Abstract: A component supplying apparatus includes a main tape entering port, a component supply port through which components are picked up from a carrier tape, a main tape path extending in a body part from the main tape entering port to the underside of the component supply port, a top tape removing part removing the top tape from the carrier tape on the main tape path upstream of the component supply port, a sub tape entering port, a sub tape path meeting a slope path portion of the main tape path at a meeting point upstream of the top tape removing part, and at least one sprocket wheels engaging with the carrier tape on the main tape path downstream of the meeting point. A length of the sub tape path is shorter than a length of the main tape path from the main tape entering port to the meeting point.

Abstract: A MEMS wafer (46) includes a front side (52) having a plurality of MEMS structure sites (60) at which MEMS structures (50) are located. A method (40) for protecting the MEMS structures (50) includes applying (44) a non-active feature (66) on the front side of the MEMS wafer in a region that is devoid of the MEMS structures and mounting (76) the front side of the MEMS wafer in a dicing frame (86) such that a back side (74) of the MEMS wafer is exposed. The MEMS wafer is then diced (102) from the back side into a plurality of MEMS dies (48).

Abstract: Methods for releasing a device substrate temporarily bonded by a bonding layer to a carrier substrate. A dissolution head is engaged with the carrier substrate and a first dissolution process is performed to partially remove the bonding layer. After the first dissolution process is completed, the dissolution head is disengaged from the carrier substrate, and then re-engaged with the carrier substrate. In response to re-engaging the dissolution head with the carrier substrate, a second dissolution process is performed to further remove the bonding layer remaining after the first dissolution process.

Abstract: A silicon substrate 12 has a main face in a (100) plane, whereby a fracture 17 generated from a molten processed region 13 acting as a start point extends in a cleavage direction of the silicon substrate 12 (a direction orthogonal to the main face of the silicon substrate 12). Here, a rear face 1b of an object to be processed 1A and a front face 10a of an object to be processed for separation 10A are bonded to each other by anode bonding, whereby the fracture 17 reaches a front face 1a of the object 1A continuously without substantially changing its direction. When generating a stress in the object for separation 10A, the fracture 17 has reached a rear face 10b of the object for separation 10A and thus easily extends toward the object 1A.

Abstract: The disclosure discloses an adhesive tape cartridge. The adhesive tape cartridge includes an adhesive tape roll around which an adhesive tape is wound about an axis line, a separation material roll configured to wind the separation material layer around an axis line, a connecting arm that freely rotatably supports the adhesive tape roll and freely rotatably supports the separation material roll, and a guide device configured to cause the adhesive tape to pass in a tape posture with a tape cross-section set to a substantially horizontal direction, substantially contact both tape width direction ends during the passing, and to guide the adhesive tape in the tape width direction, provided in a middle part of the connecting arm, between the adhesive tape roll and the separation material roll.

Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

Abstract: The disclosure discloses an adhesive tape cartridge comprising an adhesive tape roll around which is wound an adhesive tape, a peeling part, a separation material roll, and a support member. The adhesive tape comprises an adhesive layer and a separation material layer. The peeling part is configured to peel the separation material layer from the adhesive tape fed out from the adhesive tape roll and subsequently fed to one side in a predetermined direction. The separation material roll is configured to wind the separation material layer. The support member respectively rotatably supports the adhesive tape roll and the separation material roll. A position of the peeling part in the predetermined direction is disposed further on the one side than at least a position of a take-up position of the separation material roll when the separation material roll is in a minimum outer diameter state.

Abstract: New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

Abstract: It is an object of the present invention to provide a method that can separate two plates laminated via a pressure-sensitive adhesive sheet, smoothly, efficiently, and accurately without such force (load) that large strain (deformation) leading to breakage or cracking occurs being substantially applied to the plates. The method of separating plates according to the present invention is a method of separating two plates laminated via a double-sided pressure-sensitive adhesive sheet, comprising placing a cutting tool having a cutting edge angle of not more than 25° and a thickness of not more than 20 mm, on a side of a structure composed of a double-sided pressure-sensitive adhesive sheet and two plates, between the double-sided pressure-sensitive adhesive sheet and the plate, and applying force in a normal direction of the plate.

Abstract: A pressure-sensitive adhesive layer for an optical film made from an aqueous dispersion-type pressure-sensitive adhesive composition, wherein the aqueous dispersion-type pressure-sensitive adhesive composition is an aqueous dispersion comprising a water-dispersible (meth)acryl-based copolymer (A) having a glass transition temperature from ?55° C. to less than 0° C.; and a water-soluble or water-dispersible component (B) having a glass transition temperature of 0° C. or more, a mixture ratio (A)/(B) is in the range of 50-97/3-50, the component (B) forms domains with maximum lengths between 1 nm and 200 nm in a resin component made of the (meth)acryl-based copolymer (A), and the pressure-sensitive adhesive layer has a haze value (H20) of 1% or less when having a thickness of 20 ?m. The pressure-sensitive adhesive layer for an optical film, which is made from an aqueous dispersion-type pressure-sensitive adhesive composition has good reworkability or recyclability, and has a sufficient level of durability.

