Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components inner connected with one another through a plurality of circuit paths. The components include directional couplers connected in series to combine branch circuits with each branch circuit having a separate attenuator.

Abstract: An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having high density electronic devices mounted thereon. This high density pattern is electrically coupled to the lesser density second pattern which is connected to contacts of a second substrate. These contacts are of the lesser density also, and extend through a dielectric member for being coupled to conductors (e.g., copper circuit pads) on the conducting member. Ready separability of various parts of the assembly is thus assured.

Abstract: A apparatus and method of interconnecting printed circuit boards in an electronic system inside a card cage. The apparatus includes a companion printed circuit board that connects to the main printed circuit board through a first electrical connector, the companion card providing at least one electrical path to a second connector. This second connector connects to the back plane of the card cage, with the back plane providing at least one electrical connection from the second connector to another electrical connector which connects to another companion card connected to the back plane. This method of interconnection avoids requiring flexible cable interconnections, thereby providing a cleaner layout of the electronic system, allowing easy insertion and removal of the main printed circuit boards as well as the companion cards, and providing excellent noise shielding.

Abstract: The present invention relates to a card type CPU fixing structure, characterized in that when said card type CPU (CELERON) is inserted in the main board of Pentium II framework, there is no need to change the support seat. All the user has to do is to fasten the fixing cover on the support seat, the channel on the inside of the fixing cover will press the card type CPU (CELERON) in position, so the card type CPU (CELERON) will not wobble. With the invention, the interchange between a cartridge type Pentium II CPU and a card type CPU (CELERON) can be made readily without having to replace the support seat of the main board. With the invention, the manufacturers of main boards will not have to produce additional compatible components after the card type CPU (CELERON) is put on the market, while the user will be able to replace the CPU easily and readily.

Abstract: A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.

Abstract: The present invention provides a card slot unit that allows a function extending card having connection electrodes on an insertion-edge side to be inserted into the card slot unit for establishing electrical connection with the card slot unit. The unit comprisesa slot board on which a predetermined wiring pattern is formed;a slot connector which is mounted on the slot board and has connector pins electrically as well as mechanically connectable to the connection electrodes of the function extending card;a card control IC which is mounted on the slot board and electrically connected to the connector pins of the slot connector through the wiring pattern; andan output connector which is mounted on the slot board and electrically connected to the card control IC through the wiring pattern.The card slot unit is hardly affected by noise, reducing the number of errors generated in the signal. As a result, the operating frequency can be raised.

Abstract: A device with components arranged on a p.c. board and attached by connector contact pads, fasteners for additionally fixing the components in place, and at least one connector strip positioned above the p.c. board surface and attached to the p.c. board, with the fasteners being structural elements molded on the connector strip, and at least one component being arranged and fixed in place between the structural elements and the p.c. board.

Abstract: A resin-molded electronic circuit device is provided with a protection resin molded with covering electronic components and an electronic circuit substrate and having almost the same coefficient of thermal expansion as that of a metal forming the electronic components and the electronic circuit substrate, and a connector mounted at an end of the protection resin and functioning as an external connecting terminal of the electronic circuit substrate. Since a case for housing the protection resin is unnecessary, it is possible to decrease the number of components and man-hours, and enhance the outside appearance of the electronic circuit device.

Abstract: The invention relates to a computer system having a chassis with an access door allowing a user to access the computer circuitry. The computer circuitry has a plurality of critical circuit boards and an interlock circuit routed through connectors and cables associated with the critical circuitry. If any of the connectors are not connected or connected improperly the main power is prevented from turning on or the main power to the computer is turned off and auxiliary power is used to power indicator lights which aid a user determine which connector is not connected or improperly connected.

Abstract: An electronic device has an opening for up to two data carrier devices or, respectively, chip cards with row-type contact surfaces positioned alongside one another. The devices or, cards are stackable over one another in offset fashion. In a region of the terminal side lying opposite the plug opening it comprises two rows of contact springs lying next to one another, said rows being spatially offset upwards by the height of a card, and also offset in the insertion direction in a manner corresponding to the card offset. The resilient ends at the plug side of these contact springs respectively contact the contact surfaces of inserted data carriers from above.

