Abstract: A method and system for variable air cooling for data centers. The system may include: an enclosure to be cooled suitable for housing hardware components; a cooling system including: a first air input for controllably allowing input of outside air from outside the enclosure; a second air input for controllably allowing input of recycled air from the enclosure; a selectively activatable cooling mechanism; an air output for allowing output of air into the enclosure; a first temperature monitor for monitoring an outside air temperature of air outside the enclosure; a second temperature monitor for monitoring a blowing air temperature of air at the air output; and a control mechanism for controlling an operation of the first air input, the second air input, and the cooling mechanism dependent on a monitored outside air temperature at the first temperature monitor and a monitored blowing air temperature at the second temperature monitor.

Abstract: An occupancy-sensing apparatus a device control assembly including a detector configured to generate an image wherein the device control assembly includes one or more illumination sources configured to emit illumination including at least one wavelength of radiation measurable by the detector. The apparatus includes a controller communicatively coupled to the detector configured to detect occupants based on the image generated by the detector, wherein the controller is configured to determine an active state of the detected occupants, the activity state including at least one of a stationary state or moving state.

Abstract: A network includes a first device control assembly and at least one second device control assembly. The first device control assembly is electrically connected to a power distribution panel. The first device control assembly is further configured to regulate a load. The at least one second device control assembly is electrically connected to a power distribution panel. The first device control assembly is in data communication with the at least one second device control assembly. The first device control assembly regulating the load based on the data communication from the at least one second device control assembly.

Abstract: A multi-stage air moving system for cooling servers in a rack includes a rack-level air moving device that moves air through the rack, one or more server-level air-moving devices that move air through one or more of the servers, one or more sensors, and an air flow control system. The sensors sense characteristics of air in the rack. The air flow control system includes one or more controllers. The one or more controllers control the rack-level air-moving device and the server-level air moving devices in response to one or more sensed characteristics.

Abstract: An electrical junction box includes a circuit assembly including a circuit board and a conductive plate, a engaging component (terminal block), a frame including an installation portion to which the engaging component is installed. A first engaging portion (first bus bar) is formed on one end side of the circuit assembly, and a second engaging portion (second bus bar) is formed on another end side of the circuit assembly. The frame includes a first engaged portion (receiving portion) that is engaged with the first engaging portion and receives the one end side of the circuit assembly. The engaging component includes a second engaged portion (auxiliary receiving portion) that is engaged with the second engaging portion and receives the other end side of the circuit assembly.

Abstract: An enclosure assembly for housing printed circuit boards and related electrical components that provides secured component mounting in outdoor environments.

Abstract: A modular data center includes a plurality of first containers and a plurality of second containers. The plurality of first containers and second containers are partitioned into a plurality of functional modules respectively, the functional modules of the plurality of first containers being arranged in parallel, and the functional modules of the plurality of second containers being arranged in parallel on one side of the plurality of first containers and corresponding to the functional modules of the plurality of first containers respectively. The present disclosure combines the functional modules of the plurality of first containers and the plurality of second containers into modular data centers with different forms, capacities, and data center usability tiers, and the assembly of the plurality of first containers and second containers with standardized sizes may facilitate the transportation and reduce the time and cost of assembling and delivery of the modular data center.

Abstract: A battery charger that is configured to charge a battery pack including a secondary battery includes: a housing; and a charging circuit unit disposed in the housing. The housing defines a first air passage in which air flows to cool the secondary battery and a second air passage in which air flows to cool the charging circuit unit. The second air passage is independent from the first air passage.

Abstract: A semiconductor package structure and a fabrication method thereof are provided. The fabrication method comprises: providing a substrate strip, the substrate strip comprising a plurality of substrate units; disposing a plurality of chips on the plurality of substrate units; disposing a packaging encapsulant on the substrate strip to encapsulate the chips; forming a warp-resistant layer on a top surface of the packaging encapsulant; and dividing the substrate strip to separate the plurality of substrate units to further fabricate a plurality of semiconductor package structures, wherein the warp-resistant layer is formed of a selected material with a selected thickness to make a variation of warpage of the semiconductor package structure at a temperature between 25° C. and 260° C. to be smaller than 560 ?m.

