Abstract: A method of manufacturing a printed circuit board having a buried solder bump, including: preparing a carrier on which a circuit layer, a solder bump, and a circuit pattern formed on the solder bump are formed; pressing the carrier into an insulating layer so that the circuit layer, the solder bump and the circuit pattern are buried in the insulating layer; and removing the carrier.

Abstract: Embodiments are directed to a method for manufacturing a smoke detector, comprising: manufacturing a substrate that comprises a guard ring configured to surround an ion chamber collector plate pin connection point, a surface mount component connection point, and a trace coupling the ion chamber collector plate pin connection point and the surface mount component connection point, and coupling a surface mount component to the substrate at the surface mount component connection point.

Abstract: An electric lamp (10) comprises: a plurality of electrically-powered light sources (such as LEDs 34); at least one electrical connector (35) electrically connected to the light sources; and a structure to which the light sources are mounted with different orientations and to which the connector(s) is/are mounted. The structure has the form of an open, three-dimensional arrangement of, preferably metallic, interconnected mounting portions (21) with gaps therebetween so that ambient air can pass through the gaps and circulate through the arrangement of mounting portions. The light sources are mounted in thermal contact with the mounting portions. The mounting portions are thermally conductive so that they can dissipate heat away from the light sources.

Abstract: In one embodiment, A MEMS sensor assembly includes a substrate, a first sensor supported by the substrate and including a first absorber spaced apart from the substrate, and a second sensor supported by the substrate and including (i) a second absorber spaced apart from the substrate, and (ii) at least one thermal shorting portion integrally formed with the second absorber and extending downwardly from the second absorber to the substrate thereby thermally shorting the second absorber to the substrate.

Abstract: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having internal electrodes exposed on both surfaces thereof.

Abstract: A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes.

Abstract: It is to provide an electronic component connecting method capable of performing dehumidification within a short time without giving a thermal influence to an electronic component which has already been mounted on a wiring board. When a first connection terminal group 5 formed on a connection area 3 of a rigid board 1 is connected to a flexible board 2 where a second connection terminal group 6 has been formed by employing a thermosetting resin in an electrically conductive manner, since a connection area 3 which is heated in a step for thermally hardening the thermosetting resin is locally preheated, moisture, and oils and fats contained in the connection area 3 among such moisture, and oils and fats, which have been absorbed in the rigid board 1 are dehumidified. Thereafter, the thermosetting resin interposed between the first connection terminal group 5 and the second connection terminal group 6 is thermally hardened.

Abstract: A method for manufacturing a probe card prepares a plurality of probes, each having a metal layer on an attaching portion, and hot-melt material covering the metal layer. Each probe is attached to a probe substrate by inserting its attaching portion into a different through hole of the probe substrate so that at least a part of the metal layer is located in the through hole. The hot-melt material of each attaching portion is melted and thereafter solidified such that the hot-melt material contacts the metal layer and a part of a wall surface of the through hole, to fix each probe to the probe substrate.

Abstract: To provide a card capable of improving external appearance, and a card production method. A card (1) is provided with: a module substrate (30); a lower layer (10) and an upper layer (50) arranged above and below the module substrate (30), the layers having an outline larger than the outline of the module substrate (30); and thickness adjustment layers (11, 51) for adjusting the thickness in a substrate outward region (S1), the thickness adjustment layers being provided between the lower layer (10) and the upper layer (50) and to the substrate outward region (S1) further outward than the outline of the module substrate (30), and being provided by printing to at least one layer among the layers that form the card (1).

Abstract: The invention relates to a housing (1) for an electrical device wherein an inner surface (2) of said housing has a conductive pattern (3) providing at least one conductive track, said track being arranged to provide local electric interconnection from the housing to at least one enclosed electrical component of said electrical device and/or vice versa, wherein the conductive pattern is fixedly fastened to said inner surface (2) of said housing so that said conductive pattern will break if the housing wall is broken where the conductive pattern is fastened.

