Abstract: A method is provided for optimising cell variant selection within a design process for an integrated circuit device. The method comprises performing cell placement and signal routing for an integrated circuit being designed using default cell layout information for cell variants of at least one cell type. The method further comprises performing cell variant optimization comprising identifying at least one cell of the at least one cell type to be substituted and substituting a default cell variant of the at least one identified cell with an alternative variant of the at least one identified cell. The method further comprises, during cell optimization, configuring a pin interconnect modification for mapping at least one pin location of the alternative variant of the at least one identified cell to at least one pin contact for the default cell layout.

Abstract: First and second pin groups are each formed from a plurality of pins associated with specific nets. Pins in the first pin group are to be wired to pins in the second pin group according to their associated nets. A candidate selection unit selects a set of pair candidates each specifying a first pair of pins in the first pin group and a second pair of pins in the second pin group. The first and second pairs of pins are associated with the same pair of nets, and their respective distances are within a specified range. A pair determination unit determines which pins in the first and second pin groups are to be wired in pairs, based on the pair candidates selected by the candidate selection unit.

Abstract: Methods for allocating spare latch circuits to logic blocks in an integrated circuit design are provided. A method includes determining logic blocks in the design and determining and determining an allocation of spare latch circuits among the logic blocks based on respective attributes of the logic blocks. The method further include placing the spare latch circuits in the design in accordance with the determined allocation based on local clock buffers corresponding with the logic blocks.

Abstract: Flexible, space-efficient I/O architectures for integrated circuits simplify circuit design and shorten design times. In one aspect, cells for power supply pads are eliminated, in part by locating ESD protection circuitry for these pads underneath the pads themselves, leaving only signal I/O buffers. Pads coupled to the signal I/O buffers may be defined as either signal I/O pads or power supply pads in accordance with customization circuitry. Customization circuitry also provides for flexible bank architectures, where signal I/O buffers within a bank share power supply requirements that may be different from power supply requirements of signal I/O buffers of another bank. The number of banks and the number of signal I/O buffers belonging to each bank is flexibly defined. Customization circuitry also provides for flexible pad options, whereby the IC pads may be configured for different packaging technology, for example, for wire bonding for flip-chip bonding, or for other types of bonding.

Abstract: Flexible, space-efficient I/O architectures for integrated circuits simplify circuit design and shorten design times. In one aspect, cells for power supply pads are eliminated, in part by locating ESD protection circuitry for these pads underneath the pads themselves, leaving only signal I/O buffers. Pads coupled to the signal I/O buffers may be defined as either signal I/O pads or power supply pads in accordance with customization circuitry. Customization circuitry also provides for flexible bank architectures, where signal I/O buffers within a bank share power supply requirements that may be different from power supply requirements of signal I/O buffers of another bank. The number of banks and the number of signal I/O buffers belonging to each bank is flexibly defined. Customization circuitry also provides for flexible pad options, whereby the IC pads may be configured for different packaging technology, for example, for wire bonding for flip-chip bonding, or for other types of bonding.

Abstract: Flexible, space-efficient I/O architectures for integrated circuits simplify circuit design and shorten design times. In one aspect, cells for power supply pads are eliminated, in part by locating ESD protection circuitry for these pads underneath the pads themselves, leaving only signal I/O buffers. Pads coupled to the signal I/O buffers may be defined as either signal I/O pads or power supply pads in accordance with customization circuitry. Customization circuitry also provides for flexible bank architectures, where signal I/O buffers within a bank share power supply requirements that may be different from power supply requirements of signal I/O buffers of another bank. The number of banks and the number of signal I/O buffers belonging to each bank is flexibly defined. Customization circuitry also provides for flexible pad options, whereby the IC pads may be configured for different packaging technology, for example, for wire bonding for flip-chip bonding, or for other types of bonding.

Abstract: A method including developing a circuit schematic diagram, the circuit schematic diagram including a plurality of cells. The method further includes generating cell placement rules for the plurality of cells based on the circuit schematic diagram and developing a circuit layout diagram for the plurality of cells based on the cell placement rules. The method further includes grouping the plurality of cells of the circuit layout diagram based on threshold voltages and inserting threshold voltage compliant fillers into the circuit layout diagram. A system for implementing the method is described. A layout formed by the method is also described.

