Abstract: Computer-implemented techniques are disclosed for verifying circuit designs using dynamic problem generation. A device under test (DUT) is modeled as part of a test bench where the test bench is a random process. A set of constraints is solved to generate stimuli for the DUT. Problem generation is repeated numerous times throughout a verification process with problems and sub-problems being generated and solved. When a problem is solved, the problem structure can be stored in a cache. The storage can be based on entropy of variables used in the problem. The problem storage cache can be searched for previously stored problems which match a current problem. By retrieving a problem structure from cache, the computational burden is reduced during verification. Problems can be multi-phase problems with storage and retrieval of problem structures based on the phase level. Caching can be accomplished using an information theoretic approach.

Abstract: In a STA method, after accessing data sets regarding the IC, vectors of the data sets for STA can be generated. Each vector can include a base value and a plurality of tokens, wherein each token is quantized. For each vector, the data of the vector can be adjusted. Adjusting can include shifting a predetermined token to zero and adjusting the base value and remaining token values based on the shifting. Incremental compression can be applied within the vector by storing each token value as a difference versus its previous token value. Differential compression can then be applied by storing each token value as a difference versus a corresponding token value in a predetermined reference vector. A resulting vector can be stored. At this point, an operation for STA can be performed using multiple resulting vectors without de-quantizing or decompressing.

Abstract: In one embodiment of the invention, a method and a system for phase noise analysis of oscillators is provided using frequency aware perturbation projection vector techniques. The method and system includes performing steady state analysis on the oscillator by generating an augmented Jacobian matrix. A transfer function for frequency deviation is extracted for the augmented Jacobian matrix for a predetermined frequency range including the oscillation frequency of the oscillator. The phase noise is predicted based on the extracted transfer function.

Abstract: Certain embodiments of the present invention are configured to permit development and validation of a device driver or a device application program by using improved virtual devices. Such improved virtual devices facilitate driver development without use of real devices or hardware prototypes. The present invention also may be configured to permit advanced validation of a device-driver combination that would be difficult to achieve even with a real device. Certain embodiments also may detect inconsistencies between virtual and real devices, which may be used to improve drivers and device application programs and increase compatibility of such drivers and device application programs with real devices.

Abstract: The invention relates to a method for configuring a test arrangement for a device to be tested, which is one component of a system containing, several components. The components of the system are described by data records, which have elements that describe relationships of components with one another. The method includes linking the data records to generate a system description based on the linked data records, simulating of the system by a simulation based on the system description, wherein an image of the device to be tested is in the simulation. The method also includes removal of the image of the device from the simulation and provision of one or more test interfaces in hardware for communication between the simulation facility and the device.

Abstract: Roughly described, the invention involves ways to characterize, take account of, or take advantage of stresses introduced by TSV's near transistors. The physical relationship between the TSV and nearby transistors can be taken into account when characterizing a circuit. A layout derived without knowledge of the physical relationships between TSV and nearby transistors, can be modified to do so. A macrocell can include both a TSV and nearby transistors, and a simulation model for the macrocell which takes into account physical relationships between the transistors and the TSV. A macrocell can include both a TSV and nearby transistors, one of the transistors being rotated relative to others. An IC can also include a transistor in such proximity to a TSV as to change the carrier mobility in the channel by more than the limit previously thought to define an exclusion zone.

Abstract: A method to create an integrated circuit that includes digital and analog components comprising: displaying on a computer system display, user input to the computer system that specifies parameter information to determine a binding between an analog circuit design component and a digital circuit design component; saving the user specified parameter information within a file that also specifies at least a portion of the analog circuit design; associating the analog circuit design component a first design block of an integrated circuit that also includes a second digital design block coupled to the first design block; using parameter information to determine a binding between the first analog circuit design component and the first digital circuit design component; saving the determined binding in computer readable storage media.

