Abstract: Secondary circuit board which carries an acceleration sensor is mounted upon a primary circuit board in an anti-lock brake system control unit. The secondary circuit board is mounted at an angle to the primary circuit board and the acceleration sensor is mounted at an angle relative to the secondary circuit board to align a sensing element contained in the acceleration sensor perpendicular to a direction of vehicle travel.

Abstract: A multiple substrate mounting frame (104) includes first (132) and second (130) surfaces and a plurality of windows or cavities (106-112). A set of substrates having electrical circuitry (114-120) are attached and electrically connected to the first surface (132) of the mounting frame (104). The second surface (130) can then be electrically interconnected to a mother board (102). A leadless surface mountable assembly for multiple die (100) includes the mounting frame (104) which receives a plurality of substrates (114-120) and electrically interconnects them to each other and/or to a mother board (102). A heat sink (122) can be provided if the die (134, 124) generate too much heat.

Abstract: An electronic control unit having a housing, a substrate, particularly a hybrid, arranged in the housing and having an electronic control circuit. The electronic control unit also includes at least one device plug secured to the housing having contact elements that are electrically conductively connected to the control circuit of the substrate. A second substrate is arranged in the housing, spatially separated from the first substrate. At least one power component disposed in the housing and, electrically connected to the control circuit on the first substrate. One connecting printed circuit trace disposed in housing and conductively connected to the power component. The connecting printed circuit trace are conductively connected to a contact element, conducting power currents, of the device plug. Using the arrangement, in the event of a large number of contact elements in a device plug, the electrical connecting of the contact elements to the substrate can be simplified.

Abstract: A mounting system using a mounting frame permits the support of up to three printed circuit boards in a stacked fashion. Various cut-outs provide ridge segments to support printed circuit boards at a top, bottom and intermediate plane. Locking devices adjacent selected ridge segments engage the printed circuit boards and hold them in assembly with the mounting frame. The individual printed circuit boards can be coupled to each other employing straight pin headers or employing flexible, flat ribbon cable connected to the printed circuit board traces by suitable connectors.

Abstract: A flexible printed substrate is connected to an LCD at one end thereof. To the other end, a thermocompression bonding terminal and a repair terminal (thermocompression bonding terminal for use in repairing) are arranged side by side and connected by means of thermocompression bonding with an anisotropic conductive bond interposed between them. On the other hand, a thermocompression bonding terminal of the main substrate is formed on an end of the main substrate so as to face the thermocompression bonding terminal of the flexible substrate. In addition, a repair terminal (a thermocompression bonding terminal for use in repairing) is formed in a close proximity to the thermocompression bonding terminal of the main substrate.

Abstract: A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.

Abstract: A multilayer structure includes a plurality of stacked circuit panels interconnected by posts extending through each panel. Circuit traces provided on one or both surfaces of each circuit panel interconnect the connectors in a predetermined pattern. The connectors are provided with a blind via which is in electrical contact with a pair of contact pads on either surface of the circuit panel. One of the contact pads has an opening to allow access of a connecting post to the interior of the blind via, the other contact pad having a protruding post. The circuit panels are interconnected by inserting the post of one circuit panel into the blind via of an adjacent circuit panel.

Abstract: An arrangement of electronic components in a housing includes a housing, at least one circuit board arranged in the housing with electronic components of a first type (such as SMDs) mounted thereon, at least one electronic component of a second type (such as a non-SMD coil or capacitor) that is not arranged on the circuit board but rather is mounted on a mounting surface in the housing, and an electrical connection established between the second electronic component and the circuit board. The electrical connection may be established by a connector member having two connecting shanks connected to the wires of the second component and two mounting shanks that are press-fit into contact holes of the circuit board. Alternatively, the electrical connection may be established by respective contact clips electrically and mechanically clamped onto the wires of the second component, whereby the contact clips have contact pins that plug into contact holes in the circuit board.