Abstract: A static random access memory (SRAM) includes a column of SRAM memory cells. The SRAM may include a circuit to copy a value stored in any SRAM memory cell in a column of SRAM memory cells to any SRAM memory cell in the column of SRAM memory cells in a single cycle of the SRAM.

Abstract: Method of placing and routing circuit components including: dividing a layout area of an integrated circuit (IC) design into an array of tiles, each tile having a plurality of edges that are common to adjoining tiles; placing of circuit components into the layout area of the IC design such that each tile including a plurality of circuit components, the placing of circuit components being performed for primarily routability without resort to a timing model, routability being measured by congestion of wiring nets at the tile edges; performing a virtual timing operation of the IC design with a virtual timing model assuming ideal buffering is done to test the placement of circuit components; performing a wire synthesis operation of the IC design for layer assignment, buffering and timing optimization while minimizing degradation in routability; and performing a plurality of timing optimizations of the IC design while minimizing degradation in routability.

Abstract: An adaptive patterning method and system for fabricating panel based package structures is described. Misalignment for individual device units in a panel or reticulated wafer may be adjusted for by measuring the position of each individual device unit and forming a unit-specific pattern over each of the respective device units.

Abstract: An integrated circuit layout includes a P-type active region, an N-type active region, a first metal connection, a second metal connection and a plurality of trunks. The plurality of trunks is formed substantially side-by-side, and in parallel with each other. The first metal connection is substantially disposed over the P-type active region, and is electrically connected with drain regions of PMOS transistors in the P-type active region. The second metal connection is substantially disposed over the N-type active region, and is electrically connected with drain regions of NMOS transistors in the N-type active region. The plurality of trunks is electrically connected with and is substantially perpendicular to the first metal connection and the second metal connection. A first trunk of the plurality of trunks has a width wider than a width of other trunks of the plurality of trunks and is arranged to be located between two groups of trunks.

Abstract: The present invention discloses methods and apparatuses to design an integrated circuit. According to one aspect, the present invention circuit design discloses an iterative process of synthesis and placement where each iteration provides incremental changes on the design of the integrated circuit. The synthesis transform is then made with accurate timing information from the placement, and the process is incrementally iterative toward the final timing enclosure of the design. The incrementally iterative approach of the present invention provides a continuous advancement from synthesis to placement and vice versa, with the incremental improvements on synthesis made with knowledge of current instance placement, and the incremental improvements on placement made with knowledge of current circuit logic.

Abstract: A system and method for automatically modifying a first layout of a circuit. The first layout may describe a plurality of layers used in a fabrication process to manufacture the circuit. When performed, the fabrication process may result in a vertical electrical connection between two of the layers. However, the vertical electrical connection may not be directly specified by the first layout. The system and method may operate to apply a set of rules to the first layout to automatically generate a modified layout directly specifying a vertical electrical connection between the two layers. The set of rules may be based on knowledge of the fabrication process, and may be designed to modify the geometry of the first layout to more closely model the real geometry of the circuit that will result from the fabrication process. The modified layout may enable an electromagnetic (EM) simulation of the circuit to be accurately performed.

Abstract: A target integrated circuit layout having a plurality of design rules having minimum rules and standard rules used in the target integrated circuit layout is provided. First and second design rule checks are performed, where respective first and second sets of violations of the plurality of design rules and each design rule associated with the first and second sets of violations are recorded. An analysis is performed on the first and second sets of violations, each design rule associated with the first and second sets of violations, and a frequency of usage of each of the plurality of design rules, and a rule usage rate is determined having a number of minimum rules used overall and a number of overall violations of the design rules. An interactive rule database is formed having statistics associated with the rule usage rate for subsequent implementation in an integrated circuit.

Abstract: A method of designing an IC design layout having similar patterns filled with a plurality of indistinguishable dummy features, in a way to distinguish all the patterns, and an IC design layout so designed. To distinguish each pattern in the layout, deviations in size and/or position from some predetermined equilibrium values are encoded into a set of selected dummy features in each pattern at the time of creating dummy features during the design stage. By identifying such encoded dummy features and measuring the deviations from image information provided by, for example, a SEM picture of a wafer or photomask, the corresponding pattern can be located in the IC layout. For quicker and easier identification of the encoded dummy features from a given pattern, a set of predetermined anchor dummy features may be used.

