CMP (chemical mechanical planarization) retaining ring

- Samsung Electronics
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Description

FIG. 1 is a front perspective view of a CMP (chemical mechanical planarization) retaining ring showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left-side view thereof;

FIG. 5 is a right-side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a bottom rear perspective view thereof;

FIG. 9 is an enlarged view of the delineated portion 9 in FIG. 1;

FIG. 10 is an enlarged view of the delineated portion 10 in FIG. 2;

FIG. 11 is an enlarged view of the delineated portion 11 in FIG. 8;

FIG. 12 is a cross sectional view taken through the line 12-12 of FIG. 6; and,

FIG. 13 is an enlarged view of the delineated portion 13 in FIG. 12.

The evenly dashed broken lines in the figures depict portions of the CMP (chemical mechanical planarization) retaining ring that form no part of the claimed design. The dot-dash broken lines delineating portions of the claimed design that are illustrated in enlargements form no part of the claimed design.

Claims

The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.

Referenced Cited
U.S. Patent Documents
D699200 February 11, 2014 Nagakubo
D827592 September 4, 2018 Ichino
D839219 January 29, 2019 Yoshida
D940670 January 11, 2022 Kim
D979524 February 28, 2023 Perry
D981459 March 21, 2023 Akazawa
D1049067 October 29, 2024 Rane
D1051867 November 19, 2024 Perry
D1062662 February 18, 2025 Lee
D1063595 February 25, 2025 Lee
D1066275 March 11, 2025 Rane
D1071887 April 22, 2025 Yoshida
D1082729 July 8, 2025 Suzuki
Foreign Patent Documents
D1494712 April 2017 JP
D1639752 August 2022 JP
D1639752 August 2022 JP
D1645741 November 2022 JP
30-0492589 July 2008 KR
30-0524148 April 2009 KR
30-0667864 November 2012 KR
30-0943112 February 2018 KR
300946104.0000 March 2018 KR
30-0995858 March 2019 KR
30-1058028 May 2020 KR
Other references
  • Retaining ring, cmp, date posted unavailable, data retrieved on the internet at https://www.cipsgnet.com/parts-retainerring (Year: 2025).
  • 3230 Bead Lock Ring 6 Hole, (EPXT7XTH), (Feb. 13, 2020), eLePARTS, 4 pages. [https://www.eleparts.co.kr/goods/view?no=9209004].
  • 300mm CMP Retainer Ring, Arc Precision Engineering Co., Ltd., (2022), 4 pages. [http://www.arcpe.com/CMP_RETAINER_RING.html].
  • Retaining ring, Ensinger, (Mar. 30, 2023), 4 pages. [https://www.ensingerplastics.com/enus/semiconductor/case-study-cmp-retaining-rings].
Patent History
Patent number: D1103131
Type: Grant
Filed: Sep 1, 2023
Date of Patent: Nov 25, 2025
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Hyungjoo Lee (Suwon-si), Hyeondong Song (Suwon-si), Joonsuk Jeong (Suwon-si), Kyumin Sim (Suwon-si)
Primary Examiner: Barbara Fox
Assistant Examiner: Lorna M Georges
Application Number: 29/901,571