Abstract: An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.

Abstract: A water proof encasement for an electronic device, such as an electronic laser is used for DJ lighting, holiday lighting, video equipment, and the like. The water proof encasement of the present invention allows a user to install a laser to place outside in the elements to shine on, for example, the outside of a house for holiday lighting.

Abstract: A method for a packaged leadless semiconductor device including a heat sink flange to which semiconductor dies are coupled using a high temperature die attach process. The semiconductor device further includes a frame structure pre-formed with bent terminal pads. The frame structure is combined with the flange so that a lower surface of the flange and a lower section of each terminal pad are in coplanar alignment, and so that an upper section of each terminal pad overlies the flange. Interconnects interconnect the die with the upper section of the terminal pad. An encapsulant encases the frame structure, flange, die, and interconnects with the lower section of each terminal pad and the lower surface of the flange remaining exposed from the encapsulant.

Abstract: A printed circuit board having an electronic component which is to be cooled by a cooling surface biased thereon, where the biasing elements are abutted not by the PCB but a stiffer element attached to the PCB in order to not strain or bend the PCB.

Abstract: A thermally controlled assembly having two parallel PCBs defining there between, and by the aid of a channel forming element, a channel in which air is forced, using a fan, to cool components in the channel. The fan has a cooling surface cooled by air from the fan and which is biased toward an element provided in a space below the cooling surface. The forced air also drawing air from outside the assembly through the space and into the channel to cool other elements provided in the space.

Abstract: In accordance with aspects of the disclosure, a system and methods for thermal management of at least one processor positioned within a computing device include drawing external fluid into an enclosure of the computing device via an inlet aperture with use of at least one active pump positioned within the enclosure, directing the drawn fluid from the inlet aperture through an inlet channel formed within the enclosure to the active pump, passing the drawn fluid over the processor positioned within the enclosure by directing the drawn fluid from the active pump through an outlet channel formed within the enclosure, and expelling the drawn fluid from the enclosure of the computing device via an outlet aperture with use of the active pump after passing the drawn fluid over the processor so as to provide thermal management of the processor.

Abstract: A system and a method of controlling a blower of a vehicle. The method includes detecting, by a controller, a turning of a key to an off position of the vehicle. In addition, the controller is configured to detect whether a high voltage DC-DC converter and a high voltage battery are normally operated in response to detecting the turning of the key to an off position. Regenerative energy generated by a regenerative brake operation of the blower is transmitted by the controller through two different paths based on whether the high voltage DC-DC converter and the high voltage battery are normally operated.

Abstract: A simple configuration for cooling comprises a front-back air supply and exhaust system. A first circuit board is located in front of a relay circuit board. A cooling unit and a second circuit board are placed behind the relay circuit board in a chassis. A first air passage allows intake air through an intake hole in a front side of the first circuit board unit to pass through the first circuit board and then through an opening in the relay circuit board to the cooling unit. A second air passage allows intake air through an intake hole in a front face of the chassis to pass through a lateral side of the first circuit board and then through a vent hole in a partition provided at the lateral side of the first circuit board. The second circuit board is placed in the second air passage.

Abstract: Electronic displays and metal micropatterned substrates are described comprising a graphic defined by a contrasting area adjacent the graphic. In one embodiment, the graphic is visible when the display is viewed with reflected light and the graphic is substantially less visible or invisible when viewed with backlighting transmitted through the metal micropatterned substrate. The graphic and contrasting area have a total metal micropattern density that differs by no greater than about 5% and more preferably by no greater than 2%.

Abstract: A method of cooling electronic equipment is disclosed and includes substantially continuously circulating ambient air across a plurality of rack-mounted electronic devices, monitoring the temperature of air in or around a group of devices in the plurality of rack-mounted electronic devices, and providing substantially cooler-than-ambient air to the group of devices when the monitored air temperatures rises above a set value.

Abstract: An electronic device includes a heat-dissipating base, a first printed wiring board assembly, and a second printed wiring board assembly. The first printed wiring board assembly is disposed on the heat-dissipating base. The first printed wiring board assembly includes a first printed wiring board and at least one first electronic component. The first electronic component is disposed on the first printed wiring board, such that the first printed wiring board assembly has a raised portion and a concave portion relative to the raised portion. The second printed wiring board assembly is at least partially disposed in the concave portion.