Abstract: A semiconductor device includes: first and second circuit cell arrays extending in first direction; first and second power supply lines each extending in first direction and arranged over first circuit cell array, first power supply line being supplied with first power source voltage; third power supply line extending in first direction separately from second power supply line, arranged over second circuit cell array, and supplied with second power source voltage; first transistor coupled between second and third power supply lines; and first circuit arranged on first circuit cell array and operating on first and second power source voltages supplied from first and second power supply lines, respectively.

Abstract: An adaptive patterning method and system for fabricating panel based package structures is described. Misalignment for individual device units in a panel or reticulated wafer may be adjusted for by measuring the position of each individual device unit and forming a unit-specific pattern over each of the respective device units.

Abstract: An extraction tool for, and method of, determining a stage delay associated with an integrated circuit (IC) interconnect. In one embodiment, the extraction tool includes: (1) a driver strength estimator configured to extract dimensions of a driver associated with the interconnect and estimate a driver strength therefrom, (2) a driver delay estimator coupled to the driver strength estimator and configured to estimate a driver delay based on the driver strength, (3) an interconnect delay estimator configured to estimate an interconnect delay based on extracted C and RC parameters associated with the interconnect and (4) a stage delay estimator coupled to the driver delay estimator and the interconnect delay estimator and configured to estimate the stage delay based on the driver delay and the interconnect delay.

Abstract: Methods for designing fin-based field effect transistors (FinFETs) are disclosed. In one embodiment, an initial FinFET design is evaluated to ascertain the space between fins (i.e., the “fin pitch”). Additionally, the spacing between interconnect metal modules (i.e., the “metal pitch”) is ascertained. A ratio of metal pitch to fin pitch is established. From this initial ratio, isotropically scaled sizes are considered along with anisotropically scaled sizes. The variously scaled sizes are compared to design criteria to see what new size best fits the design criteria.

Abstract: A method and circuit for implementing faster-cycle-time and lower-energy write operations for Synchronous Dynamic Random Access Memory (SDRAM), and a design structure on which the subject circuit resides are provided. A first RAS (row address strobe) to CAS (column address strobe) command delay (tRCD) is provided to the SDRAM for a read operation. A second delay tRCD is provided for a write operation that is substantially shorter than the first delay tRCD for the read operation.

Abstract: A first gate level feature forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A second gate level feature forms a gate electrode of a second transistor of the first transistor type. A third gate level feature forms a gate electrode of a second transistor of the second transistor type. The gate electrodes of the second transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first transistors of the first and second transistor types are positioned. The gate electrodes of the second transistors of the first and second transistor types are electrically connected to each other through an electrical connection that includes respective gate contacts and a conductive interconnect structure.

Abstract: A method and layout generating machine for generating a layout for a device having FinFETs from a first layout for a device having planar transistors are disclosed. A planar layout with a plurality of FinFET active areas is received and corresponding FinFET active areas are generated with active area widths. Mandrels are generated according to the active area widths and adjusted such that a beta ratio of a beta number for each FinFET active area to a beta number for each corresponding planar active area is within a predetermined beta ratio range.

Abstract: Mechanisms are provided for performing placement of cells in a design of a semiconductor device. An initial design of the semiconductor device is generated, the initial design comprising a first placement of cells. A preferred direction of placement associated with the cells is determined. The preferred direction is a direction along which spreading of the cells is preferred. A second design of the semiconductor device is generated by modifying the first placement of the cells to generate a second placement of cells, different from the first placement cells, based on the preferred direction of placement associated with the cells.

Abstract: A method and NoC design tool is disclosed that automatically maps the paths listed in a timing report and the unit size in an area report to the topology of a NoC and displays the paths and unit sizes in a GUI. The tool can also automatically add pipeline stages, separated by the maximum delay allowed in the timing budget, in order to achieve timing closure in an automated way.

