Abstract: An apparatus for removing a protective film for a flat display panel includes a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam; a separation member configured to peel at least one of the plurality of division regions from the flat display panel; a spacer member configured for insertion between the protective film and the at least one division region to be peeled from the flat display panel; and an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction.

Abstract: A first process for making labels comprises the steps of feeding a laminated combination of a face stock and a process liner to a cutting station such as a microperforator or die-cutter and thereafter stripping the process liner from the face stock and further processing the face stock. The process liner may be recycled and reused. A second method includes all of the steps described above along with the further step of laminating the cut or perforated face stock, immediately after stripping off the process liner, to a second lighter liner which carries the face stock, minus the web or matrix of waste material, to a roller. A complete description of the machinery is given herein.

Abstract: An outer housing structure includes a soft polymer layer, a decorative layer and a plastic injection substrate. The soft polymer layer includes a three-dimensional texture surface. The decorative layer is disposed on a surface of the soft polymer layer, which is opposite to the three-dimensional texture surface. The plastic injection substrate is disposed the decorative layer, wherein the decorative layer is disposed between the soft polymer layer and the plastic injection substrate, and the plastic injection substrate and the decorative layer are bonded by a plastic injection process.

Abstract: A label for removable application to an article such as a beverage bottle includes a backing layer (2) comprising a laminate of a bi-axially oriented polyester such as PET (12) and a bi-axially oriented polypropylene (14). The polyester film (12) has a lower coefficient of thermal expansion than the polypropylene film (14). Consequently, when the label is heated, it will tend to curl and this effect can be used to assist in the removal of the label from the article in a hot washing bath during recycling of the article.

Abstract: Provided is a method of manufacturing a wiring board, in which: a composite adhesive sheet 20 is attached to one of the surfaces of a support substrate 10, and a double-sided CCL 30 is attached to the other surface. Then, in an integrated state of the above components, a multilayer wiring structure including a conductive layer and a resin insulating layer is formed on a metal layer 33 of the double-sided CCL 30 by a known build-up method. A thermally foamable adhesive layer 22 of the composite adhesive sheet 20 is then heated, thereby thermally decomposing a thermal foaming agent to generate gas, and the support substrate 10 is separated from the remaining bonded body. Thereafter, a carrier foil layer 32b and a copper foil layer 32a of a carrier-foil coated copper foil 32 are mechanically peeled from each other at a boundary between both the layers, thereby obtaining a wiring board 1.

Abstract: An optical coupling structure that interfaces between optical devices mounted on a substrate and optical waveguides formed in the substrate. A manufacturing method includes preparing a wafer formed on an inorganic solid material on a dicing tape and cutting the back surface of the wafer to form substantially angled portions using a dicing blade having a point angle. The dicing tape is stripped from the wafer and the wafer is separated at the valleys between the substantially angled portions to obtain an optical coupling element. The obtained optical coupling element is a three-dimensional polyhedral light-reflecting member having a mirror surface corresponding to a surface of the wafer. The obtained optical coupling element is inserted into a trench that opens, substantially perpendicular to an optical waveguide of an optical transmission substrate, in the main surface of the optical transmission substrate to provide a structure for optical coupling with the outside.

Abstract: A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element and includes a first release substrate and the reflecting resin layer provided on one surface in a thickness direction of the first release substrate. In the first release substrate and the reflecting resin layer, a through hole extending therethrough in the thickness direction is formed corresponding to the light emitting diode element so as to allow an inner circumference surface of the through hole in the reflecting resin layer to be disposed in opposed relation to a side surface of the light emitting diode element.

Abstract: A device for separation of a stack in two distinct parts, including a first part, a second part and a zone of weakness between the first and second parts, and an insertion zone located at the periphery of the stack at or close to the zone of weakness, extending over all or part of the periphery of the stack. The device includes at least one separator capable of penetrating into the insertion zone along a penetration distance until coming into contact with the first part of the stack at at least one first contact point located at the periphery of the stack, and coming into contact with the second part of the stack at at least one second contact point located at the periphery of the stack. The device also includes drive means for making the separator penetrate into the insertion zone as far as the penetration distance and for applying a relative movement between the separator and the stack.

Abstract: There is provided a method for separating an optical film bonded to an adherend with a pressure-sensitive adhesive layer interposed therebetween from the adherend. The pressure-sensitive adhesive layer is formed using an optical pressure-sensitive adhesive. The optical pressure-sensitive adhesive of the invention comprises a base polymer having a functional group (F); and a coupling agent that has a benzyl ester group and is represented by Formula (1): wherein A1 and A2 are different functional groups, one of A1 and A2 shows reactivity or interaction with the functional group (F) of the base polymer, R1 is an optionally substituted alkylene group of 1 to 12 carbon atoms and/or an optionally substituted phenylene group, and R2 and R3 are each a hydrogen atom or an alkyl group of 1 to 12 carbon atoms and may be the same or different.

