CMP (chemical mechanical planarization) retaining ring
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The evenly dashed broken lines in the figures depict portions of the CMP (chemical mechanical planarization) retaining ring and form no part of the claimed design. The dot-dash broken lines delineating portions of the claimed design that are illustrated in enlargements form no part of the claimed design.
Claims
The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.
| 7597609 | October 6, 2009 | Wang |
| 8517803 | August 27, 2013 | Sather |
| D716742 | November 4, 2014 | Jang |
| D724553 | March 17, 2015 | Choi |
| D734377 | July 14, 2015 | Hirakida |
| 9227297 | January 5, 2016 | Rahmathullah |
| D766849 | September 20, 2016 | Fukushima |
| D767234 | September 20, 2016 | Kirkland |
| D770992 | November 8, 2016 | Tauchi |
| D783922 | April 11, 2017 | Kirkland |
| D793976 | August 8, 2017 | Fukushima |
| D794585 | August 15, 2017 | Nabeya |
| D799437 | October 10, 2017 | Nabeya |
| D815385 | April 10, 2018 | Kirkland |
| D845568 | April 9, 2019 | Ishii |
| D871608 | December 31, 2019 | Okuda |
| D876504 | February 25, 2020 | Lee |
| D917825 | April 27, 2021 | Kirkland |
| D940670 | January 11, 2022 | Kim |
| D981459 | March 21, 2023 | Akazawa |
| 20030070757 | April 17, 2003 | DeMeyer |
| 20040065412 | April 8, 2004 | Ensinger |
| 20040077167 | April 22, 2004 | Willis |
| 20070224864 | September 27, 2007 | Burns |
| 20080171500 | July 17, 2008 | Kuwabara |
| 20110065368 | March 17, 2011 | Sather |
| 20120309276 | December 6, 2012 | Kim |
| 20150050870 | February 19, 2015 | Kim |
| 20180021918 | January 25, 2018 | Nagengast |
| 20180264621 | September 20, 2018 | Yoo |
| 1645741 | November 2019 | JP |
| 30-0492589 | July 2008 | KR |
| 30-0995858 | March 2019 | KR |
| 30-1058028 | May 2020 | KR |
- “Kyodo International CMP Retaining Ring”, Aug. 27, 2015, Kyodo-Inc.co.jp, site visited Sep. 11, 2024: https://web.archive.org/web/20150827052115/http://www.kyodo-inc.co.jp/english/electronics/parts/index.html (Year: 2015).
- “Novellus Wafer Retaining Ring CMP Polishing”, Apr. 17, 2017, Ebay.com, site visited Sep. 11, 2024: https://www.ebay.com/itm/301515679216 (Year: 2017).
- “CMP Retainer Ring, CMP Guide Ring, CMP Retaining Ring”, Sep. 1, 2023, YouTube.com, site visited Sep. 11, 2024: https://www.youtube.com/watch?v=P2O79NKw_sk (Year: 2023).
- “3230 Bead Lock Ring 6 Hole”, (EPXT7XTH), [https://www.eleparts.co.kr/goods/view?no=9209004], 2020, 4 pages.
- “300mm CMP Retainer Ring”, [http://www.arc-pe.com/CMP_RETAINER_RING.html], Retrieved on Apr. 17, 2023, 4 pages.
Type: Grant
Filed: Jun 15, 2023
Date of Patent: Feb 18, 2025
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Hyungjoo Lee (Suwon-si), Hyeondong Song (Suwon-si)
Primary Examiner: Jack Reickel
Assistant Examiner: Michael A Kervin
Application Number: 29/894,919