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

Abstract: The yield of a peeling process is improved. A first step of forming a peeling layer to a thickness of greater than or equal to 0.1 nm and less than 10 nm over a substrate; a second step of forming, on the peeling layer, a layer to be peeled including a first layer in contact with the peeling layer; a third step of separating parts of the peeling layer and parts of the first layer to form a peeling trigger; and a fourth step of separating the peeling layer and the layer to be peeled are performed. The use of the thin peeling layer can improve the yield of a peeling process regardless of the structure of the layer to be peeled.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same.

Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Abstract: A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station.

Abstract: In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Abstract: Techniques are disclosed for a cutting apparatus that can be used to cut a target layer within a display module, e.g., a liquid crystal display that includes a protective cover glass. The cutting apparatus includes a platform that supports a track. The cutting apparatus also includes a linear slide that is configured to both hold the display module in place and travel along the track, where the movement of the linear slide along the track is driven by a mass that is in free fall. The cutting apparatus further includes a cutting wire, where the cutting wire is positioned relative to the target layer and oscillates to cut the target layer as the linear slide moves along the track. Additional techniques are disclosed and directed toward a method for operating the cutting apparatus described above.

Abstract: A method of manufacturing a touch panel is disclosed. The method includes providing a plurality of substrates, each having a size, providing a carrier including a plurality of grooves each having a size corresponding with the size of the substrates. The method also includes placing the plurality of substrates into the grooves, simultaneously forming a touch structure layer on each of the substrates, and separating substrates from the carrier.

Abstract: A manufacturing apparatus for an organic light emitting diode (OLED) display includes a stage mounted with an organic light emitting display panel and a supporting substrate of the organic light emitting display panel, a porous sheet attachable to and detachable from a thin film encapsulation layer of the organic light emitting display panel, and a porous sheet attaching/detaching apparatus configured to be separable from the organic light emitting display panel and to attach and detach the porous sheet to and from the thin film encapsulation layer of the organic light emitting display panel. The porous sheet attaching/detaching apparatus is configured to remove an attaching/detaching gas from between the porous sheet and the thin film encapsulation layer to attach the porous sheet to the thin film encapsulation layer.

Abstract: A wafer debonding and cleaning apparatus comprises a wafer debonding module configured to separate a semiconductor wafer from a carrier wafer. The wafer debonding and cleaning apparatus also comprises a first wafer cleaning module configured perform a first cleaning process to clean a surface of the semiconductor wafer. The wafer debonding and cleaning apparatus further comprises an automatic wafer handling module configured to transfer the semiconductor wafer from one of the wafer debonding module or the first wafer cleaning module to the other of the wafer debonding module or the first wafer cleaning module. The semiconductor wafer has a thickness ranging from about 0.20 ?m to about 3 mm.

Abstract: Balancing weights for cars have an adhesive tape with at least a first tape layer and a second tape layer, for attaching the balancing weights to a rim. The first tape layer is held in close proximity to a rim by a first adhesive layer. The second tape layer is held in close proximity to the balancing weights by a second adhesive layer. The first tape layer is stiffer and less flexible than the second tape layer, the second tape layer is softer and more flexible than the first tape layer. This allows easy removal of the balancing weights from the rim by pushing a wedge shaped tool between the first tape layer and the rim.

Abstract: A clad absorber unit is provided on a passive fiber of a high power fiber laser system and operative to trap and remove modes propagating along the waveguide clad of the fiber. The mode absorber is configured with such an optimal length that the clad light may be removed in a localized manner, substantially uniformly removed over the entire length thereof. The absorber removing clad light in a unformed fashion includes a host material impregnated with diffusers.

Abstract: An adhesive fastening element (602) for holding a workpiece (608), the adhesive fastening element (602) comprising: a body (604, 606) defining a recess (642) for receiving a protrusion (644) of the workpiece (608); wherein, in use, adhesive is applied between an end surface of the recess (642) and an end surface of the protrusion (644) and between a side surface of the recess (642) and a side surface of the protrusion (644) to bond the workpiece (608) to the adhesive fastening element (602). The workpiece (608) may be aligned with a reference point on the adhesive fastening element (602) and the adhesive cured to fix the position of the workpiece (608) relative to the adhesive fastening element (602).

Abstract: An electronic device comprising a cover plate is disclosed. The cover plate comprises one or more thin sapphire layers having a thickness of from about 50 microns to about 500 microns. Also disclosed are methods for preparing these thin sapphire layers.