Abstract: A module retention system including a pair of retention assemblies (32) at ends of a board-mounted receptacle connector (36) for securing a processor module (10) thereto, where the module includes a massive heat sink (12) mounted along one side thereof. Each retention assembly (32) includes a resilient member (50) secured along the base of a rigid retention member (38) and against the circuit board (20) that has portions (62,66) engageable by the module leading end (22) and by the heat sink distal end (16) to stabilize the module and to absorb looseness in the arrangement.

Abstract: A connector with a staggered contact design is described. The connector comprises a first row of connector pins, the connector pins alternately proximal pins and distal pins. The connector further comprises a second row of connector pins alternately proximal pins and distal pins. The distal pins of the connector carry the signals, while the proximal pins are ground or power signals.

Abstract: In an apparatus for testing an electronic device, a life of a measurement board is significantly extended by interposing a plate member between the measurement board and a device mounting member for accommodating the electronic device. The plate member has a plurality of rear pads to be brought into contact with each of the pads of the measurement board on a back surface thereof and a plurality of front pads electrically connected to each of the rear pads through via holes on a front surface thereof. The plate member is places between the measurement board and the device mounting member on testing the electronic device and can be readily replaced by a new one when it is worn away.

Abstract: A device for transferring electric signals comprises a first unit having a bus and electrical and mechanical interconnections of this bus and a bus of another device at at least one side of the unit. A second unit has terminals electrically connected to the bus for external connection of the device to, and signal exchange with, electrical arrangements. The device further comprises two different carriers on which the bus unit and the terminal unit, respectively, are arranged, and members for releasable mechanical connection of the two carriers to each other, and adapted to allow separation of the terminal unit from the bus unit with maintained connection thereof to the bus unit of an adjacent device.

Abstract: A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.

Abstract: A power electronics device incorporating a modular packaging concept and having an integrated device cooler is disclosed. A modular power electronics die cooler is designed for use with a coolant manifold adapted to circulate a coolant medium past a mounting receptacle. The modular power electronics die cooler comprises a base unit adapted for mounting to the manifold, with the base unit having an upper portion and a lower portion. The upper portion includes a plurality of sidewalls defining an enclosure, and the lower portion includes a heat sink and is adapted for insertion in the manifold receptacle. At least one electronic component is mounted within the enclosure. Accordingly, upon mounting the base unit to the manifold, the heat sink is positioned in the coolant medium and thereby dissipates heat produced by the electronic component.

Abstract: An apparatus for guiding a circuit board into an electronic chassis includes a circuit board guide having an end portion. An insertion guide member is positioned adjacent to the end portion of the circuit board guide to guide the circuit board into the electronic chassis and to prevent the circuit board from contacting the end portion of the circuit board guide.

Abstract: An expansion card having an expansion edge comprises: a board having an edge supporting a special bus method for controlling input/output of a signal; fixing means for securely attaching the board to system main frame by using screws, the fixing means being provided on an edge of the board and having a plurality of input/output terminals; at least one expansion connector connected to an expansion card via a cable and to the board for transmitting signals to and receiving signals from an expansion card; and an expansion edge additionally formed on an edge of the board, and connected to at least one expansion connector by a wiring pattern, the expansion edge being mated with an expansion edge connector of the main board, thereby allowing the board to exchange with each expansion card.

Abstract: A surge suppression system for use in a telephone and data communications terminal block. The surge suppression system includes a modular housing having surge suppression circuitry disposed therein, and a ground rail. The ground rail is mounted on the terminal block. The modular housing includes a plurality of contact blade pairs and associated surge suppression circuitry such that, when positioned on the terminal block, each pair of contact blades disposes surge suppression circuitry between an "equipment side" terminal and a "field side" terminal of the terminal block.

Abstract: A terminal structure in a memory module includes a male connector having a plurality of terminal strips adapted to be engaged with the terminal tongues in the female socket. Each of the terminal strips has an obstacle removal portion defined therein for removing foreign matter present on at least one of the terminal tongues.