Abstract: Roughly described, a method for approximating stress-induced mobility enhancement in a channel region in an integrated circuit layout, including approximating the stress at each of a plurality of sample points in the channel, converting the stress approximation at each of the sample points to a respective mobility enhancement value, and averaging the mobility enhancement values at all the sample points. The method enables integrated circuit stress analysis that takes into account stresses contributed by multiple stress generation mechanisms, stresses having vector components other than along the length of the channel, and stress contributions (including mitigations) due to the presence of other structures in the neighborhood of the channel region under study, other than the nearest STI interfaces. The method also enables stress analysis of large layout regions and even full-chip layouts, without incurring the computation costs of a full TCAD simulation.

Abstract: Embodiments of the disclosed technology are directed toward facilitating the concurrent emulation of multiple electronic designs in a single emulator without partition restrictions. In certain exemplary embodiments, an emulation environment comprising an emulator and an emulation control station is provided. The emulation control station includes a model compaction module that is configured to combine multiple design models into a combined model. In some implementations, the design models are merged to form the combined model, where each design model is represented as a virtual design with the combined model. Subsequently, the emulator can be configured to implement the combined model. Furthermore, an emulation clock control component is provided that allows for portions of the emulated combined model to be “stalled” during emulation without affecting other portions.

Abstract: A system, method and program product for modeling load effects of a load CCC (channel connected component) in a transistor network. A system is disclosed that includes an analysis system that determines allowable logical state and transition functions for nets in a load CCC for a transition or state of a driving CCC for which a load condition is being determined; a trace system that traverses paths in the load CCC from a set of input terminals; and an element replacement system that replaces circuit elements in the load CCC to create a modeled CCC, wherein a circuit element replacement is based on a type of circuit element encountered along a trace, and state and transition functions of nets connected to an encountered circuit element.

Abstract: A method, implemented in a processor, of determining a likelihood of failure of a circuit to be made in accordance with a circuit design, and a computer-readable storage medium storing instructions to the processor for carrying out the method. A sensitivity of a figure of merit to each variable of a plurality of variables is determined by simulating operation of the circuit using the processor. Determining the sensitivity is based on a departure of each of the variables from a respective mean value, where the variables include at least one variable derived from measurements of a fabricated component or component combination to be included in the circuit. Results from the simulation are used to predict a failure probability of the circuit to be made in accordance with the circuit design.

Abstract: Various embodiments of a system and method for creating and controlling a model of a sensor device for a computer simulation are disclosed. Sensor information specifying physical properties of the sensor device may be received, and a model of the sensor device may be automatically generated using the sensor information. An electrical circuit simulation may be performed using the model of the sensor device. The system and method may enable the user to interactively change the sensor device model during the simulation. The user may interact with a graphical user interface during the simulation to provide input specifying a change in one or more physical properties of the sensor device. In response to the user input, the model of the sensor device may be dynamically modified during the simulation to simulate the change in the one or more physical properties of the sensor device.

Abstract: A method is presented for responding to user input by displaying when a circuit has a property expressed by an assertion based on data indicating values of signals of the circuit at a succession of times. The assertion expresses the property as a first sequence of expressions, and separately defines for each expression a corresponding evaluation time relative to the succession of times at which the expression is to be evaluated. The circuit has the property only if every expression of the first sequence evaluates true at its corresponding evaluation time. The method includes displaying a representation of each expression of the first sequence and identifying each variable that caused that expression to evaluate false and distinctively marking that variable's symbol relative to other variable symbols within the display for each expression of the first sequence that evaluates false at its corresponding evaluation time.

Abstract: Approaches for creating a timed hybrid simulation model for a circuit design specification. An untimed, high-level language (HLL) data-path model is input, along with an HLL data-path interface specification that specifies input ports of the HLL data-path model. A hardware description language (HDL) control-path model that specifies port attributes and associated stitching directives is generated. Each stitching directive specifies a control port and an associated one of the input ports of the HLL data-path model. The HLL data-path and HDL control-path models are linked (314) to create the timed hybrid simulation model, and the timed hybrid simulation model is stored in a processor-readable storage medium.

