Abstract: Housing with directed-flow cooling (10) for computer (110) provides auxiliary airflow for cooling a heat-sensitive component, such as CPU (120). Housing (10) includes partition (60) that separates housing (10) into a lower compartment (40) for enclosing computer (110) and an upper compartment (20) for receiving ambient air through slots (24). Partition (60) includes vent opening (61) above CPU (120) that allows air to flow from upper compartment onto CPU (120), directed by impingement fan (50).

Abstract: A cooling structure for separating a cooling air which is forced to pass an electronic unit in a horizontal direction. The electronic circuit unit is attached in a subunit of a communication device. The cooling structure includes a separation member for separating an intake air and a discharge air into a front area and a back area. This separation member is provided at an upper side or a lower side of the subunit, and extends from one side to the other side of the subunit.

Abstract: Method and apparatus for fluid-based cooling of heat-generating devices are disclosed. A heat-generating device is mounted on a carrier. The heat-generating device is spatially displaced from the surface of the carrier, thereby forming a channel. The heat-generating device and the carrier are enclosed in an enclosure having an inlet and an outlet. A substantially electrically non-conductive cooling fluid for introduction into the enclosure and into the channel and expulsion from the enclosure and for extracting heat from and thereby cooling the heat-generating device and the carrier.

Abstract: A cooling device for an electronic apparatus, comprising: a heat generating element attached within a first housing; a heat receiving jacket, being connected with said heat generating element, and being attached within said first housing; a second housing being rotatably supported on said first housing; a first heat exchanger attached within said second housing, for exchanging heat between an outside; and a liquid driving means for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger and an ion exchanger are provided in a part of said pipe, said second housing is received within said second housing, and said ion exchanger is received within said second housing.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: A module is formed in which semiconductor components are soldered to an electrically conductive heat sink. The electrically conductive heat sink is formed so that it will serve as an electrical bus in an electronic device. The chips of the semiconductor component are metallurgically bonded to the surface of the heat sink. The heat sink uses a heat transfer fluid that flows through an interior of the heat sink, the interior containing an internal element. In the preferred embodiment, the internal element is a plurality of silver plated copper balls. The copper balls are brazed to each other and to the walls of the heat sinks in an assembly process. The heat sink housing will typically be made from copper, with one surface made from molybdenum so that the expansion and contraction of the heat sink housing molybdenum surface will be similar to that of the silicon substrate of the chips, thereby avoiding the problem of the chip substrate cracking and breaking due to thermal flexing.

Abstract: A means is discussed for electrically interconnecting, cooling and mechanically supporting a multiplicity of heat producing electronic and/or electrical components which is amenable to automated assembly. A structure is identified which consists of one or more fluid-cooled heatsinks; which are in proximate contact with heat producing components and one or more U-shaped spring clips which mechanically force thermal contact between the heat producing components and heatsinks. In turn, each heatsink contains two fluid-filled cavities separated by a common wall, wherein fluid in the first cavity flows in one direction, while fluid in the second cavity flows in the reverse direction. The components are powered by a bus that compensates for the location of the components, providing an equal voltage drop between a power source and each component. The bus is a flat plate that has been stamped to include slots that increase the voltage drop between selected portions of the bus.

Abstract: A circuit board cooler employs a closed fluid delivery system to transfer heat from electronic components to a cooling fluid. One or more channels embedded within the circuit board carry cooling fluid to the components where the fluid absorbs heat from the component, then away from the component to deposit the excess thermal energy in a thermal sink, such as a heat exchanger. The cooling system may employ conductive thermal transfer elements, such as “thermal vias”, to enhance heat transfer from electronic components to the cooling fluid.

Abstract: A computer motherboard selectively uses various memories in the light of a dummy card. The computer motherboard comprises a serial resistor, and a first slot and a second slot for holding various memories, respectively. Various memories can be configured on the motherboard without additional settings by means of predefined dummy card or/and rearranging the location of the serial resistor.

