Abstract: A filter removal method for removing a filter held in a filter holding space provided in a tip part of a nozzle shaft in a component suction head, in which a suction nozzle is detachably attached to the tip part of the nozzle shaft, from the component suction head. The method comprises a deforming step of compressing and deforming the filter in the filter holding space, and a discharging step of discharging the compressed and deformed filter from the filter holding space.

Abstract: The present disclosure provides a method making a semiconductor structure with an antenna module. The semiconductor structure includes an antenna substrate with a first surface and a second surface opposite to the first surface; an antenna module is disposed on the first surface of the antenna substrate; and a redistribution layer is disposed on the second surface of the antenna substrate. The method of making the semiconductor structure with the antenna includes fabricating the antenna module and the redistribution layer on two opposite surfaces of the antenna substrate, the material of the antenna substrate for supporting the antenna module can be selected according to actual needs, to provide more options. Signal loss can be reduced through the selection of the antenna substrate; the redistribution layer is provided on the surface of the antenna substrate for bonding the semiconductor chips.

Abstract: A method includes forming a first redistribution line, forming a polymer layer including a first portion encircling the first redistribution line and a second portion overlapping the first redistribution line, forming a pair of differential transmission lines over and contacting the polymer layer, and molding the pair of differential transmission lines in a molding compound. The molding compound includes a first portion encircling the pair of differential transmission lines, and a second portion overlapping the pair of differential transmission lines. An electrical connector is formed over and electrically coupling to the pair of differential transmission lines.

Abstract: The semiconductor memory device includes: a first substrate including a peripheral circuit, first conductive contact patterns connected to the peripheral circuit, and a first upper insulating layer having grooves exposing the first conductive contact patterns; a second substrate including a memory cell array, a second upper insulating layer disposed on the memory cell array, the second upper insulating layer formed between the memory cell array and the first upper insulating layer, second conductive contact patterns protruding through the second upper insulating layer into an opening of the grooves; and conductive adhesive patterns filling the grooves to connect the second conductive contact patterns to the first conductive contact patterns.

Abstract: An interconnecting member of a solar cell panel for connecting a plurality of solar cells, can include a core layer and a solder layer formed on a surface of the core layer, in which the core layer includes a protruding portion having a peak portion extending along a longitudinal direction of the core layer, and a reflection surface having an inclined surface or a rounded portion disposed at opposite sides of the peak portion, and a width of the protruding portion increases from the peak portion towards a center of the core layer.

Abstract: A component mounting system includes a component mounting apparatus, a data creating apparatus and a component arranging operation supporting apparatus. The component mounting apparatus mounts components on a substrate. The data creating apparatus creates component data for each component. The component arranging operation supporting apparatus includes an identification information acquiring unit that acquires component identification information given to the component supplying member, and a control unit which checks a component to be disposed in a position based on the component identification information. The control unit of the component arranging operation supporting apparatus performs a request for a creation of component data regarding an alternative component, and the data creating apparatus receives the request and creates the component data regarding the alternative component.

Abstract: An apparatus and method for bonding alignment are provided. The apparatus for bonding alignment includes a press assembly and an objective lens group (105) disposed on one side of the press assembly. The press assembly includes a first chuck (103) and a rotatable second chuck (104). When support surfaces of the first and second chucks are not parallel to each other, the second chuck is rotated to make the two support surfaces parallel. A first substrate (301) is then loaded on the first chuck, and alignment marks (302) on the first substrate are observed using the objective lens group disposed on one side of the press assembly. A second substrate (501) is loaded on the second chuck, and alignment marks (502) on the second substrate are also observed with the objective lens group. Based on an observation result by the objective lens group, the two substrates are moved so that the alignment marks thereon are aligned and hence the two substrates themselves are aligned.

Abstract: The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. The cartridges may be assembled by coupling a base of the cartridge to a carriage that is transported via a track. The track transports the carriages between various substations at which one or more parts are added to the base. The carriage may be lifted from the track by a lifter mechanism at each substation in order to perform assembly operations on the base. An inspection system may inspect the cartridges at various stages of completion at or between the various substations.

