Abstract: A first package for an integrated circuit has both a first set of electrical contacts and a first connector. A second package has a second set of electrical contacts and a second connector. The first and the second connector are mating connectors that are electrically and physically coupled. The first set of electrical contacts and the first connector are disposed on opposite surfaces of the first package and the second set of electrical contacts and the second connector are disposed on the same surface of the second package. The first and second set of electrical contacts couple to a printed circuit board directly or indirectly through a socket. The connectors allow higher speed signals to be routed over the first and second connectors, while power, ground and slower speed signals can be routed over the first set and second set of electrical contacts.

Abstract: There is disclosed a junction box including a junction box main body, a connector portion, and a cable portion which connects the junction box main body to the connector portion. Terminal connecting portions are formed to extend from opposite side edges of a strip portion of a flexible printed circuit constituting the cable portion in a short direction of the strip portion, and are connected to first to third connecting terminals. The third connecting terminal is connected to a desired connecting terminal connecting portion of a circuit distribution wiring circuit of a joint connector, electricity is conducted through a plurality of circuit portions in a desired circuit mode, and a wiring design freedom degree is enhanced.

Abstract: An electromechanical device for mounting an electronic assembly on a mounting rack, in particular for mounting a display instrument recessed in a dashboard. There is at least one conductive Velcro-type connector between the electronic assembly (6) and the mounting rack (7), the conductive Velcro-type connector serving both for the mechanical fastening and the electrical contacting of the assembly (6) on the mounting rack (7).

Abstract: An integrated high-speed package comprising a package housing having a housing lip and connector having a center pin abutting along a bottom surface of the housing lip. For signal registration of a first substrate to the signal lead, the substrate is “floated” up to the housing lip, which provides an alignment reference to ensure that the top surface of the first substrate is aligned and in direct registration with the signal lead. In another embodiment, the center pin to substrate registration is provided at a top surface of a housing base. The housing base preferably comprises a first portion of a first height and a second portion of a second height. Accordingly, the housing base can accommodate substrates of different thickness while allowing a top surface of the first and a second substrate to be coplanar to facilitate signal registration there between.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: In an electronic control unit mounting structure, electronic control units are mounted on a junction block, and printed circuit boards 4a and 4b of the electronic control units, each having a connector 41a, 41b of a through construction mounted thereon, are superposed in such a posture that these connectors 41a and 41b are disposed in registry with each other in an upward-downward direction, and connection terminals 31 of the junction block are inserted in the connectors 41a and 41b.

Abstract: Memory modules without signal-conditioning devices (unbuffered, unregistered) are provided in a system by using adapter cards that have signal-conditioning devices and are then operated in the manner of memory modules with signal-conditioning devices (buffered, registered). Systems can thereby be expanded in a very simple manner and can be flexibly adapted according to requirements, and for this purpose only one type (unbuffered, unregistered) of memory module is required.

Abstract: A surge protector block assembly includes a plurality of individual 5-pin housing units which are formed integrally together. Each of the plurality of individual housing units has a plurality of surface mountable socket contacts for receiving corresponding pins of a surge protector module. A single and/or multi-layer printed circuit board is provided with a plurality of solder pads. Each of the plurality of individual housing units is surface mounted onto the solder pads of the single and/or multi-layer printed circuit board for electrical connection to corresponding ones of the plurality of the socket contacts.

Abstract: The invention relates to a module unit for memory modules and to a method for producing the module unit. A module unit of this type has at least one main module and submodules. The modules are arranged in a star-shaped manner and are arranged radially with their inner contact strips in slots of a central plug connector. The module unit has a substantially cylindrical housing, from which an outer contact strip of the main module protrudes.

Abstract: Described is a computer having two circuit boards (10, 11) on which plug connectors (15) are present for plug-in cards (16) which project above the circuit boards (10, 11) to a first height (H1). There is a bridge card (19), which is plugged into the two circuit boards (10, 11), connecting the two circuit boards (10, 11) electrically, and which project above the circuit boards (10, 11) to a second height (H2). The bridge card (19) is connected to the two circuit boards independently of the plug connectors (15), and the first height (H1) is greater than the second height (H2).

Abstract: In a docking apparatus for coupling a first apparatus consisting of a handler or prober and a second apparatus consisting of a testing head (2) for electronic components, at least one locking unit (4) is provided having an axial insertion opening (8) for inserting a locking pin (7). In the area of the insertion opening (8), a plurality of balls (25) are arranged, between which the locking pin (7) is insertable. Furthermore, a ball clamping sleeve (15) is provided, which by means of an axial displacement causes a radial movement of the balls (25) and therefore fixes the locking pin (7).

