CMP (chemical mechanical planarization) retaining ring

- Samsung Electronics
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Description

FIG. 1 is a front perspective view of a CMP (chemical mechanical planarization) retaining ring showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left-side view thereof;

FIG. 5 is a right-side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a bottom rear perspective view thereof;

FIG. 9 is an enlarged view of the delineated portion 9 in FIG. 1;

FIG. 10 is an enlarged view of the delineated portion 10 in FIG. 2;

FIG. 11 is an enlarged view of the delineated portion 11 in FIG. 8;

FIG. 12 is a cross sectional view taken through the line 12-12′ of FIG. 6; and,

FIG. 13 is an enlarged view of the delineated portion 13 in FIG. 12.

The evenly dashed broken lines in the figures depict portions of the CMP (chemical mechanical planarization) retaining ring and form no part of the claimed design. The dot-dash broken lines delineating portions of the claimed design that are illustrated in enlargements form no part of the claimed design.

Claims

The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.

Referenced Cited
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Other references
  • “Kyodo International CMP Retaining Ring”, Aug. 27, 2015, Kyodo-Inc.co.jp, site visited Sep. 11, 2024: https://web.archive.org/web/20150827052115/http://www.kyodo-inc.co.jp/english/electronics/parts/index.html (Year: 2015).
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Patent History
Patent number: D1063595
Type: Grant
Filed: Jun 15, 2023
Date of Patent: Feb 25, 2025
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventors: Hyungjoo Lee (Suwon-si), Hyeondong Song (Suwon-si)
Primary Examiner: Jack Reickel
Assistant Examiner: Michael A Kervin
Application Number: 29/894,971