Abstract: A motor drive unit includes a housing in which a heat sink and at least one electronic component to be cooled by the heat sink are disposed. An end of the heat sink which is opposite to the electronic component is inclined relative to a horizontal plane so as to prevent a cutting fluid dropping from the heat sink from falling onto another electronic component located below the heat sink.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack and positioned for air passing through the electronics rack to pass across the heat exchanger. The heat exchanger is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

Abstract: Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.

Abstract: An electronic apparatus partially overmolded with a overmold sealing material that seals the circuit board, protects the electrical components on the circuit board and provides seals between the circuit board and mating devices is disclosed. The electronic apparatus may be an engine controller. The electrical components may be an electrical edge connector, a sensor, and a heat sink. The sensor may be a pressure sensor. The controller may be connected to a throttle body such that the overmold sealing material provides a first seal between the controller and the throttle body allowing the pressure sensor to be in fluid communication with the interior of the throttle body. A wire harness may be connected to the controller such that the overmold sealing material provides a second seal between the wire harness and the controller protecting the electrical connection. The overmold sealing material may also be translucent.

Abstract: A cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves.

Abstract: A container data center includes a container and a server cabinet received in the container. The server cabinet includes a rack and a number of heat dissipation devices mounted to a rear side of the rack. Each heat dissipation device includes a case fixed to the rack, a fan mounted to an outer side of the case, and a heat dissipation plate received in the case and aligning with the fan. The heat dissipation plate defines a vent. The fan draws heat air through the vent of the heat dissipation plate from the rack, and the heat air is cooled by refrigerant received in the heat dissipation plate to become cool air. The cool air flows in the container, and circularly flows into the cabinet from a front side of the cabinet.

Abstract: A system includes an optical transmitter package comprising an optical transmitter to generate optical transmission signals based on electrical transmission signals. The system also includes an optical receiver package comprising an optical receiver to generate electrical reception signals based on optical reception signals. The system further includes a printed circuit board (PCB) on which the optical transmitter package and the optical receiver package are mounted. The PCB includes a heat generating circuit component. The optical transmitter package can be mounted to the PCB to subjected to less heat from the heat generating circuit component than the optical receiver package.

Abstract: An adjustable blocking arrangement for electronic hardware or computer racks, for preventing the undesired leakage of air through rack spaces not filled with hardware. An airflow control device is provided comprising a flexible web and a magazine adapted to receive the part of the flexible web that is not deployed. The device is adapted such that a length of the web may be deployed to sealingly block a space in the rack that is not filled with hardware modules, to prevent the flow of air through the space. The device may comprising a detection system adapted to detect the space in the rack that is not filled with hardware modules, and a processing system adapted to receive a signal from the detection system, and as a function of the signal to automatically deploy or retract the flexible web so as to sealingly block the space.

Abstract: According to one embodiment, a server rack includes a server, a housing which includes a ventilation opening part, and surrounds the server, a water sensor which is provided outside the housing and senses water, a closing member which is movable between a first position in which the closing member is dislocated from the opening part and a second position in which the closing member covers the opening part, a moving mechanism which moves the closing member from the first position to the second position, an adhering mechanism which brings the closing member that has moved to the second position into close contact with the housing, and a controller which operates the moving mechanism and the adhering mechanism, when the water sensor senses water.

Abstract: A support for plural display modules each including a rearwardly extending heat sink includes a compound structural frame that defines a frame frontside, a frame backside, and a vertical cooling conduit, the frame backside for mounting the structural frame to a mounting structure, the frame frontside defining a bay member, the bay member defining an opening that couples to the vertical cooling conduit, the bay member configured to receive and support one of the display modules with the heat sink extending through the opening and into the vertical cooling conduit whereby the display module is convectively cooled by the vertical motion of air through the cooling conduit.

Abstract: An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

Abstract: A cooling mechanism for cooling an object includes a duct that leads a fluid for cooling, multiple fans that are placed on a channel in the duct and send forth the fluid for cooling, and a bypass channel that detours at least one of the multiple fans.

Abstract: An improved solution for cooling a data center is provided. In an embodiment of the invention, a data center design that combines physical segregation of hot and cold air streams together with a data hall variable air volume system is provided. The invention is a data center design that resolves air management issues of re-circulation, bypass and load balance. Bypass is airflow supplied by the cooling units that directly returns without cooling servers. Recirculation airflow is server discharge warm air that returns directly without being cooled. Load balance is supplying the required server airflow. An embodiment includes physical segregation of cold and hot air streams and by providing variable air volume to match server load. Air segregation is done by enclosing the hot aisle end and above the cabinets. The air conditioning system provides variable air volume to the data hall (cold side) to meet server demands.

