Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: An interconnection assembly for electrically connecting the contacts of an integrated circuit device with the contacts of said circuit board. The interconnection assembly having a base removably and adjustably attached to the circuit board and further having a preselected configuration for accepting the integrated circuit device therein such that the contacts thereon are aligned with the contacts on the circuit board. A bladder-like member having fluid therein is interposed between the integrated circuit and a closure element for forcing the bladder-like member into contact with the integrated circuit device thereby causing the contacts thereon to make electrical connections with the contacts on the circuit board.

Abstract: A meter module includes a meter panel in which meters and indication lamps are mounted, a centralized control circuit board in which control circuits for car electric devices including the meters and indication lamps are installed, an electric junction box for distribution of power, input and output signals and for integration of earth lines, and a module case. The electric junction box is formed by setting a bus-bar circuit board and an insulator cover in the module case. The centralized control circuit board and the meter panel are fixed over the electric junction box, whereby the meter panel, the centralized control circuit board and the electric junction box are intensively incorporated. The above arrangement simplifies electric wiring in the instrument panel portion of car and facilitates assembling of the electric devices such as the meter panel. A wiring harness protector includes a protector main body for protecting a wiring harness therein and a cover.

Abstract: A motherboard assembly which has an integrated circuit socket that can be mated with either a single integrated circuit package or a multiple integrated circuit package module. The motherboard has a socket connector which can receive the external pins of an integrated circuit package. The motherboard also has an auxiliary connector that can mate with a corresponding connector-mounted to a daughterboard. Mounted to the daughterboard are a first integrated circuit package and a second integrated circuit package. Each package may contain a multi-processing microprocessor. The first integrated circuit package has a plurality of pins that mate with the socket connector. The daughterboard can be coupled to the motherboard by pressing the external pins of the first integrated circuit package into the socket connector and mating the auxiliary connectors. The present invention allows a plurality of processors to be plugged into a single socket without occupying a significant amount of space on the motherboard.

Abstract: A fiber optic module includes a connector connected to a mother board of a host computer, an LD semiconductor IC for converting serial data received from the mother board to an LD electric signal for a laser diode, an LD module for converting the LD electric signal to an LD optical signal, a PD module for converting a photodiode optical signal to a PD electric signal, a PD semiconductor IC for converting the PD electric signal to PD serial data, a circuit board having the connector and carrying LD semiconductor IC and PD semiconductor IC, an LD shielding plate and a PD shielding plate for electrically shielding the LD module and the PD module, respectively, a first frame and a second frame for holding the circuit board, LD module and PD module.

Abstract: A space-saving circuit board mounting of a Surface Mounted Technology (SMT) device, such as a resistor, capacitor, ferrite or clock oscillator, is achieved using (1) a single through hole extending transversely through the board substrate, and (2) a cylindrical adapter having a first longitudinal portion coaxially received in the through hole and a second longitudinal portion projecting outwardly therefrom. The second longitudinal adapter portion has a radially inwardly extending notch that receives the SMT device and positions it with its electrically conductive opposite end sections spaced apart in a direction parallel to the axis of the through hole. Spaced apart external metal plating sections on the adapter connect the SMT device end portions to circumferentially separated metal plating segments on the surface of the through hole which, in turn, are representatively connected to ground and signal plane structures within the interior of the board substrate.

Abstract: An interlock switch for electrically coupling opposing surfaces of a circuit card assembly, wherein each of the surfaces includes a contact pattern defining circuit and switch functions. The interlock switch comprises a pair of contacts which engage the contact patterns on the circuit card assembly to electrically couple the circuits located on the oppositely facing surfaces thereof and a switch body for housing the contacts. The switch body includes a slot for solder-free coupling the switch to an edge of the circuit card assembly. The slot enables the switch to selectively reciprocate among three switch positions on the edge of the circuit card assembly to provide either an open circuit or a closed circuit on the circuit card assembly in any one of three switch positions for each contact. A spring is housed within the switch body for biasing the switch from one of the three positions making it a momentary position.

Abstract: A reconfigurable apparatus for computing systems including a set of baseboards and a family of daughtercards, together with a programmable interface to an external bus for a host system. Daughtercards attach to the baseboard through complementary connectors mounted on the baseboard and the daughtercards. In addition, daughtercards are constructed to allow stacking of daughtercards vertically. The baseboard and daughtercard approach of the present invention allows simple, incremental upgrade of installed boards by adding or replacing the daughtercards and allows simple migration to new systems by changing baseboards.

Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board. A cap extends around and encloses and seals electrical elements of the electrical module.

Abstract: A expansion board including a main board, a common board and a system connector. The main board including a cutout and a board connector for receiving the common board. The common board having a data connector at one end and a board connector at the other end. The board connector being mounted perpendicular to the system connector to connectably mate to the common board whether components are mounted on either side of the main board. The main board includes circuitry for one of several expansion buses, the common board contains circuitry independent to any specific expansion bus.

Abstract: A system for connecting printed circuit boards to each other includes electrical connectors and positioners. The positioners fixedly position the boards relative to each other in a general spaced parallel configuration. The electrical connectors can connect the boards to each other in series. The connectors include power contacts, ground contacts, and driver circuits located inside the connector housing. The driver circuit has a transceiver for synchronous two way communications and buffers for repeating and strengthening digital signals.

Abstract: A number plate including luminous characters is usually mounted below head lamps of a vehicle. As essential components, this number plate includes a front plate having a plurality of character portions punched therefrom, a plurality of characters each molded of a transparent or translucent synthetic resin and adhesively fitted into the character portions, a plurality of light emitting diode assemblies arranged on the rear surface side of the front plate at the positions located corresponding to the character portions, a cover secured to the rear surface of the front plate and having the light emitting diode assemblies accommodated therein, and a plurality of base boards having the light emitting diode assemblies arranged at the positions located corresponding to the character portions. In addition, the cover includes a support member for supporting the base boards which are connected to each other in the side-by-side relationship.

Abstract: A circuit board is provided having a plurality of vias and uniformly spaced connector stubs arranged upon one or both outer surfaces of the control board. Sets of trace conductors are formed within the control board between the vias. The trace conductors are arranged in two planes within the control board, wherein trace conductors within one plane are laterally offset from trace conductors in the other plane. Laterally offset trace conductors allow close spacing of the trace conductor planes while maximizing the spacing between trace conductors and corresponding reference conductors also placed within the control board. Additionally, the trace conductors are serpentine-shaped when viewed from a perspective perpendicular to the planar surface of the control board.

Abstract: Circuit supporting modules form a three-dimensional communication interconnect mesh. Each module has fewer than six sets of connectors, preferably four. The preferred three-dimensional communication interconnect is a tetrahedral lattice having a regular, isotropic, three-dimensional topology in which each module connects to its four physically closest neighbors. The structure of the tetrahedral interconnect is isomorphic with a diamond lattice structure.

Abstract: A integrated circuit card having a rigidized frame to surround the electronic devices on a printed circuit (PC) board. The card includes a frame and integral cover for the top and bottom. The top and bottom are constructed out of a material that does not interfere with the use of an antenna coupled to the board assembly within the card. The bottom and top are coupled together using pins. When the two are coupled together the frame is better supported.

Abstract: A card-shaped optical data link device is utilized for transmitting and receiving data in optical communications using an existing card slot of a computer, electronic devices etc. The card-shaped optical data link device of the present invention comprises an electric connector, electric signal processor electrically connected to the electric connector, an optical transmission module, an optical reception module electrically connected to the electric signal processor, an optical connector for supporting the optical transmission module and the optical reception module, a frame for supporting the electric connector and the optical connector at a position opposing to the electric connector, and a pair of panels for sandwiching the frame and constituting an envelope with the frame. The electric connector, the electric signal processor, the optical transmission module, the optical reception module and the optical connector are located within the envelope.

Abstract: A manifold expansion card connector on the motherboard of a personal computer. The computer connector comprises a base, there being a number of pins in the base. An upper portion has three sockets, each socket having connectors therein that are connected to the pins. A first socket is oriented in a plane horizontal to the plane of the pins. A second socket is oriented in a plane vertical to the plane of the pins. A third socket is oriented in a plane at an angle, such as 45 degrees, to the plane of the pins. Two of the connectors placed side by side provide for six add-in cards in a computer that has two different buses, such as a PCI bus and an ISA bus. In a computer with a single bus, such as a PCI bus or an ISA bus, a single manifold expansion card connector provides for seven cards with a single multi-pin connector to the bus.

Abstract: A branch joint box comprising: a casing which is made of resin and includes a bottom wall; a plurality of connector blocks which are provided on a front face of the bottom wall and each include a plurality of terminals erected from the front face of the bottom wall such that distal ends of the terminals are projected from a rear face of the bottom wall; and a sheetlike flexible printed circuit board which is secured to the rear face of the bottom wall and has a conductive pattern such that the distal ends of the terminals are soldered to the conductive pattern of the flexible printed circuit board.