Abstract: An application processing system for placing applications and their associated data into a colocation data center, wherein an application placement module is configured to perform the method of steps including: constructing a facility communication node graph; constructing a composite elastic map which represents the compute nodes in the colocation data center; associating a force function between two nodes based on communication bandwidth; constructing an application usage data space; inserting the node graph into the application data space; assigning the applications to the compute nodes; associating a force function between each application and each compute node based on the assignment; determining an elastic map energy (EME) for the elastic map, wherein the EME is the total energy of the system; and assigning the real-world applications to the real-world compute nodes in the data center if the EME is less than a threshold energy.

Abstract: Panels are extended from housings affixed to equipment racks that abut a cold aisle, during normal operation of the electronic equipment installed in the racks, in order to fully or partially contain the cold aisle (e.g., within a data center). The panels may extend automatically (e.g., during powering up of the equipment) and/or in response to a specific control. In response to an emergent condition (e.g., fire), and/or activation or deactivation of a control, the panels automatically retract. The retraction allows a fire suppression agent (e.g., water, foam) to enter the aisle, may allow easier access to the equipment, and/or provide other benefits. The panels are generally transparent in order to allow light to enter the aisle even when the panels are extended. In its extended orientation, a given panel may engage or be in contact with an opposing panel (e.g., across the cold aisle) and/or an adjacent panel.

Abstract: A circuit board arrangement includes a deflector configured to guide flow over an electronic component on a circuit board disposed in an air flow. A method for thermal management of a circuit board includes modifying an air flow over the circuit board to increase speed or direction the air flow over a component of the circuit board using a deflector.

Abstract: A telecommunications cable management assembly (100) for a distribution frame (10) is disclosed. The cable management assembly (100) includes a front plate (110) extending between first and second ends (110a, 110c) and is provided with apertures (112) for mounting telecommunications components (20). A first side bracket (120) is mounted with the first end (110a) of the front plate (110) to the distribution frame (10). The first side bracket (120) supports cables (26) extending laterally from components (20). A second side bracket (130) is mounted with the second end (110c) of the front plate (110) to the distribution frame (10). The second side bracket (130) can also support cables (28) extending laterally from components (20).

Abstract: An enclosure and a method for dispersing heat generated by an electrical component within the enclosure is provided and includes associating the electrical component with a conductive via/trace such that the conductive via/trace absorbs the heat generated by the electrical component, wherein the conductive via/trace is constructed from a heat conducting material; directing heat generated by the electrical component away from the electrical component by associating the conductive via/trace with a column having a column wall that defines a column cavity communicated with a column first opening and a column second opening, wherein the column wall is thermally conductive to receive heat flowing into the at least one of the plurality of columns; and allowing an airflow to flow through the column first opening into the column cavity and out of the column second opening, such that the airflow contacts the column wall within the column cavity.

Abstract: A connector is provided and includes a bottom, a top case positioned above the bottom case, and a partition is positioned between the top case and the bottom case. A plurality of ports is provided between the top case and the bottom case and the ports are separated by the partition. A temperature exchange device is mounted on the bottom case.

Abstract: A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

Abstract: A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.

Abstract: Described herein is an integrated data center that provides for efficient cooling, as well as efficient wire routing.

Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.

Abstract: A fan serial connection structure includes a series fan assembly and a connection member assembly. The series fan assembly includes a first fan frame and a second fan frame serially connected with the first fan frame. The connection member assembly includes a first connection member and a second connection member. The first connection member has a first locating section and two first side sections respectively connected with two ends of the first locating section. The second connection member has a second locating section and two second side sections respectively connected with two ends of the second locating section. The first and second locating sections are respectively assembled and connected with two opposite sides of the series fan assembly in the serial connection position. The first and second side sections are respectively assembled and connected with two other opposite sides of the series fan assembly in the serial connection position.

Abstract: Resource management for data centers is disclosed. In an exemplary embodiment, a method includes determining electrical power usage for the data center, and determining cooling fluid usage for the data center. The method also includes processing a resource utilization cap for the data center, and adjust ng at least one of the electrical power and the cooling fluid for the data center based on the resource utilization cap.

Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.

Abstract: Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.

Abstract: Provided is a vibrating body mounting structure capable of reducing vibrations generated from a plurality of vibrating bodies. Vibrating body mounting structure (48) includes base member (40), a plurality of retaining members (39, 45), and connecting damper (49). The retaining members include first portions (39a, 45a) secured to the base member, and second portions (39b, 45b) adjacent to the first portions and retaining vibrating bodies (24, 25). The connecting damper connects second portion (39b) of one retaining member (39) of the plurality of retaining members to second portion (45b) of the other retaining member (45) of the plurality of retaining members.

Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a back cover disposed on a rear side of the display panel, the back cover having a curved shape of which both ends protrude forward, and a fixing part fixing the back cover to maintain the curved shape of the back cover. The display panel is curved in a shape corresponding to that of the back cover.

Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be established by one surface of a component that supports one or more heat-producing components in the separate plenum, including an underside of a circuit board mounted in the interior. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Abstract: The invention provides a fixed structure for an interface card. The interface card is fixed within an interface slot by the fixed structure. The interface slot is provided on a front side therefore with at least one protruding block. The fixed structure comprises a metal shell, which is assembled to a surface of the interface card, and comprises a pressing portion and an engaging portion. When the interface card is to be inserted into the interface card, the user presses the pressing portion of the metal shell so as to expand the engaging portion. When the interface card has been inserted into the interface card, the user will release the pressing portion of the metal shell so that the engaging portion can engage with the protruding block of the interface slot. Therefore, the interface card is steady fixed within the interface slot by means of the fixed structure.

Abstract: A modular data center includes a plurality of first containers and a plurality of second containers. The plurality of first containers and second containers are partitioned into a plurality of functional modules respectively, the functional modules of the plurality of first containers being arranged in parallel, and the functional modules of the plurality of second containers being arranged in parallel on one side of the plurality of first containers and corresponding to the functional modules of the plurality of first containers respectively. The present disclosure combines the functional modules of the plurality of first containers and the plurality of second containers into modular data centers with different forms, capacities, and data center usability tiers, and the assembly of the plurality of first containers and second containers with standardized sizes may facilitate the transportation and reduce the time and cost of assembling and delivery of the modular data center.

Abstract: A modular data center is disclosed. The modular data center may have a plurality of unit structures arranged generally parallel to one another. A plurality of supports may be used for supporting the unit structures elevationally above a floor, and wherein adjacent ones of the unit structures form hot aisles therebetween through which hot air generated from data center components may be channeled. Each unit structure may form an elongated structure having a frame structure, a roof panel supported by the frame structure, and a ceiling panel. The unit structures may be used to channel cold air to the data center components and hot air from the hot aisles out from the unit structures.

Abstract: Disclosed is a cooling device including a blower including an exhaust port; and a radiator including heat radiation fins, wherein the heat radiation fins include a first heat dissipation area and a second heat dissipation area, wherein a first surface area of the heat radiation fins disposed in the first heat dissipation area is greater than that of the heat radiation fins disposed in the second heat dissipation area, wherein the exhaust port of the air blowing part includes first and second exhaust areas for exhausting cooling air, wherein an amount of the cooling air exhausted from the second exhaust area is greater than that of the first exhaust area, and wherein the first heat dissipation area is disposed in the first exhaust area, and the second heat dissipation area is disposed in the second exhaust area.

Abstract: Fiber optic cable sub-assemblies having a fiber optic cable including at least one optical fiber attached to a circuit board are disclosed. The circuit board includes an active optical component in operable communication with the optical fiber for forming an active optical cable (AOC) assembly. A strain relief device attaches an end portion of the fiber optic cable to the circuit board, thereby forming the cable sub-assembly. Methods of assembling the fiber optic cable sub-assembly are also disclosed and include the step of attaching an end portion of the fiber optic cable to the circuit board.

