Abstract: An electronic device thermal management system comprising a thermal management controller configured to maintain a temperature level within a housing of an electronic device based on a signal indicative of a temperature of at least a portion of a wall of the housing of the electronic device.

Abstract: A display unit and a vending machine having the same. The display unit includes a display panel to display an image, a circuit board to control the display panel, a board bracket installed at a rear of the display panel and formed with a receiving section to receive the circuit board, and a plurality of inlet holes and a plurality of outlet holes formed in opposite surfaces of the board bracket to allow external air to flow through the receiving section. The air travels through the inlet and outlet holes and passes through the receiving section in one direction to cool the display panel and the circuit board. Thus, the display unit is prevented from malfunctioning and the display panel is prevented from being degraded by heat even if tempered glass is installed at a front of the display panel.

Abstract: A power converting apparatus includes a housing, a cable, and a grommet supporting member. The housing includes a housing base, a main body, and an air duct. The housing base has a first surface and a second surface and includes a through hole. The main body includes a plurality of electronic components on the first surface of the housing base. The air duct is disposed on the second surface of the housing base, and cooling air flows through the air duct. The cable is disposed through the through hole of the housing base so as to be wired between the main body and the air duct. The grommet supporting member is in the air duct or the main body. The grommet supporting member supports a grommet through which the cable is disposed. The grommet supporting member is not integral with the housing base.

Abstract: According to one embodiment, a liquid cooling type power conversion apparatus is provided. The liquid cooling type power conversion apparatus has a power conversion apparatus and a cooling apparatus which are provided in an engine room of a railway vehicle, an electric component and a plurality of semiconductor devices which are provided in the power conversion apparatus, a third heat exchanger located between the electric component and an electric blower, a cooling body on which the plurality of the semiconductor devices are mounted, a first heat exchanger provided in the cooling apparatus, a second heat exchanger provided in the cooling apparatus having a size smaller than the first heat exchanger 111b, a piping to connect the third heat exchanger 5 and the second heat exchanger, and a piping to connect the cooling body and the first heat exchanger.

Abstract: An electric power converter can include an electric power converter case mounted on rolling stock, a unit mounting section formed in the electric power converter case and having a cooler insertion opening, and an internal unit mounted on the unit mounting section. The internal unit can include a cooler projecting from the unit mounting section through the cooler insertion opening into an outside air introduction section into which the outside air is introduced and a plurality of securing holders made to butt against the unit mounting section for securing the internal unit. Each of the securing holders can have a butting surface for butting against the unit mounting section to form a step by making the butting surface protrude from the opposed surface of the internal unit facing the unit mounting section.

Abstract: A power converting apparatus includes a housing, a cylindrical capacitor, and a cylindrical capacitor cover. The housing includes a housing base, a main body, and an air duct. The main body includes a plurality of electronic components on a first surface of the housing base. The air duct is disposed on a second surface of the housing base. The capacitor penetrates through the housing base so that a part of the capacitor is disposed in the main body while a rest part of the capacitor is disposed in the air duct. The capacitor cover is disposed on the housing base and covers the rest part of the capacitor. The capacitor cover includes an elastic material and an inner surface. The capacitor cover includes a groove disposed on the inner surface in an axial direction of the capacitor cover.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.

Abstract: A heat management system may include a generally planar printed circuit board extending in a first plane, heat-generating electrical components mounted on a first side of the PCB, and an air baffle coupled to the PCB and configured to direct air flow across some of the components. The air baffle may include a generally planar air baffle body extending in a second plane parallel to and offset from the first plane of the PCB such that at least one of the components is located in an area between the air baffle body and the PCB, an opening in the generally planar body, and a generally planar wing coupled to the air baffle body at a first side of the opening and extending toward the PCB at an askew angle relative to the first plane of the air baffle body, the wing being configured to facilitate air flow through the opening.

Abstract: A power converting apparatus includes a housing base, a main body, an air duct, a pair of upright air duct walls, first and second heat generators, and a protrusion. The housing base has first and second surfaces. The main body is on the first surface. The air duct is for cooling air to flow through the air duct and is on the second surface. The upright air duct walls are on the second surface and extend from an upwind side to a downwind side. The first and second heat generators are disposed in series from the upwind side to the downwind side in the air duct. The protrusion is between the first and second heat generators to protrude from at least one of the pair of air duct walls toward a center portion of an air-flowing space for the cooling air.