Abstract: In accordance with the invention, an I-channel surface mount connector comprising a length of cylindrical rod having a generally I-shaped cross section is improved by providing an extended mounting flange. When a first circuit device is connected to a second circuit device with the extended flange extending outward of the first device, the flange can extend beyond the periphery of the first device. This extension has the advantage that the solder bond between the flange and the second device can be easily inspected from above using visual inspection equipment.

Abstract: A hub includes a bluetooth system module coupled to a hub module. The hub module is also coupled to an upstream port and a plurality of downstream ports provided on a housing of the hub respectively enabling the hub to connect to an electronic device via the upstream port and to connect to a plurality of peripherals via the downstream ports for performing a wireless signal communication therebetween, thereby reducing the number of cables connected between the electronic device and peripherals.

Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.

Abstract: A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive film, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.

Abstract: An electronic board assembly carrying connectors on each side of its lower edge which is adapted to withstand the relatively strong forces required to insert or remove the assembly, e.g., from a backplane board, and yet provide many electrical contacts along the interconnection sites. The electronic board assembly comprises two symmetrical elementary PCBs electrically coupled together, each carrying a connector on its external lower edge. In one embodiment, these two PCBs are coupled together by a flexible adhesive insulative layer and maintained by mechanical devices such that the distance between these two connectors is set to a predetermined distance (to align precisely with the backplane board). The mechanical device used to maintain a predetermined distance between the two connectors of the assembly may comprise a U-shaped member, the upper part of this member being strategically inserted between these connectors.

Abstract: In a computer system, a passive component minimization of connector pins configuration includes a motherboard and daughterboardd. The daughterboard includes a selection switch coupled via passive components to a single connector pin, according to a prescribed state of multiple states of the daughterboard. In one embodiment, the passive components include three series connected resistors collectively coupled to the daughterboard connector pin. The motherboard includes a supply voltage and pull-up resistor circuit coupled to a single connector pin, and further includes decoding circuitry coupled to the motherboard connector pin for decoding a voltage level of the motherboard connector pin into binary data.

Abstract: A modular probe card assembly comprises a silicon substrate with probes modularly assembled on a main board. At least a socket is installed around silicon substrate and electrically connects to probe needles by a flexible printed wiring film. A plurality of detachable coaxial wires electrically connect sockets with the main board for achieving variability of connecting paths during manufacturing. Thus, the probe card assembly has the effect of adjustable amendment and is suitable for high speed testing.

Abstract: A sensor mount assembly including a housing, fastener and a lever mechanism. The housing contains a sensor having two electrical leads and includes an integral flange adapted to receive a fastener. The fastener includes a body and a head. The body is received in the flange to secure the housing to a mount. The lever mechanism is proximate the flange and includes a contact block and a conductor. The contact block is acted upon by the fastener head to move the lever mechanism and, hence the conductor, between a first position and a second position. The first position corresponds to an unmounted sensor and creates a short circuit condition between the two electrical leads. The second position corresponds to a properly mounted sensor and creates an open circuit between the two electrical leads such that the electrical circuit path of the overall system includes the sensor within the housing.

Abstract: A memory module having series-connected printed circuit boards is provided. The memory module comprises a plurality of printed circuit boards, each comprising a plurality of memory chips mounted thereon, and signal lines and connection means for electrically connecting the printed circuit boards to one another. The connection means electrically series-connects the signal lines of each of the printed circuit boards. Preferably, an end termination circuit is formed on a terminal of the signal line of the farthest printed circuit board from a connector of a mother board, and the memory chip performs at a speed of approximately 150˜300 MHz. The connection means is a flexible jumper assembly having a flexible film and a jumper line formed on the flexible film. Each of the printed circuit boards further comprises a jumper pad connected with the signal lines. The flexible jumper assembly interconnects the jumper pads of each of the printed circuit boards to one another.

Abstract: A system and method for interconnecting circuit boards is disclosed. In one embodiment, a first circuit board connects with a second circuit board via a connector. The first circuit board has an aperture with a plurality of conductive surfaces on an inner surface. At least one of the conductive surfaces is coupled to at least one of a plurality of first circuit board traces. The second circuit board has a plurality of second circuit board traces. Therebetween, the connector has a plurality of conductive signal conductors, each having a first portion disposed at the periphery of the connector and adjacent to the conductive surfaces and a second portion coupled with the second circuit board traces.

