Delaminating, Per Se; I.e., Separating At Bonding Face Patents (Class 156/701)
Delaminating process responsive to feed or shape at delamination (Class 156/702)
Using solvent during delaminating (e.g., water dissolving adhesive at bonding face during delamination, etc.) (Class 156/703)
Using vibration during delaminating (Class 156/705)
Using direct fluid current against work during delaminating (Class 156/706)
Changing dimension during delaminating (e.g., crushing, expanding, warping, etc.) (Class 156/709)
Temperature change for delamination (e.g., heating during delaminating, etc.) (Class 156/711)
Gripping and pulling work apart during delaminating (Class 156/714)
Delaminating from release surface (Class 156/719)
  • METHOD OF MANUFACTURING WAFER LAMINATED BODY, DEVICE OF MANUFACTURING WAFER LAMINATED BODY, WAFER LAMINATED BODY, METHOD OF PEELING SUPPORT BODY, AND METHOD OF MANUFACTURING WAFER
    Publication number: 20110151176
    Abstract: The present disclosure is to provide a method of manufacturing a wafer laminated body, a device for manufacturing a wafer laminated body, a wafer laminated body, a method of peeling a support body, and a method for manufacturing a wafer, all of which are capable of improving the grinding characteristic of the reverse surface of a wafer.
    Type: Application
    Filed: August 27, 2009
    Publication date: June 23, 2011
    Inventors: Ryota Akiyama, Shinya Nakajima, Kazuta Saito
  • Method for Reworking Adhesively Bonded Liquid Crystal Displays
    Publication number: 20110126989
    Abstract: A method is disclosed for reworking a bonded LCD having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the LCD. The method provides for efficient and clean removal of the substrate from the LCD when necessary (e.g., when defect(s) are present) without damage to the LCD such that the LCD can subsequently be re-bonded.
    Type: Application
    Filed: December 17, 2008
    Publication date: June 2, 2011
    Inventor: Hassan Mohamed Farah
  • Apparatus for Stripping Metal From a Cathode Plate
    Publication number: 20110108203
    Abstract: An apparatus for stripping metal from a cathode plate in which part of the metal has been separated from the cathode plate to form a gap between the part of the metal and the cathode plate, the apparatus comprising at least one roller for positioning in the gap between the metal and the cathode plate and drive means for driving the roller along the cathode plate or the metal to cause stripping of the metal from the cathode plate.
    Type: Application
    Filed: July 31, 2008
    Publication date: May 12, 2011
    Applicant: Xstrata Technology Pty Ltd.
    Inventor: Per Ola Eriksson