Abstract: Embodiments described herein generally relate to methods and apparatus for refurbishing a gas distribution plate assembly utilized in a deposition chamber or etch chamber. In one embodiment, a method for refurbishing a gas distribution plate assembly is provided. The method includes urging a faceplate of a gas distribution plate assembly against a polishing pad of a polishing device, the faceplate having a plurality of gas distribution holes disposed therein, providing relative motion between the faceplate and the polishing pad, and polishing the faceplate against the polishing pad.

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: A ceramic substrate for an electronic part inspecting apparatus that can be manufactured in accordance with predetermined specifications, regardless of the number and location of pins required, relatively quickly and inexpensively is provided. In certain embodiments the ceramic substrate is configured to connect to a probe for inspecting an electronic component, and the ceramic substrate comprises a plurality of vias located in a center area of the ceramic substrate that penetrate through the ceramic substrate in its thicknesswise direction, pads located in an outer periphery that surrounds the center area where the vias are located, the pads being configured to connected to the probes, and a conductive layer located only over the front surface of the ceramic substrate and connects the vias to the respective pads. Certain embodiments comprise a greater number of vias than pins. A method of manufacturing the ceramic substrate is also provided.

Abstract: A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit.

Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.

Abstract: Example embodiments relate to a method of forming a polymer dispersed liquid crystal (PDLC) layer including a dichroic dye. A first PDLC layer including the dichroic dye and a second PDLC layer having no dichroic dye may be bonded to each other so as to form the desired PDLC layer.

Abstract: A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.

Abstract: Methods and compositions are provided for protecting exterior surfaces of automobiles and other products, or components of products, against abrasion, abrasive dust, water, acid rain, etc. The methods involve applying to a surface a protective coating composition comprising a polyvinyl butyrate emulsion and a relatively inert extender. The emulsion is dried to form a water-resistant protective coating that can be removed from the underlying surface by peeling when no longer desired.

Abstract: A method for processing a supply of post consumer scrap linear low density or low density polyethylene film into near-virgin quality blown film product. The method includes tearing the supply of film in a shredder, wherein the surface area of the film is exposed, including delaminating the film. The torn supply of film is washed in a water bath including a surfactant. The film is agitated in the bath containing the surfactant wherein contaminants on the film are removed from the film. The washed film is ground into smaller pieces and additional washing of the ground film in a rotating friction washer occurs wherein additional contaminants are removed from the film. The ground film is then dried and compacted without addition of water into granulated objects of near-virgin quality blown film product.

Abstract: The present invention relates to a glass laminate including a glass substrate and a supporting glass plate, in which a surface of the glass substrate and a surface of the supporting glass plate are directly contacted to each other, in which each of the surface of the glass substrate and the surface of the supporting glass plate that are contacted to each other is a smooth flat surface, and the both surfaces are closely adhered.

Abstract: One embodiment includes an application of multilayer thermo-reversible dry adhesives in robotic handling of objects.

Abstract: A method for producing a lamina from a donor body includes implanting the donor body with an ion dosage and separably contacting the donor body with a susceptor assembly, where the donor body and the susceptor assembly are in direct contact. A lamina is exfoliated from the donor body, and a deforming force is applied to the lamina or to the donor body to separate the lamina from the donor body.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: An apparatus and method adapted to enhance the structural performance of a desired connection and provide a readily perceivable indication of predetermined limitations having being reached prior to actual failure of a connection. A method for enhancing structural performance of a desired structure by preventing fracture propagation.

Abstract: A delaminating apparatus (1) includes: a delamination stage (3) configured so that an LCD device (30) having an LCD panel is placed thereon; a wire (10) that is placed to extend along an entire outer periphery of a polarizing plate, so that the wire is inserted into a gap formed between the LCD panel and the polarizing plate in four corners of the polarizing plate; and a wire wind-up portion (5) configured to wind up the wire (10) to move the wire (10). By winding up the wire (10), the polarizing plate is separated from the LCD panel while moving the wire (10) between the polarizing plate and the LCD panel, whereby the polarizing plate is delaminated from the LCD panel.

Abstract: A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10).

Abstract: A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.

Abstract: Exfolilation of graphene from graphite using multilayer coextrusion is generally disclosed. In some example embodiments, graphite may be dispersed within a first processing material, and the first processing material and a second processing material may be co-extruded through a plurality of series coupled layer multiplication dies to exfoliate graphene from the graphite. The graphene may be separated from the resulting multi-layered material. In some example embodiments, graphite flake and/or expanded graphite may be dispersed within the first processing material.

Abstract: The beam bending of a MEMS device is minimized by reducing interfacial strength between a sacrificial layer and a MEMS structure.