Abstract: A digital system that includes a main printed circuit board that has a first conductive portion formed thereon is provided. A microprocessor module is coupled to and extends orthogonally from the first conductive portion of the main circuit board. A voltage regulator printed circuit board is coupled to and extends orthogonally from the first conductive portion of the main circuit board adjacent the microprocessor module. The voltage regulator printed circuit board supplies a regulated voltage to the microprocessor module over the first conductive portion.

Abstract: A memory module configured such that it can be operated as a first memory module such as a (Single In-line Memory Module) SIMM or as a second memory module such as a (Dual In-linc Memory Module) DIMM module without requiring external switching circuitry. This is accomplished by providing a memory module card with a circuit thereon that is designed to emulate a DIMM module when plugged into a DIMM socket as found in the latest computer architectures and to emulate a SIMM module when plugged into a SIMM socket as found in older computer architectures. The memory module is provided with memory devices (DRAMS or SDRAMS) and interconnecting bypass devices (CMOS transistor pairs) mounted thereon.

Abstract: A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to connector center line distances equals the connector offset at the backplane.

Abstract: An electrical motor unit 2 having main housing 4 with the inner workings of the motor, a brush housing 44 at one end of the main housing 4, and a control module disposed along the main housing 4 generally transverse to the brush housing 44; where the control module includes circuit links 26 defining a circuit grid 24 with electronic components 30 thereupon to define a control circuit where some of the circuit links 30 include first contacts 32 for mating with an electrical connector and second contacts 34 that are pluggably matable with electrical circuitry of the brush housing 44 as the circuit grid 24 is fitted to the rain housing 4.

Abstract: A printed circuit card having first and second circuit units mounted thereon in connection to terminal pads adjacent two card edges, with the first and second circuit units being in connection to each other and to select pads of a first edge such that upon insertion of that edge into a given card socket, both circuit units are enabled, and the circuit units also being in connection to the pads of a second edge such that upon insertion of that edge into a second card socket, only the second circuit unit is enabled. In the preferred embodiment, the card is a memory module card having buffer and memory circuit units designed to cooperate with each other and with either of standard, buffered or unbuffered memory card sockets in a system board in accordance with insertion of a first or second pad edge in one of the card sockets to automatically provide, either combined circuit unit operation, or single circuit operation. The invention is also applicable to clocked register circuits and series pass devices.

Abstract: A universal enclosure system in a tower type manner for receiving different type mother boards therein includes the main body generally having at least a top wall, a bottom wall, a first and a second side walls, a front panel. Two kinds of different removable back panels are interchangeably adopted to cooperate with the main body for exclusively receiving a first type mother board, i.e., the ATX type, or a second type mother board, i.e., the NLX type, in the enclosure system wherein the first type mother board is bigger than the second type mother board. The first back panel cooperates with a first metal carrier which is adapted to mount the first type mother board thereon whereby the first type mother board is positioned in the interior of the enclosure system and almost very close to the first side wall.

Abstract: A method and implementing system are described in which planar board or motherboard stiffness is provided through a support structure mounted to the planar. The support structure includes support bars connected together to form a stiffening structure for the motherboard. The support bars are mounted within planes which are substantially perpendicular to the plane of the motherboard and in proximity to electrical connectors on the motherboard which are arranged to have circuit boards connected thereto. A board mounting apparatus is connected to the support structure to enable and guide the insertion and extraction of circuit boards to the motherboard with only enclosure side panel access. In one example, the circuit boards include guide pins which are inserted into slots of a mounting bracket, and the mounting bracket is selectively moved to exert an insertion or extraction force on a pin connector attached to the circuit board relative to a corresponding connector on a motherboard.

Abstract: A method and apparatus for attaching a set of components to a printed circuit board is presented. A second board includes the set of components to be attached to the printed circuit board. The second board attaches directly to the printed circuit board by attaching to pins of a through hole device, such as an application specific integrated circuit. The through hole device is mounted on one side of the printed circuit board. The through hole device includes pins which protrude to the other side of the printed circuit board. The second board attaches to the protruding pins on the other side of the printed circuit board.

