Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when the contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A modularized electronic system such as notebook or palmtop computer for packaging and assembling one or more electronic I/O module assemblies comprises one upper case assembly and one lower case assembly for mounting the I/O modules in between. Each I/O module comprises a module head and a substantially rectangular module body. The module head further comprises a rigid module connector on its bottom, vertically plugged in a receptacle on the lower case assembly. The module body further comprises a substantially rectangular protruding port on its rear end. The lower case assembly further comprises a U-shaped side opening wherein the rear protruding port of the module body engages and securely attaches to the U-shaped side opening. The I/O module is upwardly supported by the lower case assembly over the module head and the rear protruding port only.

Abstract: Electronic apparatus comprises a main circuit board, a transition board, and a first connector composed of a first part attached to the main circuit board at one edge thereof and a second part attached to the transition board at a first main face thereof, whereby when the first and second parts are engaged the transition board is substantially perpendicular to the main circuit board. The transition board is attached to a connector board so that the second main face of the transition board is in spaced substantially parallel confronting relationship with a first main face of the connect or board. A second connector is composed of a first part attached to the connector board at its first main face and a second part attached to the transition board at its second main face.

Abstract: A mother unit includes a mother board within a case. Control units control output devices, such as an air conditioning actuator, an antiskid actuator, an air bag module, or a constant speed actuator, each provided in a vehicle. The control units are freely connected to or disconnected from the mother unit. The mother unit is connected with the actuators by a wiring harness. Further, the mother unit is connected with sensors requisite for controlling the actuators by a wiring harness. A mother board of the mother unit is provided with common circuits shared by the control units.

Abstract: A modularized electronic system for packaging and assembling one or more electronic module assemblies comprising at least one external enclosure case having one internal room for module mounting. The external enclosure case further comprises at least one upper case assembly and one lower case assembly for clamping the electronic modules in between. Each electronic module comprises a module head and a substantially rectangular module body. The module head further comprises a rigid module connector on its bottom vertically plugged in a receptacle on the lower case assembly. The module body further comprises a substantially flat top end and bottom end and is clamped between upper and lower case assemblies whereby the module assembly can be easily installed or removed by hand without using tools. The internal mounting mechanism of the system greatly simplifies the mounting mechanisms of both the internal modules and the external enclosure case and allows complete modularization of a portable computer system.

Abstract: A computer chip mounting hardware includes a mother board having two electrical connectors at the top; a sub PC board having two electrical connectors at the bottom respectively connected to the electrical connectors on the mother board and a center opening for heat dissipation; a computer chip electrically connected to the sub PC board at the bottom and suspended above the mother board for letting heat be dissipated through the center opening on the sub PC board and the space between the computer chip and the mother board; and a heat conductive clamp bridged over two opposite sides of the sub PC board and clamped on two opposite sides of the computer chip for dissipating heat from the computer chip.

Abstract: An improved electrical connection between each of a set of metallized areas (16) on a first substrate (11 ) and those on a second substrate (12), via a layer of anisotropically conductive material (22) sandwiched therebetween, is obtained by arraying the metallized areas in concentric rings about each of a plurality of fasteners (28) extending through both substrates and the material. By arraying the metallized areas in concentric rings about each fastener, the anisotropically conductive material in contact with the metallized areas arrayed in each ring will advantageously be subjected to a uniform pressure by the fastener, improving the conductivity of the material.

Abstract: A unit for providing a socket for a plurality of removably mountable peripheral devices to a computer including a receptacle for receiving the body of such removably mountable peripheral devices, the receptacle being generally block shaped and having a pair of generally-parallel generally-rectangular outer surfaces separated by a distance which is small compared to dimensions of the rectangular surfaces, the receptacle including conductors for electrically connecting to any such removably mountable peripheral devices and being designed to fit within the interior of a computer; a first circuit board having a generally-rectangular shape; interface circuitry for effecting a connection of such removably mountable peripheral devices to a bus of a computer within which the unit is positioned, the interface circuitry being mounted on the first circuit board and having electrical connections on the surface of the first circuit board to the receptacle, the first circuit board being mounted to the receptacle; a second