Abstract: A cooler for an electrical component, including a pressure-tight vessel enclosing the electrical component and including a support plate above the electrical component, a bath of electrically insulating and evaporating liquid surrounding the electrical component within the vessel, a flow channel for cooling liquid on the support plate, and a heat exchange element. The heat exchange element includes a serpentine plate having generally horizontally extending and aligned flanks alternately connected along horizontally extending upper and lower edges, with the lower edges being connected by connectors spaced along the horizontally extending edges and the upper edges being connected by horizontally extending crests secured to the flow channel for heat conduction therebetween. The flow channel may define a U-shaped path with two channel legs connected at one end, with a cooling liquid inlet connected to one of the channel legs and a cooling liquid outlet connected to the other of the channel legs.

Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g., lower) opposite side of that source.

Abstract: In an information processing apparatus, a heat-generating portion including at least a CPU is cooled by circulation of a cooling liquid, the temperature of the cooling liquid is measured and the operating condition of a pump for circulating the cooling liquid is obtained in accordance with the measured temperature of the cooling liquid. The pump is operated on the basis of the operating condition to control the flow rate of the circulated cooling liquid. Further, even after the system for the information processing apparatus stops, the circulation of the cooling liquid is continued until the temperature of the heat-generating portion becomes not higher than a predetermined value.

Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.

Abstract: Data storage systems are provided. A representative data storage system includes a chassis that is configured to mount at least one data storage device and a carrier. The carrier incorporates a frame and a handle assembly. The frame includes a first and second rails that are spaced from each other and configured to engage opposing sides of a data storage device. Preferably, the first and second rails are formed at least partially of metal for dissipating heat from the data storage device. The handle assembly includes a handle that is configured to move between a latched position and an unlatched position. In the latched position, the handle facilitates secure mounting of the carrier to the chassis. In the unlatched position, the handle facilitates removal of the carrier from the chassis. Other systems and devices also are provided.

Abstract: A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The oscillator is integrally contained within the plate.

Abstract: A cooling mechanism within an integrated circuit includes an internal pump for circulating thermally conductive fluid within closed loop channels. The cooling channels are embedded within an integrated circuit die, such as in interlevel dielectric layers between metal levels. The channels are formed by engineering deposition of a layer to line trenches and form continuous voids along the trenches. Exemplary heat pumps comprise cavities, formed in communication with the channels, covered by piezoelectric actuators. Preferably, the actuators are wired to act in sequence as a peristaltic pump, circulating the fluid within the channels. The channels are positioned to carry heat from active devices within the integrated circuit, and a heat sink carries heat from the die.

Abstract: In a superconducting current limiter 1, in the limiting state pressure waves which may damage the superconductor are produced as a result of the evaporation of cooling liquid. According to the invention, the current limiter is not immersed in a cooling liquid, but rather is brought into thermal contact with a cooling fluid 22 which does not undergo a phase transition at over the operating temperature and therefore does not evaporate in the limiting state. A refrigeration reservoir 21, which may be the condensed phase of a gaseous cooling fluid or a cryogenic cooler, determines the operating temperature of the current limiter. One advantage is that it is now possible for a plurality of plate-like current-limiter modules 10, 10′ of unlimited size to be arranged next to one another in the cooling fluid 22.

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract: A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.

Abstract: In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.

Abstract: An electronic apparatus has a water-cooling system suited for a construction having compact, thin design. In the electronic apparatus, a water-cooling jacket is thermally connected to a heat-generating element, a heat-dissipating pipe is thermally connected to a heat-dissipating metal sheet provided at a rear panel of a display case, and a cooling medium liquid is circulated between the water-cooling jacket and the heat-dissipating pipe by a liquid-moving device. A necessary and sufficient circulating flow rate and a necessary discharge pressure are determined by the relation between the upper limit temperature of the heat-generating element and the limit amount of heat dissipation from the surface of the housing. With this structure, heat occurring in the heat-generating element can be dissipated from the rear surface of the display case due to the necessary and sufficient liquid-circulating flow rate.

Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: Systems for cooling heat-generating components are provided. A representative embodiment of such a system includes a heat-generating component supported by a substrate. A microcompressor supported by the substrate compresses a cooling fluid. A heat exchanger supported by the substrate receives cooling fluid from the microcompressor and removes heat from the cooling fluid. A microexpander is thermally coupled to the heat-generating component and receives and expands the cooling fluid to remove heat from the heat-generating component. Methods and other systems also are provided.