Abstract: Various methods for analyzing mutual inductance in an integrated circuit layout are disclosed. In one exemplary embodiment, for example, circuit design information indicative of a first inductor and a second inductor is received. A dipole moment associated with the first inductor is determined, where the magnetic field associated with the dipole moment is representative of magnetic fields created by respective turns in the first inductor. A mutual inductance between the first inductor and the second inductor is determined by determining a magnetic flux of the magnetic field of the dipole moment through surfaces bounded by respective wire segments of the second inductor.

Abstract: Computer-implemented methods are disclosed for providing an elastic modulus map of an integrated circuit (IC) chip of a chip/device package, for identifying a probable failure site of the chip/device package from the elastic modulus map of the IC chip, for modifying a connector footprint of the chip/device package based on identifying a probable failure site from the elastic modulus map of the IC chip, and for modifying the IC chip based on identifying a probable failure from the elastic modulus map of the IC chip. Each layer of the IC chip may be mapped, and each grid shape of the mapped layers may comprise a metal area and a dielectric area. Grid shapes from each layer of the IC are vertically aligned to provide a combined spring constant for each grid shape, which are then mapped onto the elastic modulus map to identify possible failure sites in the chip/device package.

Abstract: Methods and apparatus for designing and measuring a cell-electrode impedance sensor to detect chemical and biological samples, including biological cells. The method of designing a cell-electrode impedance sensor comprises: determining a cell free cell-electrode impedance and a cell-covered cell-electrode impedance; obtaining a sensor sensitivity of the cell-electrode impedance measurement system; and choosing one or more design parameters of the cell-electrode impedance sensor to maximize the sensor sensitivity. When the frequency of AC signal between electrodes ranges from 10 kHz to 40 kHz, the sensitivity of the sensor is maximized.

Abstract: A system that simulates an integrated circuit is formed of a plurality of devices. The system initially performs a fundamental circuit simulation run using original parameters for the plurality of devices and an initial time step. The system generates one or more fundamental time steps from the fundamental circuit simulation run. The fundamental time steps are generated when changes that indicate state time derivatives during two or more successive integration steps are within a predetermined range. The system stores the one or more fundamental time steps as fundamental circuit events in an events queue, and updates the parameters for the plurality of devices based on the fundamental circuit events to generate one or more derivative circuits. The system then performs one or more derivative circuit simulation runs using the derivative circuits.

Abstract: A hybrid simulation model includes a real model, a bus interface and an acceleration model. The real model simulates a group of instructions. The acceleration model includes a trace generation unit, a trace replay unit, a selection unit, a snapshot generation and load unit and a virtual breakpoint control unit. The trace generation unit records at least one trace file of the real model in a first simulation. The trace replay unit reads and accordingly accesses the at least one trace file. The selection unit dynamically switches to perform a real simulation or a trace simulation. The snapshot generation and load unit generates at least one status snapshot file and loads the at least one status snapshot file to the real model in repeated simulations. The virtual breakpoint control unit controls the selection unit to switch between the trace simulation and the real simulation according to a virtual breakpoint.

Abstract: A method for verifying power management of an integrated circuit design includes estimating a current load requirement of clocked modules in the circuit design based on the clock frequency and a predefined current load model. The voltage supplied to the circuit design is monitored. A first voltage regulator provides additional current drive to the circuit design when the supplied voltage drops below a threshold value of a full throttle run mode of the circuit design. A second voltage regulator is enabled to boost a response time of the first voltage regulator when the voltage drops below the threshold value.

Abstract: An apparatus of system level simulation and emulation and an associated method are provided, where the apparatus includes: a simulation/emulation engine, an existing intellectual property (IP) installation platform, a speed driver, and an IP proxy. The simulation/emulation engine is utilized for performing at least one of simulation and emulation to make the apparatus be equipped with a first portion of a plurality of IP modules. The existing IP installation platform is utilized for installing a chip equipped with existing IP modules to make the apparatus be equipped with a second portion of the plurality of IP modules, where the second portion of the plurality of IP modules includes a specific IP module of the existing IP modules. With the aid of the speed driver, the apparatus utilizes the specific existing IP module without introducing any unnecessary delay.

