Abstract: The present invention provides an electrostatic discharge protector capable of taking measures for electrostatic discharge against electronic wiring boards having various designs freely, simply and easily, having excellent accuracy of regulating an operating voltage and capable of being downsized and decreased on its cost, and also provides a resin composition for a discharge gap capable of preparing the electrostatic discharge protector. The resin composition for filling a discharge gap of an electrostatic discharge protector comprises a resin having a urethane structure represented by the formula (1): wherein plural R's are each independently an alkylene group of 1 to 18 carbon atoms, X is a bivalent organic group and m and n are each independently an integer of 1 to 20. The electrostatic discharge protector is obtainable by filling the discharge gap with the resin composition. The discharge gap has a width of 2 to 10 ?m.

Abstract: A temperature detector includes a first metal and a second metal different from the first metal. The first metal includes a plurality of wires and the second metal includes a wire. The plurality of wires of the first metal are connected to the wire of the second metal in parallel junctions. Another temperature detector includes a plurality of resistance temperature detectors. The plurality of resistance temperature detectors are connected at a plurality of junctions. A method of detecting a temperature change of a component of a turbine includes providing a temperature detector include ing a first metal and a second metal different from the first metal connected to each other at a plurality of junctions in contact with the component; and detecting any voltage change at any junction.

Abstract: A method of forming a film is described. The method begins by forming a mixture including a polymer and a plurality of unordered nanomaterial. The film is dried and a plurality of pores is formed within the film. A sensitive film transducer capable of detecting changes in pressure and applied force can be made using this method.

Abstract: A superconducting article and method of fabrication are provided. The superconducting article includes a superconducting structure, which includes a superconducting conductor and multiple discrete overlay regions of higher heat capacity than the superconducting conductor. The multiple discrete overlay regions are disposed along a length of the superconducting conductor, in thermal contact with the superconducting conductor, and positioned to define a heat modulation pattern along the length of the superconducting structure. The multiple discrete overlay regions create a temperature distribution favorable to transition of the superconducting structure under load from a normal resistive state to a superconductive state by facilitating formation of a continuous superconducting path along the length of the superconducting structure.

Abstract: A touch panel includes a first transparent electrode substrate, a second transparent electrode substrate, a first bonding layer, a first transparent substrate, and a second bonding layer. The first transparent electrode substrate includes a first wiring pattern, a first surface, a second surface, and a first path. The second transparent electrode substrate includes a second wiring pattern, a third surface, a fourth surface, and a second path. The second path causes the third surface and the fourth surface to communicate with each other. The first bonding layer includes a first peripheral area, an opening area, and a third path. The first bonding layer bonds the first transparent electrode substrate and the second transparent electrode substrate to each other. The first transparent substrate is opposed to the second surface. The second bonding layer includes a first opening portion.

Abstract: Between adjacent windings of a bifilar coil made of an HTS strip conductor in a resistive superconductive current limiter device, a spacer is provided which is transparent for a coolant. The spacer includes an electrically insulating support tape for sufficiently massive spacer elements attached thereon. The spacer elements are spaced and made of a material having high thermal conductivity. The spaces between the spacer elements form cooling channels for the coolant.

Abstract: A varistor includes a ceramic base body having a surface. The varistor also includes an insulating layer on at least a portion of the surface of the ceramic base body. The insulating layer includes a base glass and filler. The filler includes 3Al2O32SiO2.

Abstract: The superconducting current-limiting device contains at least one coil (61), the conductive track of which is formed from at least one band-shaped superconductor (17), where a holding element (2, 41, 10, 51, 62) is located between adjacent coil windings. The holding element (2, 41, 51, 62) is constructed wider than the superconductor (17) in the axial direction of the coil (61). The holding element (2, 41, 51, 62) further includes a flat strip (11) and an undulating strip (12, 42, 52). The flat strip (11) extends essentially parallel to the band-shaped superconductor (17) at an essentially constant distance (22) therefrom. The undulating strip (12, 42, 52) extends essentially parallel to the flat strip (11), and in the longitudinal direction periodically has regions (15, 43, 53) distant from and regions (13) close to the flat strip (11). The regions (13) of the undulating strip (12, 42, 52) near to the flat strip have a mechanical connection (21) to the flat strip (11).

Abstract: An RF terminating resistor with a flange body, a planar layer structure, an upper face of a substrate, a resistance layer, an input conductor track, and an earth connection conductor track. The input conductor track electrically connected to opposite ends of the resistance layer. The substrate having a contact face, facing away from the layer structure. The flange body being bent around in a direction parallel to a first edge facing the earth conductor track, and a predetermined section bent around in a direction at right angles to this edge. The bent-around section extending in a space between a first plane, defined by the contact face, and a second plane, defined by the upper face, with the substrate abutting on the bent-around section connecting the contact face to the upper face and facing the earth connection conductor track on the upper face.