Abstract: An adhesive fastening element (802) for holding a workpiece (808), the adhesive fastening element (802) comprising: an outer member (804); and a consumable inner member (806) disposed inside the outer member (804) and releasably movable relative to the outer member (804) along a longitudinal axis of the adhesive fastening element (802); wherein the consumable inner member (806) comprises a bonding surface which, in use, is bonded by an adhesive (810) to the workpiece (808) and is removed and replaced to detach the workpiece (808) from the adhesive fastening element (802).

Abstract: A masking material and method of forming a masking tape that includes a substrate and an adhesive layer disposed on the substrate. The adhesive layer is preferably thicker than the substrate and formed of a material that has a modulus of elasticity combined with a viscoelastic component that allows the adhesive to conform to discontinuities associated with a surface to which the masking material is applied. Preferably, the adhesive is formed in two rows that are aligned with the lateral edges of the substrate and which prevent seepage of liquid materials between the masking material and the surface to which it is applied.

Abstract: Provided is a cut tape/leaderless feeder finger for use in tape feeders for component mounters. The cut tape/leaderless feeder finger can be attached to existing component tape feeders to allow feeding of component tape without a leader. The cut tape/leaderless feeder finger includes a stripping mechanism that folds and creases the top cover of component carrier tape to expose the component in the tape. The cover tape stays attached to the carrier tape and is folder and creased out of the way of the feeder mechanism and the chip mounter. The component tape passes between guides that retain the component in the tape until it is picked by the component mounter.

Abstract: This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide; and a solvent; wherein elastic modulus at 30.0° C. of a cast film formed by applying the solution onto a glass plate is 5.0 GPa or less, and coefficient of thermal expansion (CTE) of the cast film is more than 30 ppm/K, and wherein the aromatic copolyamide comprises at least two repeat units, and at least one of the repeat units has one or more free carboxyl groups.

Abstract: A method for transfer of a two-dimensional material includes forming a spreading layer of a two-dimensional material on a substrate, the spreading layer having a monolayer. A stressor layer is formed on the spreading layer, and the stressor layer is configured to apply stress to a closest monolayer of the spreading layer. The closest monolayer is exfoliated by mechanically splitting the spreading layer wherein the closest monolayer remains on the stressor layer.

Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

Abstract: Provides a method and a terminus processing tool whereby terminus processing for the purpose of connection to another optical fiber may be carried out simply. The terminus processing method entails cutting an optical fiber 20 composed of a glass fiber 21 and a coating 24; and with the optical fiber 20 positioned relative to a terminus processing tool that is disposed contacting the coating at the end surface of the optical fiber 20 and that has a protruded-into space for accommodating inward protrusion of the glass fiber 21, and with the cut end surface of the glass fiber 21 facing the protruded-into space, pushing the optical fiber 20 to thereby strip the coating 24 from the glass fiber 21.

Abstract: A method for manufacturing a twist ball type electronic paper capable of preferably displaying an image and enabling easily taking out of a wiring, and a manufacturing method for a twist ball type electronic paper for manufacturing a reusable twist ball type electronic paper.

Abstract: A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge.

Abstract: The invention concerns a detaping process for a protective foil taped onto a front-side of a semiconductor wafer, this detaping process comprising the successive steps of: A) introducing the wafer and the protective foil taped onto the front-side of the semiconductor wafer into an electrically dissipative liquid or into an electrically dissipative solid-state medium having a flowing behavior substantially similar to the one of a liquid; B) removing the protective foil when the wafer is into the electrically dissipative liquid or into the electrically dissipative solid-state medium. In another implementing mode, the detaping process comprises, during the removing of the protective foil, a spray of an electrically dissipative liquid in the region adjacent to the detaping line between the semiconductor wafer and the protective foil or an injection of an electrically dissipative liquid along this detaping line.

Abstract: A process and method for recycling carpet is disclosed. The process and method involves the liberation and separation of desirable carpet face fibers from the carpet backing materials. The present invention eliminates face fiber shearing. In the present process, the secondary layer of the carpet backing is removed either manually or mechanically. Then, the bottom of the primary backing layer of the carpet with the bottom of the face fiber “U's” exposed, is mechanically grip-abraded by a rubber material. The grip-abrasion of the rubber or rubber-like material across the bottom of the primary carpet backing layer loosens the glue and grips and pulls the face fiber from the primary backing without destructing primary or secondary backing. The liberation and separation of face fibers from the backing materials using this method produces the highest yield of usable materials compared to any other method.

