Abstract: An apparatus and method for inserting and extracting printed circuit boards from a housing using screwing devices. A connector on the printed circuit board includes two tapped holes that cooperate with two threaded shafts held by the housing. The threaded shafts are operatively coupled to a common control shaft in such a way that rotating the control shaft in turn rotates the threaded shafts. Depending upon the rotation direction, the threaded shafts either screw or unscrew within the tapped holes so that the printed circuit board coupled to the connector is inserted or extracted.

Abstract: The present invention features a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly thereto. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed-up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a motherboard or similar structure. A thermal control structure may be placed in the memory module, cooling the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.

Abstract: A set of modules from which custom passive backplanes can be assembled coplanarly couple together and are mounted on a rigid base plate which holds them coupled and coplanar. Each module has a plurality of orthogonally oriented card connectors. Preferably there is a CPU module into which is plugged a CPU card from which an ISA and a PCI originates. On one edge of the CPU module is an connector communicating with the ISA bus. This connector is for chaining together one or more ISA modules, each of which expands the ISA bus to three more ISA connectors. On an opposite edge of the CPU module is an connector communicating with the PCI bus. This connector is for chaining together one or more PCI modules, either 32-bit or 64-bit, each of which expands the PCI bus to three more PCI connectors. Power and ground can be jumpered from module to module or can be directly connected to any module.

Abstract: A controller housing for a water pool apparatus has two separate enclosures disposed back-to-back. The two separate enclosures are electrically connectable by electrical connectors disposed in the adjoining walls of the two enclosures. The electrical connections are aligned with one another so that pressing the two enclosures towards one another automatically places the two enclosures into electrical communication. In one embodiment of the invention, the two enclosures are attached to one another by a pair of disengageable hinges.

Abstract: An electronic component unit such as a speaker unit which is to be installed in the main body of a notebook-sized PC, includes an integral connector with compression type terminals that are connected with lead wires to a speaker. When the speaker unit is disposed on a speaker-unit mounting portion, the compression type terminals are disposed at a position where they contact with the lands of a system board. The speaker unit is fixed by inserting screws into the support portions of a housing, and at the same time, the compression type terminals are elastically contacted with the lands and electrically connected thereto.

Abstract: An electrically conductive circuit conductor 2 is disposed on an insulating resin substrate 1, an electrically conductive surface 3 of the circuit conductor is exposed from the resin substrate continuously in a longitudinal direction, and both side portions 4 of the conductive surface are covered and fixed by collar walls 5 of the resin substrate. A bus bar or an electrically conductive resin material is used as the circuit conductor 2. The bus bar 2 is insert-molded onto the resin substrate. The electrically conductive resin material is poured and solidified in a groove portion in the resin substrate. A contact terminal on a mating circuit side or electrical component side is brought into contact with the conductive surface of the circuit conductor 2. A second circuit board is laminated on the resin substrate, and an insertion hole for allowing the conductive surface of the circuit conductor 2 to be exposed is provided in the second circuit board, and the contact terminal is inserted in the insertion hole.

Abstract: An electronic module (20) includes a first circuit substrate (40) and a second circuit substrate (44). The first circuit substrate (40) has a post surface (50) and a post (52) protruding from the post surface (50). The second circuit substrate (44) has an upper surface (46) opposed to a lower surface (48). The second circuit substrate (44) forms an opening (56). The first circuit substrate (40) may be manufactured using a Molded Interconnect Device substrate. The second circuit substrate (44) may be manufactured using a High Density Interconnect substrate. The second circuit substrate (44) is placed on top of the first circuit substrate (40) so that the post (52) of the first circuit substrate (40) is mated with the opening (56) of the second circuit substrate (44).

Abstract: The present invention provides a through-hole structure for connecting a connector to a printed circuit board, the through-hole structure comprising a signal through-hole having a conductive layer therein for supplying a signal to the printed circuit board, power through-holes having a conductive layer therein for supplying power to the printed circuit board, and dielectric constant adjusting portions formed among the signal through-hole and the power through-holes. Moreover, the present invention provides a printed circuit board having the above-described through-hole structure formed therein.

Abstract: A computer enclosure includes a rear panel (20) and a fastener (40) detachably and rotatably mounted to the rear panel. The rear panel defines a plurality of parallel slots (23) for receiving expansion cards (80). A pair of limbs (25) is formed on the rear panel for locking the fastener in place. The rear panel forms semi-circular pivots (21) to which the fastener is pivotally attached. The fastener is thus rotatably movable between a first position and a second position during assembly. When located at the first position, the fastener does not engage with the covers, thereby allowing the expansion card covers to be attached to or detached from the rear panel. When located at the second position, the fastener is secured to the rear panel by the limbs, and engages with the covers.