Abstract: A method of forming a thin film varistor array includes creating a metal-metal oxide-metal layer stack without breaking vacuum. The stack is patterned as a plurality of bus lines, each having a plurality of varistor islands formed thereon.

Abstract: A touch panel includes a first transparent electrode substrate, a second transparent electrode substrate, a first bonding layer, a first transparent substrate, and a second bonding layer. The first transparent electrode substrate includes a first wiring pattern, a first surface, a second surface, and a first path. The second transparent electrode substrate includes a second wiring pattern, a third surface, a fourth surface, and a second path. The second path causes the third surface and the fourth surface to communicate with each other. The first bonding layer includes a first peripheral area, an opening area, and a third path. The first bonding layer bonds the first transparent electrode substrate and the second transparent electrode substrate to each other. The first transparent substrate is opposed to the second surface. The second bonding layer includes a first opening portion.

Abstract: A first terminal electrode is provided directly on one longitudinal end surface of a chip thermistor element, a third terminal electrode is provided directly on the other end surface, a second terminal electrode is provided on a top surface via an insulating layer, a resistor layer is provided adjacent to the second terminal electrode, the second terminal electrode is electrically connected to the resistor layer, and the resistor is electrically connected to the first terminal electrode. Voltage is applied between the input terminal electrode and the ground terminal electrode, the voltage between the output terminal electrode and the ground terminal electrode is measured, and the output voltage is converted to a temperature to detect a change in the temperature.

Abstract: A varistor includes a ceramic base body having a surface. The varistor also includes an insulating layer on at least a portion of the surface of the ceramic base body. The insulating layer includes a base glass and filler. The filler includes 3Al2O32SiO2.

Abstract: An electronic device including a breakdown layer having variable thickness. The device includes a variable resistance material positioned between two electrodes. A breakdown layer is interposed between the variable resistance material and one of the electrodes. The breakdown layer has a non-uniform thickness, which serves to bias the breakdown event toward the thinner portions of the breakdown layer. As a result, the placement, size, and number of ruptures in the breakdown layer are more consistent over a series or array of devices. The variable resistance material may be a phase-change material. The variable-thickness breakdown layer may be formed through a diffusion process by introducing a gas containing a resistivity-enhancing species to the environment of segmented variable resistance devices during fabrication. The resistivity-enhancing element penetrates the outer perimeter of the variable resistance material and diffuses toward the interior of the device.

Abstract: Methods in accordance with aspects of this invention form microelectronic structures in accordance with other aspects this invention, such as non-volatile memories, that include (1) a bottom electrode, (2) a resistivity-switchable layer disposed above and in contact with the bottom electrode, and (3) a top electrode disposed above and in contact with the resistivity-switchable layer; wherein the resistivity-switchable layer includes a carbon-based material and a dielectric filler material. Numerous additional aspects are provided.

Abstract: This invention provides thermal sensors and imagers that are flexible and capable of conforming to curved surfaces and corresponding methods of making and methods of thermal sensing. The thermal sensors contain an array of thermal resistors patterned in a row and column configuration, with each thermal resistor electrically isolated from other thermal resistors within the sensor. Thermal information is obtained from a region by measuring the resistance of each thermal resistor and calculating a thermal resistance for each entry of the array.

Abstract: The invention provides a variable-resistance element having a multilayer structure. The variable-resistance element includes, for example, a first electrode, a second electrode, and an oxygen ion migration layer disposed between the first electrode and the second electrode. In the oxygen ion migration layer, oxygen vacancy can be produced owing to oxygen ion migration, thereby forming a low resistance path. The variable-resistance element also includes an oxygen ion generation promoting layer disposed between the oxygen ion migration layer and the first electrode and held in contact with the oxygen ion migration layer.

Abstract: According to a first aspect the present invention relates to a fault current limiter formed by a conductor tape (11, 41, 51, 61, 71) coated with a high temperature superconductor and having at least one mounting element (12, 42, 52, 62, 72) which is essentially holding the conductor tape solely on one or more edge regions in such a way that the principal surfaces of the tape cannot get in touch with the mounting element. According to a second aspect the present invention relates to a fault current limiter formed by a conductor tape coated with a high temperature superconductor and comprising at least one mounting element (23, 24) which is contacting the conductor tape on one or on both major surfaces in an electrically conducting manner such that the conductor tape (21) in its normal conducting state is electrically shunted by the mounting element (23) in the contact region.