Abstract: An Expandable Modular Information Technology (EMIT) Facility (EMITF) includes: an EMIT Building Infrastructure (EMITBI) having an initial enclosure that includes: a base pad providing a fixed usable space area on which one or more modular IT components are placed; and a plurality of exterior walls, including at least one removable expansion wall (REW) that enables expansion of the usable space area of the EMITBI; a plurality of modular IT components placed within the EMITBI on the usable space, and which dissipate heat; and at least one air handling unit (AHU) in fluid communication with the enclosure to support cooling of one or more of the IT components within the enclosure. As the EMITBI is expanded to include more IT components, additional AHUs are added to the EMITF in fluid communication with a respective area of the EMITBI to provide cooling to the added IT components.

Abstract: A system that includes four racks arranged in a cruciform arrangement having a center, when viewed from above. Each rack has a front and a rear, with the rear of each rack facing the center of the cruciform arrangement. Each rack includes at least two electronic components, a cooling system connected to the rack and arranged to draw cool air into the rack to cool the electronic components and expel hot air from the rack via the rear of the rack, a panel movable from a first position not blocking the rear of an adjacent rack to a second position blocking the rear of the adjacent rack, and a rail system connected to the rack and for moving the rack from an operating position forward to a non-operating position.

Abstract: An application processing system for placing applications and their associated data into a colocation data center, wherein an application placement module is configured to perform the method of steps including: constructing a facility communication node graph; constructing a composite elastic map which represents the compute nodes in the colocation data center; associating a force function between two nodes based on communication bandwidth; constructing an application usage data space; inserting the node graph into the application data space; assigning the applications to the compute nodes; associating a force function between each application and each compute node based on the assignment; determining an elastic map energy (EME) for the elastic map, wherein the EME is the total energy of the system; and assigning the real-world applications to the real-world compute nodes in the data center if the EME is less than a threshold energy.

Abstract: A rack-based information handling system (RIHS) includes: a rack chassis having a plurality of interconnected panels forming a volumetric space having a front section and a rear section, both with opposing side panels forming a front access space and a rear access space, respectively, between corresponding opposing side panels; one or more IT gear sleds that are inserted into the front section of the rack chassis; and a pair of front expansion panels that are added to the rack chassis and which extend past an end of the opposing side panels at the front section of the rack chassis to provide a deeper IT bay within the front section and enable insertion of longer-than-standard depth IT gear within the rack chassis. The front expansion panels are cable management panels that include at least one strap that is utilized to secure one or more cables extending from one or more IT gear inserted into the rack chassis.

Abstract: A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.

Abstract: Disclosed are a secondary battery and a circuit board assembly suitable for the secondary battery. The secondary battery includes a bare cell including an electrode terminal, a circuit board electrically connected to the electrode terminal and arranged on a top surface of the bare cell. The circuit board includes an installation part having a smaller thickness than rest of the circuit board. The secondary battery further includes a temperature device installed on the installation part of the circuit board to sense temperature variation of the bare cell.

Abstract: An application processing system for placing applications and their associated data into a colocation data center, wherein an application placement module is configured to perform the method of steps including: constructing a facility communication node graph; constructing a composite elastic map which represents the compute nodes in the colocation data center; associating a force function between two nodes based on communication bandwidth; constructing an application usage data space; inserting the node graph into the application data space; assigning the applications to the compute nodes; associating a force function between each application and each compute node based on the assignment; determining an elastic map energy (EME) for the elastic map, wherein the EME is the total energy of the system; and assigning the real-world applications to the real-world compute nodes in the data center if the EME is less than a threshold energy.

Abstract: A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.

Abstract: A server cabinet includes a bottom wall, a top wall, two opposite side walls, two air inlet tubes each with a number of openings, a number of servers, a number of air distributing tubes received in the servers, a number of rotating members rotatably installed to the air inlet tubes, and a number of resilient members installed to the air inlet tubes. Each server defines a number of vents aligning with the corresponding openings of the air inlet tubes. Each air distributing tube communicates with the vents of the corresponding server. The air inlet tubes are attached to the side walls. Each air distributing tube defines a number of air outlets communicating with the corresponding server. Each rotating member includes a shielding plate. Each resilient member abuts against the corresponding shielding plate to cover the corresponding opening of the air inlet tubes.