Abstract: A motherboard module includes a motherboard, a backboard, and a modular mechanism. The modular mechanism for fast assembly and disassembly of a motherboard includes an upright, an upstanding structure, and a fastener. The upstanding structure is used for positioning the motherboard. Since the upstanding structure is perpendicularly attached to the back edge of the motherboard and the backboard is adhered to one surface of the upstanding structure, the fastener presses and engages the backboard so that the upright clinches the slit in the motherboard and the motherboard is thus secured.

Abstract: In a Compact PCI system, a method and apparatus for bridging multiple PCI segments in a chassis utilizing backplane connections, instead of a front side component slot. Embodiments of the present invention may be used, with either a transparent or non-transparent bridging system, between multiple PCI segments, to increase the number of shared peripherals in a single Compact PCI chassis.

Abstract: An upstream side motherboard 50 having an upstream side system slot 51 and upstream side daughter board mounting slots 52 to 58 and a downstream side motherboard 60 having a downstream side system slot 61 and downstream side daughter board mounting slots 62, 63 . . . are connected together by a bridging board 10. The bridging board 10 has bridge wires that electrically connect a plurality of wiring pins provided in the upstream side daughter board mounting slots and a plurality of wiring pins provided in the downstream side system slot when an upstream side connector 11 is fitted into one the upstream side daughter board mounting slots and a downstream side connector 12 is fitted into the downstream side system slot 61, and IC switches 13 and 14 that carry out connection changing on prescribed wires out of the bridge wires.

Abstract: A switching device and a method for the configuration thereof is disclosed. A first aspect of the present invention comprises a switching device. The switching device comprises at least one line card and at least one switching card. The device includes a mid-plane coupled to the at least one line card and the at least one switching card. The A second aspect of the invention comprises a method for configuring a switching device. The method for configuring a switching device comprises providing a mid-plane, and providing at least one switching card and at least one line card on the mid-plane. The at least one switching card and the at least one line card are perpendicular to each other. Through the use of the present invention, line cards and/or switch cards can be connected to a mid-plane via a plurality of connectors wherein the line cards and switching cards are perpendicular to each other.

Abstract: A circuit board assembly for use in a communication system switch includes a motherboard that comprises a planar, substantially rigid, and substantially dielectric circuit, a back plane connector affixed to the circuit board and a pair of daughter board connectors affixed to the circuit board, each of which is for coplanerly coupling with a daughter board. Each daughter board includes rigid dielectric circuit board, a plurality of integrated circuit components disposed thereon, at least one media coupler affixed to the circuit board and a motherboard connector affixed to the circuit board for coplanerly coupling with the motherboard. Finally, a pair of guides affixed to the circuit board for removably engaging a pair of daughter board slot assemblies of the motherboard to mate the daughter board with the motherboard.

Abstract: An apparatus for regulating voltage and power in a computer system is disclosed. The voltage and power regulation is performed by voltage regulation circuitry on a voltage regulator module. The voltage regulator module is a detachable unit which interfaces with the motherboard through a socket connector. The socket connector has a fixed pin definition which allows a variety of voltage regulator modules programmed to regulate voltages and power at different levels to be implemented on the motherboard.

Abstract: A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive adhesive, a band comprising conductive film, a band comprising conductive tape, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.

Abstract: An electronic circuit card includes a circuit board and a faceplate attached to the circuit board. A connector is mounted on the faceplate such that the electronic circuit card occupies substantially one slot of a housing when the electronic circuit card is contained in the housing. The connector is also mounted on the faceplate to enable contact between the faceplate and a faceplate of an adjacent electronic circuit card for shielding against electromagnetic interference leakage when the electronic circuit card is contained in the housing. A ribbon cable electrically interconnects the connector and the circuit board. A strap is attached to the faceplate. The strap is adapted to secure a mating connector to the connector.

Abstract: An integrated circuit which has a packet router to which a plurality of functional modules are connected by respective ports is described. One of the ports acts as a socket port for an expansion socket. The expansion socket provides a plurality of additional expansion ports to which additional functional modules can optionally be connected. All the ports connected to the packet router, including the expansion socket port, preferably lie in a common address space for the integrated circuit.