Abstract: A chassis member for carrying at least one circuit board for use in a WDM add/drop multiplexer unit, wherein the chassis member is adapted, in use, to function as a heatsink for a heat generating component mounted on the circuit board.

Abstract: A cooling system and method of fabrication are provided for cooling one or more heat-generating electronic elements within a portable computer. The cooling system includes a cold plate assembly thermally coupled to a heat-generating electronic element, and a heat exchange structure disposed within the cover of the portable computer. The heat exchange structure includes a hollow channel and an expansion chamber in fluid communication with the channel. A conduit carries coolant between the cold plate assembly and the hollow channel in the heat exchange structure, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange structure in a manner to remove heat from the heat-generating electronic component. The expansion chamber integrated within the heat exchange structure provides a reservoir for the circulation pump from which to draw coolant for circulation through the cold plate assembly.

Abstract: A cooling apparatus attaches to a cabinet housing electronics for protecting the electronics from external elements. The cooling apparatus includes an exterior surface for exposure to the external elements and a coupling that attaches the exterior surface to the cabinet. When the cooling apparatus is attached to a surface of the cabinet, the exterior surface is maintained in a spaced-apart relationship from the cabinet, forming an enclosed channel having a pair of openings, one of the openings being located above the other. In such a manner, the cooling apparatus can be added to cool an existing, installed, in-place cabinet without requiring extensive modification to the existing cabinet.

Abstract: Cooling Device for Computer Hard Drive with a rectangular cooling tank, a coolant entrance pipe, a coolant exit pipe, one wall of the tank being constructed of highly heat conductive metal such as solid silver, a plurality of cooling highly heat conductive plates, the plates each having a ninety degree flange, each the flange attached to the highly conductive tank plate wall, a plurality of hard drives sandwiched between each cooling plate, a plurality of compression screws that cause the cooling plates to remain in intimate contact with said hard drive housing, and a plurality of rubber shock mounts, the top of which communicates with said compression screw, the bottom of which communicates with a mounting rail. A preferred embodiment includes wherein said highly conductive cooling plates are made of silver and have an oxidized surface that allows infrared rays to be absorbed by said plate.

Abstract: An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.

Abstract: An electronic apparatus has a housing that includes a bottom wall with a communication hole formed therein, and also has an extension apparatus on which the housing is removably mounted. The housing contains a heat generating component and a heat sink thermally connected thereto. The communication hole is opened and closed by a lid, which is always urged toward a position for closing the communication hole. The extension apparatus has operation members for forcibly opening the lid when the housing is mounted thereon.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: A gas stream moisture condenser assembly for use in a fuel cell power plant includes a gas stream flow path which is formed from a monolithic open cell foam body. The foam body is preferably formed from a high temperature material such as stainless steel, nickel alloys and iron-aluminum alloys, or from a ceramic material. The foam body includes open cells or pores which are contained within a metal or ceramic lattice. Coolant tubes are in contact with the foam monolith so as to cool the lattice sufficiently to cause moisture in the gas stream to condense on a lattice surrounding the pores of the foam. The condensate migrates from the foam lattice into a reservoir. The condenser can be used to remove water from gas streams, such as a cathode exhaust stream or a mixed burner and cathode exhaust stream, of a fuel cell power plant.

Abstract: A composite heat dissipation assembly having a net shape injection molded thermally conductive elastomeric heat sink and at least one integral heat pipe is provided in the present invention. The molded conformable heat sink is formed from a base elastomeric material that is loaded with thermally conductive filler. The base material is mixed with the filler and net shape molded to form the outer geometry of the assembly. Within the geometry of the part an integral channel is formed that is capable of receiving a heat pipe. The channel is formed to have an opening that is slightly smaller than the outer cross-sectional dimensions of the heat pipe. When the heat pipe is pressed into the channel a portion of the elastomeric material is compressed and the reactionary force of the compressed material firmly presses the elastomer into thermal communication with the outer surface of the heat pipe.

Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

Abstract: An oil-cooled inverter for an electric traction motor that uses six IGBT switches to generate 3-phase AC electrical current as its output. The switches are mounted on heat sinks that use hot motor oil (hydraulic fluid) as the heat transfer fluid. An interior of each of the heat sinks contains a heat transfer medium. The heat sink housing is made of molybdenum, which has a thermal expansion rate equal to that of silicon. This allows the circuitry of the inverter to be mounted directly on the top surface of the heat sinks, as the expansion and contraction of the heat sink housing will match that of the silicon substrate of the chips. Since both elements, the heat sink housing and the chip substrate, expand and contract at an equal rate during heating and cooling, the problem of the chip substrate cracking and breaking due to thermal flexing is eliminated.

Abstract: An electronic apparatus receiving therein a plurality of electronic equipments, each of which has heat generating electronic parts and which are spaced from one another, has caused a problem that amounts of an air flowing into wind paths between the respective electronic equipments involve scatter. To solve the above-mentioned problem, the electronic apparatus is constructed such that the pressure-loss adjusting plates 12 are provided on the fins 5 facing those wind paths of large inflowing air volume among the wind paths formed between the respective electronic equipments 2 received in the rack 1.

Abstract: An electronic apparatus containing in a rack a plurality of electronic equipments each having heat generating electronic parts, and provided with fins for dispersing heat from the electronic equipment, involves a problem of low heat radiating efficiency. Providing a wind-path separation covers formed in a manner to cover top portions of the fins increases an amount of an air flowing into the fin-inbetween wind paths.

Abstract: It is an exemplified object of the present invention to provide a radiator mechanism and electronic apparatus having the radiator mechanism that can prevent destruction, deterioration, and malfunction due to heat of exoergic components or other electronic components, thermal deformation of a housing thereof, and low-temperature burn, without preventing the electronic apparatus including a printed board from miniaturization. The radiator mechanism is comprised of a cooling fan and a through hole provided in a motherboard, thereby thermally protecting a variety of circuit components mounted on the motherboard to provide a stable operation.

Abstract: A desk-top type computer with a built-in LCD includes a chassis, a planar display attached to the chassis, a mother board attached to the chassis, heat generating portions including a CPU mounted on the mother board, and a memory device electrically connected to the mother board. A heat receiving head is fixed to at least one of the heat generating portions including the CPU, and the head is connected a tube filled with a cooling liquid. The tube is arranged in a serpentine or zigzag shape in a clearance between the chassis and the planar display facing the chassis. The cooling medium liquid circulating in the tube serves as a heat transferring medium to absorb the heat at the heat generating portion, and radiate the heat through the tube disposed in the clearance between the LCD and the chassis.

Abstract: The present invention is directed to ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or housing, such as the housing of a web server, or of a storage array device for a network server or web server. The cooling element includes a fan that is disposed at an angle to integrate its cooling air with general circulation or air flow through the chassis. The element may mount on a plate, such as the thermally conductive plate of a heat sink, that is adapted for coupling to the chassis and/or contacting a microprocessor chip, and a fan is disposed on the mounting plate at an angle to cool the plate or chip without creating obstructive cross wind. The mounting plate can be disposed within the middle portion of the chassis. The fan or cooling element can be angled so as to direct airflow towards at least a selected portion of the chassis, e.g.

Abstract: A data acquisition module (1) includes an interconnection board (15) with several electronic components (3, 18) mounted on at least one side of said board. A protective cover (16) mounted opposite said side covers the electronic components (3, 18). In order to cool notably the module's analog-to-digital converters, a piston 41 connected to the protective cover (16) is pressed by a spring (43) against the upper side of at least one electronic component (3) so as to establish a thermal bridge between said electronic component and said protective cover. The piston is mounted in a piston carrier fastened on the cover (16). The diameter of the portion (410) of the piston (41) that is in contact with the electronic component (3) to be cooled is smaller than the diameter of the portion (411) of the piston that is in contact with the piston carrier (40).

Abstract: A cooling apparatus is constructed wherein, a fan box is provided with a plurality of suction openings and exhaust openings formed on a suction main surface and an exhaust main surface opposite to each other, a plurality of fan units each comprising a multi-blade fan and a suction duct disposed in different positions in a inserting direction are alternately arranged in an axial direction of the multi-blade fan so as to be able to insert and drawn out, and the fan unit is configured so that a suction duct thereof operates as a suction passage for the multi-blade fans of the next fan unit by communicating a fan suction opening with the suction opening through the suction duct and communicating a fan exhaust opening with the exhaust opening.