Abstract: The present invention relates to a dehumidification and humidification apparatus for vehicles using an adsorbent which is capable of feeding a dehumidified air for preventing fogging of window glass and a humidified air for improvement in comfortableness, and is simplified in construction thereof and reduced in size thereof. The dehumidification and humidification apparatus for vehicles according to the present invention comprises a casing (1), and a blower (2), an adsorbent module (3) and an air passage switching device (4) which are accommodated in the casing.

Abstract: A telecommunications cable management assembly (100) for a distribution frame (10) is disclosed. The cable management assembly (100) includes a front plate (110) extending between first and second ends (110a, 110c) and is provided with apertures (112) for mounting telecommunications components (20). A first side bracket (120) is mounted with the first end (110a) of the front plate (110) to the distribution frame (10). The first side bracket (120) supports cables (26) extending laterally from components (20). A second side bracket (130) is mounted with the second end (110c) of the front plate (110) to the distribution frame (10). The second side bracket (130) can also support cables (28) extending laterally from components (20).

Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Abstract: A cooled electrical assembly is disclosed which includes a plurality of cooled components and a first cooling fan adapted to provide a cooling flow for cooling the cooled components, the first cooling fan including a blade holder and a fan blade, the fan blade having a fixed end stationary mounted to the blade holder and a free end adapted to swing for generating the cooling flow. The plurality of cooled components can include four substantially cylindrical components each having a centre axis, the four substantially cylindrical components being spaced apart and located such that the centre axis of each said substantially cylindrical component passes through a respective vertex of a quadrilateral, the free end of the fan blade being located between the four substantially cylindrical components and inside the quadrilateral.

Abstract: A case assembly encloses heat generating electronic components. The case includes first and second housing parts which can be cast from the same mold. Covers are mounted to the housings to form coolant passages. The housing parts include built-in the connecting parts which are coupled together to form additional coolant passages. One of the connecting parts has a lip which sealingly receives an end of another connecting part. The lip is received by a slot adjacent to the other connecting part. The slot communicates with an exterior of the housing.

Abstract: A system can include a chassis; a board operatively coupled to the chassis where the board includes card slots aligned along respective parallel planes and circuitry operatively coupled to the slots; a processor operatively coupled to the circuitry of the board; memory accessible by the processor; a bracket operatively coupled to the chassis where the bracket includes parallel recesses corresponding to the parallel planes; and a retainer operatively coupled to the bracket where the retainer includes parallel recesses where in an open orientation the parallel recesses of the retainer align with the parallel recesses of the bracket and where in a retention orientation the parallel recesses of the retainer misalign with the parallel recesses of the bracket. Various other apparatuses, systems, methods, etc., are also disclosed.

Abstract: A vehicle lamp includes a semiconductor light emitting device, a thermally conductive portion which is in contact with the semiconductor light emitting device, a heatsink which dissipates heat generated by the semiconductor light emitting device, and a housing in which the semiconductor light emitting device, the thermally conductive portion and the heatsink are accommodated. The heatsink includes a base and plate fins arranged at intervals to protrude from the base. Each of the plate fins includes a plate surface facing the plate surface of an adjacent one of the plate fins and upwardly extending in a direction along the base. A plane parallel to at least one of the plate surfaces of the plate fins may be oblique with respect to a vertical direction. An inner surface of the housing may be oblique with respect to the vertical direction in a region above the plate fins.

Abstract: The disclosure relates to an electronic device comprising an insertion housing produced from a profile element having a closed cross-section and including a first opening and a second opening, a circuit board having at least one electronic component, and a first closure element. The first closure element is disposed at the first opening, and the first opening lies in a plane at an angle to a direction of insertion of the circuit board.

Abstract: In a display device to be mounted in a vehicle, a space is secured between a cover with which a first opening of a case main body is sealed and a liquid crystal panel of a display unit mounted on the backside of the case main body, ventilation openings (spaces around protrusions and through holes) that communicate with an external space are formed in portions of a casing, which is a component member of the display unit, except for the front surface of the casing, and protruding portions each partially supporting the outer edge portion of the front surface of the liquid crystal panel are formed on the inner surface of the front wall of the casing. Thus, a long and complicated air flow path is secured around the liquid crystal panel by the protruding portions, and the space and the external space communicates with each other via the path.