Abstract: A wiring substrate includes a substrate body, a post formed on an upper surface of the substrate body, a thin film capacitor, and a first insulation layer covering the thin film capacitor and the post. The thin film capacitor includes a reference hole extending through the thin film capacitor in a thickness-wise direction. The post is inserted through the reference hole.

Abstract: An electronic component mounting machine includes: a mounting head that mounts electronic components onto a circuit board; a tape feeder which feeds a first tape material that accommodates a plurality of electronic components to the mounting head; a counting device which counts the number of electronic components remaining in the first tape material by subtracting the number of consumed electronic components which corresponds to an operating amount of the electronic component mounting machine from an initial value of the number of the electronic components accommodated in the first tape material; a detection device which detects a splice portion that joins a starting end of a second tape material to a tail end of the first tape material; and a determining device which determines whether or not a count value obtained by the counting device is within a predetermined normal range when the detection device detects the splice portion.

Abstract: One aspect relates to a method for producing an electronic module assembly. According to the method, a curable first mass extending between a substrate assembly and a module housing is cured while a circuit carrier of the substrate assembly has at least a first temperature. Between a side wall of the module housing and the substrate assembly, an adhesive connection is formed by curing a curable second mass. Subsequent to curing the first mass, the circuit carrier is cooled down to below a second temperature lower than the first temperature. Embodiments of the electronic module assembly are also described.

Abstract: A method for manufacturing an electronic device and the electronic device therefor are provided. The electronic device includes a substantially enclosed window including a front surface, a rear surface and a side surface surrounding at least a portion of a space between the front surface and the rear surface, a display disposed inside the window, and a display bracket, to which the display is coupled and disposed inside the window. The display is coupled to the window by curing a bonding member inserted between the window and the display.

Abstract: A component supply device of the disclosure includes: a loader being capable of accommodating a plurality of stick cases in a stacked state, each of the plurality of stick cases being capable of accommodating a plurality of electronic components, each of the plurality of stick cases having an opening in an end portion in a longitudinal direction; a component transporter moving one or more electronic components supplied from the plurality of stick cases to a predetermined component supply position; and a stick case detector detecting presence or absence of one or more stick cases in the loader.

Abstract: A circuit board assembly for a control unit of a motor vehicle has a multi-layer circuit board and a plug connector with a housing faceplate. The circuit board, which includes conductor paths for conducting signals, has a first section, a second section, and a flexible third section with a lower stiffness between the first and second sections. The first section encloses an angle ? with the second section. The plug connector has a multiplicity of connection elements, each with an attachment part and a contact pin. The housing faceplate has first and second side panels each enclosing an angle ? with the first panel central plane and an angle ? with the second panel central plane. A first detent element prevents a change in the angle ? in a first direction of rotation. A second detent element prevents a change in the angle ? in a second direction of rotation.

Abstract: Provided is a feeder management device that appropriately controls editing of management information related to feeders so as to prevent electronic components of an incorrect type being supplied. The feeder management device includes: a data management section including management data in which a component type of an electronic component loaded on each of the feeders is linked to an identification code that specifies each of the multiple feeders; and an editing control section configured to determine whether editing is allowable based on a loading state of the electronic component on the feeder in a case in which editing of the management information is attempted to be performed in accordance with a change to the component type linked to the identification code of the feeder.

Abstract: A board work system which optimizes amounting order of components on a circuit board. In a case where an error rate which shows the number of defective dies included in the wafer provided in the wafer-type supply device is input by a user, an integrated control device uses the input value in processing. In addition, in a case where the error rate is not input by the user, the integrated control device decides a value obtained by averaging the number of defective dies of the same type of wafer in production information as the error rate. In addition, the system decides the mounting order of mounting the components of the tape-type supply device or the wafer-type supply device on the circuit board based on the decided error rate, or changes the mounting order after the decision.

Abstract: A three-dimensional image processing apparatus includes: an image capturing part for acquiring reflected light to capture a plurality of pattern projected images; a distance image generating part capable of generating a distance image based on the plurality of pattern projected images; a tone conversion part for tone-converting the distance image generated in the distance image generating part to a low-tone distance image that has a lower number of tones than the number of tones of the distance image and is obtained by replacing height information in the distance image with a shade value of the image; and a tone conversion condition automatic setting part for automatically setting, based on the height information in the distance image, a tone conversion parameter for prescribing a tone conversion condition at the time of tone-converting the distance image to the low-tone distance image in the tone conversion part.

Abstract: A linear motion system utilizing one or more printed circuit boards embedded within a stage wherein the system components, including the controller, drive, and controller, may be mounted to a printed circuit board (PCB), and the electrical communications between the system components and the power to the system components are supplied through traces or etchings on the printed circuit board, thereby omitting the need for additional power and communication cables.