Abstract: An invention is disclosed for providing a signal indicating whether a processor is installed and providing improved voltage regulation. A contact is selected and isolated from an array of ground contacts and is further coupled with circuit for generating an INSTALL signal. A capacitor and pull up resistor coupled to a supply voltage, ground and the isolated contact form a signal line at a common node such that a circuit to ground is completed through the processor and the isolated contact when the processor is plugged in and a direct signal indication of the presence or absence of the processor is provided. Voltage sense lines of a Voltage Regulation Module (VRM) are coupled directly to processor contacts isolated from an existing voltage supply contacts coupled to the supply plane of a supply voltage within the circuit board providing improved regulation without adversely affecting power supply current capacity considerations.

Abstract: A connector system for printed circuit boards uses extensions of the traces of the printed circuit board as connector pins by supporting the malleable traces with isolated support pillars. This eliminates the need for electrical junctions between the connector and the printed circuit board. The support pillars provide the necessary mechanical properties for the connector pins. The conductive trace may be adhered to one side of the support or may be draped over the top to cover both sides and may be plated with the material of the support to provide a uniform electrical conductivity over the surface of the formed pin.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract: A spring-to-spring engagement of a kick-out spring and a secondary spring is disposed intermediate a structure supporting an electrical connector and an insertable and latchable electronic module or the like to enhance the disconnection and ejection of the module from the connector to which the module is connected. The spring-to-spring engagement insures both that adequate spring force is stored upon insertion and connection of the module and that disconnection and ejection forces are applied to the module. The forces are applied over a sufficient distance to fully displace the module from its latched position to its position of disconnection from the connectors and still provide spring force travel of the module to eject at least partially the module from the receiver or port into which the module was inserted and connected.

Abstract: A method and apparatus for mounting a lidless semiconductor device. A lidless semiconductor device, such as a land grid array device comprising a substrate having a semiconductor die mounted thereon is disposed in a socket. The socket includes a plurality of resilient conductive members arranged in a predetermined contact array pattern for conductively coupling conductive contacts on a printed circuit board with corresponding contacts on the underside of the lidless semiconductor device. A first set of springs applies a predetermined force to the substrate to conductively couple the contacts on the substrate to the contacts on the printed circuit board via the conductive members of the socket. Another set of springs urges the bottom surface of a heat sink into thermally conductive abutting relation with the top surface of the semiconductor die. The pressure on the die is less than the pressure applied by the substrate so as to avoid damage to the semiconductor die.

Abstract: In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board of a computer system is covered by an insulating sheet. In the CDC, an edge of one end of this insulating sheet is extended so as to form a projection. A user can take this projection with fingers, thereby carrying and connecting/disconnecting the CDC to/from the mother board easily.

Abstract: A printed circuit assembly for use in an implantable medical device comprises a plurality of panels having active and passive circuit components on one major surface thereof, the plurality of panels being interconnected with flexible flat cable segments allowing the assembly to be folded so as to place the individual panels carrying the circuit components in a stacked relationship. By providing conductive layers on predetermined surfaces of the panels, shielding is provided to inhibit noise generating circuitry from contaminating wanted signals passing between the components and the plural panels.

Abstract: A midplane board adapted for use in an electronic equipment shelf is provided. The midplane board includes a first surface having a plurality of contact elements adapted to engage corresponding contact elements on a first circuit board. The midplane board also includes a second surface in opposite relationship with the first surface. The second surface has a plurality of contact elements adapted to engage corresponding contact elements on a second circuit board in such a manner that at least a portion of a side of the first circuit board is opposed to at least a portion of a side of the second circuit board. The midplane includes at least one signal connection path including a buried via suitable for establishing a connection between a contact element on the first surface and a contact element on the second surface. The contact elements on the first surface define a first pattern while the contact elements on the second surface define a second pattern.

Abstract: Apparatus and methods for connecting a device to an integrated circuit. The apparatus includes an insulating substrate that has two major sides and a number of sites for housing components. Each site has a first node on one of the two sides of the insulating substrate and a second node on the other of the two sides of the insulating substrate. Each site also has components that are aligned normal to the sides of the insulating substrate and are connected to the nodes at the site. Such apparatus are useful as adapters for testing an integrated circuit, such as connecting a test device to the integrated circuit with the adapter and observing and/or driving signals through the adapter.

Abstract: The present invention provides for an apparatus and method for retaining a first circuit board on a second circuit board. Embodiments of the invention use a clip attached to uprights to exert a biasing force on the first circuit board. The uprights are also coupled to the second circuit board. In embodiments of the invention, the first circuit board is a processor package such as a processor package for use in a Slot 1 or Slot 2 connector, and the second circuit board is a motherboard of a computer system. Embodiments of the invention also include a memory module and a power supply.

