Abstract: A radar sensor for a vehicular radar sensing system includes a housing structure and at least one printed circuit board (PCB). The housing structure includes a front housing and a rear housing. The PCB is accommodated between the front housing and the rear housing in a cavity established when the front housing and the rear housing are joined together. The rear housing may be joined to the front housing via an intermediate frame disposed between the front housing and the rear housing, with the rear housing secured to the intermediate frame via a plurality of fasteners and with the front housing secured to the intermediate frame via welding.

Abstract: A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.

Abstract: An interface having a frame with a plurality of slots, a first pass-through insert in the frame and a second pass-through insert in the frame. The first pass-through insert and the second pass-through insert each have a housing and a contact with the type of contact in the first pass-through insert is different than the type of contact in the second pass-through housing.

Abstract: The disclosed current-distribution inductor may include (1) a magnetic core and (2) a conductor electrically coupled between a power source and an electrical component of a circuit board, wherein the conductor comprises (A) a bend that passes through the magnetic core and (B) a flying lead that extends from the bend to the electrical component of the circuit board and runs parallel with the circuit board. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A battery provided with at least one battery cell electrically coupled to a battery management circuitry, a power regulation and supply circuitry, a USB-C port controller, an E-marker integrated circuit and a USB interface. The E-marker integrated circuit provided in-line along a CC conductor between the USB-C port controller and the USB interface. The USB-C port controller is configured to enable the E-marker integrated circuit upon reception of a vendor defined message via the USB interface which enables a high power delivery mode between the battery and a device without the presence of a separate interconnecting E-marker cable there between.

Abstract: A drive carrier for retaining a persistent storage drive in an enclosure. The drive carrier includes a mounting bracket, a handle coupled to the mounting bracket, and an electromagnetic interference (“EMI”) shielding apparatus disposed between mounting bracket and at least a portion of the handle. The mounting bracket is shaped to be coupled to the persistent storage drive. The EMI-shielding apparatus includes a plurality of EMI-shielding fingers. Each EMI-shielding finger includes a lower surface, an upper surface that is approximately parallel to the lower surface, and a contoured surface extending between the lower surface and the upper surface.

Abstract: Disclosed herein are various implementations of communications connectors. In some implementations, a communications plug may include a housing and a body positioned in the housing. A flexible printed circuit board (PCB) may be wrapped at least partially around the body, a and a plurality of metal contact pads may be positioned on the flexible PCB to mate with plug interface contacts (PICs) of a communications jack when the communications plug is inserted into the communications jack.

Abstract: A semiconductor device includes a first lead, a second lead, a control element, an insulating element, and a driver element. The control element and insulating element are mounted on a first pad portion of the first lead, while the driver element on a second pad portion of the second lead. In plan view, the first pad portion has a first edge adjacent to the second pad portion in a first direction and extending in a second direction perpendicular to the first direction. The first edge has first and second ends opposite in the second direction. The second pad portion has a second edge adjacent to the first edge and extending in the second direction. The second edge has third and fourth ends opposite in the second direction. One of the third and fourth end is located between the first and second end in the second direction.

Abstract: A power storage system of the present technology includes a battery board configured to accommodate a secondary battery, a branch board, a first frame on which the battery board is placed, a second frame on which the branch board is placed, and a plurality of connection wirings that are disposed in the first frame and the second frame and connects the battery board and the branch board. The plurality of connection wirings are aggregated in the second frame.

Abstract: Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.

Abstract: Implantable medical devices that include a battery to power circuitry utilize a battery connector to electrically interconnect the battery to the circuitry. The battery connector may be mounted directly to a device housing to have the battery connector a fixed position within the device. Battery terminals of the battery are electrically connected to terminals on the battery connector, and the terminals on the battery connector are electrically connected to power terminals of the circuitry. The battery connector may include various features such as mounting grooves formed in a connector body, tapered pins to connect to power terminals on a circuit board, as well as plates to engage the battery terminals. The device housing may provide mounting features that allow the battery connector to be affixed directly to the device housing.

Abstract: Example implementations relate to a dual-sided fan tray assembly of an electronic system. The fan tray assembly includes a housing having a front panel, a back panel, and a pair of side walls coupled to the front and back panels. The fan tray assembly further includes a handle assembly pivotably connected to the pair of side walls such that the handle assembly is at least rotatable around the housing to at least first and second positions spaced apart from each other. When the handle assembly is rotated to the first position, the fan tray assembly is slidably insertable into a chassis of an electronic system with the front panel facing the chassis to install the fan tray assembly to the electronic system. When the handle assembly is rotated to the second position, the fan tray assembly is slidably insertable into the chassis with the back panel facing the chassis.