Abstract: A system and method for design and modeling of vertical interconnects for 3DI applications. A design and modeling methodology of vertical interconnects for 3DI applications includes models that represent the frequency dependent behavior of vertical interconnects by means of multi-segment RLC scalable filter networks. The networks allow for accuracy versus computation efficiency tradeoffs, while maintaining correct asymptotic behavior at both high and low frequency limits. In the framework of the model it is shown that a major effect is pronounced frequency dependent silicon substrate induced dispersion and loss effects, which is considered in through silicon via (TSV) parallel Y-element parameters, including capacitance and conductance.

Abstract: Semiconductor integrated circuit line structures for improving a process window in the vicinity of dense-to-isolated pattern transition areas and a technique to implement the line structures in the layout process are described in this disclosure. The disclosed structure includes a semiconductor substrate, and a material layer above the substrate. The material layer has a closely spaced dense line structure, an isolated line structure next to the dense line structure, and a dummy line shoulder structure formed in the vicinity of the dense line and the isolated line structures. One end of the dummy line shoulder structure connects to the isolated line structure and another end extends away from the isolated line structure in an orientation substantially perpendicular to the isolated line structure.

Abstract: The number of nodes in an RTL schematic is reduced in a process of cloud grouping, a process whereby nodes that are not specified to be of interest will be grouped into a cloud to the extent possible. This results in a much simplified schematic as the remaining nodes within the schematic will be those nodes that the users desire to see. Analysis of all nodes including those designated as cut nodes is performed to determine what circuitry can or cannot be simplified. The user will also have the option to revert to the original schematic if viewing more than the cut nodes is desirable.

Abstract: A standard cell library for designing integrated circuits is provided. In some aspects, the standard cell library includes a plurality of standard cells having a cell height that is a non-integer multiple of a wiring pitch of routing tracks associated with the standard cell library. The standard cell library further includes a plurality of landing pins for connecting to the routing tracks arranged in the plurality of standard cells, wherein each of the plurality of landing pins is extended by half of the wiring pitch in opposite directions orthogonal to an orientation of the routing tracks.

Abstract: Methods for generating a device layout are provided. First, design rules corresponding to a specific technology are received. A selection of at least one element and a parameter value corresponding to at least one parameter on the selected element are received. A draft device layout corresponding to the selected element is generated by a device generator by referencing the parameter value and the design rules. A script is then executed to modify the draft device layout to generate an updated device layout. The script includes at least one command, and when the script is executed, the at least one command is performed to modify the parameter value of the at least one parameter of the selected element and cause the device generator to delete the old draft device layout and generate a new draft device layout by referencing the modified parameter value and the design rules.

Abstract: A system and design methodology for performing routing in an integrated circuit design is disclosed. An integrated circuit design is first created using standard cells having metal level 2 (M2) power rails. Routing is performed and power rail current density for the integrated circuit is computed. Standard cells that have power rail current density below a predetermined threshold are replaced with a functionally equivalent standard cell that does not have M2 power rails, and the routing operation is performed again, until the design converges.

Abstract: A method of manufacturing a semiconductor device on the basis of changed design layout data. The method decides a functional relationship between layout parameters based on layout data and the electrical characteristic of a plurality of semiconductor elements. Candidates of the values of the layout parameters are extracted from design layout data so as to decrease the difference between a target electrical characteristic and a predicted electrical characteristic. A specific value from the candidate values of the layout parameters is selected and the design layout data is changed based on the specific selected value.

Abstract: Method, apparatus and system for finding instances of a pattern in a main netlist include reading in the main netlist and the pattern that is used for finding pattern matches in the main netlist. The main netlist and the pattern include a plurality of vertices. Each of the vertices is a device or a net. Labels for the vertices are computed in both the pattern and the main netlist up to a depth appropriate for the pattern. A vertex of the pattern is identified and used in matching with one or more vertices in the main netlist at the depth appropriate for the pattern using the computed labels. The computed labels for each of the vertices of the main netlist are stored for possible reuse in subsequent pattern matches.

Abstract: An integrated circuit includes a gate array layer having a two-dimensional array of logic gates, each logic gate including multiple transistors. At least one upper template-based metal layer is coupled to the gate array layer and is configured to define at least one of a power distribution network, a clock network and a global signal network. A configuration of traces of the upper template-based metal layer is at least mainly predetermined prior to design of the integrated circuit.