Abstract: A laminated variable resistor comprises a main body, internal electrodes extending along two side edges of the main body into the main body, terminal electrodes disposed on the two ends of the main body. The mole percentage of the oxide in overlapping active regions between opposite internal electrodes is reduced and the reduced portion is replaced by a metal selected from gold (Au), silver (Ag), palladium (Pd), platinum (Pt), rhodium (Rh), or the alloy of any two of such metals.

Abstract: A device comprising at least one cantilever comprising at least one piezoresistor is described, where the cantilevers comprise silicon nitride or silicon carbide and the piezoresistors comprise doped silicon. Methods for making and using such a device are also provided.

Abstract: To measure and regulate temperature, a temperature measuring resistor and a control element are accommodated in one layer as metallization on a substrate. The printed or otherwise manufactured conductors of the temperature measuring resistor and of the control element are arranged in close proximity to one another.

Abstract: A phase change memory device comprising a substrate. A plurality of bottom electrodes isolated from each other is on the substrate. An insulating layer crosses a portion of the surfaces of any two of the adjacent bottom electrodes. A pair of phase change material spacers is on a pair of sidewalls of the insulating layer, wherein the pair of the phase change material spacers is on any two of the adjacent bottom electrodes, respectively. A top electrode is on the insulating layer and covers the phase change material spacers.

Abstract: A multilayer positive temperature coefficient thermistor that has a BaTiO3-based ceramic material contained as a primary component in semiconductor ceramic layers, the ratio of the Ba site to the Ti site is in the range of 0.998 to 1.006, and at least one element selected from the group consisting of La, Ce, Pr, Nd, and Pm is contained as a semiconductor dopant. In this multilayer positive temperature coefficient thermistor, a thickness d of internal electrodes layer and a thickness D of the semiconductor ceramic layers satisfy d?0.6 ?m and d/D<0.2. Accordingly, even when the semiconductor ceramic layers have a low sintered density such that an actual-measured sintered density is 65% to 90% of a theoretical sintered density, a multilayer positive temperature coefficient thermistor having a low rate of temporal change in room-temperature resistance can be obtained without performing any complicated processes, such as a heat treatment. When the content of the semiconductor dopant is 0.1 to 0.

Abstract: The arrays of independently-addressable resistors are commonly used to control miniature elements. The invention proposes solving the problem caused by the loss of power dissipated in the addressed resistor by choosing, for this resistor, a material with a negative thermal coefficient resistance, which enables the addressing output of this resistor to be increased.

Abstract: Provided are a phase change memory device and a method of forming the same. According to the phase change memory, a first plug electrode and a second plug electrode are spaced apart from each other in a mold insulating layer. A phase change pattern is disposed on the mold insulating layer. The phase change pattern contacts a top of the first plug electrode and a first potion of a top of the second plug electrode. An interconnection is electrically connected to a second portion of the top of the second plug electrode.

Abstract: A laminate includes an insulating substrate, and a temperature-sensitive resistor made of crystals of a metal based on a platinum group element and laminated on the insulating substrate; and has a percentage of (111) planes of crystals oriented at 10° or less from the normal direction (ND direction) in a layer of the temperature-sensitive resistor being 90% or more. By controlling the orientation of crystals forming the temperature-sensitive resistor, laminates suitable as a thin-film sensor, thin-film sensors including the laminate, thin-film sensor modules including the thin-film sensor, and methods for producing the thin-film sensors are provided.

Abstract: Provided are a non-volatile memory device having a threshold switching resistor, a memory array including the non-volatile memory device, and methods of manufacturing the same. A non-volatile memory device having a threshold switching resistor may include a first resistor having threshold switching characteristics, an intermediate electrode on the first resistor, and a second resistor having at least two resistance characteristics on the intermediate electrode.

Abstract: A system comprising a control logic that generates a code having n digits, a translation logic coupled to the control logic that translates the code to a new code having greater than n digits, and a variable resistance logic coupled to the translation logic and comprising greater than n semiconductor devices. A resistance associated with the variable resistance logic depends on activation statuses of the semiconductor devices. The translation logic adjusts at least some of the semiconductor devices in accordance with the new code.

Abstract: According to one aspect, a switching element may comprise a first electrode, a second electrode, and a resistive switching region extending from the first electrode to the second electrode and comprising transition metal oxinitride.

