Abstract: The present disclosure provides a cooling device, the cooling device including a case including a first region and a second region isolated from the first region, a first cooling unit arranged at the first region to cool a first heat generating unit using an outside air, and a second cooling unit arranged at the second region to cool a second heat generating unit using inside air.

Abstract: In the electronic device, an inlet 10 is provided on a front face 1c of a first housing 1. Thus, it is possible to reduce the possibility of the inlet 10 being blocked by objects. That is, when a user uses a notebook computer in a normal position, his body opposes the front face 1c in many cases. Thus, when the inlet is provided on the front face 1c, the inlet is less likely to be blocked than when it is provided on any other face of the first housing 1. For this reason, the cooling efficiency within the first housing 1 does not drop.

Abstract: A multi-floor data center, comprising in one implementation, a plurality of floors; a first set of server racks disposed about a first vertical center axis on each floor, the first set of server racks formed in a substantially closed shape, with a substantially vertical open center comprising a first airflow plenum at least for air flow; a first opening in each of the floors, with the first opening aligned with the substantially vertical first airflow plenum on it respective floor, wherein the substantially vertical first airflow plenums on the floors are aligned for communication through the first openings in the floors; outer wall; a roof with a roof opening therein.

Abstract: A fastener includes a main body, a washer, and a spring. The main body includes a pole, two spaced latches extending from a top end of the pole, and two spaced legs extending down from a bottom end of the pole opposite to the latches. An annular blocking portion protrudes out from a circumference of the pole adjacent to the legs. A tapered first projection protrudes from an outer side of a distal end of each latch opposite to the other latch. A tapered second projection protrudes from an outer side of a distal end of each leg opposite to the other leg. The washer and the spring are fitted around the pole, and the spring is sandwiched between the washer and the blocking piece.

Abstract: A variable frequency drive system for use with a motor on an offshore platform having a variable frequency drive unit connected with a cooling unit. The variable frequency drive unit includes a climate controlled and sealed housing, a framework, a power input, a power output, a main circuit breaker, a power converter module, an autoswitchable transformer, an auxiliary power system, an output filter, and an air conditioning unit. The cooling unit includes a heat exchanger, a multistage centrifugal pump, a fresh water outlet, a mixing valve, and a process logic controller connected to a pair of temperature probes. The variable frequency drive system provides a drive system that is reliable and modular, allowing for versatility in placement on an offshore rig.

Abstract: An electric vehicle supply equipment may include a first cover element including a well portion to accommodate a first circuitry, wherein the first circuitry includes a chimney stack that couples to a venting hole. Also, the electric vehicle supply equipment may include a second cover element including a recess portion to accommodate a second circuitry, wherein the second circuitry includes a charcoal filter that couples to the chimney stack to absorb impurities generated by the first circuitry and the second circuitry. Further, the electric vehicle supply equipment includes a universal/serial connection port configured to couple to peripheral devices, wherein the universal/serial connection port is an optical coupled connection.

Abstract: An air-cooling method is provided which includes providing a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.

Abstract: In an electrical distribution cabinet a mechanism providing quick, reliable, passive arc blast control has a flue chamber surrounding the likely arc site such as an electrical connection point. The flue chamber provides a flue channel which lengthens the arc and attenuates the current and temperature until the arc is extinguished. Preferably, the flue chamber and channel are formed of opposable open-faced polyhedral structures, one fitting inside the other. The mechanism is particularly suited for draw-out circuit breaker connections in a switch gear cabinet.

Abstract: Semiconductor element groups constituting a unit are mounted on a cooler heat receiving part 1 on the same plane and are adapted to radiate heat by self-cooling or cooling by wind. First and fourth semiconductor elements Q1, Q4 are arranged on the lower side of the cooler heat receiving part, second and third semiconductor elements Q2, Q3 are arranged in the middle, a first diode D5 and a second diode D6 are arranged on the upper side, the first and second semiconductor elements Q1, Q2, as well as the third and fourth semiconductor elements Q3, Q4 are each arranged in positions opposite to each other in a horizontal direction with respect to a centerline of a cooler in a vertical direction.