Abstract: Embodiments of a method are disclosed that may allow for the optimization of a memory circuit design parameter. The method may include the statistical simulation of one or more operational parameters of the memory circuit. Probabilities of the operational parameters achieving pre-defined probability goals may be used to optimize the memory circuit design parameter.

Abstract: A method and system for compiling a representation of a source circuit including one or more source subchannels associated with portions of source logic driven by a plurality of clock domains are described. Each source subchannel may generate packets carrying signal data from one of the portions of the source logic. A representation of a destination circuit may be compiled to include one or more destination subchannels associated with portions of destination logic replicating the source logic. Each destination subchannel may forward the signal data via the packets to one of the portions of the destination logic. A switching logic may be configured to map the source subchannels to the destination subchannels as virtual channels to forward the packets from the source subchannels to the destination subchannels. A single queue may be configured to couple with the switching logic to record packets from the source subchannels into a packet stream for a delay period to distribute to the destination subchannels.

Abstract: Provided is a noise analysis model and a noise analysis method that can analyze effects of substrate noise on each of elements included in a circuit to be analyzed. The noise analysis model includes first to third resistors. The first resistor serves as a substrate resistor in a semiconductor substrate between a first point set in the semiconductor substrate between a noise source and a transistor to which substrate noise from the noise source propagates through the semiconductor substrate and a second point set in the semiconductor substrate just below a back gate of the transistor. The second resistor serves as a substrate resistor in the semiconductor substrate between the second point and a fixed potential region near the transistor. The third resistor serves as a line resistor of a line connecting the fixed potential region and a power pad that supplies a ground potential.

Abstract: An automated system-on-chip (SOC) hardware and software cogeneration design flow allows an SOC designer, using a single source description for any platform-independent combination of reused or new IP blocks, to produce a configured hardware description language (HDL) description of the circuitry necessary to implement the SOC, while at the same time producing the development tools (e.g., compilers, assemblers, debuggers, simulator, software support libraries, reset sequences, etc.) used to generate the SOC software and the diagnostics environment used to verify the SOC.

Abstract: A method of producing a temperature model of a surface of an object using ultrasonic transducers comprises the steps of iteratively adjusting a temperature model by using measured travel times of ultrasonic waves and their predictions model-based. The ultrasonic waves used for producing the temperature model are preferably substantially non-dispersive ultrasonic waves. The method may further involve a height model of the surface, which height model is produced using substantially dispersive ultrasonic waves and is corrected by using the temperature model.

Abstract: Provided are a device model, a recording medium storing a program, a simulation circuit, device, and method that calculate a local temperature increase in an element. The device model according to the present invention is used for a semiconductor circuit simulation and has at least two model parameters. The model parameters include an electrical model describing temperature characteristics and a thermal model describing thermal characteristics and corresponding to the electrical model.

Abstract: A system, method and non-transitory computer-readable medium utilize an equivalent circuit model in which electrostatic capacitance changes in response to an arbitrary DC bias voltage applied to a capacitor from the outside. The equivalent circuit model includes a capacitor equivalent circuit section composed of a base circuit and a multistage circuit, a reference current generator section that calculates a reference current, a multiplying factor generator section that calculates a multiplying factor, and a current source current generator section that generates a current of the current source based on the reference current and the multiplying factor. The multiplying factor generator section generates a voltage of an nth-degree polynomial corresponding to the DC bias voltage when applying the DC bias voltage, and defines a current to be generated when the generated voltage is applied to a resistance as the multiplying factor.