Abstract: In some embodiments, the invention includes a system having first and second modules, the first module having a first group of chips and the second module having a second group of chips, and a circuit board including first and second module connectors to receive the first and second modules, respectively. The system also includes a first buffer on the first module and a second buffer on the second module, and a path including conductors in a first section that splits into a second section and third section, wherein the second section couples to the first buffer and the third section couples to the second buffer, and wherein impedances of the second and third sections are at least 50% greater than impedances of the first section.

Abstract: In some embodiments, the invention includes a system having first and second modules and a circuit board including first and second module connectors to receive the first and second modules, respectively. The system includes a first path of conductors extending from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector, to the second module, and to on module terminations of the second module; and a second path of conductors extending from the circuit board to the second module connector, to the second module, back to the second module connector, to the circuit board, to the first module connector, to the first module, and to on module terminations of the first module.

Abstract: In some embodiments, the invention includes a system having first and second modules; and a circuit board including first and second module connectors to receive the first and second modules, respectively. A first path of conductors extending from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector and to the second module, and wherein the first path in the first module couples to stubs for first and second chips of the first module and the first path in the second module couples to stubs for first and second chips of the first module; and each of the first and second chips include selectable on die terminations.

Abstract: Isolated planar conductive structures on separated layers of a PCB provide the normally-open, common, and normally-closed components of an electromechanical relay circuit to minimize inductive area. The isolated planar configuration reduces coupling of relay contact-noise currents to nearby sensitive circuits, and minimizes coupling EMI energy from nearby logic or microprocessor circuits to the relay contact circuits.

Abstract: A stacked backplane assembly, including two or more backplanes or midplanes having different functionality and combined together so as to form an integral unit, is provided. The backplanes forming the assembly are manufactured with prime and secondary manufacturing holes to enable alignment, so that the resulting tolerance build-up of the assembly is similar to that of a single backplane. Connectors can be arranged on the backplanes of the assembly so that an electronic or optical card can be simultaneously plugged in to one or more of the backplanes that comprise the stacked backplane assembly. The stacked backplane assembly of the embodiments of the invention is illustrated by having power and signal backplanes and midplanes, but can be equally applied to backplanes that provide other types of functionality.

Abstract: A device is described for a computer having two circuit boards (10, 11) on which plug connectors (15) are present for plug-in cards (16) which project above the circuit boards (10, 11) with a first height (H1). There is a bridge card (19), which is plugged into the two circuit boards (10, 11), connecting the two circuit boards (10, 11) electrically and projecting above the circuit boards (10, 11) with a second height (H2). According to this invention, the bridge card (19) is connected to the two circuit boards independently of the plug connectors (15), and the first height (H1) is greater than the second height (H2).

Abstract: The present invention provides a compact riser card system which provides two or more PCI connectors to couple one or more peripheral boards to a PCI bus on a computer board while satisfying the height requirements for 1U systems. In one embodiment, this invention provides two 64-bit connectors on two riser cards coupled to a single connector on a 66 MHz PCI bus.

Abstract: An I-channel surface mount connector includes a length of cylindrical rod having a generally I-shaped cross section is improved by providing an extended mounting flange. When a first circuit device is connected to a second circuit device with the extended flange extending outward of the first device, the flange can extend beyond the periphery of the first device. This extension has the advantage that the solder bond between the flange and the second device can be easily inspected from above using visual inspection equipment.

Abstract: An improved structure of a Ball Grid Array IC mounting seat is disclosed. The IC mounting sear is characterized in that the middle section of the elongated thin strap is provided with a notch such that when the thin strap is folded correspondingly, the folding is at the side wall of the notch and all regions of the side edge of the notch are curved to externally clip the clipping body of the ball edge of the solder ball and the solder ball is mounted to the bottom clipping body of the conductive plates, thereby the solder ball is secured. In application the pre-soldering of the solder ball onto the conductive clipping plate is avoided, and the production process is rapid.

Abstract: A system for providing a signal indicating whether a process is installed and providing improved voltage regulation. A contact is selected and isolated from an array of ground contacts and is further coupled with circuit for generating an INSTALL signal. A capacitor and pull up resistor coupled to a supply voltage, ground and the isolated contact form a signal line at a common node such that a circuit to ground is completed through the processor and the isolated contact when the processor is plugged in and a direct signal indication of the presence or absence of the processor is provided. Voltage sense lines of a Voltage Regulation Module (VRM) are coupled directly to processor contacts isolated from an existing voltage supply contacts coupled to the supply plane of a supply voltage within the circuit board providing improved regulation without adversely affecting power supply current capacity considerations.