Abstract: A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.

Abstract: A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.

Abstract: In a modular tower building block system for containing computing system devices, an I/O bus is incorporated into the modular blocks of the building block system by using a printed circuit board to carry the I/O bus in each modular block. The printed circuit board is mounted and positioned in each modular block to electrically connect with a printed circuit board in a next adjacent modular block when two modular blocks are stacked on each other. Also, there are a plurality of I/O buses on the printed circuit boards and only one I/O bus is distributed from each modular block. The printed circuit board is precisely located in each modular block at a predetermined position. Alignment pins and receivers provide alignment between stacked modular blocks to precisely position one modular block to the other modular block. This also aligns electrical connectors on the printed circuit boards of the stacked blocks so that the connectors on the printed circuit boards from two blocks mate when the two blocks are stacked.

Abstract: Terminal pins with two lateral portions and a bridge-shaped elevated middle portion are provided. The terminal pin and perpendicularly rising hybrid circuit typically together have an inverted T shape. On the one hand, the hybrid circuit stands on its own on the substrate without further means of assistance and can be soldered. On the other hand, the bridge-shaped construction effects a sufficient elasticity and carrying capacity relative to swivellings, or respectively, accelerations, as well as effecting the presence of two defined support surfaces whose co-planarity is guaranteed by the springing configuration of the terminal pins.

Abstract: In one form, the invention is directed to the combination of: a plate; a first connector on the plate; a first circuit card assembly including a first circuit card and a second connector on the first circuit card which second connector is capable of coupling to the first connector; and a layer of sealing material on the plate and having a first opening therein to accept a part of the first circuit card assembly with the first and second connectors coupled. The layer of sealing material has a first cantilevered flap which has a first, relaxed state. The first cantilevered flap is deflected from the first state into a second state wherein the first cantilevered flap bears sealingly against a part of the first circuit card assembly with the first and second connectors coupled.

Abstract: An information processing apparatus includes a plurality of processor boards arranged parallelly on the main board and the DC--DC converters for generating operation voltages for processor devices each disposed between the adjacent processor boards. Further, a metal plate with high thermal conductivity is placed in close contact with an area of each of the processor boards where devices generating a large amount of heat are mounted. Heat dissipating fins are joined to the surface of each of the metal plates so that when the processor boards are mounted on the main board, the heat dissipating fins do not contact the DC--DC converter. The heat dissipating fins and the DC--DC converters are arranged so that they are vertically disposed one over the other with respect to the main board.

Abstract: The present invention is directed to a multifunction structure (MFS) in which electrical/electronic componentry, thermal control and structural support are integrated into a monolithic structure that is particularly useful in spacecraft applications. The multifunctional structure is also designed to be modular so that the electrical/electronic componentry can be repaired or replaced.

Abstract: A computer bus system is provided with at least two parallel bus lines and at least a first and a second connector, each connector including at least two bus terminals. Each is connected to a respective bus line, and at least one non-bus terminal is not connected to a bus line. The first connector is an image of the second connector, rotated through 180 degrees. This image rotation maps each bus terminal of the second connector to a respective bus terminal of the first connector, and maps a predetermined non-bus terminal of the second connector to a predetermined non-bus terminal of the first connector. The predetermined non-bus terminals of the two connectors are electrically connected. Also provided are circuit cards adapted to be used with such a bus, each card include switches that map the received signals according to the direction of the connectors. The overall arrangement allows staggered mounting of cards on the bus, shorter parallel bus lines, and more efficient cooling.

Abstract: A computer system is described having a chassis, a motherboard coupled to the chassis, the motherboard having at least one PCI (Peripheral Component Interconnect) connector, and a riser board coupled to the at least one PCI connector. When installed, a surface of the riser board having at least one PCI connector is oriented substantially perpendicular to the motherboard. The computer system may also include a bracket connected to the motherboard, that allows the motherboard to be slideably inserted and removed from the chassis.