Abstract: A cooling unit has a vessel that is filled with a refrigerant. The vessel includes a heat receiving portion for receiving heat from a heat generating component, a heat dissipating portion for dissipating the heat from the heat generating component, and a heat transfer portion for transferring the heat transmitted to the heat receiving portion to the heat dissipating portion via a refrigerant. At least the heat receiving portion of the vessel is formed of a soft heat conduction sheet that receives the heat from the heat generating component. The heat conduction sheet is directly in contact with the heat generating component.

Abstract: A computer system is provided having a heat exchanger that is relatively large. Although the heat exchanger is large, it is still sufficiently light because of its plastic material. Because of the large size of the heat exchanger, a relatively large surface is provided by the cumulative outer surfaces of fins. The relatively large surface area results in a lower heat flux. The lower heat flux obviates the need for forced convection. There is thus no need to use fans when the computer system is at room temperature.

Abstract: Radiating member 16 comes into contact with a flat surface of semiconductor device 15 mounted on a circuit board, thereby absorbing heat from device 15. For effective heat-transfer, radiating plate 16 should be made of materials having high thermal conductivity. Housing 18 is formed by molding and fixed with member 16. Housing 18 contains coolant passage 12, and passage 12 contains diaphragm 21. Diaphragm 21 should be made of materials having high thermal conductivity and being easy to work with, and should be processed into a shape that offers highly effective heat-exchange. Coolant passage 12 is partitioned, with diaphragm 21 and housing 18, into a fluid-flow path. A fluid absorbs heat from the semiconductor device while circulating through coolant passage 12; the heated-up fluid is sucked up by a circulating pump then led back to radiator 14 for being refreshed as coolant; and the cooled-down fluid goes out for the next round of the cooling process.

Abstract: A cooling mechanism within an integrated circuit includes an internal pump for circulating thermally conductive fluid within closed loop channels. The cooling channels are embedded within an integrated circuit die, such as in interlevel dielectric layers between metal levels. The channels are formed by engineering deposition of a layer to line trenches and form continuous voids along the trenches. Exemplary heat pumps comprise cavities, formed in communication with the channels, covered by piezoelectric actuators. Preferably, the actuators are wired to act in sequence as a peristaltic pump, circulating the fluid within the channels. The channels are positioned to carry heat from active devices within the integrated circuit, and a heat sink carries heat from the die.

Abstract: An elongate component of an apparatus is positioned generally transverse to a general direction of a forced air stream, upstream from at least one electrical component, and spaced apart from and extended over a portion of a circuit board such that removal of thermal energy emitted from the at least one electrical component results. The forced air stream is provided in the general direction to flow over the circuit board and toward the at least one electrical component located on the circuit board. The circuit board is located proximate to zero or more additional circuit boards. The elongate component is supported by a support component separate from the circuit board and the zero or more additional circuit boards. Turbulence is added to the forced air stream to increase the amount of air contacting the at least one electrical component through employment of the elongate component.

Abstract: A cooling apparatus using “low profile extrusions” is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion.

Abstract: A chassis for housing components includes a shell having an intake duct and an exhaust duct. The intake duct is coupled to an intake port for directing cooling air from the intake port into the chassis, and the exhaust duct is coupled to an exhaust port for directing cooling air out of the chassis. The intake duct and the exhaust duct include active and/or passive noise attenuating features for attenuating noise generated within the chassis, which allows the chassis to operate more quietly. The ducts are also dimensioned to attenuate electromagnetic radiation generated within the chassis, which prevents the escape of electromagnetic radiation from the chassis.

Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side.

Abstract: An amplifier for a portable telephone of the like is repaired or replaced without loss of an amplifying function even when the amplifier malfunctions. A plurality of door-shaped amplifier parts are provided on the left and right sides of an amplifier box. The left and right door-shaped amplifier parts can be mounted on opposite sides to each other. One amplifier part is in service and the other amplifier part is a backup. In a case where the amplifier part in service malfunctions, the other amplifier part is used or is mounted for use on the opposite side.