Abstract: A circuit card mounting shelf apparatus having an automatic identification number setting function by which the identification number of a circuit card can be set automatically without the necessity of an artificial operation while maintaining the universality of the shelf apparatus which is realized with conventional apparatus. The circuit card mounting shelf apparatus comprises a plurality of circuit cards having respective identification number setting connectors mounted thereon which are different from one another, and a shelf having a back board for mounting the circuit cards thereon. A plurality of wiring lines for interconnecting the identification number setting connectors of the circuit cards are formed on the back board and cooperate with the identification number setting connectors to automatically set identification numbers of the circuit cards.

Abstract: A memory packaging scheme for high speed computer systems includes, several memory module sockets mounted to a printed circuit board and interconnected by a common set of address, data and control transmission lines within the printed circuit board. The transmission lines are interrupted at each connector. Cooperating memory modules, such as SIMM memory modules are installed in sequence into one or more of the module sockets in accordance with the requirements of the computer system. Installation of a memory module into a memory socket closes the open circuits for each one of the transmission lines at the memory socket, extending the uninterrupted length of the transmission lines to the next memory socket in the sequence.

Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.

Abstract: A printed circuit board arrangement and method of making the same are provided, the printed circuit board arrangement comprising a first printed circuit board having a component carrying side and an opposite printed circuit side, a second printed circuit board having a component carrying side and an opposite printed circuit side, and securing structure securing the second printed circuit board to the first printed circuit board, the securing structure comprising a plurality of conductive jumper wires each having a generally L-shaped configuration and having opposite ends one of which is secured to the printed circuit side of the second printed circuit board and the other of which is secured to the printed circuit side of the first printed circuit board.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract: Attachment of electronics to optical devices is made by supporting the optical devices on a heat spreader card and the electronics on a separate circuit card. Each card has at least a first major surface, with an optical transducing subassembly mounted perpendicularly from the major surface of the heat spreader card. Electronics, except for transducing elements, are placed on the circuit card. The only direct attachment between the circuit card and the heat spreader card is one or more flexible cables attached to the respective major surfaces. This arrangement mechanically isolates the circuit card from the heat spreader card. The flexible cables include electrical conductors held positionally in a polyimide matrix, which provides for thermal isolation of the heat spreader card and the circuit card.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A meter module assembly includes a combination meter panel implemented with meters/indicating lamps and a drive circuit thereof, an electric junction box integrating functional circuits to distribute and control power sources and input/output signals for vehicle-mounted electric equipment including the meters/indicating lamps, and a switch unit integrating switches for vehicle-mounted electric equipment. The combination meter panel, the electric junction box, and the switch unit are integrally united. The electric junction box is integrally combined with the switch unit at the rear surface of the unit being arranged side by side with the combination meter panel. The electric junction box is electrically connected with the combination meter panel by a flexible circuit board.

Abstract: A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips attached to the substrate. A plurality of head pads are located on the substrate to provide interconnection points between the lead wires and the substrate. Each intermediate strip is placed on the substrate such that each of a plurality of holes therein is aligned with one of the head pads on the substrate. An electrical connection is then formed between each head pad and a corresponding conductive pad of the intermediate strip.

Abstract: A high impact high memory capacity flight data recorder, includes a plurality of planar parallel circuit cards and a plurality of planar parallel spacers stacked in alternating sequence to form a card stack. Each of the circuit cards includes a circuit board, plural integrated circuits mounted on the circuit board, plural connector pads on a periphery of the circuit board connected through the circuit board to output terminals of the integrated circuit memories, a foam layer covering the plural integrated circuit memories and an adjacent portion of the circuit board, the periphery of the circuit board being uncovered by the foam layer.

Abstract: An electronic equipment drawer 20 is aligned with an electrical connector in a tunnel in the horizontal and vertical directions with alignment pins and holes. A screw drive 34 and cam 36 mounted on the drawer engages a tunnel wall and controls insertion into the tunnel to provide proper electrical contact and lock the drawer in place in the tunnel. A bus extender card 25 inserted in a connector 26 centrally located on a mother board 21 is supported by surfaces on a bar 28 extending between end walls 24 of the drawer. The end walls 24 include pairs of channels 31 on opposed walls which support feature cards inserted into connectors mounted on the bus extender card 25.