Abstract: In an electronic device, a board connection structure of the present invention is provided, that electrically connects conductive parts of multiple circuit boards arranged in layers. The board connection structure reduces the positional displacement of the two circuit boards without considering the positioning precision of connectors provided on each circuit board. The board connection structure of the present invention is a board connection structure 1 which connects electrically conductive parts (13, 23) of two circuit boards (11, 21) arranged in layers. The board connection structure has a pair of connectors (31, 41) which have electrical continuity with the conductive parts (13, 23) of the two circuit boards (11, 21) arranged facing each other, and a flexible wiring board 51 which is electrically connected with each of the pair of connectors (31, 41) and ensures electrical continuity between the connectors (31, 41).

Abstract: Multiple PCI adapter cards are supported by a single PCI slot through the aspects of the present invention. A computer system aspect includes an &mgr;ATX planar including at least one PCI slot, and a riser card mounted in the at least one PCI slot, the riser card supporting multiple PCI adapter cards and providing signal generation to allow the multiple PCI adapter cards to utilize the at least one PCI slot. The riser card aspect includes a PCI connector for coupling to a PCI slot on the &mgr;ATX planar, a plurality of PCI slots for attaching a plurality of PCI adapter cards, and a logic device for providing separate bus signal pairs to each of the plurality of PCI adapter cards from a single signal pair of the PCI slot on the &mgr;ATX planar.

Abstract: A circuit sub-board for regulating constant power source and strengthening ground connections. The circuit sub-board is a double-layered printed circuit board having a large surface power-source layer and a ground-connection layer. The circuit sub-board is utilized to cover the insufficiently ground-covered main board signaling lines as well as insufficiently ground-connected power and ground signaling lines on the main board. With the installation of the circuit sub-board, signals can be transmitted more reliably and with less interference.

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract: A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.

Abstract: The present invention provides a double-sided memory module with improved memory device density and improved manufacturability, and with optional bus terminations mounted directly on the memory module for use with high speed, impedance-controlled memory buses. It also allows the same memory devices to be used on both sides of the card, instead of requiring memory devices with mirrored I/O connections on a second side as on prior art double-sided memory cards. The memory module may be formed on a conventional printed circuit card using cost-effective printed circuit board line widths and spaces with unpacked or packed memory chips attached directly to the memory module, while maintaining good signal integrity. Using memory modules with bus terminations mounted directly on the module improves the signal quality and integrity even further and therefore enhances system performance.

Abstract: A test socket connecting an integrated circuit chip to a printed circuit board is disclosed. The test socket includes a horizontal upper portion connected to the integrated circuit chip, a horizontal lower portion connected to the printed circuit board, and an intermediate portion connected between the horizontal upper portion and the horizontal lower portion.

Abstract: A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.

Abstract: An apparatus for providing automatic alignment of a circuit board within a chassis includes a housing member having an end wall portion. The end wall portion includes a plurality of openings formed therein for receiving a plurality of connectors. The end wall portion further includes a first raised portion and a second raised portion to provide automatic alignment of the circuit board within the chassis.

Abstract: In a power module, an interconnection terminal (10) is inserted into a through hole (30) and a connector (16) of a control circuit substrate (12) from the side of a lower main surface of the control. circuit substrate (12). Then, the interconnection terminal (10) presses a terminal (17) to displace the terminal (17). Thus, electrical and physical connections are provided between the control circuit substrate (12) and the interconnection terminal (10) in such a manner that the interconnection terminal (10) is held between the terminal (17) and an inner peripheral side surface of the connector (16). The interconnection terminal and the control circuit substrate are fixed. to each other without using solder, whereby the power module which is easy to mount and remove is provided.

Abstract: A multi in-line module and an electronic component socket for the multi in-line module are provided. One embodiment of a multi in-line memory module includes a printed circuit board having at least two protrusions formed along one edge of the printed circuit board. Each of the protrusions has first and second surfaces for blocks of contact pins. Accordingly, the module can include three or more pin blocks on separate surfaces of the protrusions. The module provides a large number of pins without being significantly larger than a conventional SIMM or DIMM. Alternatively, physical and electrical attachment of multiple circuit boards provides three or more independent pin blocks on the various surfaces of the printed circuit boards. A socket for a module includes dielectric protrusions with two or more gaps between the protrusions and contact pins on side surfaces of the protrusions that are in the gaps.

Abstract: A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the daughter boards have mounted connectors so that the boards can be electronically and mechanically interconnected with another board.