Abstract: A method for manufacturing a honeycomb structure includes molding a ceramic raw material to manufacture honeycomb molded bodies. The honeycomb molded bodies are fired to manufacture honeycomb fired bodies. End faces of at least two of the honeycomb fired bodies are joined interposing a joining material between the end faces to manufacture honeycomb joined bodies each having a length larger than a length of each honeycomb fired body. Side faces of the honeycomb joined bodies are bonded interposing an adhesive paste between the side faces to manufacture an aggregated body of the honeycomb joined bodies. The adhesive paste is dried and solidified to manufacture a honeycomb block including the aggregated body. The honeycomb block is separated at the joining material into at least two honeycomb blocks.

Abstract: Methods for applying protective polymeric films on metal substrates are described. The methods involve depositing a liquid curable resin on a substrate in a particular manner and then curing the resin to form the protective film. The films can be readily peeled off from the substrates and are environmentally friendly.

Abstract: A method for producing a display device includes: (A) coating a resin composition, which is a raw material of the cured resin, on at least one of the display part or the protective part, (B) closely attaching the display part and the protective part via the resin composition, and (C) arranging the cured resin layer between the display part and the protective part by curing the resin composition by irradiating UV rays from external side of the protective part. After (B), if there is any defect in the resin composition layer, the method further includes (b1) separating the display part and the protective part, and (b2) peeling and removing the resin composition adhered to the separated display part and the separated protective part by a removing solution which contains an organic solvent.

Abstract: A method for producing a display device includes: (a) coating a resin composition on at least one of a display part and a protective part, (b) closely adhering the display and protective parts via a resin composition interposed therebetween, and (c) arranging the cured resin layer between the display and protective parts by curing the resin composition by irradiating UV rays on an external side of the protective part. If a defect is detected, the method includes: (d) separating the display and protective parts by applying a wire to a side face of the cured resin layer where the protective and display parts are bonded and moving the wire through the cured resin layer, (e) peeling off and removing the cured resin adhered to the separated display and protective parts by a removing solution which contains an organic solvent, and (f) repeating steps (a) to (c).

Abstract: This invention discloses a novel process for manufacturing very thin freestanding polymeric films with the steps of supplying a molten film layer stream and a molten assist layer stream by a first extruder and second extruder; intimately contacting the film layer stream and the assist layer stream in coplanar fashion; extruding the film layer stream and the assist layer stream through a planar coextrusion die lip; stretching the multilayer melt curtain; cooling the multilayer film; delaminating the assist layer or layers from the film layer; and transporting the film layer to downstream processing operations. This process allows manufacturing of very thin freestanding films made from amorphous polymers, highly filled films made from amorphous, semi crystalline, or crystalline polymers, chemically cross linked films, and films with diffused addenda that would normally cause undesirable reactions in an extrusion environment.

Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.

Abstract: A semiconductor-chip exfoliating device for exfoliating a semiconductor chip 1 from an adhesive sheet 6 is provided. The device includes a backup holder 28 for holding the adhesive sheet 6 so that semiconductor chips 1 turn upward, a pair of needle pins arranged on a backside of the holder 28 to lift off the adhesive sheet 6 from the holder 28 through through-holes 31a, 31b in the holder 28 and a sliding unit 33 arranged on the backside of the holder 28 to slide one needle pin 30b in a direction to depart from the other needle pin 30a. By the sliding unit 33, the interval between the needle pins 30a, 30b can be changed so as to cope with a variation of semiconductor chips 1, 1A.

Abstract: To provide a mounting apparatus for uniting a semiconductor wafer with a ring frame, the wafer having an adhesive sheet stuck on one surface thereof. In the mounting apparatus, a portion of the adhesive sheet is preliminarily peeled off through a preliminary peeling means, the wafer is disposed inside the ring frame after a preliminarily peeled portion is formed, and a mounting tape is stuck to the ring frame and the wafer through a sticking means. The mounted wafer is fully peeled off by holding the preliminarily peeled portion.

Abstract: The invention can firmly and easily remove a finely divided weft piece without leaving the weft piece by constituting a method and an apparatus of removing weft from a cord fabric for a topping sheet in a calender line for topping rubber on a number of pieces of aligned cords by a calender roll. In the midst of transferring a cord fabric (F) transferred to a calender apparatus, weft is finely divided by passing the cord fabric (F) through weft dividing means, thereafter, a plurality of blades (45) arranged movably in a width direction on an upper face side of the cord fabric (F) are reciprocally moved in the width direction over an entire width thereof to be brought into contact with the cord fabric (F), and the divided weft piece (W1) is wiped off to remove by respectively striking respective cords (C) of the cord fabric (F) by the respective blades (45).