Abstract: A transfer method includes steps of a) supplying a support layer having a first face, structures being assembled by their front face on the first face, and c) transferring the structures onto a host face of a host substrate. The support layer includes folding regions, between the structures, adapted to pass from a folded state to an unfolded state under the action of an external excitation. Between steps a) and c), a step b) is included of executing the external action in such a way as to make the folding regions pass from the folded state to the unfolded state such that the spacing between the structures varies.

Abstract: A mounting target working device includes a head unit, a first mounting target work area in which the head unit mounts a component on a first mounting target having a flat plate shape, and a second mounting target work area in which the head unit mounts the component on a second mounting target having a three-dimensional shape as compared with the first mounting target.

Abstract: A production management system of a component mounting line that includes component mounters that identify a board ID of a circuit board conveyed during production, send the board ID to a production management computer of the production management system, measure actual data for early-stage-discovery of a mounting defect at a specified interval during production, and send the measurement results to the production management computer. The production management computer saves the board IDs sent from each of the component mounters with a time stamp, monitors whether there is a possibility of a mounting defect based on the measurement result, extracts board IDs of circuit boards on which components were mounted at the component mounters since the previous time measurement was performed if there is the possibility of a mounting defect, and displays a list of the circuit boards with a possible mounting defect.

Abstract: The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.

Abstract: An integrated fan-out package includes a first redistribution structure, a die, an encapsulant, a plurality of conductive structures, and a second redistribution structure. The first redistribution structure has a first surface and a second surface opposite to the first surface. The die is disposed over the first surface of the first redistribution structure and is electrically connected to the first redistribution structure. The encapsulant encapsulates the die. The conductive structures are disposed on the first surface of the first redistribution structure and penetrates the encapsulant. The conductive structures surround the die. The second redistribution structure is disposed on the encapsulant and is electrically connected to the first redistribution structure through the conductive structures. The second redistribution structure includes at least one conductive pattern layer that is in physical contact with the encapsulant.

Abstract: Apparatus and methods for biasing power amplifiers are provided herein. In certain embodiments, a power amplifier includes a bipolar transistor having a base biased by a bias network having a reactance that controls an impedance at the transistor base to achieve substantially flat phase response over large dynamic power levels. For example, the bias network can have a frequency response, such as a high-pass or band-pass response, that reduces the impact of power level on phase distortion (AM/PM).

Abstract: A PCBA for use in a high-energy broadband electric field includes a low-voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact is connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 ?m, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.

Abstract: A chip-mounted board including: micro light-emitting chips arranged in a matrix pattern in a light-emitting region; and a conductive line electrically connected to the micro light-emitting chips, the light-emitting region including a first region having a first luminance, a second region having a second luminance lower than the first luminance, and a third region having a third luminance lower than the first luminance and higher than the second luminance, the luminances being values determined with the same magnitude of current supplied to the micro light-emitting chips, the third region being positioned between the first region and the second region and satisfying the following formulas (1) and (2): (1+k)/(1?k)?63.895×tan(0.5°)×500/W+6.0525??(1) L2=k×L1??(2) wherein L1 represents the first luminance, L2 represents the second luminance, and W represents a width (unit: mm) of the third region.

Abstract: A feeder system includes a feeder configured to receive a component, a pick location configured to present the component from the carrier tape for a subsequent picking process, a camera system configured to view the component at or prior to the pick location. The camera system is configured to measure an offset between one or more topside features of the component and an outline of the component. A pick and place machine that includes the feeder, and a method of inspecting components.

Abstract: A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. A patterned photoresist layer is formed on the carrier substrate. An adhesive layer is formed on the top surface of the patterned photoresist layer. A dielectric substrate is provided. A circuit pattern and a dielectric layer covering the circuit pattern are formed on the dielectric substrate, wherein the dielectric layer has an opening exposing a portion of the circuit pattern. The adhesive layer is adhered to the dielectric layer in a direction that the adhesive layer faces of the dielectric layer. The carrier substrate is removed. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed. The adhesive layer is removed.

Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.

Abstract: An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

Abstract: Movable section of a cut and clinch unit includes exchange section in which is formed second insertion hole for cutting and bending a lead, and main body section to which exchange section is removably attached. An opening position of the second insertion hole is calculated as an attachment position of the exchange section on the main body section based on image data. It is determined whether a difference between the calculated opening position and a standard position of the second insertion hole that is set in advance exceeds a threshold value. If the difference between the calculated opening position and the standard position exceeds the threshold value, calibration is performed based on the assumption that the exchange section has been exchanged.

Abstract: A method of manufacturing a display device includes bending a first film member of a processing object such that a part of one side of the first film member surrounds a part of an outer side of a bending area of a second film member of the processing object while the first film member is laminated on the second film member.

Abstract: A pulse measuring device of the disclosure includes a housing, a light-emitting device, a light-receiving device, and a light guide body having a first end surface facing the light-emitting device, a second end surface facing the first end surface and facing the light-receiving device, one or a plurality of first side surfaces covered by the housing, and one or a plurality of second side surfaces exposed from the housing.

Abstract: A conductive fluid sensor cable capable of manufacture in long lengths comprising a flexible substrate, a pair of conductors, and a cover material arranged to allow a conductive fluid path between the conductors when conductive fluid contacts the cable.

Abstract: Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.

Abstract: A method includes encapsulating a device die in an encapsulating material, planarizing the device die and the encapsulating material, and forming a first plurality of conductive features electrically coupling to the device die. The step of forming the first plurality of conductive features includes a deposition-and-etching process, which includes depositing a blanket copper-containing layer, forming a patterned photo resist over the blanket copper-containing layer, and etching the blanket copper-containing layer to transfer patterns of the patterned photo resist into the blanket copper-containing layer.

Abstract: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25° C. of 40 mPa·s or more and less than 500 mPa·s. The curable composition (A2) except a solvent has a viscosity at 25° C. of 1 mPa·s or more and less than 40 mPa·s.

Abstract: A power supply control device that controls consumption currents that are supplied from power supply devices in a component supply device in which multiple tape feeders are replaceably installed, the device including: a total consumption current measuring section that obtains, based on measurement, a total consumption current by adding actual consumption currents which are supplied to a plurality of tape feeders; and an overcurrent protection section that causes a specific tape feeder, which is in an operation state, to transition to a stop state or a standby state, in a case of an overcurrent state where the total consumption current exceeds an output current capacity of the power supply device. Accordingly, even though the overcurrent state occurs during setup changing work in which the multiple tape feeders can operate, the overcurrent state is rapidly canceled, and thus a protecting function is improved.

Abstract: A system and method for remotely monitoring Inter Ocular Pressure (IOP) is disclosed. The system and method verify proper operation of glaucoma drainage, measure and potentially affect Intra-Ocular Pressure (IOP), and facilitate remote disease management of e.g. glaucoma, among other ocular diseases.

Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.

Abstract: A process for manufacturing a silica gel extruded soft lamp strip, comprises the following steps: a. pasting LED beads and other components on an FPC soft board, and performing reflow soldering; b. soldering the FPC soft board into a lengthened FPC soft board in a lead-free manual soldering manner; c. performing aging impact on the lengthened FPC soft board; d. performing pre-extrusion processing on the FPC soft board which is qualified after aging impact; e: extruding the FPC board using a solid silica gel mixture in combination with an extrusion mold, and then curing using a baking oven; and f. clipping from a connection plate position of a semi-finished product from the step e, and installing a plug so as to complete processing. The process can effectively ensure water-proof and moisture-proof properties, luminance uniformity and color temperature consistency of the LED soft lamp strip, and has a high practical value.