Abstract: Extension boards and a method of extending boards capable of reducing a fabrication cost and capable of mounting electronic devices on a board with high density which board is mounted onto an electronic equipment from the beginning. In a memory board on which connectors and electronic devices are mounted, each connector is formed of an upper connector and a lower connector, and signal lines extend in the memory board, wherein terminals or connector pins of the upper and lower connectors form one pair in appearance while interposing the memory board therebetween, and each pair forms a terminal group.

Abstract: An electronic board assembly carrying connectors on each side of its lower edge which is adapted to withstand the relatively strong forces required to insert or remove the assembly, e.g., from a backplane board, and yet provide many electrical contacts along the interconnection sites. The electronic board assembly comprises two symmetrical elementary PCBs electrically coupled together, each carrying a connector on its external lower edge. In one embodiment, these two PCBs are coupled together by a flexible adhesive insulative layer and maintained by mechanical devices such that the distance between these two connectors is set to a predetermined distance (to align precisely with the backplane board). The mechanical device used to maintain a predetermined distance between the two connectors of the assembly may comprise a U-shaped member, the upper part of this member being strategically inserted between these connectors.

Abstract: A PC board support is disclosed to include a hollow support shell adapted to support a PC board above a frame, a spring mounted inside the support shell, the support shell having a top opening, a top neck, and a retainer head at the top of the top neck, and a slide supported on the spring inside the support shell and moved along a vertical sliding groove at the retainer head and top neck of the support shell in and out of the top opening to unlock/lock the PC board.

Abstract: The specification describes interconnection strategies for micro-electronic machined mechanical systems (MEMS). Typical MEMS device array comprise a large number of individual mechanical devices each electrically driven by multi-chip modules (MCMs). High density interconnection is achieved by mounting the MCMs mounted on both sides of a system interconnection substrate. Overall interconnection length is reduced by locating the MCMs in a common circuit driving a given mechanical element on opposite sides of the system interconnection substrate and interconnecting them using vias through the substrate. Rapid replacement/repair is facilitated by mounted all active elements in sockets using contact pin arrays for electrical connections. In service reliability is obtained by providing spare sockets for redundant MCMs.

Abstract: A circuit module includes a connector terminal (4A) provided on a front surface of a printed wiring board (2) and connected to a data pin (DQt) of a memory IC (3) through an interconnect line (5a). A conductive connector terminal (4c) corresponds to the connector terminal (4a) and is provided on a back surface of the printed wiring board (2). A through hole (16) extends between part of the front surface of the printed wiring board (2) where the connector terminal (4a) is formed and part of the back surface thereof where the conductive connector terminal (4c) is formed. A conductor fills the through hole (16), thereby suppressing skews resulting from a difference in interconnect line length on the circuit module and decreasing a stub capacitance to achieve the reduction in power consumption.

Abstract: The present invention provides for an apparatus and method for retaining a first circuit board on a second circuit board. Embodiments of the invention use a clip attached to uprights to exert a biasing force on the first circuit board. The uprights are also coupled to the second circuit board. In embodiments of the invention, the first circuit board is a processor package such as a processor package for use in a Slot 1 or Slot 2 connector, and the second circuit board is a motherboard of a computer system. Embodiments of the invention also include a memory module and a power supply.

Abstract: A printed circuit board is disclosed which has conductive pads located near an edge of a board main body on its upper and lower surfaces to reduce the width in the direction of contact sliding and to provide for a smoother connection between electrical contacts of an electrical connector and the conductive pads despite a powdered substance produced as a result of friction between the conductive pads and the electrical contacts. The printed circuit board (1) has conductive pads (14a, 14b) on upper and lower surfaces of the board main body (2) near the edge (3) of the main body (2). Electrical contacts (20) slide over the conductive pads (14a, 14b) from the edge (3) of the board main body (2). The conductive pads (14a, 14b) are connected together by via holes (15a) that are located in the paths of the contacts (20).

Abstract: An ONU includes circuit cards, a card cage, and electrical connector hardware. The card cage releaseably engages and supports the circuit cards in installed positions in the card cage. At least one pair of the circuit cards have serial interconnections with each other. The electrical connector hardware defines all of those serial interconnections and is free of a backplane.

Abstract: A socket attaches to a first component and includes a receptive area to couple a second component to the first component. A low profile voltage regulator is integrated into the socket and proximately disposed adjacent to the receptive area. The low profile voltage regulator converts a first power signal from the first component to a second power signal for the second component. A chassis encloses the socket and the low profile voltage regulator and serves as a base for a heat sink to be attached to the second component.