Abstract: A vehicle lighting device includes a light guiding board and a plurality of LEDs attached to the light guiding board. The light guiding board has a first face, a second face opposite to the first face, a first side face and a second side face connecting the first face and the second face. The LEDs are attached to and face the first side face and the second side face. A light reflecting film is formed on the first face, the second face, the first side face and the second side face. A plurality of light emerging windows are defined in the light reflecting film on the first face. The light emerging windows extend through the light reflecting film. The first face is exposed at the light emerging windows. A method for manufacturing the vehicle lighting device is also provided.

Abstract: An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.

Abstract: A light emitting device comprising a substrate (6) having an electrically conducting circuit layer (8), a LED package (7) surface mounted on the substrate (6) and electrically connected to the circuit layer (8), and a heat sink element, surface mounted on the substrate (6) separately from the LED package (7), the heat sink element having a body (2) of a heat conductive material surrounding the LED package (7), the body being thermally connected to the circuit layer (8), and being adapted to provide heat dissipation from the circuit layer (8) to a surrounding environment, wherein a surface (3) of the heat sink element facing the LED package is adapted to form part of a beam shaping optics for shaping light emitted from the LED package. Since the heat sink body is in thermal contact with the circuit layer, the heat resistance from the LED package to the heat sink body via the circuit layer is minimized.

Abstract: Apparatuses and methods for installing light modules are described. One such apparatus includes a light emitting diode (LED) module including one or more LEDs, a printed circuit board (PCB), and a connector. The apparatus further includes a holder for retaining the LED module and a magnet attached to the lower surface of the holder. The apparatus may then be attached to a surface by the magnet.

Abstract: Fabricating preassembled optoelectronic interconnect structures is provided, which have an optical waveguide link with first and second optoelectronic circuits attached to first and second ends of the waveguide link. The optoelectronic circuits include active optical componentry which facilitates optical signal communication across the optical waveguide link. Further, first and second pluralities of electrical contacts are associated with the first and second optoelectronic circuits, respectively, to facilitate electrically, operatively connecting the interconnect structure between first and second components of an electronic assembly as, for instance, a single, field-replaceable unit. The first and second components of the electronic assembly may be, for instance, stacked electronic components of the electronic assembly, or laterally offset components of a substantially planar electronic assembly.

Abstract: An electro-optic display includes an electro-optic medium, a pixel electrode for applying an electric field to the medium and a column electrode associated with the pixel electrode. To reduce power consumption, when it is necessary to change the voltage on the column electrode from a first value to a second value to change the optical state of the electro-optic medium, the column electrode voltage is first changed to a third value intermediate the first and second values to permit charge to flow to or from the column electrode, and thereafter the column electrode voltage is changed from the third voltage to the second voltage.

Abstract: A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern.

Abstract: A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.

Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.

Abstract: The present invention relates to a LED lamp with a fan and manufacturing method thereof. A lamp body of the LED lamp has an upper lamp body and a lower lamp body connected together; an external wall of a facet of a prism of the upper lamp body is covered with a LED aluminum substrate connected to a LED PCB, a capacitor is soldered at the center of the bottom of the PCB, a LED driving circuit and a fan both are received in a cavity of a lamp holder; air flows into the LED lamp from an air inlet of the lower lamp body and a window of the lamp holder, then passes through an air outlet, a penetrating hole and an air flow channel, and finally an air outlet flue opened in a lamp cover and matching the penetrating hole dissipates heat away from the LED lamp.

Abstract: The present invention relates to a method of manufacturing a control interface for motor vehicle comprising a touch pad exhibiting a front face, and a housing accommodating said touch pad, said housing exhibiting an aperture delimited by a border for access to the front face of the touch pad by a user, characterized in that: —in the course of a first step (101), the aperture of a housing is disposed around a touch pad provided with a film on the front face, the film covering at least the front face of the touch pad and the edges of the housing, —in the course of a second step (102), a holding force is applied to the housing so as to hold it, and —in the course of a third step (103), a liquid levelling lining material is introduced into a peripheral space partitioned off by the film, the border of the housing and the rim ate touch pad, so as to spread the liquid levelling lining material in said peripheral space.