Abstract: Techniques for “wrapping” functional geometric elements with fill geometric elements are provided. With some implementations, functional geometric elements, such as geometric elements representing metal contact and interconnect structures, are identified in layout design data. Next, fill regions requiring fill geometric elements are identified. If a portion of a functional geometric element faces a fill region, then that portion of the functional geometric element is “wrapped” with fill structures. Typically, the exposed portions of the functional geometric elements are wrapped before the remaining fill region is populated with fill geometric elements. By wrapping the exposed portions of the functional geometric elements, a designer can surround the functional geometric elements with a predictable pattern of fill geometric elements that can serve to protect the functional geometric elements from, for example, the capacitive effect of other fill geometric elements in the fill region.

Abstract: A global placement grating (GPG) is defined for a chip level to include a set of parallel and evenly spaced virtual lines. At least one virtual line of the GPG is positioned to intersect each contact that interfaces with the chip level. A number of subgratings are defined. Each subgrating is a set of equally spaced virtual lines of the GPG that supports a common layout shape run length thereon. The layout for the chip level is partitioned into subgrating regions. Each subgrating region has any one of the defined subgratings allocated thereto. Layout shapes placed within a given subgrating region in the chip level are placed in accordance with the subgrating allocated to the given subgrating region. Non-standard layout shape spacings at subgrating region boundaries can be mitigated by layout shape stretching, layout shape insertion, and/or subresolution shape insertion, or can be allowed to exist in the final layout.

Abstract: A computer implemented method for reworking a plurality of cells initially placed in a circuit design. An expander allocates cells to tiles. The expander determines a high detailed routing cost tile class, wherein the high detailed routing cost tile class is a class of tiles that has high detailed routing costs. The expander selects a cell within a tile of the high detailed routing cost tile class to form a selected cell in a selected tile. The expander applies multiple techniques to reposition these cells at new locations to improve the detailed routability. The expander can place an expanded bounding box around the selected cell, wherein the bounding box extends to at least one tile adjacent the selected tile, and repositions the selected cell within the bounding box to form a modified design to improve the detailed routability. The expander may also inflate and legalize those cells.

Abstract: A method of circuit design involving an integrated circuit (IC) having an interposer can include identifying an active resource implemented within the IC within a region of the interposer exposed to an amount of stress that exceeds a normalized amount of stress on the interposer and selectively assigning an element of the circuit design to be implemented within the IC to the active resource according to a stress-aware analysis of the circuit design as implemented within the IC.

Abstract: A method for validating standard cells stored in a standard cell library and for use in design of an integrated circuit device is described. Each standard cell of the standard cells is iteratively placed adjacent to each side and corner of itself and each other standard cell of the standard cells to produce an interim test layout comprising a first plurality of cell pair permutations. The cell pair permutations are reduced by identifying at least one of: illegal or redundant left-right and top-bottom boundaries, and removing any cell pair permutations using the identified boundaries to generate a final test layout comprising a second plurality of cell pair permutations.

Abstract: To provide a design support device of a three-dimensional integrated circuit capable of, in the case where a placement position of a through-via changes in the design phase of a three-dimensional integrated circuit composed of a plurality of semiconductor chips in layers, avoiding change of respective placement positions of other parts as much as possible. A design support device includes a TSV placement unit that determines respective placement positions of through-vias on one semiconductor chip, the through-bias each penetrating to connect to another semiconductor chip, a TSV reserved cell placement unit that determines, based on the respective placement positions of the through-vias, respective placement positions of reserved cells as respective spare placement positions of the through-vias, and a mask data generation unit that generates layout data that includes the respective placement positions of the through-vias and the respective placement positions of the reserved cells.

Abstract: According to one embodiment, a design method of layout formed by a sidewall method is provided. The method includes: preparing a base pattern on which a plurality of first patterns extending in a first direction and arranged at a first space in a second direction intersecting the first direction and a plurality of second patterns extending in the first direction and arranged at a center between the first patterns, respectively, are provided; and drawing a connecting portion which extends in the second direction and connects two neighboring first patterns sandwiching one of the second patterns, and separating the one of the second patterns into two patterns not contacting the connecting portion.