Abstract: A computer assembly includes a processor integrated circuit; a hard disk drive electrically connected to the processor integrated circuit and a power supply assembly, powering the processor integrated circuit and hard disk drive; a liquid-tight case, entirely containing and physically isolating and protecting the processor integrated circuit, hard disk drive and power supply assembly, the liquid-tight case defining fluid channels; electrical connectors to permit connection of the computer to outside devices; and a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitating the movement of heat through the computer assembly.

Abstract: Certain embodiments of the present invention provide an apparatus for closing off an opening above, below, or between electronic equipment in a rack. The rack includes a pair of equipment rails. The electronic equipment is mounted to the equipment rails. The apparatus includes a base, a roller shade, and a handle. The roller shade is rotatably connected to the base and includes a free end extending from the base when the roller shade is rotated. The handle is connected to the free end of the roller shade. The base is removably connected to the equipment rails at a first position. The handle is removably connected to the equipment rails at a second position spaced apart from the first position such that the free end of the roller shade is extended to close off the opening in the rack.

Abstract: A modular datacenter having multiple levels. The levels are stackable, and the number of levels can be selected based upon a desired installation. The datacenter includes walls or other structures that define ducts that extend through all the levels. The ducts can be used as hot and cold aisles for servers and networking equipment. The ducts can be formed by concentric cylinders.

Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.

Abstract: Disclosed herein is an electronic apparatus including a component disposed inside the electronic apparatus, a vent that is located in a first direction with respect to the component disposed inside the electronic apparatus and is opened toward the external of the electronic apparatus, a plurality of first louvers that are provided in the vent and are lined in a second direction perpendicular to the first direction when the vent is viewed along the first direction, and a plurality of second louvers that are located between the component disposed inside the electronic apparatus and the plurality of first louvers and are lined in the second direction when the vent is viewed along the first direction. A straight line that passes between adjacent two first louvers and is along the first direction intersects any of the plurality of second louvers.

Abstract: The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.

Abstract: An apparatus for tracking a portable asset includes a solar panel, an electronics assembly integrated into an enclosure, and a heat spreading assembly adjacent the solar panel, the heat spreading assembly located to form an air gap separating the heat spreading assembly from the electronics assembly such that heat generated by the solar panel is dissipated in the air gap before reaching the electronics assembly.

Abstract: A thermal interface unit includes a pedestal, a first contact surface below the pedestal to interface with a first die and a flat spring to enable the first contact surface to adapt to a variable height of a first die of a multi-chip package (MCP).

Abstract: To determine a system condition, temperature information from at least one temperature sensor in the system is received, along with second information from at least a second type of sensor in the system. An out-of-range temperature condition is detected according to the received temperature information. According to the second information, one of plural potential causes of the out-of-range temperature condition is selected.

Abstract: An apparatus and method for cooling a semiconductor device. The apparatus comprises a chamber configured for receiving a cooling fluid; and a plurality of contact elements comprising respective first ends disposed within the chamber; wherein, during operation, respective second ends of contact elements contact a surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An improved electronic communications system and process 100 with front to back cooling can be provided in which the flow of influent cooling air can be directed horizontally through an intake cooling plenum chamber 145-146 positioned above or below line cards 127-129 and then passed downwardly through an inlet side cooling plenum 139-141. The cooling air can thereafter be propelled sideways, laterally and horizontally across passageways 138 between the line cards to remove heat generated by the line cards. The effluent heated air can be passed upwardly through an outlet side cooling plenum 142-144 and can be discharged through an exhaust cooling plenum to chamber 147-148 which can be diagonally separated from the intake cooling plenum chamber 145-146 by a fluid-impermeable plate 149-151.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space.

Abstract: An electronic substrate 200A mounts a heater element 220. A chassis 300A houses an electronic substrate 200 in an airtight manner. A cooling unit 400 cools the electronic substrate 200. The cooling unit 400 includes a heat receiving part 410 and a heat radiation part 420. The heat receiving part 410 receives heat from the electronic substrate 200. The heat radiation part 420 is connected with the heat receiving part 410, and radiates heat from the electronic substrate 200 which has received by the heat receiving part 410. Further, the heat receiving part 410 is provided in the chassis 300A in an airtight manner, and the heat radiation part 420 is provided outside the chassis 300. As a result, efficient cooling is possible, and moreover, maintenance replacement work can be performed for each piece of electronic substrate housing equipment individually.