Abstract: A fluid cooled electrical assembly that includes a metal box, having a bottom wall, side walls and a top wall. A set of straight-edged pins, each smaller than 3 mm across in widest dimension, extend down from the top wall and up from the bottom wall. Also, electrical components are mounted on top of the top wall and on bottom of the bottom wall.

Abstract: An electronic component unit includes a substrate including principal surfaces opposing each other and side surfaces between the principal surfaces, and components mounted on the principal surface of the substrate. The side surfaces include first side surfaces formed before the components are mounted and second side surfaces formed after the components are mounted. As viewed from a line normal to the principal surface of the substrate, distances between the first side surfaces and the components are different from distances between the second side surfaces and the components.

Abstract: A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.

Abstract: Provided is an electronic circuit unit to be mounted within a casing of an automatic transmission for a vehicle. An electronic circuit body including circuit-side terminals protruding in an outward direction from a main-body, connectors to be connected to the electronic circuit body, a cover, and a base member having a placing face on which the cover, the electronic circuit body and the connectors are placed. The cover is provided with a main-body covering part, fitting-portion covering parts and which cover a fitting-portion of the circuit-side terminals and fitting parts of the wire-side terminals from a side opposing to the placing face, and a restricting part for regulating the detachment of the connectors from the fitting position to the detached position.

Abstract: Embodiments of devices and methods of their manufacture include coupling first and second package surface conductors to a package surface with an intra-conductor insulating structure between the package surface conductors. The package surface conductors extend between and electrically couple sets of pads that are exposed at the package surface. Elongated portions of the package surface conductors are parallel with and adjacent to each other. The intra-conductor insulating structure is coupled between the package surface conductors along an entirety of the parallel and adjacent elongated portions, and the intra-conductor insulating structure electrically insulates the elongated portions of the package surface conductors from each other. Some embodiments may be implemented in conjunction with a stacked microelectronic package that includes sidewall conductors and an intra-conductor insulating structure between and electrically insulating the sidewall conductors from each other.

Abstract: Embodiments of methods for forming microelectronic device packages include forming a trench on a surface of a package body between exposed ends of first and second device-to-edge conductors, and forming a package surface conductor in the trench to electrically couple the first and second device-to-edge conductors. In one embodiment, the package surface conductor is formed by first forming a conductive material layer over the package surface, where the conductive material layer substantially fills the trench, and subsequently removing portions of the conductive material layer from the package surface adjacent to the trench. In another embodiment, the package surface conductor is formed by dispensing one or more conductive materials in the trench between the first and second exposed ends (e.g., using a technique such as spraying, inkjet printing, aerosol jet printing, stencil printing, or needle dispense). Excess conductive material may then be removed from the package surface adjacent to the trench.

Abstract: A dual-spectra pulse oximeter sensor is provided. The dual-spectra pulse oximeter sensor includes a sensor substrate, an array of a plurality of pairs of wavelength sources disposed on the sensor substrate, and a plurality of wavelength conversion devices. Further, each pair of the plurality of pairs of wavelength sources comprises a pair of light emitting diodes. Moreover, one light emitting diode of each pair of light emitting diodes is operatively coupled to a wavelength conversion device of the plurality of wavelength conversion devices.

Abstract: A circuit board structure includes a core circuit structure, a first and a second dielectric layers, a first and a second conductive blind via structures, a third and a fourth patterned circuit layers, and a first and a second surface passivation layers. The first and the second dielectric layers have at least one first and second blind vias exposing parts of a first and a second patterned circuit layers of the core circuit structure, respectively. The first and the second conductive blind via structures are disposed into the first and the second blind vias respectively. The third and the fourth patterned circuit layers are electrically connected to the first and the second patterned circuit layers through the first and the second conductive blind via structures respectively. The first and the second surface passivation layers respectively expose parts of the third and the fourth patterned circuit layers.

Abstract: According to one embodiment, a pressure sensor includes: a support unit; a substrate; and a plurality of sensing elements. The substrate is supported by the support unit and deformable. The plurality of sensing elements are provided on a part of the substrate. The sensing element includes a first magnetic layer, a second magnetic layer, and an intermediate layer. Magnetization of the first magnetic layer changes according to deformation of the substrate. Magnetization of the second magnetic layer is fixed. The intermediate layer is provided between the first magnetic layer and the second magnetic layer. A direction of the magnetization of the second magnetic layer of a first sensing element among the plurality of sensing elements is different from a direction of the magnetization of the second magnetic layer of a second sensing element among the plurality of sensing elements.

Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.

Abstract: Inductive coupling arising between adjacent vias in interconnect technologies (commonly associated with printed circuit boards or package) can be combatted through the addition of metal plates to vias. The plates generate capacitive coupling that can compensate for the inductive crosstalk normally generated between vias in printed circuit boards or packages. When the added plates of two neighboring vias overlap with each other, a capacitive coupling is generated. By balancing the inductive coupling with capacitive coupling, an effective reduction of far end crosstalk may be obtained.

Abstract: An optical isolator is provided. The optical isolator includes a printed circuit board having a first surface and a second surface opposite the first surface. The printed circuit board has a recess extending only partially through the board. The first photoelement has an active surface and is mounted relative to the first surface of the printed circuit board. A second photoelement has an active surface and is mounted relative to the second surface. The second photoelement is configured to interact with the first photoelement. At least one of the first and second photoelements has its active surface disposed at least partially in the recess. A portion of the printed circuit board is interposed between the first and second photoelements.

Abstract: Disclosed herein is a device embedded printed circuit board, including: a first core layer having a first via and having a via land for a first connection pad disposed on a lower surface thereof; a build-up layer formed on the first core layer and having a plurality of circuit layers including a second connection pad, a plurality of insulating layer disposed between the plurality of circuit layers, and a second via connecting the plurality of circuit layers; and a second core layer formed on the build-up layer and having a cavity.

Abstract: An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the substrates. The substrates, lead frames, and electronic devices are sintered together using silver-based sintering paste between each layer. The material and thicknesses of the substrates and lead frames are selected so stress experienced by the electronic devices caused by changes in temperature of the assembly are balanced from the center of the assembly, thereby eliminating the need for balancing stresses at a substrate level by applying substantially matching metal layers to both sides of the substrates.

Abstract: Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.

Abstract: An electronic personal vaporizer is provided, having components including a heating element; a liquid container; a power source to provide power to the heating element; a first bulkhead defining an airway at a first end of the vaporizer; a second bulkhead separating the power source from the heating element and liquid container; and a shell containing the heating element, liquid container and power source. The shell is made of flexible printed circuit and is rolled or folded around the other components to allow for electronic communications to pass along the vaporizer without piercing the bulkheads.

Abstract: A parts mounting system includes: a parts checking section that detects parts information which is identification information applied to the electronic parts and includes a parts code for specifying parts of the electronic parts and a parts maker code for specifying the parts maker and checks the detected parts information with parts information previously registered in a storing part; and a parts data generation section that, when the detected parts information is unregistered parts information in which the parts code is stored in the storing part and the parts maker code of the parts code is not stored in the storing part, generates parts data of the electronic parts relating to the unregistered parts information based on previously registered parts data having the same parts code.

Abstract: Stiffening is provided for an electronic package assembly having a substrate. A first electronic package, having a first function, is electromechanically fastened to a first surface of the substrate with a first array of electrically conductive interconnects, which is disposed over a central area of the substrate first surface. A second electronic package, having a second function, is fastened to the first substrate surface with a second conductive interconnect array. At least a pair of the first array conductors is electrically coupled to at least a pair of the second array conductors for data/signal exchange and at least a component of the first electronic package interacts with at least a component of the second package. A metallic stiffener ring is disposed about an outer periphery of at least the central area of the substrate.

Abstract: An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink.

Abstract: A light source includes a substrate and a plurality of light emitting devices disposed on the substrate. Each of the light emitting devices is configured to generate a first light. A plurality of quantum-dot devices are respectively disposed on the light emitting devices. The quantum-dot devices are configured to convert the first light to a second light. The quantum-dot devices are configured to be attached to and detached from the light emitting devices, respectively.