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Abstract: A component supplying device of the disclosure includes a main body, a carrier tape transport unit which transports a component to a component pick-up position, a detector which detects presence or absence of a carrier tape in the transport path, a designation unit which designates a transport mode of the carrier tape using a flag based on a change in the presence or absence of the carrier tape which is detected, a storage unit which stores the presence or absence of the carrier tape, the flag which is designated, and information of the component which is stored by the carrier tape which is mounted in the component supplying device, and a determination unit which determines a processing operation to be performed when power which is supplied to the component supplying device is reintroduced based on the presence or absence of the carrier tape and the flag which is designated.

Abstract: A board held by a board holding plate is heated by a heater, and after performing mounting processing of components in a region of the mounting regions of the board, a pressing process of using a pressing head to apply pressure to all the components mounted in the region at once while heating the board is performed, and a next mounting process of mounting components in a next region is performed while performing the pressing process. By performing the pressing process and the mounting process in parallel, waiting time for each process in the cycle of the mounting process and the pressing process is reduced, such that overall work time is reduced.

Abstract: A Hall IC of an actuator calculates a relative angle by using magnetic flux densities in two directions, and corrects a linearity error in the relative angle by using correction values at correction points and a function to calculating an interpolated correction value between correction points, the correction values and the function being stored in a storage. The storage stores, as correction values at outermost correction points in a relative angle range, correction values L? and L? causing linearity errors which are outermost ones of plural extremums to be equal to or less than linearity errors which are other ones of the plural extremums each of which is located inwardly next to the outermost extremum, the plural extremums being exhibited by the linearity error in the relative angle which is corrected by using an interpolated correction value calculated from the function which uses the correction values as parameters.

Abstract: A multifunction wafer and film frame handling system includes a wafer table assembly having a wafer table providing an ultra-planar wafer table surface configured for carrying a wafer or a film frame, and at least one of: a flattening apparatus configured for automatically applying a downward force to portions of a warped or non-planar wafer in a direction normal to the wafer table surface; a displacement limitation apparatus configured for automatically constraining or preventing uncontrolled lateral motion of a wafer relative to the wafer table surface after cessation of an applied negative pressure and application of a positive pressure to the underside of the wafer via the wafer table; and a rotational misalignment compensation apparatus configured for automatically compensating for a rotational misalignment of a wafer mounted on a film frame.

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

Abstract: A component mounter is provided with a characteristic value measuring device that measures a characteristic value of first component, and head that mounts each of first component and second component on board. Second component is a digital potentiometer provided with receiver section that receives information from head, variable resistance section for which the resistance is variable, and control section that controls the resistance value of variable resistance section. Head is provided with receiver section that receives information from characteristic value measuring device, sender section that sends information to second component, power source that supplies electric current to variable resistance section, memory section that memorizes the resistance value of second component according to the characteristic value of first component, and control section.

Abstract: An image pickup device which ensures reliability of soldering without reinforcement using any additional special members or fixing with an adhesive agent or the like. The image pickup device outputs an image signal corresponding to an optical image. Signal terminals are placed on one surface of the image pick device and soldered to a mounting board on which the image pickup device is to be mounted. Reinforcing terminals provided on the one surface, on which the signal terminal is placed, reinforce the image pickup device. A holding fixing unit holds the image pickup device on the mounting board. When the image pickup device is mounted on the mounting board, the reinforcing terminals are located between the signal terminals and the holding fixing unit.

Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.

Abstract: An electronic circuit component mounter including a component supply device which supplies electronic circuit components to a component holding tool; and a mounting device including a component holding tool and a movable device to move the tool relative to a substrate. If a moving type component supply mounting supply mode is set, a passage-equipped component case is checked for, passage-equipped component case is attached to head main body, moved together with suction nozzle, and supplies components. When component mounting by performing main body side component supply mounting supply mode is set, components supplied from tape feeders provided on the module main body are mounted, thus passage-equipped component case is not required, the presence of passage-equipped component case is checked for, and if it is attached to head main body, it is removed.

Abstract: Briefly, a new network processing system is provided that collects and coordinates key indicators regarding a product's quality as that product moves from supplier to end user. By doing so, the processing system provides robust, authentic, and trustworthy data that (1) reports the time period when any custodian had the product, (2) identifies what timing or environmental condition caused the product to go bad, and (3) verifies which custodian acted to make the product defective. In use, an intelligent label is attached to a product, and the intelligent label has a timer as well as one or more sensors for monitoring environmental conditions. Upon exceeding timing or environmental rules, a visual alarm indicator is activated on the label. Since the label has electronically retrievable data, electronically scannable data, and human readable date, the network process can collected key data regarding the product along the entire distribution chain.