Abstract: A high-speed memory module defined by first and second elements the first element including a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, the substrate having a network of conductive traces and vias forming data paths therein, at least two substantially quadrangular, rigid circuit boards, each of the boards laminarly split into substantially symmetric half-sections, each of the half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of the data paths, each of the half-sections having an opposite second face for bonding to the exterior surfaces of the substrate, the half-sections laminated together on either side of a portion of the substrate with the substrate being sandwiched therebetween, wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of the boards in a pa

Abstract: An electronic cartridge comprising a cartridge substrate, a package substrate, an integrated circuit, and an enclosure. The package substrate is mounted to the cartridge substrate. The integrated circuit is mounted to the package substrate. The enclosure encloses the integrated circuit, the package substrate and the cartridge substrate.

Abstract: A protection assembly for connectors is included on a circuit pack to prevent damage caused when a connector is removed while signal power is still being supplied to the circuit pack. More specifically, the protection assembly is disposed on the front side of the circuit pack to prevent access to the connector until signal power is automatically cut off from the circuit pack. In one embodiment, the circuit pack is the type having a lever arrangement capable of causing the circuit pack to engage and disengage the backplane of an equipment frame. When the circuit pack is engaged in the backplane, signal power is supplied through the connector that is accessible, for example, on the face plate of the circuit pack. The protection assembly includes a first shield member mounted on the face plate of the circuit pack in a location adjacent to the connector. The protection assembly further includes a second shield member mounted or otherwise formed on the lever arrangement.

Abstract: A modular integrated circuit package is mounted on a surface of a printed circuit board. The integrated circuit package includes a rigid interposer releasably coupling a component module to a substrate member designed to be affixed to the printed circuit board. The substrate member has a first side with plural first electrical connectors for connection to the circuit board and a second side with second electrical connectors coupled to the first electrical connectors. The interposer includes a plurality of electrical connectors that couple electrical connectors of the component module to the second electrical connectors of the substrate member. The component module also includes plural clip members that engage a lower surface of the interposer to releasably couple the component module to the interposer.

Abstract: An effective heat-sinking arrangement is realized for circuit elements used in a portable type information terminal having a small restricted space therein. Wherein, a first substrate has a cavity formed in its insulating layer extending to an earthing layer and filled with a silver paste to form a seat for mounting a CPU that can thus thermally contact with the earthing layer, and a second substrate has a cavity formed in an insulating layer in which cavity a heat-conducting cushion bonded to the top of the CPU is fitted for creating the heat-conductive route between the CPU and the earthing layer of the second substrate.

Abstract: A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.

Abstract: A module consists of a shroud or enclosure attached to a card containing heat-emitting electronic components or to a stack of two or more vertically spaced cards; one or all of which have heat sinks in thermal contact with at least some of the electronic components. The shroud is apertured to control air flow in many directions over the components and heatsinks. A hinge member extends along one edge of the module shaped to be inserted in a slot in a panel to establish a hinge. As the shroud is pivoted about the hinge, horizontal electrical contacts on the panel and at least one card interengage and vertical contacts on one of the cards remote from the hinge simultaneously interengage. The contour of the shroud aids in installing or removing the module.

Abstract: The cage-supported hard disk drives in a computer server system are coupled to connectors on the cage back plane circuit boards and are controlled by a pair of array controller cards which are hot-plug connected in a redundant manner on the system I/O board using a pair of connectors mounted on the I/O board, each connector having first and second sets of electrical contacts thereon. Connector edge portions of the array controller cards are plugged into the I/O board connectors and have first and second sets of electrical contacts that engage the corresponding first and second sets of electrical contacts on their associated I/O board connectors.