Abstract: An assembly and method for irradiating a surface utilizing a plurality of LEDs in a pattern such that a linear fill factor characterizing such pattern is at least 80% along a focusing direction and/or at least 20% along a direction transverse to said focusing direction, the radiation emitted from the LEDs and reflected onto the surface from a trough reflector. Non-linear disposal of LEDs on an LED assembly is disclosed.

Abstract: A method for forming an interconnection element having metalized structures includes forming metalized structures in an in-process unit that has a support material layer with first and second spaced-apart surfaces defining a thickness therebetween, a handling structure, and an insulating layer separating at least portions of the first surface of the support material layer from at least portions of the handling structure. The metalized structures are formed extending through the thickness of the support material layer. The method also includes etching at least a portion of the insulating layer to remove the handling structure from the in-process unit and further processing the in-process unit to form the interconnection element.

Abstract: A method includes securing a midplane to a bracket disposed between a first and second ends of a chassis, wherein a first surface of the midplane engages the bracket and faces the first end of the chassis. A first electronic device is secured within the first end of the chassis with a first device connector coupled to a first midplane connector on the first surface of the midplane and a first device latch secured directly to a first slot in the chassis adjacent the first end. A sub-chassis is secured within the second end of the chassis, wherein the sub-chassis has a proximal end that engages a second surface of the midplane. Furthermore, a second electronic device is secured within the sub-chassis with a second device connector coupled to a second midplane connector on the second surface of the midplane and a second device latch secured directly to a slot in the sub-chassis adjacent the distal end of the sub-chassis.

Abstract: A multi-layer substrate includes a ground structure, a plurality of dielectric layers on the ground structure and a plurality of conductive layers separating the plurality of dielectric layers. The conductive layers include a first conductive layer and a second conductive layer and a connection electrically coupling the first conductive layer and the second conductive layer. The first conductive layer and the ground structure are configured to define a first parasitic capacitance there between and the first conductive layer and the second conductive layer are configured to define a second, negating parasitic capacitance there between.

Abstract: A touch input device is disclosed. The touch input device includes a touch input medium configured to receive a touch input. The touch input device includes a conductive trace coupled to the touch input medium. The touch input device also includes a transducer electrically coupled to the conductive trace and coupled to the touch input medium via a non-conductive adhesive.

Abstract: An optoelectronic lighting device includes a lighting module with an optoelectronic semiconductor chip. A connection carrier has a first main surface and a second main surface facing away from the first main surface. The lighting module is arranged on the first main surface of the connection carrier, and the connection carrier adheres to a heat sink on account of a magnetic attraction.

Abstract: Disclosed are various embodiments of an artificial tree that is lit by LEDs. Individual trunk modules are provided on trunk sections that provide individual control of LED strings disposed on branches on each of the trunk sections. Remote control devices and smart devices connected to the Internet can control the trunk modules. Spring-loaded flat connectors between the trunk sections, and also between the branches in the trunks, provide a solid electrical connection, which has a low susceptibility to failure. Plastic injection molded branches having injected molded sockets are provided for connecting LEDs that can be plugged directly into sockets on the trunk sections. The LEDs can be driven with an AC or DC electrical power supply.

Abstract: An LED lamp for use in two-by-two light fixtures having coplanar electrical receptacles. The LED lamp is ideal for use as a replacement of fluorescent lamps in existing fluorescent fixtures and is U shaped with electrical connectors at each end. The U shaped elongate tube is made of an outer shell defining a cavity with a PCB mounted therein. The LED elements are mounted on the PCB. The LED lamp does not have coupling connectors enabling it to emit light along the entire axial length of the tube.

Abstract: A pressure sensor includes a pressure sensing element and a top cap. The pressure sensing element includes a bonded wafer substrate having a buried sealed cavity. A wall of the buried sealed cavity forms a sensing diaphragm. One or more sense elements may be supported by the sensing diaphragm and one or more bond pads are supported by the upper side of the bonded wafer substrate. Each of the bond pads may be positioned adjacent to the sensing diaphragm and electrically connected to one or more of the sense elements. The top cap may be secured to the upper side of the bonded wafer substrate such that an aperture in the top cap facilitates passage of a media in a downward direction to the sensing diaphragm. The top cap may be configured to isolate the bond pads from the media.