Abstract: The invention relates to a resin composition which is characterized by including: a reaction product that includes (A) a polyphenylene ether having an average of 1.5 to 2 hydroxyl groups per molecule and (B) an epoxy compound having an average of 2 to 2.3 epoxy groups per molecule, wherein the reaction product is obtained by pre-reacting at least a part of hydroxyl groups on the polyphenylene ether (A) with epoxy groups on the epoxy compound (B) so that the concentration of terminal hydroxyl groups on the polyphenylene ether (A) becomes 700 ?mol/g or less; (C) a cyanate ester compound; and (D) an organometallic salt.

Abstract: The present invention relates to new mixtures containing cyanamide and a urea derivative, to liquid curing agents for curing polymer resins, in particular epoxy resins, and to epoxy resin compositions comprising liquid curing agents for producing fibre composite materials.

Abstract: A reactive hotmelt adhesive comprising two components A and B each containing one or more polymers A or B having different functional groups, these groups being able to react with one another under the influence of temperature, and i) the mutually reactive functional groups are selected from hydroxyl, amine, carboxylic acid, anhydride and epoxide groups, ii) unreactive polymers and/or additives are present in at least one of the components, iii) the components are present in spatially separate regions, the adhesive having a first temperature range between 80 and 150° C. in which the components melt and are miscible with one another without reaction of the functional groups with one another, and the adhesive having a second temperature range between 130 and 190° C. in which it can melt and chemically crosslink, the second temperature being above the first temperature.

Abstract: A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0×10?3 or less. [In the formula, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, and R12 each independently represent a hydrogen atom, a halogen atom, an alkyl group which may have a substituent, or an alkoxy group which may have a substituent.].

Abstract: Curable material comprising silylated polymers containing urethane groups, and use thereof in sealants, adhesives, binders and/or surface modifiers.

Abstract: Low-density compositions and sealants prepared from sulfur-containing prepolymer compositions that exhibit enhanced fuel resistance are disclosed. The low density and enhanced fuel resistance is realized by using polyphenylene sulfide fillers.

Abstract: The present invention provides a metal paste composition which can obtain the calcined bodies having low volume resistivity in a wiring substrate after calcining. More specifically, the present invention provides a metal paste composition comprising a metal, an aliphatic polycarbonate, and an organic solvent.

Abstract: A duromer, a method for producing the duromer, a use of the duromer as well as a flame retardant containing the duromer and plastics compositions thereof are disclosed. A phosphorous-containing polymer which is based on multi-functional esters of unsaturated carboxylic acids is three-dimensionally cross-linked and forms the claimed duromer as described. The duromer is suitable as a flame retardant and suitable for use in flame retardants for plastics.

Abstract: The invention relates to hardeners for epoxy resin containing secondary amino groups having dialkyl amino phenyl groups. The hardeners have a surprisingly low viscosity and harden surprisingly fast together with the epoxy resins, even in moist, cold conditions, and without blushing to form films with high hardness and stability. They are suitable, in particular, for low-emission coatings.

Abstract: The invention relates to the technical field of fabricating a display device, and specifically, to a preparation method of a printing plate for alignment film. The method comprises the following steps of: mixing 40-70 parts by mass of a resin for a printing plate for alignment film, 10-20 parts by mass of an epoxy acrylic resin, 10-20 parts by mass of a photoinitiator, and 20-30 parts by mass of a peroxide initiator, and then coating on a surface of a substrate; exposing with an ultraviolet ray and developing; and subjecting the exposed and developed substrate to a thermal curing process.

Abstract: Disclosed is a non-halogen flame retardant styrene resin composition which comprises (a) a styrene resin and (b) a phosphorous-modified epoxy resin and thus exhibits superior flame retardancy to external candle flame ignition.

Abstract: An expandable medical balloon including an inner layer formed of a poly(ether-block-amide) copolymer and an outer layer formed of a polyamide, the expandable medical balloon having a burst strength of greater than 50,000 psi, and to methods of making and using the same.

Abstract: Fluorene derivatives are described including those having optical properties which can make them suitable for use in optical systems such as cameras. Various derivatives can have high polarity, small molecular volume, low glass transition temperature, high transparency and/or excellent optical characteristics. In addition, a process for making the fluorene derivatives and products made from the fluorene derivatives are described.