Abstract: A grounding member for installation between a surface acoustic wave filter package and a circuit board to which the filter package is mounted. The grounding member is formed from electrically conductive sheet stock material as a leaf spring which is deformed to maintain effective contact between the outer case of the filter package and a ground plane on the circuit board. In addition to providing an effective ground connection between the filter package and the ground plane, the grounding member also functions as an electromagnetic shield for radiating signals between the input signal post and the output signal post of the filter package.

Abstract: A repeater case for high-density subscriber lines includes a repeater base and repeater case housing formed of a fiberglass composite and together forming a sealed enclosure for a pressurized atmosphere. The repeater case housing has a removable cover secured in position by torque bolts, a sealing gasket to sealingly receive the cover, a plurality of high-density subscriber line module slots and a plurality of printed circuit boards mounted to certain of the slots with gaps between adjacent printed circuit boards, the printed circuit boards being adapted to receive respective high-density subscriber line modules. The repeater base has a cable inlet, and each of the plurality of printed circuit boards is provided with a connection to the cable inlet and a connector to electrically receive one of the high-density subscriber line modules. The repeater base also includes an electrically insulating barrier between the cable inlet and the printed circuit boards.

Abstract: A rechargeable cordless vacuum cleaner system comprises a hand held vacuum cleaner and a separable charger. The cleaner includes a circuit board assembly having first and second sets of contacts disposed for engagement to first and second sets of mating contacts of a battery pack and the charger. Both sets of contacts are spring loaded for resilient engagement to the mating contacts. A pocket portion is formed adjacent the set of contacts to the charger to avoid direct exposure of the contacts to an operator of the cleaner.

Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.

Abstract: A computer baseboard providing localized support for high pin count, high density components. The baseboard includes a first circuit board capable of supporting low pin count electrical components. The first circuit board has a surface onto which the low pin count electrical components are mounted, and an area to which a second, smaller, circuit board is connected in a parallel arrangement with the first circuit board. The second circuit board has a first surface onto which high pin count electrical components are mounted, and a second surface physically and electrically connected to the area on said first substrate. The first and second circuit boards together provide support for electrical components having higher pin counts and densities than the first circuit board can support individually, such as high performance microprocessors and chipsets.

Abstract: An apparatus and method for rigidly stabilizing or restraining circuit boards is provided. The apparatus has a rigid cross member (20) and a circuit board clamp (10). These provides stabilization of commercial off the shelf (COTS) circuit boards for use in harsh environments. A one piece clamp has hooks with notched ends that attach to opposite sides of each circuit board. The clamp has a surface parallel to the hook. The parallel surface has threaded holes. Threaded shafts are used with the threaded holes to contact the clamp hook and provide pressure on the printed circuit board. A threaded hole is used with a threaded shaft to engage a rigid cross member. The cross member has unthreaded holes to allow for attaching to the clamps with threaded fasteners. The rigid cross member is then attached to the chassis with a fastener. This eliminates flexing of the circuit board under vibration.

Abstract: A hot docking mechanism enables a PCI type card with an edge connector to be inserted into an enclosure and docked in a card socket on the motherboard without operator access to the enclosure interior. A card holder carries the card and is supported on a card guide for sliding motion into the enclosure to a position at which the edge connector is aligned with the socket secured to the device motherboard. A camming assembly includes a sliding cam operable from outside the enclosure to convert horizontal sliding motion to vertical motion of the card into and out of the socket. The card holder is cammed out of the sliding support of the card guide during docking and returned to sliding support when the camming mechanism undocks the card. The card guide also comprises a rail that guides the card holder within the enclosure during both card docked and card undocked conditions.

Abstract: A power distribution system utilizing a power distribution circuit board having a front and back side with at least one connector on each side. The connector on the front side is disposed to mate with a selected power supply and the connector on the back side is disposed to mate with a substantially identical power supply. The connector on the back side is rotated 180.degree. so that substantially identical power supplies can be located in close proximity to each other while maintaining required conductor spacing in order to provide an improved power distribution system.

Abstract: This invention relates to a multiplex control of components and subsystems in motor vehicles having: a central electronic control unit and multiplex bus electronic units (3) associated with each component and each subsystem. The multiplex bus electronic units (3) are incorporated in the casings (2) of the connectors, the same having on the component side (2b) the requisite number of contacts and on the back a four-pole multiplex connector (1, 2a) for two signal lines and two power lines.