Abstract: Provided is a system and method for designing the layout of integrated circuits or other semiconductor devices while directly accessing design rules and a library of design features by interfacing with a GUI upon which the design layout is displayed. The design rules may be directly linked to the design features of the pattern library and imported into the device layout. The design rules may be directly accessed while designing the layout or while conducting a design rule check and the design features from the pattern library may be used in creating the layout.

Abstract: Methods and apparatus for routing signal paths in an integrated circuit. One or more signal routing paths for transferring signals of the integrated circuit may be determined. A dummy fill pattern for the integrated circuit may be determined based on the one or more metal density specifications and at least one design rule for reducing cross coupling capacitance between the dummy fill pattern and the routing paths. The signal routing paths and/or the dummy fill pattern may be incrementally optimized to meet one or more timing requirements of the integrated circuit.

Abstract: After a global placement phase of physical design of an integrated circuit, a data processing system iteratively refines local placement of a plurality of modules comprising the integrated circuit within a die area based on density of the plurality of modules and separately refines local wirelength for the plurality of modules in individual subareas among a plurality of subareas of the die area. The data processing system thereafter performs detailed placement of modules in the plurality of subareas.

Abstract: A method of an integrated circuit (IC) design includes receiving an IC design layout. The IC design layout includes an IC feature with a first outer boundary and a first target points assigned to the first outer boundary. The method also includes generating a second outer boundary for the IC feature and moving all the first target points to the second outer boundary to form a modified IC design layout.

Abstract: Automatically modifying a layout to perform circuit simulation. Initially, a first layout of the electronic system may be received or stored. A second layout of the electronic system may be automatically generated based on the first layout. The automatic generation may involve automatically simplifying the first layout using a set of rules for electromagnetic (EM) simulation. The second layout may then be used to perform EM simulation of the electronic system, e.g., to perform verification.

Abstract: A convolution of the kernel over a layout in a multi-core processor system includes identifying a sector, called a dynamic band, of the layout including a plurality of evaluation points. Layout data specifying the sector of the layout is loaded in shared memory, which is shared by a plurality of processor cores. A convolution operation of the kernel and the evaluation points in the sector is executed. The convolution operation includes iteratively loading parts of the basis data set, called a stride, into space available in shared memory given the size of the layout data specifying the sector. A plurality of threads is executed concurrently using the layout data for the sector and the currently loaded part of the basis data set. The iteration for the loading basis data set proceeds through the entire data set until the convolution operation is completed.

Abstract: A system and method for detecting an invalid winding path in a layout design file includes generating a first reticle pattern file using a first path generation program, generating a second reticle pattern file using a second path generation program, comparing the first and second reticle patterns files to detect the invalid winding path. The invalid winding path includes one or more overlapping polygons.

Abstract: Designing operation efficiency is improved by automatically transmitting and receiving circuit-related information and layout-related information required for designing each printed board between printed boards, for designing a plurality of printed boards at the same time. In an electric information processing method in a CAD system, the printed boards are designed at the same time by transmitting and receiving the circuit design information relating to the printed boards and the layout design information relating to the printed boards between the circuits and layouts relating to the printed boards.

Abstract: A method of designing a layout, a design system and a computer program product for a multi-finger complementary metal oxide semiconductor (CMOS) inverter including a multi-finger N-type field effect transistor (NFET) and a multi-finger P-type field effect transistor (PFET) is disclosed. The design of the layout disposes a metallization wire connecting multiple drains of each type of MOS transistor. Analysis of an electric current in each segment of the metallization wire and of a total resistance of in all segments of the metallization wire provides an optimal location where the metallization wires for NFET drains and PFET drains are connected. The optimal wire connection location provides maximum drain current for the CMOS inverter along with a low wire capacitance between the wire and the gates of NFETs and PFETs.

Abstract: A wiring design method and apparatus are provided. The wiring design method includes dividing a wiring region represented by wiring region data to generate a plurality of first division regions based on a first wiring rule and generating, when a second wiring rule different from the first wiring rule may be set in the first division region, second division regions with the second wiring rule in the first division region.