Abstract: A docking station (10) slidably receives a device (12) to provide make, break or tap functions, respectively, in a circuit interface. The circuit interface includes a pair of connector housings (17, 18) provided with flexible (or compressible) electrical connectors (19, 20), respectively. A camming member (28, 29; 31, 32; 44) separates the connector housings (17, 18) as the device (12) is slidably inserted into the docking station (10), thereby assuring a substantially zero insertion force on the circuit interface. Preferably, the circuit interface is between the flexible electrical connectors (19, 20), a printed circuit board (13), and a flexible etched circuit (15). The flexible etched circuit (15) is provided with a stiffener (24) resiliently biased by springs (27).

Abstract: The current invention is a method and apparatus for shock mounting an obj in a container. A container is provided having side walls to accommodate movement of the object. The container is filled with a fluid having substantially the same density as the object to be shock mounted. The object is mounted in the container by a plurality of shock mounts. In accordance with the apparatus, a container is provided with an incompressible fluid therein. The object to be shock mounted is immersed in the fluid and suspended at an equilibrium position in the fluid filled container. The object can be a circuit board or some other similarly delicate device.

Abstract: A flexible printed circuit board is provided including a flexible sheet having at least one electrically conductive layer, with a printed circuit pattern and a fold retainer pattern formed in one of the electrically conductive layers. The fold retainer pattern is electrically isolated from the printed circuit pattern. The fold retainer pattern has notches that indicate where the sheet is to be folded when the flexible sheet is folded, it is held in its folded shape by the fold retainer pattern.

Abstract: An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.

Abstract: The invention is directed to a coding device for electrical assemblies that can be inserted parallel to one another into a module frame and that are contacted via plug devices attached at the back to a wiring backplane.A coding flange having three quadratic openings arranged in a right angle pattern is arranged on the wiring backplane between the guard rails, and a corresponding coding housing likewise provided with three quadratic openings arranged in a right angle pattern is arranged on the assembly next to the plug connector. Coding pins can be selectively oriented within the openings by 90.degree. turns, whereby the free ends of said coding pins are fashioned as tongues having a rectangular cross-section, and the area of the cross-section of the tongues corresponds to half the area of the cross-section of the quadratic openings.

Abstract: A pedestal 11 is attached to a circuit substrate 1 having a component placement area 4 when clamping portions 12 and 12 of the pedestal 11 clamp both side portions 5 and 5 of the component placement area 4. It is possible to stand the hybrid integrated circuit device on a parent circuit substrate a by itself before the hybrid integrated circuit device is soldered to the parent circuit substrate a. Since the bottom surfaces of the clamping portions 12 and 12 are flat. The circuit substrates 1, 1, . . . do not overlap one another when the hybrid integrated circuit devices are accommodated in and arranged vertically in a stick since the thickness of the clamping portions 12 and 12 of the pedestal 11 is thicker than the circuit substrate 1. Accordingly, the hybrid integrated circuit device is liable to vertically stand on the parent circuit substrate a by itself and it is easily accommodated in and taken out from the stick.

Abstract: The input and/or output device for process data has a mounting rack (1), as well as a plurality of modules (2) fastened on the mounting rack (1). A process connector (4) can be inserted into each of the modules (2) on the front side in each case. Each module (2) has a circuit board (17) which is arranged in a housing (8), as well as a terminal strip (18) which is connected non-positively to the process connector (4). The terminal strip (18) serves to receive contact pins (26) which interact with contacts of the process connector (4). The input and/or output device is intended to demonstrate a high degree of operational reliability even in the case of a high level of mechanical and electromagnetic stresses.

Abstract: A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

Abstract: A socket for mounting an external integrated circuit on a printed circuit board is described. The socket includes a base having a bottom that can be mounted on the printed circuit board and a top that can receive the external integrated circuit. A plurality of connectors are located on the top of the base for coupling to the external integrated circuit. An in-socket embedded integrated circuit is embedded inside the base for providing a predetermined electronic function. The external integrated circuit and the in-socket embedded integrated circuit occupy substantially minimized space on the printed circuit board. The external integrated circuit can be a microprocessor and the in-socket integrated circuit can also include a microprocessor. The socket can be used for a computer system that allows the embedded microprocessor functioning when the external microprocessor is not coupled to the plurality of connectors of the base.