Abstract: A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other surface of the substrate, a conductive solder for attaching the conductor to a base substrate movably contacting the other surface of the substrate to electrically connect the electronic parts with the base substrate, and a deformable bushing for holding the conductor to maintain the attachment of the conductor to the base substrate regardless of whether the base substrate is moved.

Abstract: A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection members to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection members can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies.

Abstract: A VME Bus Compatible backplane and shelf arrangement is provided which incorporates a connectorized backplane arrangement which provides for direct mating to both industry standard VME bus cards as well as VME transition cards. A backplane is provided that is double-sided. On a first face, access to two VME busses (P1 & P2) is provided via rows of first and second connectors. The connector of each row are evenly spaced along the bus and the connectors of one row are vertically aligned with the connectors of the second row. On the second face a third row of connectors is provided, directly behind the second row with each connector offset with respect to a corresponding second connector. The first and second rows of connectors accept standard VME bus cards. The third connectors accept directly, industry standard transition cards. Some of the conductors in the second connectors are connected to the second bus, while others are connected directly to conductors in the third connectors.

Abstract: For connecting external wiring to a circuit board (1), which is inserted in a housing arrangement (7), there is conventional backpanel (13) having connector elements (15) for receiving corresponding connector elements (3) on the circuit board. The external wiring is connected to contacts (29) on an exchangeable and removable connector unit (21). The unit is inserted in the housing in a similar way as a circuit board but is not connected to the backpanel (13) and comprises connector contacts (27) for connection with corresponding connectors (5) on the circuit board (1). When the circuit board (1) is inserted into the housing (7) thus electrical contact is obtained both with the contacts (15) on the backpanel (13) and with the contacts (27) on the wiring connector unit (21). From the contacts (27) on the connector unit (21) leads extend to the various contact pins (29), which are located easily accessible from the front of the housing (7).

Abstract: A socket assembly for mechanically and electrically coupling an integrated component with an interfacing carrier includes a socket body for receiving the integrated component, a retaining spring hingedly connected to the socket body for retaining the integrated component within the socket body, and at least one post element. The socket body includes at least one generally cylindrical receiving member having at least a portion protruding through an aperture in the interfacing carrier which is deformable to engage the socket body with the carrier when the post element is received within the receiving element. The socket body also includes a first mounting surface having plurality of holes for receiving wadded button contacts and a heat transfer element in contacting relation with the mounting side of the integrated component.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed. The interconnect board can have layers assigned to specific voltages, in a power-translation design.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract: A printed circuit board modular assembly is disclosed. The disclosed invention comprises a first printed circuit board having an electronic terminal portion for providing electrical connection to the first printed circuit board; a second printed circuit board having an electrical terminal portion for providing electrical connection to the second printed circuit board; a spacing member disposed between the first and second printed circuit boards; and electrical signal transmission contacts situated on the spacing member for providing electrical connection between the first printed circuit board and the second printed circuit board.

Abstract: The electronic read-only memory has an inner and an outer casing. The inner casing is located on a secondary circuit board, from whose edge projecting laterally from the inner casing project contact elements for producing a plug contact with the contact counterelements, which are located on a circuit board of a device, which is to be equipped with the ROM. The outer casing has lateral, outwardly open gaps, which protectively receive the contact elements. Due to the fact that the free end of the contact elements is set back with respect to the opening edge of the cap-like, outer casing, the contact elements are protected against harmful contact. This also greatly simplifies the loading of a device with the ROM, because as a result of a simple plugging movement numerous contact elements can be brought into reliable contact with the contact counterelements.

Abstract: In a header assembly, for interconnecting an electronic module to a mother board, including an insulating strip and at least one row of spaced-apart pins inserted through holes between an upper face and a lower face of the strip, each of the pins having an upper portion projecting from the upper face and being shaped and dimensioned to interconnect with the module, and a lower portion projecting from the lower face and being shaped and dimensioned to interconnect with the mother board, any adjacent two of the pins being separated by a length of the strip, the improvement which includes a plurality of collars of heat-dissipating material, one of the collars mounted around and in intimate contact with each of the pins, the collars having a peripheral outline shaped and dimensioned to avoid electrical contact with an adjacent pin.