Abstract: There is provided a component arrangement determination method, in a component mounting apparatus including a plurality of component supply units for supplying components, for determining arrangement of the component supply units used for production of a plurality of types of component mounted boards. The method includes specifying a production frequency of each of the plurality of types of component mounted boards for a predetermined period of time, grouping the plurality of types of component mounted boards into a plurality of groups capable of being produced without changing the arrangement of the component supply units based on the production frequency, and determining arrangement, in the component mounting apparatus, of the component supply units for supplying components necessary for production of types of component mounted boards that belong to each group of the plurality of groups.

Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.

Abstract: A fitting system includes a plurality of fitting lines for fitting printed circuit boards with electronic components. A method for allocating printed circuit boards to the fitting lines includes determining requirements for fitting each of a plurality of printed circuit boards with components with which the plurality of printed circuit boards are to be fitted, determining an amount of printed circuit boards of which the component variances exceed a predetermined value, each component variance representing the number of different components with which a printed circuit board is to be fitted, and allocating the printed circuit boards to the fitting lines under the predetermined conditions via integral linear programming, such that the printed circuit boards of the amount are distributed as uniformly as possible over the fitting lines.

Abstract: A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component mounting machine. When the wafer component is to be inverted and mounted on a circuit substrate, the wafer component supply device allows the wafer component present on an inverted supply head to be sucked by a mounting head of the component mounting machine at a position where the supply head and a stage are moved down by a vertical movement mechanism.

Abstract: A method for assembling a packaged integrated circuit for operating reliably at elevated temperatures is provided. The method includes providing an extended bond pad over an original die pad of an extracted die to create a modified extracted die. The extracted die is a fully functional semiconductor die that has been removed from a finished packaged integrated circuit. The method also includes placing the modified extracted die into a cavity of a package base and bonding a new bond wire between the extended bond pad and a lead of the package base or a downbond, and sealing a package lid to the package base and the cavity of the package.

Abstract: An electronic component includes a base insulative layer having first and second surfaces; an electronic device having first and second surfaces; at least one I/O contact located on the first surface of the electronic device; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; a first metal layer disposed on the I/O contact; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer, and located adjacent to the first metal layer. The base insulative layer secures to the electronic device through the first metal layer and removable layer. The first metal layer and removable layer can release the base insulative layer from the electronic device when the first metal layer and removable layer are exposed to a temperature higher than their softening points or melting points.

Abstract: A component mounting apparatus includes transport mechanisms that transport boards, component supply sections, mounting heads, and a control unit that controls them based on mounting data. Each transport mechanism includes an upstream side operation area and a downstream side operation area. When the mounting data corresponds to an independent mounting mode in which each of the mounting heads is used to mount a component only onto a board on a corresponding mechanism, the control unit performs a control so that the upstream side operation area is used as a mounting area. When the mounting data corresponds to an alternating mounting mode in which both mounting heads are used to mount the components sequentially onto a board that is first carried into the downstream side operation area, the control unit performs a control so that the upstream side operation area is used as a standby area.

Abstract: A method for assembling a packaged integrated circuit is provided. The method includes placing a die into a cavity of a package base, securing the die to the package base with a die attach adhesive, printing a bond connection between a die pad of the die and a lead of the package base or a downbond, and sealing a package lid to the package base.

Abstract: An electronic component integrated substrate includes a first substrate including a first pad, a first solder resist layer provided with a first open portion that selectively exposes the first pad, and a connection pad formed on the first solder resist layer, and electrically connected to the first pad; a second substrate, stacked on the first substrate, including a second pad, and a second solder resist layer formed on the second pad and provided with a second open portion that selectively exposes the second pad; an electronic component mounted on the first substrate and sandwiched between the first substrate and the second substrate; and a substrate connection member that electrically connects the connection pad and the second pad with each other, the diameter of the connection pad being larger than each of the diameter of the first pad and the diameter of the second open portion.

Abstract: A transfer method, manufacturing method, device and electronic apparatus of MEMS. The method for MEMS transfer, comprising: depositing a laser-absorbing layer on a first surface of a laser-transparent carrier; forming a MEMS structure on the laser-absorbing layer; attaching the MEMS structure to a receiver; and performing a laser lift-off from the side of the carrier, to remove the carrier. A transfer of high-quality MEMS structure can be achieved in a simple, low cost manner.