Abstract: An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

Abstract: The present invention provides a small adapter apparatus useable for high density integrated circuit packages, e.g., ball grid array packages. The adapter apparatus includes an adapter body member having a length along an adapter axis between a first adapter end and a second adapter end of the adapter body member. An array of contact elements, e.g., solder spheres, are disposed on the first adapter end of the adapter body member. Further, the adapter apparatus includes an array of elongated pin elements. Each elongated pin element corresponds to one of the array of contact elements and extends parallel to the adapter axis from a corresponding contact element through the adapter body member and the second adapter end thereof. One or more of the elongated pin elements of the array is of a different length than one or more other elongated pin elements. Various socket devices for receiving and retaining the elongated pins are also provided.

Abstract: An electrical machine, such as a router, switch, hub, etc., includes a housing in which a Primary Backplane and Secondary Backplane are mounted in stacked spaced relationship. A primary Bus is fabricated on the Primary Backplane and a secondary Bus is fabricated on the Secondary Backplane. Connectors with feed through elements provide mechanical support and electrical transmission between the Primary Backplane and Secondary Backplane.

Abstract: A computer functional card adapting seat comprises a base and at least one computer functional card. The base has a circuit substrate therein; At least one terminal slot is formed in the circuit substrate. Each terminal slot is connected to a circuit control unit of the circuit substrate. At least one universal serial bus inserting hole, a first inserting hole for being supplied with DC power, and a second inserting hole for being connected to a computer are installed on the base. The universal serial bus inserting hole, and first and second inserting holes are connected to the circuit control unit. Thereby, the computer functional card is formed on the base for being communicated to a computer without needing to detach the case of the computer mainframe.

Abstract: A memory module includes a plurality of semiconductor memory devices mounted on a printed wiring board (PWB); longitudinal contact terminals that are for connection to a computer mother board and are arranged along at least one longitudinal edge of the PWB; and transverse contact terminals that are for connection to the computer mother board and are arranged along at least one transverse edge of the PWB. A socket for the module includes at least one longitudinal part into which the longitudinal contact terminals are inserted and at least one transverse part into which the transverse contact terminals are inserted. Each transverse socket part can be mounted on a pivot attached to the longitudinal part and rotated to engage a PWB inserted in the longitudinal part. Alternatively, each transverse part can be a flexible circuit carrier.

Abstract: The process of prototyping circuits such as a backplane or a circuit board has been modularized for achieving marked reductions in costs, time, and construction errors. Rather than repeating the recurring tasks, such as making bus connections between different circuit boards, of the prototyping process, the present invention implements a plurality of modules which can be separably coupled into an assembly having a planar arrangement for prototyping circuits, where each module specializes in a particular task. In the preferred embodiment, the plurality of modules includes a data bus module, a switchable data bus module, a power bus module, and a wire-wrap module. Each one of the plurality of modules includes a coupling face configured for coupling to one or more circuit boards.

Abstract: A modular mounting system which allows a circuit board to be removed, inserted or replaced through the front of the mounting frame without deactivating power to the equipment, and in the preferred embodiment without detaching any external cables. Connections for external equipment are disposed along the rear edge of the circuit board, and a row of contacts for the internal connections is provided along the bottom edge of the circuit board. The system of the invention provides a releasable connector which retracts the connector pins into a housing when a circuit board is inserted or removed, thus eliminating the possibility of a contact on the circuit board touching a live connector pin. In the preferred embodiment the external connections are made through adaptors that plug into external cable connectors provided on a connector plate detachably affixed to the rear of the mounting frame.

Abstract: A telecommunications shelf is disclosed that includes a back portion of a shelf, a bus control transition module, and a back plane. The back portion of the shelf is operable to receive a plurality of transition modules. The bus control transition module is received in the back portion of the shelf. The back plane is coupled to the bus control transition module. The bus control transition module is operable to provide system functions for a plurality of cards in the shelf over the back plane.

Abstract: A expansion circuit board retainer comprises a supporting bracket and an adjustable sleeve. The supporting bracket is secured to a main board and the adjustable sleeve is slidably mounted thereto. The sleeve forms a slot in a wall thereof, through which bolts can extend and screw into corresponding holes of the bracket to adjust the sleeve position. The sleeve also forms pairs of guiding blocks for guiding and receiving an edge of an expansion circuit board. A retaining head is formed at top end of the sleeve, which presses the expansion circuit board downward to secure the expansion circuit board in place.

Abstract: A compact programmable logic controller provides a floating mounting of circuit cards carried by opposed terminal blocks of the industrial controller the latter only which are directly mounted to the housing. Positioning of the cards between opposed connector blocks prevents torsion on the cards resulting from unbalanced forces on the terminal blocks and provides an extremely rigid structure.