Abstract: A surface mounter for mounting an electronic component on a printed circuit board includes a stage, a mounter, a camera, a mark, and a controller. The mounter is movable in a plane direction of the stage and mounts the electronic component on the printed circuit board. The camera is on the stage or mounter, and the mark is on the other of the stage or mounter. The controller executes processing to capture images of the mark at multiple positions in a field of view of the camera and perform image recognition; calculate correction values for correcting recognition errors at the recognition positions based on recognition of the mark; capture an image of the printed circuit board or the electronic component by the camera and perform image recognition; and correct results of the recognition of the printed circuit board or the electronic component based on the correction values.

Abstract: The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.

Abstract: A semiconductor device includes an insulative substrate, a wiring pattern, a bonding portion, and a semiconductor element. The wiring pattern is formed on an upper surface of the insulative substrate. The bonding portion is formed on an upper surface of the wiring pattern. The semiconductor element includes an electrode pad connected to an upper surface of the bonding portion. The bonding portion includes first sintered layers distributed in the bonding portion and a second sintered layer having a density differing from each of the first sintered layers and surrounding the first sintered layer.

Abstract: A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.

Abstract: When performing inspection of a tip of a suction nozzle, the tip of the suction nozzle is imaged, and an opening of the tip of the suction nozzle is identified based on the image data. With the image based on the image data, locations with less than a set brightness level inside a location with the set brightness level and greater is identified as the opening. The identified opening is divided into four regions by boundary lines, and the area of the opening is calculated for each of the regions. Based on the areas calculated for each region, it is determined whether the suction nozzle is good. By determining whether the suction nozzle is good based on the area of the opening for each region, it is possible to reliably determine whether the suction nozzle is good.

Abstract: A selective transfer roll stamp is provided which rotates on a source substrate to selectively transfer elements arranged on the source substrate. The selective transfer roller stamp includes: a roller unit rotating about an axis of rotation and including projecting portions protruding in a radial direction and recessed portions formed between neighboring projecting portions; and an adhesive layer formed on the outer circumferential surface of the roller unit and coming into contact with the elements, wherein the outer circumferential surface of the adhesive layer is made flat in a circumferential direction.

Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may comprise a solid solution of Y2O3—ZrO2 and may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.

Abstract: A nozzle management device includes a plurality of pallets, each of the pallets configured to house a plurality of nozzles; a pallet storage device configured to store the pallets; and a pallet moving device configured to move the pallets.

Abstract: A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is elastically supported to be movable up and down with respect to the nozzle holder, a flange that is provided at a position that is offset from the central axis of the nozzle, and a second engaging section that is able to move the nozzle downward by engaging with the flange and pressing down the flange against the elastic force of a nozzle spring. The controller measures in advance the deviation amount of the tip position of the nozzle between before and after the second engaging section moves the nozzle downward and controls the mounting head so as to suck the component and mount the component on the board taking the deviation amount into account.

Abstract: A cover for a vehicle roof, which may have a pane, an anti-splinter layer arranged on the inside face of the pane, and a lighting device having a luminous layer, wherein the luminous and anti-splinter layer forms both the anti-splinter layer and the luminous layer in this one layer and in particular the lighting device contains at least one luminous unit, which is designed to radiate light into the luminous and anti-splinter layer at a lateral edge region of the luminous and anti-splinter layer.

Abstract: An electronic component mounting method for mounting a first board and a second board including, mounting a first set of electronic components on the first board allocated to first mounting heads; and mounting a second set of electronic components on the second board allocated to the second mounting heads and to the first mounting heads and the second mounting heads of the second lane dedicated mounters. By this, the mounting load is spread evenly across all the mounting heads, thus the idle time of mounting heads is reduced, improving the operating rate, meaning that panels are produced efficiently by the electronic component mounting method.