Abstract: A composition including a blend of: a) a polyethersulfone; b) a polyphenylene sulfide (PPS); and c) an epoxy, and optionally a polyetherimide, wherein the polyetherimide and epoxy are present in an amount effective to act as a compatibilizer for the polyethersulfone and polyphenylene sulfide (PPS). Methods of compatibilizing a blend of polyethersulfone and polyphenylene sulfide (PPS). The method can include melt mixing a polyethersulfone, and polyetherimide, a polyphenylene sulfide (PPS) and an epoxy under conditions of elevated temperature and simultaneous mixing.

Abstract: Optical compensation films (positive C-plate) with mesogen anisotropic subunits (OASUs) that have high positive birefringence throughout the wavelength range 400 nm<?<800 nm are provided. The optical compensation films may be processed by solution casting to yield a polymer film with high birefringence without the need for stretching, photopolymerization, or other processes. Such optical compensation films are suitable for use as a positive C-plate in LCDs, particularly IPS-LCDs.

Abstract: A thermosetting composition comprising (a) at least one phosphorous-free dihydrobenzoxazine component; (b) at least a quaternary ammonium salt and (c) optionally a compound comprising at least an epoxy group is disclosed. Cured products made from these compositions have valuable chemical, physical and mechanical properties.

Abstract: The present invention relates to an etheramine mixture containing a monoether diamine and its method of production by alkyloxating an initiator with an alkylene oxide to produce a precursor polyol and reductively aminating the precursor polyol to form the etheramine mixture. The etheramine mixture may be used in variety of applications including as a curing agent for an epoxy resin or as a reactant in the production of polyurea materials.

Abstract: Epoxy resin compositions contain (i) a potyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or a mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.

Abstract: Methods of synthesis and application thereof for peripherally aromatic silsesquioxanes featuring reactive functionality. A method, according to one embodiment of the invention, includes reacting a polyhedral oligomeric silsesquioxane with an anhydride. The polyhedral oligomeric silsesquioxane has an inorganic core, a phenyl moiety or an anlyine moiety covalently coupled to the at least one T-type silicon atom; and a metal-aniline group or a para-aniline group covalently coupled to the at least one D-type or M-type silicon atom.

Abstract: Composite material that contain epoxy resin which is toughened and strengthened with thermoplastic materials and a blend of insoluble particles. The uncured matrix resins include an epoxy resin component, a soluble thermoplastic component, a curing agent and an insoluble particulate component composed of elastic particles and rigid particles. The uncured resin matrix is combined with a fibrous reinforcement and cured/molded to form composite materials that may be used for structural applications, such as primary structures in aircraft.

Abstract: Injection molded articles and process of forming the same are described herein. The processes generally include providing a polyolefin including one or more propylene heterophasic copolymers, the polyolefin having an ethylene content of at least 10 wt. % based on the total weight of the polyolefin; contacting the polyolefin with a polylactic acid and a reactive modifier to form a compatiblized polymeric blend, wherein the reactive modifier is produced by contacting a polypropylene, a multifunctional acrylate comonomer, and an initiator under conditions suitable for the formation of a glycidyl methacrylate grafted polypropylene (PP-g-GMA) having a grafting yield in a range from 1 wt. % to 15 wt. %; and injection molding the compatibilized polymeric blend into an article.

Abstract: Fast cure resin system comprise semisolid epoxy resins and finely divided curatives of particle size less than 25 microns. The resins are dry to the touch, can be readily combined with fibrous reinforcement to provide prepregs which can be rapidly cured in a short moulding cycle.

Abstract: Provided is a sealant for use in ink jet recording heads, comprising a cationically polymerizable resin; a fluorine-containing compound that is liquid at a temperature in a range of 20° C.±15° C.; and a cationic polymerization initiator.

Abstract: Resin compositions which contain a compound having at least two epoxy and/or thiirane groups in the molecule (ingredient (1)) and a specific ionic liquid (ingredient (2)), as combined, are practicable resin compositions which comprise constitutive elements of readily available materials and have well-balanced suitable curing capability and storage stability. Preferably, the ionic liquid (ingredient (2)) comprises a combination of an ammonium cation or phosphonium cation and a carboxylate anion.

Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.

Abstract: An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: Method of preparing a particle dispersion within a polymer is disclosed. The dispersion may include core shell rubber particles and the polymer may include epoxies. The particles are capable of being substantially dispersed within the polymer so as to substantially inhibit agglomeration of the particles. Mechanical properties, such as toughness are improved while glass transition temperature and viscosity are not substantially impaired by the presence of the particles.

Abstract: The present disclosure provides a liquid curing agent composition comprising at least 50% by weight of a polyamine and 0.2% to 10% by weight of dicyandiamide, the amine/epoxy composition and the product from the cured amine/epoxy composition.

Abstract: Curable material comprising silylated polymers containing urethane groups, and use thereof in sealants, adhesives, binders and/or surface modifiers.

Abstract: A flame retardant containing composition resistant to becoming sticky from moisture is prepared by the introduction of epoxy containing compound either into the ethyleneamine polyphosphates or into the polymeric composition.

Abstract: A curable composition including (a) at least one cyclic diamine, (b) at least one non-heterocyclic amine that has a pKa value of approximately 9.5 to about 12 at 25° C. for the most basic amine group in the non-heterocyclic amine molecule, (c) at least one epoxy resin, and (d) at least one alkylated phenol; (i) wherein the equivalents of the amine hydrogens from the cyclic diamine compared to the total amine hydrogens from both the cyclic diamine and the non-heterocyclic amine in the composition are greater than about 5%; (ii) wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is greater than or equal to about 1; and (iii) wherein the alkylated phenol is in an amount greater than about 10 wt % of the curable composition.

Abstract: Polymeric nanocomposite materials are provided comprising polycyclic aromatic hydrocarbon compounds. During polymer synthesis, polycyclic aromatic hydrocarbon groups are directly incorporated into the polymer network. Free polycyclic aromatic hydrocarbon compounds are also dispersed within the polymer matrix. The resulting nanocomposite materials exhibit improvements in the thermal, rheological, and physical properties, including reinforcement, of the polymer material as compared to the unmodified polymer.

Abstract: Multifunctional melamine epoxy resins, methylols and amines are provided. Methods of making multifunctional melamine epoxy resins, methylols and amines are also provided.

Abstract: A composition useful for the injection molding of fluid engineering parts includes specific amounts of a high molecular weight poly(phenylene ether), a polystyrene, and glass fibers. The composition provides improved hydrostability and reduces or eliminates the butadiene monomer that is present in comparative compositions containing rubber-modified polystyrene. Fluid engineering articles prepared from the composition are described.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.

Abstract: Pharmaceutical compositions for and methods of treating an animal, including a human, and methods of preparing such compositions. The pharmaceutical compositions contain crosslinked amine polymers and may be used, for example, to treat diseases or other metabolic conditions in which removal of protons and/or chloride ions from the gastrointestinal tract would provide physiological benefits such as normalizing serum bicarbonate concentrations and the blood pH in an animal, including a human.

Abstract: A heterogeneous catalyst comprising a metal-containing polymer matrix covalently bonded to a support material and a method of making and using such catalysts. The metal-containing polymer matrix comprises metal nano-particles encapsulated in a polymer matrix, e.g., a siloxane. In one aspect, the metal-containing polymer matrix can be bonded to the support material via a hydrophobic group attached to the support material. The catalyst can be recovered after being used in a metal catalyzed reaction and exhibit excellent catalytic activity upon reuse in subsequent reactions.

Abstract: A homogeneous solid composition includes an aromatic epoxy resin and a poly(phenylene ether) having a number average molecular weight of 600 to 2000 atomic mass units and an average of 1.5 to 3 hydroxyl groups per molecule. The molecular weight and hydroxyl functionality of the poly(phenylene ether) allow it to be dissolved in the epoxy resin at relatively low temperature, and remain dissolved as the solution is cooled and solidified. The homogeneous solid composition facilitates incorporation of the poly(phenylene ether) into powder coating compositions that exhibit reduced water absorption in the cured state.

Abstract: The present invention relates to electrode materials for electrical cells, containing, as component (A), at least one polymer including polymer chains formed from identical or different monomer units selected from substituted and unsubstituted vinyl units and substituted and unsubstituted C2-C10-alkylene glycol units and containing at least one monomer unit -M1- including at least one thiolate group —S? or at least one end of a disulfide or polysulfide bridge —(S)m— in which m is an integer from 2 to 8, the thiolate group or the one end of the disulfide or polysulfide bridge —(S)m— in each case being bonded directly to a carbon atom of the monomer unit -M1-, and, as component (B), carbon in a polymorph containing at least 60% sp2-hybridized carbon atoms. The present invention also relates to electrical cells containing the inventive electrode material, to specific polymers, to processes for preparation, and to uses of the inventive cells.