Abstract: Approaches for simulating a circuit design. A block diagram of the circuit design is displayed. Each block has at least one input and at least one output, and at least one of the input or output of each block is connected to another block. Simulation data are input to a simulation model of the circuit design. During simulation of each of a plurality of the sub-circuits with the simulation model, an output data value is determined from one or more input data values to the simulated sub-circuit. Concurrent with determining the output data value, an output tag value corresponding to the output data value is determined. Concurrent with output of the output data value from the simulated sub-circuit, each output tag value is displayed proximate an output signal line from the block corresponding to the sub-circuit.

Abstract: A system, method and computer program product for implementing a quiescent current leakage specific model into semiconductor device design and circuit design flows. The leakage model covers all device geometries with wide temperature and voltage ranges and, without the need for stacking factor calculations nor spread sheet based IDDQ calculations. The leakage model for IDDQ calculation incorporates further parasitic and proximity effects. The leakage model implements leakage calculations at different levels of testing, e.g., from a single device to a full chip design, and are integrated within one single model. The leakage model implements leakage calculations at different levels of testing with the leverage of a single switch setting. The implementation is via a hardware definition language code or object oriented code that can be compiled and operated using a netlist of interest, e.g., for conducting a performance analysis.

Abstract: A link simulation tool for simulating high-speed communications link systems is provided. Communications links may include link subsystems such as transmit (TX) circuitry, receive (TX) circuitry, oscillator circuits that provide reference clock signals to the TX and RX circuitry, and channels that link the TX and RX circuitry. The link simulation tool may model each of the subsystems using behavioral models. The behavioral models may include characteristic functions such as transfer functions, probability density functions, and eye characteristics. The link simulation tool may have a link analysis engine that is capable of performing two-dimensional (two-variable) convolution operations and in applying dual-domain (frequency-time) transformations on the characteristic functions provided by the behavioral models to simulate the performance of the link system.

Abstract: Methods for optimizing conductor patterns for conductors formed by ECP and CMP processes. A method includes receiving layout data for an IC design where electrochemical plating (ECP) processes form patterned conductors in at least one metal layer over a semiconductor wafer; determining from the received layout data a global effects factor corresponding to a global pattern density; determining layout effects factors for unit grid areas corresponding to the pattern density of the at least one metal layer within the unit grid areas, determining local effects factors for each unit grid area; using a computing device, executing an ECP simulator using at least one of the global effects factor and the local effects factors, and using the layout effects factor; outputting an predicted post-ECP hump data map from the ECP simulator; and if indicated by a threshold comparison, modifying the layout data.

Abstract: A simulation system for producing equivalent circuits reads data corresponding to a tabular W element format in a storage device, and adds data of the tabular W element format file using interpolation algorithm. A frequency-dependent transmission matrix is transformed into an N-port network matrix describing electrical properties of a multi-input and multi-output network. An N-port network matrix is transformed into a S-parameter matrix. A range of frequency of a s-parameter is determined and numbers of pole-residue, times for recursion and durable maximum system errors in the equivalent circuit is also determined. A vector fitting algorithm is performed and a rational function matrix composed with s-parameters is produced, to produce a general SPICE equivalent circuit based on the generated rational function matrix.

Abstract: This application discloses a design verification tool to simulate a circuit design with a test bench to generate a simulated output for the circuit design and a simulation log corresponding to operation of the test bench during the simulation of the circuit design. The design verification tool can determine whether the simulated output for the circuit design is different than an expected output for the circuit design. A debug tool can synchronize the simulated output for the circuit design with test bench transactions from the simulation log that prompted the generation of the simulated output for the circuit design when the simulated output of the circuit design is different than the expected output of the circuit design.

Abstract: A method of performing a simulation of a design under test is disclosed. The method comprises implementing an input block having an adjustable output width; coupling test data to the input block; generating an input signal comprising the test data for the design under test according to an input requirement for the design under test by way of the input block; implementing an output block having an adjustable input width for receiving data from an output of the design under test; and coupling the output of the design under test to the output block according to an output requirement of the design under test. A circuit for enabling testing of a circuit design implemented in an integrated circuit is also disclosed.

