Abstract: Provided is a semiconductor device having improved performance. In a semiconductor substrate located in a memory cell region, a memory cell of a nonvolatile memory is formed while, in the semiconductor substrate located in a peripheral circuit region, a MISFET is formed. At this time, over the semiconductor substrate located in the memory cell region, a control gate electrode and a memory gate electrode each for the memory cell are formed first. Then, an insulating film is formed so as to cover the control gate electrode and the memory gate electrode. Subsequently, the upper surface of the insulating film is polished to be planarized. Thereafter, a conductive film for the gate electrode of the MISFET is formed and then patterned to form a gate electrode or a dummy gate electrode for the MISFET in the peripheral circuit region.

Abstract: A method of making a semiconductor structure using a substrate having a non-volatile memory (NVM) portion, a first high voltage portion, a second high voltage portion and a logic portion, includes forming a first conductive layer over an oxide layer on a major surface of the substrate in the NVM portion, the first and second high voltage portions, and logic portion. A memory cell is fabricated in the NVM portion while the first conductive layer remains in the first and second high voltage portions and the logic portion. The first conductive layer is patterned to form transistor gates in the first and second high voltage portions. A protective mask is formed over the NVM portion and the first and second high voltage portions. A transistor gate is formed in the logic portion while the protective mask remains in the NVM portion and the first and second high voltage portions.

Abstract: Fashioning a quasi-vertical gated NPN-PNP (QVGNP) electrostatic discharge (ESD) protection device is disclosed. The QVGNP ESD protection device has a well having one conductivity type formed adjacent to a deep well having another conductivity type. The device has a desired holding voltage and a substantially homogenous current flow, and is thus highly robust. The device can be fashioned in a cost effective manner by being formed during a BiCMOS or Smart Power fabrication process.

Abstract: A method of manufacturing a non-volatile semiconductor memory device including previously forming a recess in a first peripheral region on a semiconductor substrate, forming a first gate insulator having a first thickness in the recess, forming a second gate insulator having a second thickness less than the first thickness in an array region and a second peripheral region on the semiconductor substrate, successively depositing first and second gate electrode films and first and second mask insulators on each of the first and second gate insulators, forming an isolation trench on a surface of the semiconductor substrate to correspond to each position between the array region and the first and second regions of the peripheral region, depositing a buried insulator on the entire surface, and polishing an upper surface of the buried insulator so that the upper surface can be planarized.

Abstract: A non-volatile memory device includes a substrate having a first region and a second region. A first gate electrode is disposed on the first region. A multi-layered charge storage layer is interposed between the first gate electrode and the substrate, the multi-layered charge storage including a tunnel insulation, a trap insulation, and a blocking insulation layer which are sequentially stacked. A second gate electrode is placed on the substrate of the second region, the second gate electrode including a lower gate and an upper gate connected to a region of an upper surface of the lower gate. A gate insulation layer is interposed between the second gate electrode and the substrate. The first gate electrode and the upper gate of the second gate electrode comprise a same material.

Abstract: A method of forming a non-volatile memory device includes the following steps. First and second cell gates are formed in a cell region. First and second peripheral gates are formed in a peripheral-region. A first insulating layer is formed over the first and second cell gates and the first and second peripheral gates. A second conductive layer is formed over the first insulating layer. A third insulating layer is formed over the second conductive layer. Selected portions of the third insulating layer, the second conductive layer, and the first insulating layer are removed to form an inter-gate plug provided between the first and second cell gates. The inter-gate plug completely fills a space defined between the first and second cell gates.

Abstract: A method of manufacturing a non-volatile semiconductor memory device including previously forming a recess in a first peripheral region on a semiconductor substrate, forming a first gate insulator having a first thickness in the recess, forming a second gate insulator having a second thickness less than the first thickness in an array region and a second peripheral region on the semiconductor substrate, successively depositing first and second gate electrode films and first and second mask insulators on each of the first and second gate insulators, forming an isolation trench on a surface of the semiconductor substrate to correspond to each position between the array region and the first and second regions of the peripheral region, depositing a buried insulator on the entire surface, and polishing an upper surface of the buried insulator so that the upper surface can be planarized.

Abstract: A non-volatile memory device includes first and second cell gates formed in a cell region; first and second peripheral gates are formed in a peri-region; and an inter-gate plug is provided between the first and second cell gates. The inter-gate plug includes a first insulating layer, a second conductive layer formed over the first insulating layer, and a third insulating layer formed over the second conductive layer.

Abstract: A semiconductor memory device provided with a memory cell region having first gate electrodes and a peripheral circuit region having second gate electrodes includes first gate electrodes arranged a first distance apart from each other on a semiconductor substrate, second gate electrodes arranged a second distance, which is larger than the first distance, apart from each other on the semiconductor substrate, first diffusion layers formed in the semiconductor substrate, the first diffusion layers sandwiching the first gate electrodes, second diffusion layers formed in the semiconductor substrate, the second diffusion layers sandwiching the second gate electrodes, a first insulating film formed on the first diffusion layer, second insulating films formed on the side surfaces of the second gate electrodes, first silicide films formed on the first gate electrodes, second silicide films formed on the second gate electrodes, and third silicide films formed on the second diffusion layers.

Abstract: A semiconductor device may include a semiconductor substrate having a first region and a second region. The nitrogen-incorporated active region may be formed within the first region. A first gate electrode may be formed on the nitrogen-incorporated active region. A first gate dielectric layer may be interposed between the nitrogen-incorporated active region and the first gate electrode. The first gate dielectric layer may include a first dielectric layer and a second dielectric layer. The second dielectric layer may be a nitrogen contained dielectric layer. A second gate electrode may be formed on the second region. A second gate dielectric layer may be interposed between the second region and the second gate electrode. The first gate dielectric layer may have the same or substantially the same thickness as the second gate dielectric layer, and the nitrogen contained dielectric layer may contact with the nitrogen-incorporated active region.

Abstract: The present invention discloses a semiconductor device having a floating trap type nonvolatile memory cell and a method for manufacturing the same. The method includes providing a semiconductor substrate having a nonvolatile memory region, a first region, and a second region. A triple layer composed of a tunnel oxide layer, a charge storing layer and a first deposited oxide layer on the semiconductor substrate is formed sequentially. The triple layer on the semiconductor substrate except the nonvolatile memory region is then removed. A second deposited oxide layer is formed on an entire surface of the semiconductor substrate including the first and second regions from which the triple layer is removed. The second deposited oxide layer on the second region is removed, and a first thermal oxide layer is formed on the entire surface of the semiconductor substrate including the second region from which the second deposited oxide layer is removed.