Abstract: A compact expansion card to replace an Extended Industry Standard Architecture (EISA) card. An EISA card has an edge connector of 188 pins of a given width and a given gap between pins, in 5.5 inches, two rows on a front of the EISA card and two rows on a back of the EISA card. The 188 pins include 157 signal pins, 10 pins dedicated to a +5 volt supply, and 18 pins dedicated to ground. The compact expansion card has an edge connector of 162 pins in 4.5 inches in two rows, one row of 81 pins on a front of the compact card and one row of 81 pins on a back of the compact card, a gap between each of the 162 pins being the same as the given gap between pins of the EISA card. The 162 pins include 157 signal pins, one +5 volt pin dedicated to a +5 volt supply, and one ground pin dedicated to ground. The 157 signal pins are of the same given width as the 157 signal pins of the EISA card.

Abstract: A computer system includes a chassis having a generally planar floor plate; a first generally planar motherboard having circuitry thereon mounted on the floor plate; at least one riser board connected to the first motherboard to extend generally orthogonally upwardly therefrom, the riser board having an upper edge oriented generally parallel to and above the plane of the first motherboard, and being provided with electrical circuit contacts along the upper edge; and a second generally planar motherboard connected to and at least partly supported by the riser board, the second motherboard being positioned adjacent the upper edge of the riser board, the second motherboard having circuitry thereon electrically connected to the electrical circuit contacts along the upper edge of the riser board.

Abstract: A socket connector for high speed memory modules utilizes planar contact strips having the same contact element design for signal, ground, power and daisy chain. The daisy chain contact strips are segmented and staggered to permit the use of flat contact elements.

Abstract: A printed circuit board retention system for supporting printed circuit boards in a computer chassis consists of a mother board located in the computer chassis and having a mother board connector mounted to it for connecting to a daughter card. The mother board connector has attachment points molded into it for optionally fastening a base support member. A daughter card including an edge card connection along the bottom edge for mating with the mother board connector such that the daughter card is positioned substantially at right angles to the mother board. A separate base support member may be fastened to the mother board by attachment points that mechanically mate with the attachment points on the mother board connector. The base support member has upwardly extending arms with clips on the ends. A partial frame element has downwardly extending arms with clips at the end that mate with the clips on the base support member arms.

Abstract: A card stabilizer for stabilizing an expansion card inserted in a female edge connector. The card stabilizer consists of a frame member sized to extend around the female connector, locking device for locking the frame member relative to the female connector and a guide disposed on the frame member for receiving at least one end portion of the expansion card and to prevent movement and hence electrical disconnection of the expansion card in the female edge connector.

Abstract: A layered circuit-board designing method and layered circuit-board where circuit-boards to be overlaid are connected at the center or an arbitrary position of each circuit-board. The layered circuit-board includes an upper-layer first circuit-board, a lower-layer third circuit-board, and an intermediate-layer second circuit-board between the first and third circuit-boards. A first connector is mounted on the first circuit-board, a second connector is mounted on the third circuit-board, a third connector is mounted on the top surface of the second circuit-board, while maintaining the positional relation between the third connector and the first connector, and a fourth connector is mounted on the bottom surface of the second circuit-board, while maintaining the positional relation between the fourth connector and the second connector. In addition, through holes are provided at pins of the third and fourth connectors for passing through the front and bottom surfaces of the second circuit-board.

Abstract: A printed circuit board having a footprint that is capable of receiving one of two electronic components having differing pin configurations. The footprint includes a first and a second common pin receptor arranged about a first axis. The first and second common pin receptors are configured to receive a first and a second pin on either of the electronic components. The footprint also includes a third pin receptor that is positioned along the first axis so as to be interposed between the first and the second common pin receptors and is configured to receive a third pin receptor of the first electronic component. The footprint also includes a fourth pin receptor that is positioned along a second axis, that is orthogonal to and intersects the first axis at the location of the third pin receptor. The fourth pin receptor is configured to receive a third pin of the second electronic component.

Abstract: An interconnection system is for interconnecting sensors, such as temperature gauges for controlling industrial processes, to a bus cable that interconnects the sensors to a central computation unit. The connection assembly comprises edge card connectors for connection to electronic modules having printed circuit boards. The plurality of modules are interconnected to the ribbon cable bus by a printed circuit board, and a connector mounted on the PCB and pluggable with a bus connector terminated to the cable.