Abstract: A circuit constant analysis method for an equivalent circuit of an inductance element includes determining values of various elements constituting the equivalent circuit from measured values of select electrical characteristics of the actual inductance element. The equivalent circuit includes: a parallel circuit connecting in parallel an inductance Ls, a capacitance Cp, and a resistance Rp; a capacitance Cr connected in series to said resistance Rp; an inductance Lr connected in parallel to said resistance Rp; a resistance Rs connected in series to said parallel circuit; a plurality of closed circuits including a resistance Rmi and an inductance Lmi magnetically coupled with a coupling coefficient ki by a mutual inductance Mi to said inductance Ls; and a resistance Rc connected in series to said capacitance Cp.

Abstract: A memory structural model is generated directly from memory configuration information and memory layout information in an efficient manner. Information on strap distribution is generated by analyzing configuration information of the memory and the corresponding memory layout. Information on scrambling of addresses in the memory layout is generated by programming the memory layout with physical bit patterns, extracting corresponding logical bit patterns and then analyzing the discrepancy between the physical bit patterns and the logical bit patterns. The strap distribution information and the address scrambling information are combined into the memory structural model used for designing an efficient test and repair engine.

Abstract: Roughly described, a method for approximating stress-induced mobility enhancement in a channel region in an integrated circuit layout, including approximating the stress at each of a plurality of sample points in the channel, converting the stress approximation at each of the sample points to a respective mobility enhancement value, and averaging the mobility enhancement values at all the sample points. The method enables integrated circuit stress analysis that takes into account stresses contributed by multiple stress generation mechanisms, stresses having vector components other than along the length of the channel, and stress contributions (including mitigations) due to the presence of other structures in the neighborhood of the channel region under study, other than the nearest STI interfaces. The method also enables stress analysis of large layout regions and even full-chip layouts, without incurring the computation costs of a full TCAD simulation.

Abstract: Embodiments of the invention include systems and methods for automatically predicting production yield for a circuit assembly according to attributes of its components and defect data mapped thereto. Embodiments receive a proposed design specification for a circuit assembly, including bill of materials (BOM) and schematic data, at a yield prediction environment. The yield prediction environment maps a set of attributes to each component in the BOM and maps a set of possible defects to each component according to its attributes. Defects may be further mapped to a manufacturing process assigned to populate each component in the circuit assembly. The defects are associated with predicted frequencies of occurrence, which can be used to roll up a yield prediction for the circuit assembly. Embodiments further allow “what-if” analysis to be performed so that different yield prediction results can be compared according to different form factor options and/or different manufacturing process options.

Abstract: A method is provided that comprises a circuit design that includes multiple design blocks; a power intent specification file that defines a power domain within the circuit design and that identifies design instances within the power domain and that defines a control function to selectively transition the defined power domain between multiple respective power supply values; using a digital simulator to simulate operation of the digital representation while using an analog simulator to simulate operation of the analog representation; wherein simulating the digital representation includes transitioning the defined power domain between supply values from among the multiple respective supply values; wherein simulating the analog representation includes periodically storing in a storage location a power supply value currently in use during digital simulation of the digital representation; and wherein simulating the analog representation includes using the stored currently in use power supply value to supply voltage

Abstract: Techniques are presented for determining effects of process variations on the leakage of an integrated circuit having multiple devices. The operation of the circuit is simulated using a first set of values for the process parameters for the devices and is also simulated with some of the process parameter values varied. For the simulation with the varied values, the circuit is split up into distinct components (such as channeled coupled components, CCCs), where each component has one or more devices, and a process parameters value in a device in each of two or more of these components is varied.

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract: A simulator, which is used for simulating a semiconductor device including an AFE unit whose circuitry can be modified, includes: a circuitry configuration unit for configuring the circuitry of the AFE unit in accordance with a sensor that is coupled to the AFE unit; an input pattern selection unit for selecting a waveform pattern of a signal to be input to the sensor; and a simulation execution unit for executing a simulation on a combination of the sensor and the AFE unit that has the configured circuitry using the selected waveform pattern as an input condition.