Abstract: An electric machine with a closed circuit air cooling provides using only passive elements to realize an efficient and compact heat transfer from inside the electric machine to an ambient heat sink.

Abstract: The present invention is directed to an enclosure for electrical equipment. The enclosure includes a power plate assembly and a vented cover installed over the power plate assembly. Electrical components operating at 50 volts or more are mounted to a rail in the power plate assembly. The vented cover separates the electrical components mounted to the rail from the electrical components mounted in the enclosure.

Abstract: A system for use with a computing rack that prolongs operation of computing devices mounted within the rack by preventing or at least limiting the circulation of airflow (e.g., hot airflow) through empty receiving bays of the rack upon removal of computing devices from the receiving bays. In one arrangement, the system includes a plurality of airflow restriction devices (e.g., baffle plates) movably secured adjacent respective receiving bays of the cabinet. Each airflow restriction device is automatically movable between a deployed position to restrict airflow through respective receiving bay in the absence of a computing device in the receiving bay and a refracted position to allow for mounting of a computing device in the receiving bay (e.g., so that the computing device can exhaust hot air out of the rear portion of the receiving bay).

Abstract: An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from the server's compute resources. An embodiment uses optical technology to accomplish the fast communication speeds needed between the compute resources and the remotely located I/O resources. Specifically, an embodiment uses fiber-optic cables and electrical-to-optical conversion to facilitate communication between the compute resources and the I/O resources. The compute resources and the remotely located I/O resources can be designed differently to allow conductive liquid cooling for the compute resources and air cooling for the I/O resources.

Abstract: An electronic device is provided that includes a base having a top portion and a bottom portion. The bottom portion may include a first bottom part and a second bottom part. The first bottom part may form a first plane, and the second bottom part may form a second plane, the second plane being non-planar with the first plane. The second bottom part may include an input opening. The top portion of the base may include an output opening. The input opening and the output opening may allow air to flow from behind the electronic device to over the base.

Abstract: In an embodiment, a medium voltage drive system includes a transformer, multiple power cubes each coupled to the transformer, and a manifold assembly. Each power cube includes cold plates each coupled to a corresponding switching device of the cube, an inlet port in communication with a first one of the cold plates and an outlet port in communication with a last one of the cold plates. The manifold assembly can support an inlet conduit and an outlet conduit and further support first and second connection members to enable blind mating of each of the first connection members to the inlet port of one of the power cubes and each of the second connection members to the outlet port of one of the power cubes to enable two phase cooling of the plurality of power cubes.

Abstract: An electric motor controller includes controller electronics configured to control an electric motor. The electric motor controller also includes a thermoelectric cooler in thermal communication with the controller electronics. The thermoelectric cooler is configured to receive a braking current associated with braking of the electric motor and provide cooling to the controller electronics.

Abstract: A vertical exhaust duct for an electronic equipment enclosure is provided. The vertical exhaust duct includes a first duct section, a second duct section slidably connected to the first duct section and extendable to a first height above the first duct section, and a third duct section slidably connected to the second duct section and extendable to a second height above the second duct section.

Abstract: There is provided a heat sink for measuring temperature of electronic component. The heat sink includes a heat radiating plate, a fin, a heat receiving plate, and a temperature detector. The heat radiating plate has a first surface that receives heat from the electronic component. The fin is for radiating heat energy conducting through the heat radiating plate and is connected to the heat radiating plate. The heat receiving plate arranged apart from the heat radiating plate has a second surface movable to be parallel to the first surface. The temperature detector that detects a temperature is disposed on the heat receiving plate.

Abstract: An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.

Abstract: An electric power conversion device for a vehicle includes a box body partitioned into a cooling air chamber and a mounting chamber, a heat generation part which is arranged in the inside of the mounting chamber and includes a semiconductor element which performs power conversion, and a heat radiation part mounted on a partition between the cooling air chamber and mounting chamber, and configured to radiate heat generated from the heat generation part, wherein the heat generation part is detachably mounted on the heat radiation part in a state where the heat generation part is arranged on a side opposite to the heat radiation part with the partition sandwiched therebetween, and a heat transfer sheet is provided between the heat generation part and the heat radiation part.