Abstract: A function expanding apparatus for a compact electronic device includes a casing having a supporting portion and a supporting plate attached to the casing to be movable in a predetermined direction. A pair of retaining portions are formed on the supporting plate. The rear portion of the electronic device is mounted on the supporting portion and is positioned in its width direction by a pair of positioning members provided at the supporting portion. The front end portion of the electronic device is mounted on the supporting plate and the retaining portions engage the front edge of the electronic device so as to restrain the movement of the electronic device in the depth direction thereof. The position of the retaining portion is adjusted by moving the supporting plate, in accordance with the depth of the mounted electronic device.

Abstract: An electrically enhanced wiring block with break test capability employs a printed circuit board which includes integrally defined transmission lines and capacitive elements designed to improve impedance characteristics and electrical balance between interconnected wiring and connecting strips and thereby optimize its transmission performance. The transmission lines consist of impedance controlled circuitry with integral capacitive elements that are provided by means of a novel use of plated through holes. The holes may be sized, spaced and interconnected in various configurations to generate the desired capacitance. Two rows of connecting blocks with a row of connecting strips therebetween are mounted to one side of the circuit board preferably by solderless connectors and are interconnected by circuitry on the circuit board. The capacitive elements are connected between selected leads of the connecting blocks and connecting strips by the impedance controlled circuitry.

Abstract: An adapter and control card system for a digital computer is provided for coupling the digital computer to a selectable choice of communications media. The system includes a general-application host card removably insertable into the digital computer, and a communications-medium-specific adapter card removably insertable into the host card, the host card having a cutout conforming to side and end boundaries of said adapter card, the adapter card fitting within the cutout along a substantially common plane in order to minimize surface height of the adapter card and the host card. Mating connectors, particularly between the adapter card and the host card, form transmission lines taking full advantage of ground pins adjacent to signal-carrying differential pairs shielding the signals with a controlled characteristic impedance. In a specific embodiment, the support structure for the connectors also forms the mechanical support for the adapter card and the host card.

Abstract: This invention is directed to a chip carrier system for mounting to a first planar electronic device, such as a motherboard or test fixture, where first planar electronic device is provided with a planar, electrical interconnection interface mounted thereto. The chip carrier system includes a frame comprising a peripheral body portion defined by upper and lower planar surfaces, a recess in the lower planar surface to receive the planar, electrical interconnection interface, a central recess terminating in a floor to receive a second planar electronic device, such as an integrated circuit chip, having leads extending therefrom, converging side walls extending from the upper planar surface down to the floor, and plural through slots for receiving the leads. Cooperating therewith is a force applying member adapted to provide a normal force to the second planar electronic device and be mechanically secured to the frame.

Abstract: A telecommunications shelf module is provided having electronic circuit packs and conductors extending from the circuit packs to an interface station for connection to conductors exterior of the pack, the module detachably mountable in a frame. The module preferably has a cooling arrangement included in its structure.

Abstract: A printed circuit board that is formed as a shaped part of plastic. Interconnects formed of punched leadframes are embedded into this printed circuit board in one or more planes. Moreover, flat plugs are integrally formed by the leadframes. Components, particularly relays, are preferably welded to bent-off tabs of the leadframes.

Abstract: The inventive core for electrical connecting substrates, particularly for printed circuit boards and foil circuit boards, has an inner layer (I) with a columnar structure and on either side, metallic cover layers (A,A'), the columnar structure of the inner layer (I) comprising columns (9.1,9.2), which are regularly arranged, spaced from one another and from the cover layers (A,A'), being directed transversely to the service extension of the core and made from an electrically conductive material in a matrix (6) of an electrically insulating material. The cover layers (A,A') e.g. have electrical terminals (16,16', 17,17') in the form of through-plated blind holes (13,14) on selected columns (9) of the inner layer (I) and are structured in such a way that they have a regular pattern of terminals (16,16') on the facing cover layer and terminals (17,17') on the through-connections insulated from the cover layers, this grid pattern can have a size of approximately 0.5 mm.

Abstract: An apparatus for interconnection of two personal computer style processor printed circuit boards comprises a bridge printed circuit board having edge connectors on opposing edges thereof and support member for supporting the processor printed circuit boards in facing parallel arrangement with each edge connector of the bridge printed circuit board engaged in a mating socket on one of the processor boards. The support member advantageously provides pivotable support of at least one of the processor boards to permit insertion and removal of an edge connector of the bridge board into and from the mating socket of a processor board. The support member further advantageously comprises an enclosure and the pivotable support advantageously comprises a support bracket having notched end panels for engagement with pivot pins fixed to opposing surfaces of the enclosure.

Abstract: A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof.