Abstract: Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber. The composite material has a function that the oxide glass is softened and fluidized by electromagnetic waves.

Abstract: Epoxy resin compositions utilizing phosphazene blocked azole compounds as curing catalyst are provided. Also provided are epoxy resins cured with phosphazene blocked azole compounds and methods of making cured epoxy resins using curing catalysts of phosphazene blocked azole compounds.

Abstract: Nanocomposite materials and methods of making composite materials reinforced with carbon nanotubes are disclosed. The composite material includes an array of functionalized and aligned carbon nanotubes having a degree of functionalization of about 1% to about 10%; and a polymeric matrix material bonded to the array of functionalized and aligned carbon nanotubes.

Abstract: A resin composition constituting dielectric resin films of a film capacitor includes a first atom group including at least one functional group selected from among a methylene group, an aromatic ring and an ether group and having a relatively small molar polarizability, and a second atom group including at least one functional group selected from among a hydroxyl group, an amino group and a carbonyl group and having a relatively large molar polarizability. The resin composition satisfies the condition that a value calculated from the formula (sum of absorption band intensities of first atom group)/(sum of absorption band intensities of second atom group) is 1.0 or more. Herein, as absorption band intensities of the functional groups, peak intensities detected in specific wavenumber ranges are employed.

Abstract: Disclosed herein are compositions and methods related to the hydroformylation of cyclododecatriene to form cyclododecatriene trialdehyde, and the conversion of the trialdehyde to the polyphenols of Formula 1: where R, m p and Q are as defined herein. Curable compositions comprising compounds of Formula 1, including powder coating compositions, and methods of curing the compositions are also disclosed.

Abstract: Described herein are metal amidine complexes in combination with a second compound useful as catalysts in a number of polymerization reactions, including polyurethane and epoxy polymerization reactions. Also described herein are various coating compositions and methods of using same for coating substrates using the metal amidine complexes in combination with a second compound.

Abstract: The present invention is one liquid type cyanate-epoxy composite resin composition that is comprised of cyanate ester resin (A), epoxy resin (B) and latent curing agent (C) and has high thermal resistance as well as excellent fast curing properties and storage stability, characterized in that the above latent curing agent is comprised of a modified amine compound (a) and a phenol resin (b). Where, the modified-amine compound (a) is obtained by the reaction of at least one kind of amine compounds (a-1), selected from amine compounds having one or more tertiary amino groups and one or more primary and/or secondary amino groups, with an epoxy compound (a-2), in particular. It is preferable that one liquid type cyanate-epoxy composite resin composition of the present invention contains 1-10,000 mass parts of the epoxy resin component of the component (B) relative to 100 mass parts of cyanate-ester resin component of the component (A).

Abstract: Embodiments include oxazolidone ring containing adducts obtainable by combining an aliphatic epoxy compound, an aromatic epoxy compound, and a diisocyanate. Embodiments further include a curable powder coating composition including a resin component and a hardener component, where the resin component includes the oxazolidone ring containing adduct.

Abstract: The use of Michael addition curing chemistries in compositions comprising sulfur-containing polymers such as polythioethers and polysulfides useful in aerospace sealant applications are disclosed. Sulfur-containing adducts comprising terminal Michael acceptor groups are also disclosed.

Abstract: The use of Michael addition curing chemistries in compositions comprising sulfur-containing polymers such as polythioethers and polysulfides useful in aerospace sealant applications are disclosed. Sulfur-containing adducts comprising terminal Michael acceptor groups are also disclosed.

Abstract: The invention relates to the use of bis- or multifunctional N,N?-(dimethyl) urons as curing agents for curing epoxy resin compositions in a controlled manner.

Abstract: An epoxy system having a Part A and a Part B, where the Part A has an epoxy resin component present in a range of 20 weight percent (wt %) to 70 wt %, based on the total weight of the Part A; a flexibilizer present in a range from 20 wt % to 60 wt %, based on the total weight of the Part A; and a catalyst present in the range of 3 wt % to 7 wt % based on the total weight of the Part A, where the wt % of the components of the Part A of the epoxy system totals 100 wt %; and a Part B having a Mannich base hardener. Embodiments of the present disclosure also include a concrete structure that includes a reaction product of the epoxy system.

Abstract: Curable compositions including an epoxy resin, a hardener, and a block copolymer having a thermoset-philic block and a thermoset-phobic block, where the block copolymer is from 20 weight percent to 80 weight percent of the curable composition are described herein.

Abstract: A composition comprising a reaction product of reactants comprising (a) a compound comprising (i) a polysulfide moiety and (ii) an oxygen atom in a ?-position to a sulfur link having the formula: where each R is independently selected from H or a C1 to C20 organyl group, R? is independently selected from a C1 to C20 organyl group, R?? is independently selected from H or a C1 to C20 organyl group, and x has an average of greater than 2, (b) a compound comprising a nucleophilic moiety; and (c) a compound comprising a moiety reactive to active hydrogen.

Abstract: Compositions and methods for forming epoxy resin are provided, and compositions and methods for forming epoxy resin composites are provided. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component comprising a glycidyl ether of an aryl substituted phenolic compound, a curing agent component, and a substrate. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component and a curing agent component comprising an aryl substituted phenolic compound, and a substrate.

Abstract: The curable composition is a curable composition including a liquid polysulfide polymer containing 8% by weight or more of thiol groups in one molecule, an epoxy resin, and an amine, in which the liquid polysulfide polymer is HS—(R—Sx)n—R—SH wherein R is a two valent or three valent organic group containing a —O—CH2—O— bond, the average of n is less than 10, x is an integer of 1 to 5, and the average of x is 1 to 2.5.

Abstract: The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.

Abstract: Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Abstract: A sulfonium borate complex that is capable of reducing the amount of fluorine ions generated during thermal cationic polymerization, and is capable of providing a thermal cationic polymerizable adhesive with low-temperature fast curing properties is represented by a structure represented by the formula (1). In the formula (1), R1 is an aralkyl group, R2 is a lower alkyl group, and R3 is a lower alkoxycarbonyl group. X is a halogen atom, and n is an integer of from 1 to 3.

Abstract: An aluminum chelate-based latent curing agent having excellent latency and thermal response includes a latent curing agent in which an aluminum chelating agent is retained in a porous resin obtained by interfacial polymerization of a polyfunctional isocyanate compound, and an enzyme-treated gelatin film coating such latent curing agent. This microcapsule-type latent curing agent can be produced by dissolving an aluminum chelating agent and a polyfunctional isocyanate compound in a volatile organic solvent, charging the obtained solution into a gelatin-containing aqueous phase, carrying out interfacial polymerization by heating and stirring, and subjecting the gelatin to an enzyme treatment by adding an enzyme to the obtained polymerization reaction mixture.

Abstract: The present invention relates to hardeners for epoxy resins, which contain secondary amino groups having pyridinyl groups. They harden surprisingly quickly together with epoxy resins even under cold and humid conditions and without producing blushing to give films with a high degree of hardness, the highest degrees of hardness being obtained with a surprisingly low amount of hardener required. They are especially suitable for low-emission coatings with high resistance requirements.

Abstract: A multifunctional aromatic amine hardener composition including the reaction condensation product of (a) at least one aniline and (b) at least one non-aromatic cyclic dicarboxaldehyde; and a reactive thermosettable resin composition including (i) at least one multifunctional aromatic amine hardener composition curing agent, (ii) at least one thermoset resin, and optionally (c) at least one catalyst; and a process for preparing a thermoset product from the thermosettable composition. The hardener composition above and a thermoset resin may be used to prepare a thermoset product with improved thermo-mechanical behavior.

Abstract: A poly(phenylene ether)-poly(hydroxy ether)-poly(phenylene ether) (PPE-PHE-PPE) triblock copolymer is formed by reaction of a monohydroxy-terminated poly(phenylene ether) with a diepoxy-terminated poly(hydroxy ether) in the presence of a base. The PPE-PHE-PPE triblock copolymer is useful as a compatibilizer in blends of polar polymers and non-polar polymers. The PPE-PHE-PPE triblock copolymer is also useful as a compatibilizer for non-polar polymers and polar fillers.

Abstract: A hydroxyphenyl or alkoxyphenyl phosphine oxide composition comprising (i) a first mixture of mono-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers, (ii) a second mixture of bis-(hydroxyaryl) or (alkoxyphenyl) phosphine oxide isomers, (iii) a third mixture of tris-(hydroxyaryl) or (alkoxyphenyl) phosphine oxide isomers, and optionally iv) a minority amount of non-hydroxy or non-alkoxy tris-phenyl phosphine oxides is provided. Also provided are epoxy resins compositions with excellent flame retardancy and physical properties, which resins comprise the phosphine oxide composition.

Abstract: Provided herein is a multifunctional particle and methods of forming the same. The multifunctional particle includes: a silica particle; a hydrophobic silane; and a silane coupling agent; where each of the hydrophobic silane and the silane coupling agent are chemically bonded to the surface of the silica particle; where the multifunctional particle is superhydrophobic and chemically reactive.

Abstract: An epoxy curative is provided comprising: a) a Lewis base, b) calcium nitrate, and c) a polyamine amide salt. The present disclosure additionally provides a composition which is a mixture obtained by mixing the epoxy curative and a curable epoxy resin. The present disclosure additionally provides cured compositions which result from cure of such a mixture.

Abstract: The invention relates to the use of alkyl or dialkyl-semicarbazone as a hardener for hardening epoxy resin and to a method for controlling the hardening of epoxy resin and epoxy resin compounds.

Abstract: An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.

Abstract: A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.

Abstract: Composite parts may be bonded together at room temperature using an adhesive resin film that is chemically activated to cure when placed in contact with a scrim containing a catalyst.

Abstract: The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 ?m or more and 5.0 ?m or less.

Abstract: An amine-terminated, substantially linear siloxane compound comprises siloxane repeating units conforming to specified structures, one of which contains pendant aromatic groups. The amine-terminated, substantially linear siloxane compound further comprises amine-substituted terminal siloxy groups. An epoxy product is made by reacting an epoxy resin and the amine-terminated, substantially linear siloxane compound.

Abstract: A novel hydroxyl-functional polyether derived from the reaction of (a) a divinylarene dioxide, particularly a divinylarene dioxide derived from divinylbenzene such as divinylbenzene dioxide (DVBDO); and (b) a diphenol; wherein the reaction product is thermally stable and exhibits an absence of self-polymerization (crosslinking or gelling) upon heating at elevated temperatures. The novel hydroxyl-functional polyether offers improved properties compared to known hydroxyl-functional polyethers such as solid epoxy resins, phenolic epoxy resins (hardeners), and poly(hydroxyl ethers).

Abstract: The invention relates to hardeners for epoxy resin containing secondary amino groups having dialkyl amino phenyl groups. The hardeners have a surprisingly low viscosity and harden surprisingly fast together with the epoxy resins, even in moist, cold conditions, and without blushing to form films with high hardness and stability. They are suitable, in particular, for low-emission coatings.

Abstract: A two-pack type epoxy resin composition for fiber-reinforced composite materials includes components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less: [A] an epoxy resin; [B] an acid anhydride; [C] a compound that has an average of 2.5 or more hydroxyphenyl structures in each molecule; and [D] an organic phosphorus compound or imidazole derivative.

Abstract: Advanced epoxy resins comprising the reaction product of an epoxy resin comprising a diglycidyl ether of Formula 1 as defined herein, and at least on difunctional compound selected from an aromatic diol and a dicarboxylic acid are described. The diglycidyl ether contains a cycloaliphatic ring of 3-5 carbon atoms. Purified diglycidyl ether is used to obtain substantially linear, high molecular weight, advanced epoxy resin. Curable compositions, cured compositions, and articles comprising the advanced epoxy resins are also disclosed. The advanced epoxy resins provide cured coatings having improved flexibility and low total chlorine content.

Abstract: The present invention relates to hardeners for epoxy resins, which contain secondary aliphatic and primary aromatic amino groups. They harden surprisingly quickly together with epoxy resins even under cold and humid conditions and without blushing effects to give films with a high degree of hardness. They are especially suitable for coatings with high resistance requirements.

Abstract: A molding composition formulation includes a thermoset cross-linkable 12 to 45 micron polymeric resin. Hollow glass microspheroids are present from 2 to 12 total weight percent. An article formed from such a composition is further strengthened by the addition of a surface activating agent bonded to the surface of the glass microspheroids. Conventional particulate fillers when added to an inventive formulation provide enhanced performance when the filler particle has a size sufficiently small to insert within adjacent microspheroid interstitial voids. An unsaturated polyester resin so formed is particularly well suited for the formation of sheet molding compound formulations.

Abstract: An epoxy resin adduct comprising the reaction product of an epoxy resin comprising a diglycidyl ether of Formula 1 as defined herein, and at least one reactive compound having two or more active hydrogen atoms per molecule, wherein the active hydrogen atoms are reactive with epoxide groups are described. The diglycidyl ether contains a cycloaliphatic ring of 3-5 carbon atoms. Curable compositions, methods of curing, cured compositions, and articles comprising the epoxy resin adducts are also disclosed. The epoxy resin adduct has improved cure behavior and provides cured compositions having increased glass transition temperature, good weatherability, and a low total chlorine content.

Abstract: The present invention pertains to the field of thermosetting or thermoset polymers mainly used as materials, coatings or adhesives. The invention more specifically relates to the use of specific molecules having associative groups including a nitrogen heterocycle as a hardener or co-hardener of thermosetting polymers.

Abstract: The present invention provides a composition which comprises at least one epoxy resin and a mixture comprising the 7 stereoisomers of diaminomethylcyclohexane in very specific ratios relative to one another, a process for preparing the composition, the use of the composition for producing hardened epoxides, adhesives, composite materials and moldings, a mixture comprising the 7 stereoisomers of diaminomethylcyclohexane in the specific ratios, and the use of this mixture for producing the composition.

Abstract: A curable resin composition which is in a liquid form at ordinary temperature and provides a cured product having excellent heat resistance and a low thermal expansion rate is provided. The curable resin composition according to the present invention comprises: a cyanate ester compound (A) represented by the following formula (I); and a curing accelerator (B): wherein R1 represents a hydrocarbon group having 2 to 20 carbon atoms.

Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: To provide a flame-retardant resin composition that has superior adhesion subsequent to curing and molding when used as a printed wiring board adhesive and that provides superior printed wiring board electrical characteristics; and a flexible printed wiring board metal-clad laminate, a coverlay, a flexible printed wiring board adhesive sheet, and a flexible printed wiring board employing this resin composition. (SOLUTION) The flame-retardant resin composition comprises a thermosetting resin, a hardener, and a phosphorus-containing polymer.

Abstract: The present invention is directed to anti-corrosion coatings. It is particularly directed to coatings comprising a monomer, such as pyrrole, aniline, thiophene, or their analogs, and a resin. These coatings can be used with substrates such as cold-rolled steel and other metals to inhibit surface oxidation.

Abstract: A carbon fiber sizing agent imparts good bonding performance to carbon fiber, is used to reinforce a thermoplastic matrix resin, and provides a carbon fiber strand applied with the sizing agent and a fiber-reinforced composite reinforced with the carbon fiber strand. The sizing agent for carbon fiber is used to reinforce thermoplastic matrix resin. The sizing agent essentially contains a polymer component having a glass transition temperature of at least 20 deg.C. and exhibits no endothermic peaks indicating an endothermic heat of fusion due to crystalline melting of at least 3 J/g in a determination with a DSC. The weight ratio of the polymer component is 10 to 100 wt % of the nonvolatile components of the sizing agent. The polymer component is at least one component selected from the group consisting of an aromatic polyester resin, aromatic polyester-polyurethane resin and amine-modified aromatic epoxy resin.

Abstract: Partially hydrogenated bisphenol-A based polymers. Coating compositions for food or beverage containers and medical devices, including a partially hydrogenated bisphenol-A based polymer. Food or beverage containers and medical devices coated with partially hydrogenated bisphenol-A based polymers. Food or beverage containers and medical devices made from partially hydrogenated bisphenol-A based polymers.

Abstract: A hydroxyphenyl or alkoxyphenyl phosphine oxide composition comprising (i) a first mixture of mono-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers, (ii) a second mixture of bis-(hydroxyaryl) or (alkoxyphenyl) phosphine oxide isomers, (iii) a third mixture of tris-(hydroxyaryl) or (alkoxyphenyl) phosphine oxide isomers, and optionally iv) a minority amount of non-hydroxy or non-alkoxy tris-phenyl phosphine oxides is provided. Also provided are epoxy resins compositions with excellent flame retardancy and physical properties, which resins comprise the phosphine oxide composition.

Abstract: Silanes of formula (I): or inorganic fillers whose surface is coated or derivatized with a silane of formula (I), are curing agents for epoxy resins that are activatable at elevated temperature. The thermosetting epoxy resin compositions allow a large reduction in the curing temperature without great impairment of their storage stability. They are therefore very well suited for single-component thermosetting epoxy adhesives, which in particular may contain impact modifiers.