Abstract: An electronic read-only memory module having an inner casing and an outer casing cap. The inner casing is located on a secondary circuit board from whose edge which projects laterally from the inner casing project contact elements for producing a plug contact with contact counterelements located on a circuit board of a device, which is to be equipped with the ROM module. The outer casing cap has lateral internal gaps which protectively receive the contact elements. Due to the fact that the free ends of the contact elements are set back inwardly with respect to the open edge of the outer casing cap, the contact elements are protected against damage. This also greatly simplifies the loading of a device with the ROM module, because as a result of a simple plugging movement numerous contact elements can be brought into reliable contact with the contact counterelements.

Abstract: The multilayer printed wiring board of this invention consists of a base substrate, a plurality of multilayer interconnections formed by lamination of metal wiring layer and insulation layer on the base substrate and ceramic substrates provided with through holes for electrical connection of the multilayer interconnections and inserted between two multilayer interconnections. The manufacturing method comprises lamination of metal wiring layers and insulation layers on both sides of ceramic substrates to form multilayer interconnections, forming of a multilayer interconnection on the base substrate by laminating a wiring layer and an insulation layer, and integration of the ceramic substrates with metal wiring layers and the base substrate placed together under heated and pressurized conditions.

Abstract: A circuit board (12) and electrical connector (10) mounted to an edge (18) thereof is disclosed. The circuit board (12) includes an edge (18) and two major surfaces (14, 16) extending therefrom having circuitry (20). Plated through holes (24) are arranged adjacent the edge and are interconnected to circuitry on the circuit board. Each plated through hole (24) is associated with an opening such as a slot (26) or partial slot (27) that is formed in the edge (18) of the board so that it intersects the hole. The posts (32) of the connector (10) extend into the openings (26, 27) preferably in interference fit therewith whereafter soldering completes the electrical connections of the posts to the through holes.

Abstract: The invention relates to an interconnection system between a mother card and a plurality of daughter cards provided with connectors. In order to make it possible to increase the density of interconnections between the mother card (10) and the daughter cards (20, 22, 23), additional direct connections are provided between adjacent connectors in addition to the "conventional" electrical connections provided between the connectors (40, 42) and the bases (12, 14). To do this, additional connection elements (47, 48, 50, 52) connected to conductors inside the connectors are disposed facing one another in the side faces (40b, 42a) of the connectors.

Abstract: A high density connector (12 ) for connecting to circuitry on a flexible circuit substrate (16). The connector (12 ) includes a stiffener member (14 ) that is attached to the connector housing (36 ) so that the flexible substrate (16) is clamped therebetween. Tails (46) of ground buses (40) within the connector extend through flexible substrate (16 ) and through openings (48) in the stiffener member (14) and are bent over into recesses (58) to hold the stiffener member (14) and connector (12) firmly against the substrate (16) along the entire length of the connector. Pivotal levers (90) are provided to cooperate with the stiffener member (14) to secure connector (12 ) to a mating connector (18 ) in mating engagement when pivoted to a closed position, and to separate the connectors (12,18 ) with minimum bowing of connector (12) when pivoted to an open position.

Abstract: Disclosed is a chip carrier including a base having terminal slots along the four sides thereof, and terminals each of which having a mounting contact inserted in either terminal slot and a connecting leg disposed out of the respective terminal contact for fastening to a printed circuit board, wherein the base comprises four straight ribs horizontally disposed along the terminal slots at an inner side to keep the connecting leg of every terminal at the same elevation. Each straight rib has grooves spaced corresponding to the terminals slots on tile same side to hold the connecting legs of the terminals in position.

Abstract: When an external connection I/O pin which is formed on a multilayer ceramic circuit board is broken off together with a part of a ceramic substrate, an electrically conductive adhesive is filled in the area where the I/O pin broke and was removed, and together with standing a new pin in this place and connecting it electrically, the new pin is bridged and secured to the surrounding I/O pins using a fixation plate. In so doing, it is possible to restore the broken I/O pin to have the same electrical and mechanical characteristics as before.