Abstract: A computer enclosure includes a rear wall and a cooling module. The rear wall defines a slot. The cooling module includes a bracket detachably attached to an outer surface of the rear wall and a heat dissipation member mounted to the bracket. The heat dissipation member draws air through the slot.

Abstract: An apparatus for controlling grille aperture ratios of a plurality of air transfer grilles which are installed in a room, includes a determining unit for determining target grille air volumes of air blowing to the racks, for determining simulation air volumes of air blowing from the air transfer grilles on the basis of the target grille air volumes so that each of air of the target grille air volumes are blown to the racks, and for determining grille aperture ratios for each of the air transfer grilles on the basis of the plurality of simulation air volumes so that each of the amounts of air blowing from the air transfer grilles is replaced by each of the simulation air volumes, and a controller for controlling each of the grille aperture ratios of the air transfer grilles on the basis of each of the determined grille aperture ratios.

Abstract: An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink.

Abstract: A car electric equipment case module includes a housing, a covering structure, an electric equipment set, and a fan. The housing has a side wall, a containing space containing the electric equipment set and a first ventilator formed on the side wall. The covering structure includes a casing assembled to the housing and a block wall connected to the casing and extending outside the side wall to cover the first ventilator. An air channel connected the first ventilator is formed between the block wall and the side wall. The fan configured in the housing provides an air flow. The air flow flows into the containing space through the air channel and the first ventilator and flows out through a second ventilator formed on the covering structure, or flows into the containing space through the second ventilator and flows out through the first ventilator and the air channel.

Abstract: A computer system includes an enclosure, a printed circuit board, and an airflow guiding duct. The enclosure includes a bottom plate. The printed circuit board is mounted on the bottom plate. The printed circuit board includes a first heat generating element and a second heat generating element. The airflow guiding duct includes a top wall, a first sidewall, a second sidewall, a first mounting wall, and a second mounting wall. An input opening is surrounded by the top wall and the first and second sidewalls. A first output opening corresponds to the first heat generating element, and is surrounded by the top wall and the first and second mounting walls. A second output opening is defined in the second sidewall corresponding to the second heat generating element. An obtuse angle is defined between the second sidewall and the second mounting wall.

Abstract: In one embodiment, the disclosure includes a telecom utility cabinet including a heat load chamber. The telecom utility cabinet also includes an air introducing duct configured to conduct air from the heat load chamber to a geothermal cooling system. The telecom utility cabinet also includes an air discharging duct configured to conduct air from the geothermal cooling system to the heat load chamber. In another embodiment, the disclosure includes a method for managing temperature in a telecom utility cabinet. The method includes introducing air from a heat load chamber to a geothermal cooling system and discharging air from the geothermal cooling system to the heat load chamber.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: An electronic apparatus has a plurality of basic structures arranged adjacent to each other in a direction perpendicular to a gravitation direction. Each of the basic structures includes a casing, a board placed parallel to the gravitation direction inside the casing, a first space with large ventilation amount and a second space with small ventilation amount formed by the board dividing the inner space of the casing, vents in the upper and lower surfaces of the casing, an electronic component placed on the board in the first space, and an electronic component placed on the board in the second space. The casings of adjacent basic structures are in communication through inner vents in respective side walls of the casings, and external vents in communication with the outside are provided in left and right side walls of the electronic apparatus.

Abstract: A system for storing data includes a rack, one or more data storage modules coupled to the rack, and one or more data control modules coupled to the rack. The data storage modules may include a chassis, two or more backplanes coupled to the chassis, and one or more mass storage devices (for example, hard disk drives) coupled to the backplanes. The data control modules may access the mass storage devices in the data storage modules.

Abstract: The invention discloses the multistage cooling of an aircraft electronic system (2) with at least one electronic component which delivers heat. The multistage feature results from the use of a plurality of circuits for transferring the waste heat. An internal coolant (14) circulating in a closed circuit which is thermally coupled to the electronic component carries heat from the at least one electronic component to a heat exchanger (6) which delivers the heat to an external coolant which flows and/or circulates from a source outside of the aircraft electronic system (2) through the heat exchanger (6) to a sink outside of the aircraft electronic system (2). The internal coolant flows from the heat exchanger (6) in the direction of the at least one electronic component and/or circulates in a closed circuit.