Abstract: A connector is equipped with a housing capable of being fitted in a mating connector which houses a plurality of mating terminals connected to each other electrically and a holder which is attached to the housing. The housing has a plurality of terminal housing rooms which house a plurality of terminals. The holder has a plurality of noise reduction member holding rooms which hold a plurality of noise reduction members each of which reduces noise occurring in a corresponding one of the plurality of terminals housed in the plurality of terminal housing rooms, in such a manner that the plurality of noise reduction members are disposed adjacent to front end surfaces of corresponding ones of the plurality of terminals in a state that attachment of the holder to the housing is completed.

Abstract: A semiconductor device includes a substrate, an electronic component, a ring structure and an adhesive layer. The substrate has a first surface. The electronic component is over the first surface of the substrate. The ring structure is over the first surface of the substrate, wherein the ring structure includes a first part having a first height, and a second part recessed from the bottom surface and having a second height lower than the first height. The adhesive layer is interposed between the first part of the ring structure and the substrate, and between the second part of the ring structure and the substrate.

Abstract: A connector is equipped with a housing capable of being fitted in a mating housing of a mating connector, a plurality of terminals which are held by the housing and electrically connected to each other, and a noise reduction member which is held in the housing so as to reduce noise occurring in the terminals. The noise reduction member is disposed at at least one of the plurality of terminals, and is not disposed at at least one of the remaining terminals of the plurality of terminals. The noise reduction member is made of a material containing ferrite.

Abstract: A connector module adapted for a set-top box including a shielding case, a first connector disposed outside of the shielding case, an annular capacitor disposed between the first connector and the shielding case, and at least one ferrite core disposed in the shielding case and generating mutual inductance by coupling the shielding case is provided. The first connector being connected to a peripheral cable has a transmission cable penetrating into the shielding case. The annular capacitor is electrically connected between a grounding layer of the transmission cable and a grounding of a first circuit board of the set-top box. The transmission cable is connected to a second connector of the first circuit board after entering the shielding case and penetrating the ferrite core. A high frequency signal from the peripheral cable is transmitted to the first circuit board via the first connector, the transmission cable, and the second connector.

Abstract: An electric power supply device for supplying electric power from a supply side device to a receiver side device including a mechanism section that operates intermittently with a drive voltage and a receiver side control section that controls an operation of the mechanism section with a control voltage that is lower than the drive voltage, the electric power supply device including: a regulator section, which is provided on the receiver side device, that converts a received voltage received via an electric power supply into the control voltage; a supply voltage adjusting section, which is provided on the supply side device, that adjustably supplies the received voltage; and a supply side control section, which is provided on the supply side device, that controls the received voltage by controlling the supply voltage adjusting section.

Abstract: The present invention provides an electronic control device including: a housing which has an opening portion formed at one side thereof; printed circuit boards which are inserted into the housing; and a connector unit which includes connector pins coupled to the printed circuit boards and closes the opening portion of the housing, in which the printed circuit boards include a first printed circuit board, and a second printed circuit board which is connected to one side of the first printed circuit board through a substrate connecting portion and provided below the first printed circuit board, the connector unit includes a first connector pin connected to the first printed circuit board and a second connector pin connected to the second printed circuit board, and an outer connector cover of the connector unit is disposed to be directed upward.

Abstract: Techniques are described that enable personalized recap clip sequences.

Abstract: In rotary head type component mounter, provided at two locations around rotary head are Z1-axis drive mechanism and Z2-axis drive mechanism that lower suction nozzles, and in a case in which the interval between two suction nozzles is a multiple two times or greater than the arrangement pitch of components in tray, component mounter performs consecutive simultaneous pickup operation repeatedly for a quantity corresponding to the quantity of component arrangement pitches between the two suction nozzles, the consecutive simultaneous pickup operation being that of lowering the two suction nozzles simultaneously such that two of the components on tray are picked up simultaneously, then rotating rotary head by one nozzle pitch, moving rotary head in the arrangement direction of the components on tray by one component arrangement pitch, and then lowering the next two suction nozzles simultaneously such that another two of the components on tray are picked up simultaneously.