Abstract: A multi-layer printed circuit board is disclosed as having more layers and greater accuracy in the conductive traces of those layers than has been previously possible. Using the disclosed multi-layer printed circuit boards can be built having a conductive path width of 0.5 mils (0.0127 mm) and spacing between such conductive traces of 0.5 mils (0.0127 mm). The method enables multi-layer boards to be created having more than eight layers, and still maintaining the desired 0.5 mil conductive path width and spacing. The enhanced accuracy and increased number of layers is made possible by use of adjustments to customer-supplied art work based upon evaluation of test pieces made early in the procedure. By use of the disclosed method, multi-layer printed circuit boards can he built having a high density of coaxial cable equivalents and tuned wave guide equivalents.

Abstract: In a probe terminating apparatus, ground terminals, power supply terminals, and open terminals are provided on a print circuit board, and a ground potential applying terminal and a power supply voltage applying terminal are also provided on the print circuit board. In addition, a pull-down resistance apparatus is inserted to be connected between each of the ground terminals and the ground potential applying terminal, and a pull-up resistance apparatus is inserted to be connected between each of the power supply terminals and the power supply voltage applying terminal. Terminals of an evaluation microcomputer in an in-circuit emulator are connected to the ground terminals, the power supply terminals, and the open terminals by the connection of a probe and an IC socket, or connectors. The probe is connected to the terminals of the evaluation microcomputer, and the IC socket is connected to the ground, power supply and open terminals of the probe terminating apparatus.

Abstract: A jack-type semiconductor integrated circuit package with a jack-type connector instead of conventional leads. This package comprises a semiconductor chip which is provided with a plurality of bond pads, a jack housing which is adapted to electrically connect the package to a printed circuit board (PCB) and connected to a plurality of connection pins, a resin film which electrically connects the bond pads of the semiconductor chip to the connection pins of the jack housing, bonds the jack housing to the semiconductor chip and contains a plurality of conductive wires and a sealing resin housing which seals both the semiconductor chip and the jack housing and is formed in a predetermined shape by a molding process. The present package makes the operational reliability be improved and is especially suited for providing a high density IC memory chip package.

Abstract: An object of the present invention is to provide a connector structure for achieving a signal connection between modules not by way of a motherboard. In an electronic apparatus in which a plurality of modules (3, 4) are mounted on a motherboard (1) in an orderly manner, while flatly positioned parallel to the latter, and electrical connections between the modules and between the respective module and the motherboard are achieved by a connector body (2) extending along a boundary between the adjacent modules (3, 4), contacts (6, 7) are provided in the peripheral regions of the respective module (3, 4). Both the contacts (6, 7) are electrically connected with each other by pressing a connector spring (8) fixed in the connector body (2) onto the contacts (6, 7) provided in the peripheral regions of the adjacent modules (3. 4).

Abstract: A multi-layer interposer in which the X-Y engineering change wiring pattern in the interposer terminates in a pattern of pads on the upper surface of the interposer around the periphery of the chip. In order to make an engineering change, a jumper wire connect pads on adjacent interposers mounted on the multi-chip module.

Abstract: An electric junction box installed in an automotive instrument panel incorporates the meter board and its associated switch circuits as the internal circuit of the box. The electric junction box has an internal busbar circuit having branches that are directly connected to the meter board and the switch circuits so that they form an integral part of the internal circuit of the junction box.

Abstract: This invention relates to personal computers, and more particularly to the provision of a shielding structure for attenuating the possible effects of electromagnetic interference on input/output circuits of the computer while structurally reinforcing a side edge portion of a multilayer planar board. The shielding structure has two cooperating constituent parts, one being particularly formed ground plane areas in exterior layers of the planar board and the other being a particularly formed thin sheet metal member which extends about and substantially encloses connectors by which input/output signals are passed to circuits within the planar board.