Abstract: A compliant material is formed between a base substrate and a support structure prior to performing a controlled spalling process. By positioning the compliant material between the base substrate and the support structure, the localized effects of surface perturbations (particles, wafer artifacts, etc.) on spalling mode fracture can be reduced. The method of the present disclosure thus leads to improved surface quality of the spalled material layer and the remaining base substrate. Moreover, the method of the present disclosure can reduce the density of cleaving artifacts.

Abstract: An adhesive fastening element includes a first member and a second member adjacent to the first member and movable relative to the first member along a longitudinal axis of the adhesive fastening element, wherein a bond is formed by an adhesive between the workpiece and the first and second members of the adhesive fastening element. A method for de- bonding a workpiece from an adhesive fastening element includes moving the second member away from the workpiece and breaks the bond between the second member and the workpiece and moving the first and second members such that the second member moves towards the workpiece and applies a force to the workpiece so as to break the bond between the first member and the workpiece, and lo de-bond the workpiece from the adhesive fastening element.

Abstract: In a detaching apparatus, a detachment starter bends one end part of a first plate-like body into a cylindrical or prismatic surface in a direction opposite to a second plate-like body, thereby forming a single and straight boundary line between an adhering region and a detached region. A separator increases a distance between a first holder holding the first plate-like body and a second holder holding the second plate-like body to separate the first and second plate-like bodies.

Abstract: A system and method for removing steel beads from large diameter tires by lifting a tire into a position adjacent an extraction hook and a pair of stripping dyes. The hook is positioned adjacent the tire bead and is then withdrawn through a narrow opening in the stripping dyes, which removes the bead from the tire. The machine is capable of removing both rubber-encased inner beads from the tire without repositioning the tire within the system. A plurality of lifting platforms position the tire and the stripping mechanisms with respect to one another throughout the extraction process.

Abstract: Disclosed is a method for producing single- or multi-layered fiber preforms by the TFP process with fiber strands which are aligned in particular such that they are oriented with the flux of force, wherein the fiber preforms have virtually any desired material thickness without troublesome backing layers and have virtually any desired surface geometry, comprising the steps of: laying and attaching the fiber strands on a flexible and elastic base, in particular a base formed by an elastomer, with a fixing thread led through a sewing head to form the fiber perform; and lifting the fiber preform off the elastic and flexible base.

Abstract: A method is provided for transferring a graphene sheet to metal contact bumps of a substrate that is to be used in a semiconductor device package, i.e. a stack of substrates connected by said contact bumps, e.g., copper contact bumps for which graphene forms a protective layer. An imprinter device can be used comprising an imprinter substrate, said substrate being provided with cavities, whereof each cavity is provided with a rim portion. The imprinter substrate is aligned with the substrate comprising the bumps and lowered onto said substrate so that each bump becomes enclosed by a cavity, until the rim portion of the cavities cuts through the graphene sheet, leaving graphene layer portions on top of each of bumps when the imprinter is removed. The graphene sheet is preferably attached to the substrate by imprinting it into a passivation layer surrounding the bumps.

Abstract: A film 3 of a nitride of a group 13 element is grown on a seed crystal substrate 11 by flux process from a melt containing a flux and the group 13 element under nitrogen containing atmosphere. The film 3 of the nitride of the group 13 element includes an inclusion distributed layer 3a in a region distant from an interface 11a of the film 3 of the nitride of the group 13 element on the side of the seed crystal substrate 11 and containing inclusions derived from components of the melt, and an inclusion depleted layer 3b, with the inclusion depleted. provided on the layer 3a. Laser light A is irradiated from the side of the back face 1b of the seed crystal substrate 11 to peel the single crystal 3 of the nitride of the group 13 element from the seed crystal substrate 11 by laser lift-off method.

Abstract: An adhering structure is disclosed. The adhering structure includes an adhering member, an adhesive layer, and a surface treatment layer sandwiched between the adhering member and the adhesive. The surface treatment layer includes a plurality of magnetic disabling particles. Each of the plurality of magnetic disabling particles has a core-shell structure, and includes a magnetic shell and a core capsulated in the magnetic shell. The core decreases an adhesive strength of the adhesive layer.

Abstract: New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

Abstract: The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.

Abstract: A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.

Abstract: The present invention discloses a graphene platelet fabrication method, which comprises Step (A): providing a highly-graphitized graphene having a graphitization degree of 0.8-1.0; and Step (B): providing a shear force acting on the highly-graphitized graphene to separate the highly-graphitized graphene into graphene platelets, wherein the graphene platelets have a length of 10-500 ?m and a width of 10-500 ?m and have a single-layer or multi-layer structure. The present invention also discloses a graphene platelet fabricated according to the abovementioned method.

Abstract: A method for producing a patterned pressure-sensitive adhesive body includes a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a first slit in a pattern shape and an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second slit in an outer frame shape surrounding the pattern shape. The second slit has a discontinuous portion in a cutting direction.