Abstract: An interconnect structure adapts one or more signals conducted between a printed circuit board (PCB) and an integrated circuit (IC) including leads, the IC having signal requirements not provided by the PCB. The interconnect structure includes sockets that provideA. conductive paths between the circuit board and some, but not all, of the leads on the package. To adapt the signals, the interconnect structure also includes an intermediate adaptor board that includes one or more electrical components. The adaptor board and the sockets fit beneath the package containing the IC and above the PCB, and do not extend beyond the lateral boundaries of the package. Heat generated by these components during operation of the IC is dissipated through the IC package via a layer of thermally conductive material sandwiched between the component and the package.

Abstract: An apparatus and a process for precisely mounting integrated circuit packages on circuit boards. The package has guide pins on its bottom surface that mate with non standard holes on the circuit board. This simplifies the precise positioning of packages on circuit boards. When the package is properly mounted on the circuit board many leads on the bottom surface of the integrated circuit package are electrically connected with the circuit board.

Abstract: An interface cable which allows access to an operational Peripheral Component Interconnect (PCI) bus compatible circuit board is disclosed. A flat flexible cable (30,72) secures a plurality of connectors (50,32,36,38) at substantially equal intervals. The connectors on the flat cable are adapted to receive a connection (62,63,64,66,68) on a first edge of the PCI compatible circuit board (82,90). When the PCI compatible circuit board is plugged into the flat flexible cable, a second edge of the PCI compatible circuit board which is opposite the first edge is free to move laterally, away from neighboring circuit boards in response to a flexing of the flat flexible cable. Open space is created adjacent to the PCI compatible circuit board allowing sufficient access to surfaces of the functioning PCI compatible circuit board for testing purpose.

Abstract: An electrical interconnection structure. The electrical interconnection structure includes a mother board substrate having a plurality of layers. At least one layer includes a signal path having a characteristic impedance of Z.sub.O and a conductive ground plane. A signal via passes through each layer of the mother board substrate. The signal via electrically is connected to the signal path. A ground via passes through each layer of the mother board substrate. The ground via is electrically connected to the conductive ground plane. The electrical interconnection structure further includes a plurality of flex circuits. Each flex circuit includes a flex signal path having a characteristic impedance of Z.sub.O and a flex ground plane. Each flex signal path is electrically connected to the signal via and each flex ground plane is electrically connected to the ground via.

Abstract: Personal computer motherboards commonly have connectors located on them for the insertion of plug-in adapter cards. Disclosed is a connector having a first opening in which a PCI adapter card may be inserted and a second opening in which an adapter card of a second type, such as an ISA or EISA card may be inserted. The connector has an insulating moulding common to the first and second openings. By using such a connector, the spacing between slots may be reduced from that required when separate PCI and ISA or EISA connectors are used. This allows either a lower profile for a personal computer or for more connection slots to be incorporated.

Abstract: A desktop computer system is provided in which a motherboard is mounted within a computer chassis atop a tray which is rearwardly slidable out of a rear wall opening in the chassis to provide access to the motherboard. I/O cables are coupled to I/O connectors mounted on a rear end edge of the motherboard, and a connector socket extending along a side edge portion of the motherboard removably receives a bottom side edge connector portion of a riser card which transversely projects upwardly from the motherboard. All cable connections from internal computer devices are made directly to the riser card instead of to the motherboard. Accordingly, all that is necessary to provide access to the motherboard is to upwardly unseat the riser card from the motherboard and then slide the motherboard, with the I/O cables still connected thereto, rearwardly out of the chassis on the tray.

Abstract: A fiber optic module includes a connector connected to a mother board of a host computer, an LD semiconductor IC for converting serial data received from the mother board to an LD electric signal for a laser diode, an LD module for converting the LD electric signal to an LD optical signal, a PD module for converting a photodiode optical signal to a PD electric signal, a PD semiconductor IC for converting the PD electric signal to PD serial data, a circuit board having the connector and carrying LD semiconductor IC and PD semiconductor IC, and LD shielding plate and a PD shielding plate for electrically shielding the LD module and the PD module, respectively, a .[.first frame and a second.]. frame for holding the circuit board, LD module and PD module.