Abstract: A datacenter or server farm having servers mounted to blow air at an angle in a hot aisle. The angled air flow can provide a cyclonal effect in the hot aisle, enhancing heat convention in the hot aisle.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: A method for cooling an electronic display is disclosed herein. The electronic display preferably contains a rear surface, where a substantially planar surface is positioned adjacent to the rear surface to define a gap. Cooling air is preferably forced through said gap. In some embodiments, the additional step of circulating gas around the display in a closed loop may also be performed. In these embodiments the circulating gas may contact the front viewing surface of the electronic display, so that heat can be removed from this surface.

Abstract: A power supply device supplies power to a substrate holder having a plurality of electrodes. The device includes a first fixed conductive member, a second fixed conductive member, a fixed insulating member fixed to an insulating housing portion and configured to insulate the first fixed conductive member from the second fixed conductive member, a first rotation conductive member, a second rotation conductive member, a rotation insulating member fixed to an insulating column portion and configured to insulate the first rotation conductive member from the second rotation conductive member, a first power supply member configured to supply a first voltage to the substrate holder via the first rotation conductive member and the first fixed conductive member, and a second power supply member configured to supply a second voltage to the substrate holder via the second rotation conductive member and the second fixed conductive member.

Abstract: A flow-guiding hood that guides a flow of air in a computer or an electronic device includes a plurality of individual parts which includes a first flow-guiding element made of a substantially planar first material that channels the flow and at least one second flow-guiding element made of a different, second material and likewise channels the flow, wherein the second flow-guiding element rests on and/or is attached to the first flow-guiding element.

Abstract: A thermal conditioning system for an inductive charging system. An open enclosure charging unit includes at least one surface generating an electromagnetic field for inductively charging a portable device. A primary conduit coupled to the open enclosure charging unit. The primary conduit outputs conditioned air to the open enclosure charging unit. The conditioned air output by the primary conduit maintains a temperature of the portable device at a predetermined temperature range within the open enclosure charging unit.

Abstract: A daughterboard can include an airflow path or opening.

Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: The invention relates to a power switch cabinet of a device for producing electric energy. The technical object of obtaining optimum scalability and cooling of a power switch cabinet despite little space being required is achieved according to the invention in that the power switch cabinet has a machine connection, a power module and a mains connection, wherein the power module has a machine converter, a mains converter, a direct voltage intermediate circuit and a chopper, and the arrangement of the components substantially corresponds to the direction of the power flow.

Abstract: The invention relates to a switch cabinet arrangement of a device for generating electrical energy, wherein the switch cabinet arrangement comprises at least two separate power switch cabinets. The technical object of achieving an optimum scalability of devices for generating electrical energy with at the same time a simple installation and maintenance of the power switch cabinets despite a small available installation space, is achieved according to the invention in that the power switch cabinets respectively comprise a machine connection, a power module, a mains connection and a decentralised control unit, wherein the power module comprises a machine converter, a mains converter, a direct voltage intermediate circuit and a chopper, and wherein the power switch cabinets are electrically connected in parallel to one another via the machine connection and the mains connection.

Abstract: A master management server for managing print document information in a master includes an acquisition unit configured to acquire a disposal reference date from a system management server for managing a date used as a reference date in disposal processing of print document information, and a master management unit configured to, if the acquired disposal reference date differs from an executed disposal reference date retained in the master management server, perform disposal processing in which print document information is deleted or is set as a non-target for printing, based on the acquired disposal reference date, and transmit a cache update request, containing print document information for which disposal has been suspended in the disposal processing and the disposal reference date used in the disposal processing, to a cache management server for managing cache of a group identified by group identification information contained in the print document information.

Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.

Abstract: Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.