Abstract: A socket assembly for mechanically and electrically coupling an integrated component with an interfacing carrier comprises a socket body for receiving the integrated component, a retaining spring hingedly connected to the socket body for retaining the integrated component within the socket body, and at least one post element. The socket body includes at least one generally cylindrical receiving member having at least a portion protruding through an aperture in the interfacing carrier which is deformable to engage the socket body with the carrier when the post element is received within the receiving element. The socket body also includes a first mounting surface having plurality of holes for receiving wadded button contacts and a heat transfer element in contacting relation with the mounting side of the integrated component.

Abstract: An electrical assembly having a first member and a second member which form a housing for a circuit board. At least one rib extends from an inner face of the first member. The connector assembly also includes an electrical connector disposed in the housing having at least one contact arm contacting the circuit board. The rib contacts the connector and urges the connector against the circuit board. With this invention there is no need to heat stake or otherwise secure the connector to the board.

Abstract: Electronic load switch has an electronic power switch and a control circuit mounted on a hybrid ceramic. Plug lugs are soldered directly to the hybrid ceramic to form a motor-vehicle-typical plug contact element which is engagement compatible with standard plug-contact elements of electromechanical load switches. The electronic load switch of this invention can therefore, without further expense, replace previous electromechanical load switches.

Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: A computer housing and expansion card design facilitates the addition and removal of expansion cards from the front of a computer housing without disassembly of the housing, and further facilitates the connection of external cables to the expansion cards from the back of the computer housing.

Abstract: An apparatus and method for mounting an edge connector assembly within a circuit module. Connector mounting rails are attached to the sides of a printed circuit board and the circuit board is then joined with a cold plate in order to form a circuit module. The mounting rail is an elongate strip of a substantially rigid material for attachment to the circuit board along one of its edges. The strip has an upper planar surface and inner and outer sides. The inner side is for attaching the strip to the edge of the circuit board. The outer side extends beyond the edge of the circuit board and is adapted to carry thereon a female block of the edge connector assembly. The strip also has a plurality of primary mounting openings formed in a predetermined pattern through the outer side of the strip for attaching the circuit board to a circuit module.

Abstract: An electronic circuit pack and mounting frame in which a cable directed to the circuit pack is received in a connector mounted upon a face of the pack or upon a face of a printed circuit board within the pack. Cables are mounted away from the front face of the pack and are directed from a cable receiving channel of a mounting frame to the connector with cable bends being permanently held by a surrounding molded encapsulation received within an access opening of the frame.

Abstract: An input/output electrical connector header 102 includes at least two rows of terminal pins 140 which can be connected to two separate printed circuit boards 106 and 108. The same header 102 provides input and output for both printed circuit boards 106, 108. The terminal pins 140 in each of the rows extend through openings 130 in the same header housing wall 126. A separable interconnection is made between pins in a second terminal row and a second printed circuit board 108 at the rear of the header 102. This separate connection can be established by a separate multiposition connector 114, 214, 314 or 414 containing receptacle contacts 116, 216, 316, 416 respectively. In other embodiments, this separate connector 514, 614, 714 and 1214, includes the terminal pins in the second terminal row in the separate connector.

Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.

Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: A computer housing and expansion card design facilitates the addition and removal of expansion cards from the front of a computer housing without disassembly of the housing, and further facilitates the connection of external cables to the expansion cards from the back of the computer housing.

Abstract: A mounting assembly for a multiple chip module or other circuit module, which includes a board having a surface including an array of board contacts, such as a printed wiring board in a computer system. A circuit module, such as a multiple chip module, having a first surface and a second surface is included. The circuit module includes an array of circuit contacts on the first surface of the circuit module. An interposer between the board and the first surface of the circuit module, includes conductors between the circuit contacts in the array of circuit contacts on the circuit module and board contacts in the array of board contacts on the board. A thermal bridge member contacts the second surface of the circuit module. A heat spreader contacts the thermal bridge member to dissipate the heat over a large region.