Abstract: A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: A radar antenna is provided. The radar antenna includes an antenna body, a housing housing a plurality of components for controlling the antenna body, and a ventilation path formed in a predetermined ventilating direction and penetrating the housing. One or more of the plurality of components are disposed inside the housing to be separated from the rest of the components with respect to the ventilation path therebetween.

Abstract: An EMI shield for an electronic system enclosure is disclosed. The EMI shield may include an electrically conductive panel with a plurality of air ventilation channels, which has an upstream airflow side and a downstream airflow side. The EMI shield may also include a first air ventilation channel with a first cross-sectional shape having a first cross-sectional area and a first depth. The EMI shield may further include a second air ventilation channel with a second cross-sectional shape, having a cross-sectional area greater than the first cross-sectional area, and a second depth larger than the first depth.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: A method and system of cooling components of a computer system. At least some of the illustrative embodiments are computer systems comprising an enclosure, a motherboard within the enclosure, a heat generating component coupled to the motherboard and within the enclosure, a canister comprising a compressed fluid (the canister coupled to the enclosure), and a gas cooling device selectively fluidly coupled to the compressed fluid (the gas cooling device produces chilled gas when fluidly coupled to the compressed fluid). The chilled gas is directed upon the heat generating component.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Abstract: An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection currents. As such, the heat transfer for the overall heat sink is improved because hot convection currents are vented and replaced by cool ambient air along the length of the heat sink.

Abstract: An apparatus for supplemental cooling of a docked mobile device that includes a docking module having a docking interface that provides a communication connection for a separable mobile device having several heat generating electronic components that emanate heat when the separable mobile device is in an operating mode. In addition, the separable mobile device has an integrated heat sink structure that spreads the heat emanating from the operating heat generating electronic components across the entire heat sink structure. An air mover is integrated into the docking module to provide a volume of air flow that is directed to the separable mobile device while it is docked to the docking module. Accordingly, an air mover controller receives a first signal from an input sensor and therein controls the air mover to modulate the volume of air flow according to a predetermined tolerance corresponding to the heat generating electronic components.

Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: A method for controlling a motor comprises steps of: first, determining whether a switch of a motor control circuit in an electronic system is in a first state; then, operating the motor at a fanless operation mode when a temperature inside an enclosure of the electronic system is higher than zero and lower than a first threshold temperature, wherein the rotation speed of the motor is zero rpm; operating the motor at a silent operation mode when the temperature is higher than the first threshold temperature and lower than a second threshold temperature, wherein the rotation speed of the motor is a constant rotation speed; and operating the motor at a cooling operation mode when the temperature is higher than the second threshold temperature, wherein the rotation speed of the motor is a function of the temperature and varies between the constant rotation speed and a maximum rotation speed.

Abstract: A fan module is detachably mounted in a chassis. The chassis includes a sidewall defining a locking slot. The fan module includes a bracket including a base plate defining a first through slot, a fan fixed to the base plate, a fan duct fixed to the base plate beside the fan, and a locking member. The fan duct includes a side plate defining a second through slot. The locking member is fixed to the fan duct. The locking member includes a locking portion extending through the second through slot of the fan duct and the first through slot of the bracket to lock into the locking slot of the chassis.

Abstract: A method for cooling an electronic device having first and second flow paths for transmitting a coolant. The method includes assessing a merit of impelling the coolant along the first flow path relative to impelling the coolant along the second flow path. When the relative merit is above a threshold, coolant is impelled along the first flow path. When the relative merit is below the threshold, coolant is impelled along the second flow path.

Abstract: A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).

Abstract: A method for cooling an electronic display is disclosed herein. The electronic display preferably contains a rear surface, where a substantially planar surface is positioned adjacent to the rear surface to define a gap. Cooling air is preferably forced through said gap. In some embodiments, the additional step of circulating gas around the display in a closed loop may also be performed. In these embodiments the circulating gas may contact the front viewing surface of the electronic display, so that heat can be removed from this surface.