Abstract: A switching power supply has electronic parts that configure a switching circuit. The electronic parts are accommodated in a casing. A seat member is formed unitarily with the casing on which the electronic parts are mounted. A coolant channel is formed through the seat member so as to be open at least at two positions of an outer wall surface of the casing. Coolant that flows through the coolant channel cools the electronic parts mounted on the seat member.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Abstract: A system includes a removable module to process data when installed in the system, where the module includes a first surface via which heat, that is generated by the module, is transferred. The system also includes a port into which the module is installed; and a heat sink, associated with the port, to dissipate the heat received from the first surface, where the heat sink includes a second surface on which a material is applied, and where the material makes contact with the first surface when the module is installed that allows the heat to be received from the first surface, conforms to an American Society for Testing Materials (ASTM)-B607-91 standard or a United States military specification-C-26074, and transfers the heat to the second surface that allows the module to operate at a temperature that is less than a threshold.

Abstract: A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.

Abstract: Power storage module for railway vehicles, comprising multiple interconnected capacitors (1) with terminals (2) for establishing an electrical connection with a single connection plate (7) common to all the capacitors (1) and mechanical securing by means of a support plate (6) placed between the terminals (2) and the connection plane (7), the terminals (2) being oversized in such a way as to define a cooling channel between the support plate (6) and the capacitors (1), the connection plate (7) being insulated from said cooling channel by means of the support plate (6).

Abstract: A data room air circulation system has adjacent racks located side by side. The racks have a front, a rear, and a first and second side. A computer system component is mounted in at least one of the racks. A cold aisle, containing cold air, is located at the front of the racks. As the cold air passes through the component, hot air is formed and discharged to a hot aisle located at the rear of the racks. A baffle, having a front end, a rear end, and a hot air side is located between the racks. The front baffle end is attached to the front of one of the racks, and the rear end is attached to the rear of the other of the racks. The baffle separates the cold aisle from the hot aisle for at least the height of the baffle.

Abstract: A display unit and a vending machine having the same. The display unit includes a display panel to display an image, a circuit board to control the display panel, a board bracket installed at a rear of the display panel and formed with a receiving section to receive the circuit board, and a plurality of inlet holes and a plurality of outlet holes formed in opposite surfaces of the board bracket to allow external air to flow through the receiving section. The air travels through the inlet and outlet holes and passes through the receiving section in one direction to cool the display panel and the circuit board. Thus, the display unit is prevented from malfunctioning and the display panel is prevented from being degraded by heat even if tempered glass is installed at a front of the display panel.

Abstract: An electronic device thermal management system comprising a thermal management controller configured to maintain a temperature level within a housing of an electronic device based on a signal indicative of a temperature of at least a portion of a wall of the housing of the electronic device.

Abstract: A power converting apparatus includes a housing, a cable, and a grommet supporting member. The housing includes a housing base, a main body, and an air duct. The housing base has a first surface and a second surface and includes a through hole. The main body includes a plurality of electronic components on the first surface of the housing base. The air duct is disposed on the second surface of the housing base, and cooling air flows through the air duct. The cable is disposed through the through hole of the housing base so as to be wired between the main body and the air duct. The grommet supporting member is in the air duct or the main body. The grommet supporting member supports a grommet through which the cable is disposed. The grommet supporting member is not integral with the housing base.

Abstract: According to one embodiment, a liquid cooling type power conversion apparatus is provided. The liquid cooling type power conversion apparatus has a power conversion apparatus and a cooling apparatus which are provided in an engine room of a railway vehicle, an electric component and a plurality of semiconductor devices which are provided in the power conversion apparatus, a third heat exchanger located between the electric component and an electric blower, a cooling body on which the plurality of the semiconductor devices are mounted, a first heat exchanger provided in the cooling apparatus, a second heat exchanger provided in the cooling apparatus having a size smaller than the first heat exchanger 111b, a piping to connect the third heat exchanger 5 and the second heat exchanger, and a piping to connect the cooling body and the first heat exchanger.

Abstract: An electric power converter can include an electric power converter case mounted on rolling stock, a unit mounting section formed in the electric power converter case and having a cooler insertion opening, and an internal unit mounted on the unit mounting section. The internal unit can include a cooler projecting from the unit mounting section through the cooler insertion opening into an outside air introduction section into which the outside air is introduced and a plurality of securing holders made to butt against the unit mounting section for securing the internal unit. Each of the securing holders can have a butting surface for butting against the unit mounting section to form a step by making the butting surface protrude from the opposed surface of the internal unit facing the unit mounting section.