Abstract: The present invention is a reusable fixture for holding a TCP carrier tape that is of simple structure, allows the carrier tape to be held securely, and eliminates powder produced by friction during mounting of the carrier tape. The structure includes a reusable fixture with a bottom element for receiving the carrier tape, a frame that surrounds and protects an outer periphery of the bottom element, and a pair of resilient tape holding members for holding the carrier tape that can be deformed by a pair of engaging members that move in opposing directions along the same line so as to allow mounting of the carrier tape, the tape holding members being attached on at least one pair of opposing inner side faces of the frame at positions to allow the tape holding members to extend above the upper surface of the mounted carrier tape.

Abstract: A multilayer circuit card is disclosed that interconnects multichip modules to each other electrically, and simultaneously acts to dissipate otherwise destructive thermal energy. The circuit card is comprised by an aluminum nitride core and two opposed low temperature co-fired ceramic laminates, all three laminated to each other.

Abstract: A substrate to substrate interconnect and standoff assembly (10) comprises an electronic coupling (39) between the bottom of a first substrate (14) and the bottom of a second substrate (12), an electronic coupling (24) of the top of the first substrate to the bottom of the second substrate, a stand-off (20) between the first substrate and the second substrate, and a mechanical coupling (16) between the first substrate to the second substrate.

Abstract: This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate and within which corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contain solder and form solder loaded pin-like structures.

Abstract: Disclosed is a split backed pressure sensitive die carrier tape including a flexible carrier member having a plurality of holes formed therein of a size larger than a die to be carried. Two strips of pressure sensitive adhesive tape are placed along the back face of the carrier partially covering each hole in the carrier. The two strips of substantially straight pressure sensitive tape are spaced apart so that a poke up needle can be passed between the pressure sensitive tape and through the hole formed in the carrier without tearing or damaging either strip of pressure sensitive tape. An integrated circuit chip is positioned in the hole in the carrier and secured to the pressure sensitive tapes.

Abstract: A modulated electronic breadboard assembly kit for constructing and testing prototype circuits. The kit includes a motherboard that has a plurality of connectors having leads that are connected to a plurality of corresponding pins. The leads between the various connectors can be coupled together by wires wrapped around the pins. The kit also contains a plurality of discrete modules which can be plugged into the connectors of the motherboard. The discrete modules each provide a basic electronic function such as an operational amplifier, an analog to digital converter, a comparator, etc. A prototype circuit can be built with the present invention by merely selecting the desired circuit functions, plugging the corresponding modules into the motherboard and then wiring the leads of the board to connect the modules.

Abstract: An interconnecting structure in which circuit and componentry bearing cards are retained in contact with an intermediate card that has component and circuitry areas, and socket insertion contacts.

Abstract: An IC card exhibiting improved electrical insulation, heat radiation capability, and radiation noise resistance includes circuit boards stacked in two layers and spaced apart from each other and surface panels of the IC card while maintaining satisfactory mechanical strength in the card. Board supporting portions extending in a frame portion of a main frame and sub-frames disposed on the board supporting portions hold the circuit boards, maintain a predetermined interval between the two circuit boards and between each circuit board and the surface panels, and provide the desired mechanical strength for the card.

Abstract: An apparatus and a method of use for electrically connecting two printed circuit boards separated by an electrically grounded enclosure wall. The apparatus comprises a flexible, multi-conductor, flat cable that has exposed edge terminations on either end and an enlarged area comprising ground planes. The cable folds upon itself so that all three ground planes electrically connect so that after the cable passes through an opening in the wall and connects the printed circuit boards, the ground planes mechanically seal the opening and electrically shield the printed circuit boards.

Abstract: A high density interconnection technique for connecting large numbers of unique signal lines between orthogonally positioned circuit cards, utilizes pins from the back of a zero insertion force connector (ZIF) to extend through the interconnection card and mate with a female socket connector on a second circuit board. Pins from the ZIF connector which are not aligned with the sockets of the orthogonally positioned socket connector may be connected to pins on the interconnection card which are aligned with the socket connector but not the ZIF. Very high numbers of connections between circuit cards may be made in a small volume and maintain signal line length at a minimum to ensure maximum signal transfer speed.