Abstract: A web simulator of a semiconductor device having an AFE unit whose circuit configuration can be altered comprises a sensor selector that selects a sensor to be coupled to the AFE unit; a bias circuit selector that selects a bias circuit to be coupled to the selected sensor; a circuit configuration setting unit that sets the circuit configuration of the AFE unit to be coupled to the selected sensor and bias circuit; and a simulation executing unit that executes simulation of a coupled circuit combination comprising the selected sensor and bias circuit and the AFE unit of the set circuit configuration.

Abstract: A method includes designating a cell mismatch parameter of a memory cell including a plurality of transistors and an initial value of a transistor mismatch parameter for each of the plurality of transistors. A critical current sensitivity parameter is determined for each of the plurality of transistors based on the transistor mismatch parameters in a computing apparatus. The cell mismatch parameter is distributed across the plurality of transistors in the computing apparatus to update the individual transistor mismatch parameters for each of the plurality of transistors based on the critical current sensitivity parameters and the cell mismatch parameter. The memory cell is simulated based on the individual transistor mismatch parameters to generate a simulation result.

Abstract: A computer identifies a storage element in a simulation model of an integrated circuit design that, during simulation of the integrated circuit design using the simulation model, is subject to having its value forced. In response to identifying the storage element, an indication of the storage element and the associated clock signal are stored in a database. In response to receiving an input indicating the value of the storage element is to be forced during simulation, a determination is made by reference to the database whether or not forcing of the value is mistimed with reference to the associated clock signal. In response to a determination that the forcing of the value as indicated by the input is mistimed with reference to the associated clock signal, an indication that forcing of the value is mistimed is output.

Abstract: Individual mode timing constraints associated with a set of netlists are combined into merged mode timing constraints. An initial merged mode constraint is generated by combining timing constraints from individual modes. The initial merged mode includes the union of all timing constraints from individual modes that add timing relationships and the intersection of all timing constraints from the individual modes that remove timing relationships. Extraneous timing relationships are identified in the merged mode and eliminated by introducing timing constraints in the merged mode. Equivalence between the merged mode and the individual modes is verified by comparing timing relationships in the merged mode with timing relationships in the individual modes. The merged mode is considered equivalent to the individual modes if every timing relationship present in an individual mode is present in the merged mode and every timing relationship present in the merged mode is present in any of individual modes.

Abstract: A method and apparatus for providing a program-based hardware co-simulation of a circuit design are described. In one example, a circuit design is implemented for programmable logic to establish a design under test (DUT). A co-simulation model is programmatically generated using primitives defined by an application programming interface (API). The circuit design is simulated by configuring the programmable logic with the DUT and driving a co-simulation engine to communicate with the DUT via execution of the co-simulation model.

Abstract: A system and methods are provided for verifying a hardware design for an electronic circuit. The method may include: providing a hardware design description for the electronic circuit; extracting a set of design constraints from the hardware design description, where the set of design constraints represents the electronic circuit in terms of signals and logical operations performed on the signals; creating an abstraction model from the set of design constraints, where the abstraction model abstracts one or more of the logical operations in the set of design constraints by replacing the abstracted logical operations with uninterpreted functions; and property checking the abstraction model in relation to one or more design properties. When a violation in the electronic circuit is detected by the property checking step, the feasibility of the violation is then checked and, if the violation is deemed infeasible, the abstraction model is refined.

Abstract: A method for modeling and simulating a system comprising first and second interrelated components is disclosed. The method comprises modeling the behavior of said first and second components using first and second specifications. Each of said first and second specifications includes a functional specification and an associated simulation element. The method further comprises simulating the behavior of said first and second components using said first and second specifications. The simulation elements communicate with one another to provide a simulation system.