Abstract: A circuit board high in reliability and a method for manufacturing the circuit board are provided. The electrical resistance is accurately adjustable without damaging the circuit body even if it is made of resinous material and is free from a change over time. A circuit board in which a resistor (16) consisting of a resistor paste is printed between electrodes (14a) formed on a circuit pattern (14) printed on a printed circuit board (11), wherein a conductor (18) for adjusting the electrical resistance value of the resistor is coated on the surface of the resistor.

Abstract: A method of thermally coupling a flow tube or like component to a thermal sensor comprises bonding the component to the thermal sensor such that thermally conductive portions formed on the component are thermally coupled to corresponding sensing/heating elements disposed on the thermal sensor. The method can be employed to form a capillary mass flow sensor system. Thermally conductive portions, such as metal bands, can be formed on the outer surface of a capillary tube for bonding with corresponding resistive heat sensing and heating elements disposed on the substrate of a micro mass flow sensor. Bonding metal pads can be formed on the sensor surface preparatory to solder bonding the tube metal bands to the resistive sensing and heating elements.

Abstract: An RTD measurement device including a mechanism for automatic selection of a 3-wire or 4-wire configuration mode of operation. The RTD measurement device may include detection circuitry to detect whether an RTD connected to the RTD measurement device via a plurality of wire connections includes a 3-wire configuration or a 4-wire configuration. The RTD measurement device may include processing circuitry to process one or more readings from the RTD. If a 3-wire configuration is detected, the detection circuitry may automatically configure the processing circuitry to operate in a 3-wire configuration mode. If a 4-wire configuration is detected, the detection circuitry may automatically configure the processing circuitry to operate in a 4-wire configuration mode.

Abstract: A laminated variable resistor comprises a main body, internal electrodes extending along two side edges of the main body into the main body, terminal electrodes disposed on the two ends of the main body. The mole percentage of the oxide in overlapping active regions between opposite internal electrodes is reduced and the reduced portion is replaced by a metal selected from gold (Au), silver (Ag), palladium (Pd), platinum (Pt), rhodium (Rh), or the alloy of any two of such metals.

Abstract: An electronic resistor user interface comprises flexible conductive materials and a flexible variably resistive element capable of exhibiting a change in electrical resistance on mechanical deformation and is characterised by textile-form electrodes (10,12), a textile form variably resistive element (14) and textile-form members (16) connective to external circuitry.

Abstract: A robust sensor that incorporates the necessary physical structure and thermal characteristics is capable of measuring fluid flow and properties under harsh environmental conditions. The sensor die is made of a material with thermal conductivity tailored to provide the thermal transmission characteristics necessary to avoid saturation of the sensor, thus enabling the measurement of high mass flux airflow and liquid properties under high pressure and often harsh environments not previously available for silicon based sensors. The robust sensor further has internal vias for back-side electrical connection, thus avoiding electrical and mechanical interference with the measurements. All of these features come together to provide a microsensor which is capable of reliable, i.e. stable, wide dynamic range and rapid-response operation under harsh environments.

Abstract: A high resolution potentiometer implemented using at least two digital potentiometers connected in parallel. Each digital potentiometer is controlled to provide a corresponding resistance value, and a desired resistance value is attained by such control. The resolution is high in some range of desired resistance values and low in other ranges. A high resolution in a desired range can be attained by connecting another resistor in series with the digital potentiometers connected in parallel.

Abstract: The present invention provides a multifunction resistor having an improved voltage variable material (“VVM”). More specifically, the present invention provides a polymer VVM that has been formulated with a high percentage loading of conductive and/or semiconductive particles. A known length of the relatively conductive VVM is placed between adjacent electrodes to produce a desired Ohmic normal state resistance. When an electrostatic discharge event occurs, the VVM of the multifunctional resistor becomes highly conductive and dissipates the ESD threat. One application for this “resistor” is the termination of a transmission line, which prevents unwanted reflections and distortion of high frequency signals.

Abstract: A method and heating device for heating a liquid, particularly useful for removing liquid condensate from cooling devices, by wetting a heating plate with the liquid and controlling the electrical power supply to maintain the heating plate at a the predetermined temperature above the boiling point of the liquid, such that when the heating plate is not wetted by the liquid, the electrical power supply to the heating plate is automatically maintained at a relatively low value, but as soon as the heating plate is wetted by the liquid, the electrical power supplied to the heating plate is automatically increased until the liquid is completely evaporated. The heating plate is heated by one or more PTC thermistors in which the electrical resistance increases with temperature to automatically maintain the predetermined temperature. Besides evaporating liquid condensate, the heating device is described for use in many other applications including steam generation, space heating and plastic molding.