Abstract: A handheld device can include an encasing, one or more appurtenances associated with the encasing, communications circuitry contained within the encasing, and antenna elements. The antenna elements can be electrically coupled to the communications circuitry and integrated with the encasing and the one or more appurtenances. The appurtenances can include any of a touch-sensitive display screen, a button, a joystick, a click wheel, a scrolling wheel, a touchpad, a keypad, a keyboard, a microphone, a speaker, a camera, a sensor, a light-emitting diode, a data port, or a power port.

Abstract: A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.

Abstract: A protective structure for tables comprises an external frame placed around the table defining a security distance between the external frame and the table, and the protective structure further comprises protecting means including at least one beam blocker, said at least one beam blocker being preferably placed vertically on said external frame. The protective structure permits isolation of the optical table from vibrations, heat and/or air flow produced by other equipment used during the experiments.

Abstract: An electronic component mounting system stores: manufacturing plan data for each manufacturing lot; unit management data including use permission information indicating a use permission status of an equipment unit; and inventory data indicating a stock status of the equipment units. In a unit reservation processing, new allocation processing is performed for allocating an equipment unit necessary for manufacture of a new manufacturing lot to an equipment unit for a new manufacturing lot, and an allocation result is registered. The system determines whether an equipment unit of an allocation subject in the new allocation processing can be allocated to an equipment unit for the new manufacturing lot by referring to use permission information of the equipment unit, and if the equipment unit is determined as being usable, the unit reservation processing is performed.

Abstract: An airflow-rate detecting device capable of detecting humidity has a housing, a flow rate sensor, a humidity sensor, a humidity sensor case, and a dust separating portion. The housing therein defines a bypass passage into which a part of air flowing in a duct flows. The flow rate sensor is disposed in the bypass passage. The humidity sensor detects a humidity of air flowing in the duct at an outside of the housing. The humidity sensor case houses the humidity sensor and therein defines an interior space into which a part of air flowing in the duct flows as a target air of which humidity is detected by the humidity sensor. The dust separating portion removes dust from the target air before the target air flows into the interior space.

Abstract: An example method involves: forming a first bio-compatible layer that defines a first side of a bio-compatible device; forming a conductive pattern over a portion of the first bio-compatible layer; mounting an electronic component to the electrical contacts; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, the conductive pattern, wherein the second bio-compatible layer defines a second side of the bio-compatible device; forming a first etch mask to partially cover the second bio-compatible layer, thereby exposing a first portion of the second bio-compatible layer; removing the first portion of the second bio-compatible layer; forming a second etch mask to partially cover the second bio-compatible layer, thereby exposing a second portion of the second bio-compatible layer; and removing the second portion of the second bio-compatible layer.

Abstract: A modular test fixture for testing electronic devices. In some embodiments, such a modular test fixture can include a support frame having a base, and a substrate having a plurality of test components, with the substrate being coupled to the base. The modular test fixture can further include an upper support positioned above the support frame, and a plurality of suspension elements that each extend between the upper support and the support frame. The suspension elements can couple the upper support to the support frame, and the upper support can be movable relative to the support frame. The modular test fixture can further include a daughterboard module coupled to the upper support, and a daughterboard having a test device interface. The daughterboard can be coupled to the daughterboard module and be operatively coupled to the plurality of test components.

Abstract: Inter-substrate coupling and alignment using liquid droplets can include electrical and plasmon modalities. For example, a set of droplets can be placed on a bottom substrate. A top substrate can be placed upon the droplets, which uses the droplets to align the substrates. Using the droplets in a capacitive or plasmon coupling modality, information or power can be transferred between the substrates using the droplets.

Abstract: A method for manufacturing a pressure sensor includes: preparing a stem which has a cylindrical shape with a bottom as a diaphragm; mounting a sensor chip on the diaphragm; preparing a conductive member, in which an internal connection region is integrated with an external connection region electrically connected to an external circuit by an outer frame; forming a first resin mold to couple the internal connection region to the external connection region; separating the outer frame from the internal connection region and the external connection region; arranging the internal connection region in the stem; and electrically connecting the sensor chip and the internal connection region through the first connection member.

Abstract: A magnetic memory device includes a magnetic memory unit having a plurality of magnetic memory cells, a first surface, and a second surface opposite to the first surface, the first and second surfaces extending in a direction parallel to a direction in which the magnetic memory cells are arranged, a first magnetic shield unit extending below the first surface, and a second magnetic shield unit having a first portion that extends over the second surface and a second portion that extends from the first portion towards the first magnetic shield unit and is directly in contact with the first shield magnetic unit.