Abstract: The present invention makes it easier to connect board modules to each other and to increase reliability in a portable semiconductor apparatus having two board modules within a frame. Upper-row connection pins and lower-row connection pins have electrode leads, each having connection portions divided into two parts that are arranged in respective upper and lower rows. One of the board modules is inserted between one upper-row electrode lead and one lower-row electrode lead and electrically connected. The other board module is inserted between another upper-row electrode lead and another lower-row electrode lead and electrically connected. In this way, the board modules are electrically connected to each other.

Abstract: An improved apparatus for coupling a tiltable computer display to a base unit for controlling the viewing angle of the display. The improved apparatus includes a mounting area formed integrally along one edge of the computer display, the mounting area including a first electrical connector coupled to the display and a plurality of support apertures. A support flange is pivotally mounted to the base unit with a plurality of brackets. The support flange includes a second electrical connector for interfacing with the first electrical connector for electrically connecting the display to the base unit. The support flange also includes a plurality of support posts for engaging the support apertures. The apparatus also includes a device coupled between the support flange and the plurality of brackets for controlling the angular relationship if the support flange with respect to the base unit.

Abstract: Packaging for an electronics assembly. A base card has a row of elongated slots. A number of individually insertable subassemblies have standoff feet and a pair of offset hooks at their sides. The hooks snap into the slots in such a way that each slot can hold the hooks for four different subassemblies, which are positioned adjacent each other and on both sides of the base card.

Abstract: The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that locates all circuit input and output pads along a single edge of each chip. The relocated pads are provided with contact bumps to facilitate the addition of a bonded lead to each I/O pad extending therefrom to a point beyond the edge of each chip. Thus, upon lamination the protruding tips form an array of leads on a single lateral face of the laminated chip stack.

Abstract: An LSI package structure with high efficiency of the power supply and fast transmission of the signal is provided in which: adjacent to a pin 8 side surface of an LSI package 1, a power supply member 2 having an electrically conductive portions 6 and 7 for power supply bus and ground bus respectively, and a flexible interconnection board 3 having a power supply pattern layer 3b and a ground pattern layer 3a connected to the portions 6 and 7 respectively via a pin 9, are disposed; the pins 8 and 9 each extend through a through hole 3c formed on the interconnection board 3, the power supply pattern layer 3b and the pins 8 and 9 for power supply being interconnected within the through hole, the ground pattern layer 3a and the pins 8 and 9 for grounding being interconnected within the through hole; and the signal input/output pin 8 and a connector 5 of a signal input/output coaxial cable 5a are interconnected at the side of the interconnection board 3 oppsite the LSI package 1.

Abstract: An apparatus according to the present invention is capable of housing a plurality of plug-in packages, each plug-in package being provided with a first connector. The apparatus includes, a housing having a front panel on which a plurality of insertion openings is provided through which openings the plug-in packages can be inserted into the housing, a first edge of each of the plug-in packages leading and a second edge of each of the plug-in packages trailing when inserting, a mother board mounted in the housing, the mother board having a plurality of second connectors fixed thereon, each second connector corresponding to one of the insertion openings formed on the panel, and a supporting member for pivotably supporting the first edge of each of the plug-in packages which was inserted in the housing so that the first connector faces to a corresponding one of the second connectors of the mother board.

Abstract: A remote driver board suitable for creating electrical interconnections in a substantially wireless electrical apparatus such as a electrophotographic apparatus. A series of parallel conductors extend the length of one side of the board, and along the other side is disposed a modular connector and a switching device, such as in the form of an integrated circuit, for controlling connections between the parallel conductors to other electrical devices in the system through the modular connector.

Abstract: The input and/or output device for process data exhibits a subrack (1) and at least one assembly (2) mounted on the subrack (1) and a process connector (4) which can be frictionally introduced into the at least one assembly at the front. The at least one assembly (2) exhibits a circuit board (17) arranged in a housing and a connector strip (18) which is frictionally connected to the process connector (4). This device is to be of simple and appropriate design and, at the same time, loading of the circuit board (17) with large mechanical forces is to be avoided. This is achieved by the fact that the connector strip (18) is mechanically rigidly connected to the housing and contains elastically deformable terminal pins (21) on which the circuit board (17) is supported.

Abstract: A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.