Abstract: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes an activity monitor configured to infer a user touch to the shell in response to a detected activity of the portable electronic device. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the inferred user touch.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: An electronic device includes: a frame-body that has a rectangular-cross-section and includes: first and second inner-walls that oppose each other, third and fourth inner-walls that oppose each other and that intersect with the first and second inner-walls, first engagement-members arranged on the first inner-wall at a first interval, second engagement-members e arranged on the second inner-wall at the first interval so as to oppose the first engagement-members, the second engagement-members each having a structure that allows each of the second engagement-members to be engaged with a corresponding first engagement-member of the first engagement-members, third engagement-members arranged on the third inner-wall at a second interval, and fourth engagement-members arranged on the fourth inner-wall at the second interval so as to oppose the third engagement-members, the fourth engagement-members each having a structure that allows each of the fourth engagement-members to be engaged with a corresponding third eng

Abstract: Example electrical component assemblies are described. In some examples, the electrical component assembly may include a printed board and an electrical component on the printed board, the electrical component defining a first surface adjacent the printed board and one or more second surfaces other than the first surface. The assembly may also include a thermal bridge comprising a plurality of vias extending through the thermal bridge, and a thermally conductive member interposed between the one or more second surfaces of the electrical component and the thermal bridge. In some examples, the thermally conductive member extends at least partially through the plurality of vias of the thermal bridge. During operation of the electrical component, the assembly configuration may facilitate thermal transfer from a first direction defined by the thermally conductive member to a second direction defined by the thermal bridge to transfer thermal energy away from a surface of the electrical component.

Abstract: An air partition member includes a main body, a sliding plate slidably received in the main body, and two side plates. One of the plates is pivotably connected to a first end of the main body. The other side plate is pivotably connected to a distal end of the sliding plate away from the first end of the main body.

Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.

Abstract: A system and method of reducing consumption of electricity used to cool electronic computer data center, networking, and telecommunications equipment, and to reduce the incidence of thermal failure of electronic components, includes provision 5 of one or more partitions to reduce the volume of the cooled environment supplying coldest possible cooled air from air conditioning systems to a chamber adjacent to racks containing the electronic components, preventing dilution of the supplied cooling airflow by warmer air from outside of the reduced volume environment, and controlling the delivery of cooling air flow through the reduced volume of the cooled environment.

Abstract: A protective case with multiple air tunnels for the protective case, so the heat absorbed by contact blocks from the electronic equipment is radiated rapidly out of the protective case through vent pipes. When the electronic equipment is supported up to watch movie or play games, because the hot air will raise and be exhausted from the upper part, and the fresh cool air will come inside from lower part of the protective case, as a result, the ventilation is accelerated and the heat dissipation performance is greatly improved.

Abstract: A chassis for a plurality of computers for use in a data center, the chassis at least one extensible fin, the fin either extensible perpendicularly from the front of the chassis or extensible parallel with the front of the chassis.

Abstract: An apparatus, system, and method are provided for venting an enclosure, such as a chassis housing electronic equipment. The method includes receiving, at least one air directing surface, airflow moving in a first direction, the at least one air directing surface being disposed externally from the chassis at a predetermined placement relative to the at least one ventilation surface in a path of the airflow. The at least one air directing surface has a configuration to alter the direction of the airflow between the air directing surface and the at least one ventilation surface. The method also includes redirecting the airflow between the at least one air directing surface and the at least one ventilation surface to at least a second direction using the air directing surface.

Abstract: The electric power converter has a transformer having a primary coil and a secondary coil, a first circuit section connected to the primary coil side of the transformer, a second circuit section connected to the secondary coil side of the transformer, and a case that accommodates the transformer, the first circuit section, and the second circuit section inside and has a lower opening and an upper opening. An air passage communicated with an exterior of the case is formed inside the case in a vertical direction between the lower opening and the upper opening. At least one of the transformer, the first circuit section, or the second circuit sections is disposed in the air passage.

Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.

Abstract: An air-cooling apparatus is provided which includes a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.

Abstract: The present invention is directed to an enclosure for electrical equipment. The enclosure includes a power plate assembly and a vented cover installed over the power plate assembly. Electrical components operating at 50 volts or more are mounted to a rail in the power plate assembly. The vented cover separates the electrical components mounted to the rail from the electrical components mounted in the enclosure.