Abstract: A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the daughter boards have mounted connectors so that the boards can be electrically and mechanically interconnected with another board.

Abstract: Secondary circuit board which carries an acceleration sensor is mounted upon a primary circuit board in an anti-lock brake system control unit. The secondary circuit board is mounted at an angle to the primary circuit board and the acceleration sensor is mounted at an angle relative to the secondary circuit board to align a sensing element contained in the acceleration sensor perpendicular to a direction of vehicle travel.

Abstract: A line replaceable module (LRM) configured with a plurality of mini-modules, each of which have relatively higher contact densities than currently available LRMs with the same form factor, for example, a Standard Electrical Module-Size E (SEM-E) form factor. The mini-modules are significantly less expensive than an entire module allowing such mini-modules to be disposable, eliminating relatively costly fault diagnostics and repair. Each mini-module includes a printed circuit board which includes a rigid primary portion, a rigid secondary portion and flexible portion interconnecting the primary and secondary portions. The rigid secondary portion may be configured to provide dual-sided interconnection to a backplane data bus. Use of the dual-sided rigid secondary portion provides for generous spacing for contact densities much higher than known contact densities for LRMs with the same form factor. The rigid primary portion carries the components forming the LRM.

Abstract: An FPC mounting structure wherein an inner surface of a guide hole formed in a chassis is cut and raised to form a support projection, an FPC holder is formed with first and second holding portions which permit the support projection to be fitted therein, the FPC holder with a terminals-formed portion of the FPC attached thereto is inserted into the guide hole of the chassis and the first holding portion of the FPC holder to be fitted on the support projection, allowing the FPC holder to be supported by the chassis and allowing terminals on the FPC and circuit patterns on a printed circuit board to become conductive with each other.

Abstract: A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.

Abstract: A peripheral apparatus for personal computer (PC) cards, which decreases the limit of the components installing height on a printed circuit board (PCB) of a PC by changing the installing position of a PC card slot unit, is provided. Two connectors are provided. A first connector is fixed to the PCB and a second connector is fixed to the PC card slot unit. And these two connectors are connected at a state that the two connectors can be de-connected in the opposite direction of inserting PC cards. A slot of the first connector is provided in the horizontal direction and the first connector is fixed at the end side of the PCB. The second connector is made of a card edge type PCB and this card edge type PCB is inserted to the slot of the first connector. The PC card slot unit is connected to the PCB in a cabinet of the PC at a state that the PC card slot unit is placed in the horizontal direction at the outside of the cabinet of the PC.

Abstract: An expansion card for a computer and a method for configuring the expansion card, where the expansion card includes a main card body, a daughter card, and a bracket. The main card body includes a coupling portion for coupling the expansion card to an expansion slot of the computer. The main card body further includes a connector area that is accessible from both the first and second face of the expansion card. The daughter card is coupled to the main card body on either he first or second face of the main card body, wherein the coupling configuration is determined based on the computer system chassis in which the expansion card is to be mounted The daughter card includes a connector that couples to the connector area of the main card body. The bracket is coupled to the main card body and the daughter card and facilitates mounting the expansion card in the computer chassis.

Abstract: A card retention apparatus has an enclosure including an attachable cover. A connector having a card seated in the connector is mounted in the enclosure. A card retaining member is connected to extend from the enclosure into contact with the card. The card retaining member urges the card into seated engagement with the connector. A resilient member is mounted between the card retaining member and the cover for providing a retention force. The card retaining member is engaged with the card and moved into a biased position when the cover is mounted onto the enclosure, the movement to the biased position acting on the spring to establish a retention force that is applied on the card.

Abstract: The invention features an apparatus, which allows a power converter module to be easily connected and disconnected from an external device and includes an electronic component. The apparatus includes a connector for making an electrical connection to a terminal on the power converter, a component interface subassembly which provides for making connections to the electronic component and an enclosure which encloses the electronic component and the connector. The component interface subassembly may include a thermally conductive plate which provides a low thermal impedance path for removing heat from the electronic component. The electronic component may be an OR diode or a MOSFET which may be connected in series between the power converter output and the external device. The apparatus may be attached to a heat sink for efficient removal of heat.

Abstract: A module for insertion into an expansion slot of a computer includes a primary board and a pair of auxiliary boards. The auxiliary boards are mounted in a spaced relationship on respective sides of the primary board to define air paths between the boards. The air paths allow air to circulate between the boards. The auxiliary boards each have a trace for electrically connecting the board to the primary board, and the primary board has a trace for connecting chips mounted thereon to an interface with the expansion slot. The traces of the auxiliary boards are substantially the same length. The trace of the primary boards is only slightly longer than the traces of the auxiliary boards.