Abstract: An electrical receptacle connector includes a metallic shell, an insulated housing, first and second groups of terminals, an adapting circuit board, and extension terminals. The insulated housing is received in the metallic shell and includes a base portion, upper and lower tongue portions, and a partition plate. Upper and lower plug openings are respectively formed between the partition plate and the upper portion of the metallic shell and between the partition plate and the lower portion of the metallic shell. The terminals are held in the insulated housing. The adapting circuit board is disposed at the rear of the insulated housing and includes an upper-row contact set connected to the first group of terminals and a lower-row contact set. One ends of the extension terminals are connected to the lower-row contact set, and the other ends of the extension terminals are extended to the bottom of the insulated housing.

Abstract: A chip packaging structure includes a chip, a passive component, and at least two metal lines. In the chip, first bonding pads, second bonding pads and connecting pads are disposed above an integrated circuit, and the second bonding pads and the connecting pads are separated from the integrated circuit. The second bonding pads are electrically connected to the corresponding connecting pads, respectively. The passive component is disposed on the chip, and includes two electrodes that are respectively electrically connected to and adhered to one of the corresponding connecting pad. The metal lines are disposed on the chip, and have one end thereof respectively connected to the second bonding pads, and the other end respectively connected to the first bonding pads.

Abstract: A mounted structure includes a laminated capacitor, a wiring substrate, and a joint material. The laminated capacitor includes a body with dielectric layers and internal electrode layers alternately stacked, and an external electrode connected to the internal electrode layers. The body includes a side surface coated with a side surface coating portion of the external electrode. The joint material is joined to the side surface coating portion and a land provided on the wiring substrate so as to cover the outer surfaces thereof. The outer end portion of the thickest portion of the joint material covering the side surface coating portion is located farther outside an outer end of the land in a direction perpendicular or substantially perpendicular to a side surface of the body.

Abstract: An improved power distribution network for an integrated circuit package that reduces the number of power supply pins that are used in the pin array and achieves better operating performance. In a preferred embodiment, the ratio of power supply pins to input/output (I/O) pins is in the range of approximately 1 to 24 to approximately 1 to 52. In this embodiment, the integrated circuit package comprises a substrate, an integrated circuit mounted on the substrate, a first decoupling capacitor mounted on the substrate, and a second decoupling capacitor formed in the integrated circuit. The package is formed by coupling a power supply pin to both the first and second capacitors by a low frequency path and a DC path, respectively, and the first and second capacitors are coupled by a high frequency path.

Abstract: A method for making phase change memory cell includes following steps. A carbon nanotube wire is located on a surface of the substrate, wherein the carbon nanotube wire includes a first end and a second end opposite to the first end. A bending portion is formed by bending the carbon nanotube wire. A first electrode, a second electrode, and a third electrode are applied on the surface of the substrate, wherein the first electrode is electrically connected to the first end, the second electrode is electrically connected to the second end, and the third end is spaced from the bending portion of the carbon nanotube wire. A phase change layer is deposited to cover the bending structure and electrically connects to the third electrode.

Abstract: A circuit interconnecting substrate manufacturing method includes depositing a first layer of metallic powder on top of a carrier, and then forming a first layer of electrically conductive traces from the first layer of metallic powder. A second layer of metallic powder is then deposited onto at least one region of the first layer of electrically conductive traces. Then a second layer of electrically conductive traces is formed from the second layer of metallic powder and each trace of the second layer is electrically coupled to a trace of the first layer. An insulating material is deposited onto the carrier to provide an insulating substrate that supports the traces. The method does not require the use of any wet chemicals or chemical etching steps.

Abstract: A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.

Abstract: A power converter includes a bus bar, a semiconductor device, a lead, and solder. The bus bar has a vertical wall. The semiconductor device includes an electrode. The lead has one end connected to the bus bar and another end connected to the semiconductor device to supply power from the bus bar to the electrode of the semiconductor device via the lead. The one end of the lead includes a bending part which is spaced away from the bus bar by a predetermined distance and which is inclined in a vertical downward direction. The vertical wall of the bus bar and the bending part are bonded to each other via the solder. The vertical wall extends in a substantially vertical direction to face the bending part.

Abstract: A mechanism is provided for packaging a multiple socket, one-hop symmetric multiprocessor topology. The mechanism connects each of a first plurality of processor modules to a first multiple-socket planar via a respective one of a first plurality of land grid array (LGA) connectors. The mechanism connects the first multiple-socket planar to a first side of a redistribution card via a second plurality of LGA connectors. The mechanism connects each of a second plurality of processor modules to a second multiple-socket planar via a respective one of a third plurality of LGA connectors. The mechanism connects the second multiple-socket planar to a second side of the redistribution card via a fourth plurality of LGA connectors.