CMP (chemical mechanical planarization) retaining ring
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The evenly dashed broken lines in the figures depict portions of the CMP (chemical mechanical planarization) retaining ring and form no part of the claimed design. The dot-dash broken lines delineating portions of the claimed design that are illustrated in enlargements form no part of the claimed design.
Claims
The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.
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Type: Grant
Filed: Jun 15, 2023
Date of Patent: Feb 18, 2025
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Hyungjoo Lee (Suwon-si), Hyeondong Song (Suwon-si)
Primary Examiner: Jack Reickel
Assistant Examiner: Michael A Kervin
Application Number: 29/894,919