Abstract: The method provides that, in an initial peeling phase (AP), the material block is started to be peeled in a spiral shape. This is followed by a transition phase (UP) of a fraction of a turn so as to change to the set layer thickness. In the subsequent peeling phase (SP), the work is done with the same spiral pitch as in the initial peeling phase. During each turn of the material block, the knife is sunk further into the material block within a limited angular range and thereafter the turn is completed with the pitch of the initial peeling phase. Advantages are achieved by the fact that the set layer thickness is reached within fractions of a turn. The method can be executed with little expenditure of time and little waste of material.

Abstract: An apparatus for stripping metal from a cathode plate, the apparatus comprising stripping means adapted for positioning between the metal and the cathode plate in order to separate the metal from the cathode plate, and wherein movement of the stripping means is achieved through movement of a robotic arm.

Abstract: A method for making a thermal interface structure which includes a carbon nanotube layer, in which the carbon nanotubes are oriented parallel to the direction of thermal transmission and metal layers provided on two edge surfaces of the carbon nanotube layer, the edge surfaces being perpendicular to the direction of the thermal transmission and located substantially parallel to the orientation direction at which edges of the carbon nanotubes are oriented.

Abstract: An airfoil component includes an aluminum alloy body having at least an airfoil portion and a root portion. A metallic layer is located on at least a portion of the aluminum alloy body and an electrochemically insulating layer is located between and adjoining the aluminum alloy body and the metallic layer.

Abstract: The non-polar or semi-polar Nitride film is grown using Metal Organic Vapor Phase Epitaxy over a substrate. The in-situ grown seed layer comprising Magnesium and Nitrogen is deposited prior to the Nitride film growth. The said seed layer enhances the crystal growth of the Nitride material and makes it suitable for electronics and optoelectronics applications. The use of non-polar and/or semi-polar epitaxial films of the Nitride materials allows avoiding the unwanted effects related to polarization fields and associated interface and surface charges, thus significantly improving the semiconductor device performance and efficiency. In addition, the said seed layer is also easily destroyable by physical or chemical stress, including the ability to dissolve in water or acid, which makes the substrate removal process available and easy.

Abstract: There are provided a composition for matte layer formation suitable for the production of a matte synthetic leather having a matte surface with a high level of jet-blackness even without the practice of embossing, raising, etc., and a release sheet for the production of a matte synthetic leather by using the composition. The composition for matte layer formation suitable for the production of a matte synthetic leather comprises a thermosetting resin and a matting agent as indispensable components. The matting agent comprises one or at least two types of organic or/and inorganic porous fine particles. The porous fine particles have a mean particle diameter in the range of 0.5 to 20 ?m and a specific surface area in the range of 1 to 1000 m2/g. The release sheet is produced by using the composition.

Abstract: A special patch is adhered to the bare metal of a dash panel in covering relation to one or more pass-through holes and their margins before a truck cab is primed and painted. After painting, a cover of the patch is peeled off to expose an electrically conductive medium that remains adhered to the bare metal. A ground block is mounted on the dash panel with a stud passing through a pass-through hole. The electrically conductive medium establishes conductivity of the body of the ground block to the dash panel.

Abstract: The present invention provides a method of patterning an electronic or photonic material on a substrate comprising: forming a film of said electronic or photonic material on said substrate; and using an adhesive to selectively remove regions of said electronic or photonic material from said film, thereby leaving on said substrate said patterned electronic or photonic material.

Abstract: A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.

Abstract: Provides a method and a terminus processing tool whereby terminus processing for the purpose of connection to another optical fiber may be carried out simply. The terminus processing method entails cutting an optical fiber 20 composed of a glass fiber 21 and a coating 24; and with the optical fiber 20 positioned relative to a terminus processing tool that is disposed contacting the coating at the end surface of the optical fiber 20 and that has a protruded-into space for accommodating inward protrusion of the glass fiber 21, and with the cut end surface of the glass fiber 21 facing the protruded-into space, pushing the optical fiber 20 to thereby strip the coating 24 from the glass fiber 21.

Abstract: A method and a device for removing backing adhesive, typically a mixture of CaCO3 and SBR, from a carpet. The method includes: (a) sorting the carpets into different categories according to the materials from which the fibers of the carpets are made; (b) removing the bottom layer from a sorted carpet; and (c) removing the backing adhesive by grinding it off the carpet with a grinder until all the adhesive is removed and the fibers of the carpet become loss, which is then collected for recycle. The device is specifically designed to perform the above method and includes a grinder, a feeding device and a pressing wheel device on a frame. The feeding device has an active roller and a passive roller positioned on a support base.

Abstract: A method for reworking a bonded display (e.g., a bonded LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the display. The method provides for efficient and clean removal of the substrate from the bonded display when necessary (e.g., when defect(s) are present) to afford a de-bonded display that is undamaged such that the resulting de-bonded display (e.g., de-bonded LCD) can subsequently be re-bonded as a component in a device being manufactured.

Abstract: A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.