Abstract: The invention provides an insulation material comprising an epoxy-terminated prepolymer and an amine curing agent. The reaction production of the epoxy-terminated prepolymer and amine curing agent provides for an elastomer that combines the processing and mechanical properties of polyurethane elastomers with improved thermal-hydrolytic stability. The insulation material is particularly useful as thermal insulation and coating for subsea oil and gas applications.

Abstract: This invention relates to epoxy resin formulations for preforms to be used in molding processes, especially resin transfer molding processes and to methods for preparing the performs. The epoxy formulation is based on liquid or solid epoxy resins blended, with medium to high molecular weight, phenoxy resins. These formulations are highly compatible with epoxy curable injection resins, and more over are reacted in the polymeric matrix, without reducing the glass transition temperature (Tg) of the cured composite material.

Abstract: A substance includes diamond particles having a maximum linear dimension of less than about 1 ?m and an organic compound attached to surfaces of the diamond particles. The organic compound may include a surfactant or a polymer. A method of forming a substance includes exposing diamond particles to an organic compound, and exposing the diamond particles in the presence of the organic compound to ultrasonic energy. The diamond particles may have a maximum linear dimension of less than about 1 ?m. A composition includes a liquid, a plurality of diamond nanoparticles dispersed within the liquid, and an organic compound attached to surfaces of the diamond nanoparticles. A method includes mixing a plurality of diamond particles with a solution comprising a liquid solvent and an organic compound, and exposing the mixture including the plurality of diamond nanoparticles and the solution to ultrasonic energy.

Abstract: Disclosed herein are polyglycidyl ethers of the formula: where R, m, Q, p and Z are as defined here. Also disclosed are methods of forming said polyglycidyl ethers and methods of using said polyglycidyl ethers to make epoxy resin oligomers and polymers, including powder coatings.

Abstract: The present invention relates to an amine composition comprising linear triethylenetetramine and one or more amine compounds selected from the group consisting of tertiary amines derived from the condensation of ethylenediamine and methyl-substituted compounds derived from linear triethylenetetramine as well as a method of production for said composition. The present invention also relates to the use of linear triethylenetetramine or an amine composition according to the invention as amine curing agents. The present invention also relates to amine curing agent compositions comprising linear triethyienetetramine as well as to curable compositions comprising linear triethylenetetramine and to a method for producing said curable compositions. Additionally, the present invention relates to a cured epoxy resin comprising linear triethylenetetramine, especially a reinforced composite, and a method for producing said cured epoxy resins.

Abstract: An oligomeric condensation product can be obtained from at least one (hydroxymethyl)phenol of general formula (I), in which R1 is hydrogen or —CH3, R2 is —CH2OH, and R3 is hydrogen or —CH3, at least one polyamine, and optionally at least one phenol compound having two centres reactive by means of a reaction with the methylol groups of the (hydroxymethyl)phenol.

Abstract: A resin binder composition for the production of a fiber preform comprising an amount of at least one polyarylether thermoplast resin component and an amount of at least one thermoset resin component in weight ratio 80/20-10/90, in substantial absence of a catalyst which is active at the prevailing preform production temperature, wherein the polyarylether thermoplast has number average molecular weight (Mn) in the range 2,000-20,000, and comprises ether linked phenyl units and ether linked arylsulphone units and reactive end groups, method for producing a fiber preform using the thermally stable binder resin composition, a perform obtained with use of the method and composition, a method for injecting or infusing the preform with curable matrix resin, the curable injected or infused preform resin, a method for curing thereof and a cured composite obtained with the method.

Abstract: A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.

Abstract: A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.

Abstract: An adhesive for anchoring materials in or to concrete or masonry exhibits a shorter cure time than previous adhesives and comprises an epoxy compound and a curing agent of at least one aliphatic amine and at least one tertiary amine, optionally with a reactive dilent, which possesses sufficent strength to pass ICBO Heat Creep Test at 110 degrees F. and the ICBO Damp Hole Test at 75 degrees F.