Abstract: Mother board 10M provides a flexible circuit component layout for computer system 10 within housing 10H. The mother board accommodates system component options such as an add-on card 12C or a disk drive bay 10D. Memory module footprint sites 14A-F within memory region 14 are defined on the mother board. Footprints designated in the layout receive components which provide the option flexibility of mother board 10M. Memory module connectors are to be emplaced within the memory region depending on the space requirements of component options. The M memory connectors may be arranged in any configuration selected from a set of multiple possible configurations permitted by M module connectors of T types emplaced in F footprint sites (where F>M). F minus M footprint sites remain vacant without a module connector emplaced therein. These vacant sites provide empty spaces which may be "shuffled around" to accommodate the various system component options.

Abstract: An electrically reconfigurable multi-chip module (MCERD) comprises three electrically reconfigurable integrated circuits (ERICs) enclosed in a package. The package provides for more "extra-package" connections between the ERICs and package pins than it does "intra-package" inter-chip connections. However, configuration connections between ERICs are intra-package. The MCERD is mounted on a daughterboard which provides connections between package pins and between package pins and pins of the daughterboard. The connections between package pins define "extra-package inter-chip" connections that typically far exceed the number of intra-package inter-chip connections. The connections between package pins and daughterboard pins connect the MCERD to a host system when the daughterboard is mounted on the host system motherboard. When the MCERD and daughterboard are installed in a host system, the MCERD can be electrically configured and then operated as configured.

Abstract: A mounting structure for providing DC power to an IC package is disclosed. The mounting structure comprises a socket for receiving an IC package, having one or more IC chips, and a power supply for supplying at least one specified DC voltage to the IC package. The power supply is coupled to the IC package by conductive paths formed in the socket.

Abstract: A PC card wherein a housing of a socket connector is provided with a guide boss and a stopper protruding on the circuit board side, and with a cutout for fitting the guide boss in the circuit board. In this cutout the guide boss is fitted to position the socket connector in the direction of x. And the forward end of this stopper is held in contact with the circuit board to position in the direction of y, thus facilitating positioning of a socket connector in relation to a circuit board without a fear of socket connector displacement in subsequent processes.

Abstract: A integrated circuit card having a rigidized frame to surround the electronic devices on a printed circuit (PC) board. The card includes a frame and integral cover for the top and bottom. The top and bottom are constructed out of a material that does not interfere with the use of an antenna coupled to the board assembly within the card. The bottom and top are coupled together using pins. When the two are coupled together the frame is better supported.

Abstract: A device and method wherein electrical components are mechanically suspended and electrically interconnected in an insulative elastomeric body, such as silicone, thereby eliminating the need for a circuit board or other circuit substrate. The device can change shape through compression, distension, flexure, and other external forces while maintaining its electrical performance and mechanical integrity. The device can be compressed and deformed to fit snugly within another device, such as the shell of an electrical connector or a plastic clamshell, simultaneously creating spring forces for reliable electrical contacts and an environmental seal. Accordingly, the device and method can be used for a wide variety of purposes such as electrical filtering for avionics, computer or automotive connectors, or a non-intrusive manner to package electronics for medical implants.

Abstract: A mechanical deck guide and a board guide for video in which a video set and a print board for video are provided integrally with a front cabinet, and a board guide for television is disposed in an array with the board guide for video. A shield plate is provided on the mechanical deck guide so as to cover it.

Abstract: An electronic component assembly including a connector hole built as part of an enclosure serving as a cabinet of electronic device, where the connector hole is used for passing through an electric connector connecting a component inside the cabinet to an external device installed outside the cabinet, has a knurled portion with a plurality of dents provided around the inside of the hole for preventing the connector from rotating by engaging the corners of the flange in the connector with any of the dents. As a result, other parts, including a rear terminal assembly for preventing the connector from rotating, and the number of the assembly operations can be eliminated. The cost and processes of molding other parts can also be eliminated.

Abstract: The invention provides for sharing a socket between a new-standard IC card provided with side electrodes on the sides thereof, to thereby allow the number of connections to be increased, and a current-standard IC card, and to prevent the side electrodes and the mating side electrodes of a socket from being rubbed against each other by a simple structure without any need for specific operation when an IC card is inserted or removed.

Abstract: A circuit board assembly (10) having a plurality of circuit board subassemblies (12) having a device (14) for releasably electrically and mechanically connecting the subassemblies (12) into a general configuration of a plane, the subassemblies (12) having a device (16) for electrically and mechanically interconnecting the subassemblies (12) into a system back plane (18). One or more brackets (20) interlock a plurality of the generally planar subassemblies (12) for stability.

Abstract: A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted on the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.