Abstract: A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.

Abstract: An airflow guide cover includes a top wall, a first sidewall and a second sidewall extending down from opposite sides of the top wall, and an intrusion switch. The intrusion switch includes a detection switch mounted to an inner surface of the first sidewall, a connector, and a cable connected between the detection switch and the connector. A through hole is defined in the top wall. A probe capable of moving up and down is mounted on a top of the detection switch and extends through the through hole.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.

Abstract: Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.

Abstract: A filter unit includes an air filter, which captures dust from intake air, and a cleaning unit, which automatically cleans the air filter. The cleaning unit includes a rotation brush, which removes dust from the air filter, and a dust box, which extends parallel to the rotation brush. The dust box includes a dust inlet that opens toward the rotation brush and receives dust from the rotation brush. The dust box is removable from the filter unit.

Abstract: An electronic display which can be mounted above a paved surface in an outdoor environment. A surface or plate is placed behind the electronic display to define a gap where cooling air can be drawn through said gap in order to cool the electronic display. A plurality of ribs may be placed within the gap and in thermal communication with the electronic display. The density of the ribs may be varied according to the inlet and exhaust openings for the cooling air. The ribs may be placed at a higher density near the exhaust to account for the increase in temperature of the cooling air as it travels through the gap.

Abstract: The present application provides for an enclosure for mounting electrical components therein. The enclosure may include a base, a roof, a number of side walls, and one or more support ducts extending from the base to the roof. The supports ducts may include an air channel therein extending from the base to the roof.

Abstract: A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

Abstract: An electronic device includes one or more electronic components and an electronic enclosure enclosing the electronic components. The electronic enclosure includes venting holes and flaps blocking visibility of the electronic components through the venting holes and from outside the electronic device. In addition, air readily flows through the venting holes providing adequate cooling of the electronic device.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Abstract: A disclosed cooling structure includes a casing including a bottom plate arranged in a bottom portion of the casing and having a through hole formed in the bottom plate; a heat source to be cooled accommodated in the casing; a suctioning unit configured to suction outer air from an outside of the casing to an inside of the casing via the through hole in the bottom plate; an open and close member including an outer air path for carrying the suctioned outer air and being capable of opening and closing relative to the casing; and an outer air applying unit configured to cool the heat source by the carried outer air received from the open and close member.

Abstract: A media device includes at least one piezoelectric fan selectively located to draw or urge air past one or more electrical components, such as an integrated circuit chip. Preferably, the piezoelectric fan is located within a channel milled or otherwise formed in the chip, however the fan may be located proximate the channel yet in fluid communication therewith. The piezoelectric fan operates to convectively cool the electrical component and may also prevent heat that has been generated by the electrical component from moving toward another electrical component within the media device. Thus, the configuration and location of the piezoelectric fan may advantageously cool one component while preventing heat energy from building up around one or more other components mounted nearby.

Abstract: An electronic apparatus includes a housing having a first connector; a Plug In Unit (PIU) having a second connecter, coupled to the first connector, and inserted into the housing; a first guide mechanism (1st GM) provided on the housing and/or the PIU; a second guide mechanism (2nd GM) provided on another housing and/or the PIU and guides insertion of the PIU in cooperation with the 1st GM so that the first connector is coupled to the second connector. The 1st GM, for example, includes a guide cylinder, and the 2nd GM, for example, includes a pin inserted into the guide cylinder; a fixed cylinder surrounding the pin; and a movable member, which has a hole that passes through the fixed cylinder, and the movable member is held by the fixed cylinder to be movable in the axial direction. The guide cylinder pushes the movable member when the pin is inserted.

Abstract: Disclosed is a member that contains electronic components. Using the member, when, for example, a vehicle or the like carrying electronic components such as an inverter collides with an external object, there is prevented damage to a housing containing the electronic components, which would otherwise occur due to interfering objects. Furthermore, the disclosed member can dissipate heat produced by the contained electronic components. The member includes a housing for containing electronic components, a cooling passage that is provided inside the housing and uses a refrigerant to cool the electronic components, and a heat dissipation part that dissipates heat from the cooling passage and prevents the housing from being damaged by impacts from external interfering objects.