Abstract: A programable gain amplifier (PGA) has an amplifier and a variable resistor that is connected to the output of the amplifier. The variable resistor includes a resistor that is connected to a reference voltage and multiple parallel taps that tap off the resistor. A two-stage switch network having fine stage switches and coarse stage switches connects the resistor taps to an output node of the PGA. The taps and corresponding fine stage switches are arranged into two or more groups, where each group has n-number of fine stage switches and corresponding taps. One terminal of each fine stage switch is connected to the corresponding resistor tap, and the other terminal is connected to an output terminal for the corresponding group. The coarse stage switches select from among the groups of fine stage switches, and connect to the output of the PGA.

Abstract: A memory function body 113, which includes a plurality of silver particles 103 covered with silver oxide 104, is interposed between a first electrode 300 and a second electrode 411. A magnitude of a current through the memory function body 113 changes on applying a prescribed voltage between the first electrode 300 and the second electrode 411, and a storage state is discriminated according to the magnitude of the current. The silver particles 103, which capture electric charges, are covered with the silver oxide 104 that serves as a barrier against the passage of electric charges, and therefore, the memory function body 113 can stably retain electric charges at the normal temperature.

Abstract: An integratable fluid flow and property microsensor assembly is configured to be operably embedded in a microfluidic cartridge of the type used in lab-on-a-chip systems. The assembly is a robust package having a microstructure flow sensor contained within a housing in order to achieve a robust sensing device. The cartridge provides a flow path to the assembly, which directs the fluid across the flow sensor and returns the fluid to the cartridge flow path. The flow sensor monitors the controlled flow of fluid and transmits signals indicative of that flow. The assembly structure provides a robust sensor that is operable and accurate in many different applications.

Abstract: An elongated current limiting composite material comprising one or more high-temperature superconductor filaments and a second electrically conductive member, which may include a sheath of high bulk resistivity surrounding the filament. The current limiter exhibits dissipation in the range of 0.05-0.5 V/cm at currents of 3-10 times the operating current, thereby minimizing fault currents and improving recovery capability.

Abstract: An integrated dual-purpose sensor is shown. The dual-purpose sensor in one embodiment of the present invention includes a full Wheatstone bridge or a half Wheatstone bridge providing two output measurements. Specifically, the Wheatstone bridge provides two output measurements that are utilized to determine a temperature sensor reading and a magnetic sensor reading.

Abstract: There are provided a point contact array, in which a plurality of point contacts are arranged, each point contact electrically and reversibly controlling conductance between electrodes and being applicable to an arithmetic circuit, a logic circuit, and a memory device, a NOT circuit, and an electronic circuit using the same.

Abstract: The present invention provides a composite material such as a passive element, a passive element composite component, a substrate with a built-in passive element and a composite wiring substrate which are free from, for example, a layer peeling problem and enables high density packaging with ease. In the present invention, a porous base material is divided into plural functional regions and a material having different electromagnetic characteristics is filled in a pore of the porous base material of each functional region, to form a passive element or a wiring substrate. Among the aforementioned plural functional regions, at least one functional region is a conductive material region filled with a conductive material and other regions are filled with a high-dielectric material, a high-permeability material or a low-dielectric material.

Abstract: A sensing and measuring circuit, employing a positive-temperature-coefficient sensing device, for detecting the presence and approximately measuring the quantity or concentration of heat-absorptive substances such as water. May be used for sensing a quantity of rainfall or irrigation water, or for detecting and giving an alarm or initiating remediation for leakage of water, oil, or other fluids from confinement to an unauthorized location.

Abstract: The present invention relates to a resistive superconducting current limiter with a meandering shape. This current limiter avoids current density peaks at the turning points (12) or corners of the conductor track (10, 11) in that the central path of the fault current when limiting occurs is artificially increased by appropriate design of the turning points. For this purpose, conductor material is removed in the region of the inner edge of the turning points (13), or the electrical bypass is reinforced at its outer edge (14).

Abstract: An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members.

Abstract: A sensor and associated circuitry for sensing and reacting to the presence of a fluid or other material having heat capacity. A positive-temperature-coefficient device initiates a switching step when the amount of heat-capacity material reaches a certain level, or is totally absent. The switching step may trigger an alarm or control circuit to rectify the fluid level.

Abstract: A current limiting device comprises at least two electrodes; an electrically conducting composite material between the electrodes; interfaces between the electrodes and electrically conducting composite material; an inhomogeneous distribution of resistance at the interfaces whereby, during a high current event, adiabatic resistive heating at the interfaces causes rapid thermal expansion and vaporization and at least a partial physical separation at the interfaces; and a structure for exerting compressive pressure on the electrically conducting composite material, wherein the electrically conducting composite material comprises at least one polymer matrix and at least one conductive filler.