conditions of the switching unit. The IGBT's may be placed in thermal communication with a compartment that may contain phase change material (PCM). When and if the switching unit is operated under transient high load conditions, excess heat may be absorbed by melting of the PCM. When steady state operating conditions are restored the PCM may solidify and release its latent heat to a coolant. The PCM may thus act as a thermal buffer for the cooling system and thus may provide that the cooling system may be minimally sized.

Abstract: A noise-reducing attachment apparatus for a heat exchanger door is provided for facilitating attenuation of noise emanating from an electronics rack. The apparatus includes a frame structure configured to coupled to the heat exchanger door. The door includes in air opening and air-to-liquid heat exchanger, and air passing through the air opening also passes across the heat exchanger. The air opening facilitates passage of external air through the electronics rack. The frame structure defines in part an airflow channel through the apparatus, wherein air passing through the air opening also passes through the airflow channel when the apparatus is operatively coupled to the door. An acoustically absorptive material, which is coupled to the frame structure and at least partially defines the airflow opening through the apparatus, is selected and positioned to attenuate noise emanating from the electronics rack when the apparatus is coupled to the heat exchanger door.

Abstract: A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.

Abstract: An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.

Abstract: A frame for mounting a data storage device, includes a holder configured for mounting the data storage thereto, a baffle board mounted to the holder, and a V-shaped air guiding board mounted to the holder between the baffle board and the data storage device. An intake defined in the baffle board is configured to let airflow therethrough to cool the data storage device mounted to the frame. The opening of the “V” of the air guiding board faces the data storage device. Because of the V-shaped air guiding board, the frame efficiently dissipates heat from and around the data storage device.

Abstract: An electronic equipment cabinet is provided, which includes an upper portion, a lower portion and a support configured to receive electronic equipment. The bottom portion defines a base plenum configured to receive a low temperature gas and communicates with a gas flow distribution pathway, which includes a first plenum communicating with the base plenum and configured to direct the low temperature gas to the support. The gas flow distribution pathway further includes a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the top portion. The top portion includes at least one fan configured to direct the high temperature gas flow from the gas flow distribution pathway. A temperature sensor senses the temperature of the high temperature gas flow and communicates with a control module to control the first plenum and the at least one fan for regulating temperature.

Abstract: An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space so as to enhance the heat-dissipating efficiency of a cooling fan, minimize crashing and other problems due to poor heat dissipation, avoid the use of a heat-dissipating module that is high in cost and complicated in structure, and reduce manufacturing costs.

Abstract: A substrate processing apparatus includes: a processing room in which a semiconductor substrate may be treated by a process; a cooling unit positioned to cool the processing room, the cooling unit configured to convey cooling fluid; and a temperature-adjusting unit that alters the temperature of the cooling fluid supplied into the cooling unit. The temperature-adjusting unit has a cycling circuit. The cycling circuit has a compressor configured to compress a refrigerant, a condenser configured to condense the compressed refrigerant, an expander configured to expand the condensed refrigerant, the expander including a plurality of expansion valves arranged in parallel, and an evaporator configured to evaporate the expanded refrigerant, the evaporator positioned to cool the cooling fluid.

Abstract: Embodiments of this invention relate generally to systems used to cool computer hardware and more particularly to an adaptor for a graphics module. In one embodiment a graphics card assembly is provided. The graphics card assembly includes a printed circuit board (PCB); a graphics processing unit (GPU) attached to the PCB; and an adaptor having first and second surfaces and made from a thermally conductive material. The adaptor is disposed on the PCB so that the first surface is in thermal communication with the GPU and the second surface providing a standard interface for thermal communication with a cooling system.