Abstract: A display device includes a display part including a first non-folding area, a second non-folding area, and a folding area between the first non-folding area and the second non-folding area, the folding area being foldable with respect to a folding axis, a window disposed on the display part, and an adhesive layer disposed between the display part and the window, the adhesive layer including a first adhesive material and a second adhesive material having an elongation rate greater than an elongation rate of the first adhesive material. The first adhesive material has a planar area greater than a planar area of the second adhesive material in each of the first non-folding area and the second non-folding area, and the second adhesive material has a planar area greater than a planar area of the first adhesive material in the folding area.

Abstract: A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.

Abstract: A housing is provided with an electrical wire drawing path projecting toward outside and causing a plurality of at least one of an electrical wire bundle and the electrical wire to be drawn from inside to outside. The electrical wire drawing path includes a first wall member including two side portions extending in a projecting direction of the electrical wire drawing path, a second wall member disposed to be opposed to the first wall member with an interval, a first side wall member projecting from one side portion in a direction crossing an extending direction of the side portions and toward the second wall member, and a second side wall member projecting from the other side portion in a direction crossing an extending direction of the side portions and toward the second wall member.

Abstract: A power electronics submodule for mounting on a cooling device, has first and second surface sections next to one another, a substrate with a housing and includes a connection element, conductively connected by a contact to a track of the substrate and a connection section, arranged parallel to the substrate, the substrate arranged on the first surface section, the housing has a housing section, with a first main surface, arranged on the second surface section, and a second main surface, situated opposite the first main surface. In a non-mounted state a first main surface of the connection section is a first distance from the second main surface of the housing section in the housing region of a fastening device.

Abstract: An example electronic device includes a housing. In addition, the electronic device includes a display panel supported by the housing. The display panel includes a planar portion and a side portion extending from the planar portion to an end of the display panel. The planar portion and the side portion are to display images. The side portion is to transition between a first position in which the side portion is co-planar with the planar portion and a second position in which the side portion is curved relative to the planar portion.

Abstract: The invention is a power electronic system comprising at least one power electronic component implemented at least partly on at least one circuit board. The circuit boards are planar and circular or toroidal in shape with the center thereof comprising a circular opening having a diameter D cooperating with a hose for circulating a flow.

Abstract: A multilayer ceramic electronic component includes multilayer ceramic electronic component bodies each including a laminate and first and second outer electrodes respectively disposed on two end surfaces of the laminate, first and second metal terminals respectively connected to the first and second outer electrodes, and first and second terminal blocks respectively connected to the first and second metal terminals. A thickness dimension of each multilayer ceramic electronic component body in a height direction is less than a width dimension of the multilayer ceramic electronic component body in a width direction. Each multilayer ceramic electronic component body is disposed such that a first or second side surface faces a mounting surface. The first and second metal terminals are respectively disposed astride the first and second outer electrodes of the multilayer ceramic electronic component bodies.

Abstract: A multilayer ceramic capacitor includes a multilayer main body including an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and outer layer portions on both sides of the inner layer portion in a stacking direction, two external electrodes at two end surfaces of the multilayer body in which side gap portions are provided on both sides of the multilayer main body in the width direction, and an interposer on any of the main surfaces, the side surfaces, and the end surfaces of a capacitor main body including the multilayer and the external electrodes. The difference in location between ends at side surfaces of two adjacent internal electrode layers in the stacking direction is about 0.5 ?m or less. In the two side gap portions, a portion in contact with the multilayer main body has a thickness of about 10 ?m or less.

Abstract: An electronic device includes one or more sensors, one or more processors operable with the one or more sensors, and a status indicator configured to indicate whether an authorized user of the electronic device is busy, free, or somewhere in between. The status indicator can operate in at least a first state and a second state that is different from the first state. The first state indicates the authorized user is busy and should not be disturbed, while the second state indicates the authorized user is free. Red light can be emitted in the first state, and green light in the second state. The state of the status indicator can be set manually, such as with a chopping gesture, or automatically, such as from calendar events stored in a calendaring operation.

Abstract: A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is ?P and a thermal expansion coefficient of the metal layer is ?M, a value of ?P/?M is 5.1 or less.

Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.

Abstract: Various embodiments of the present invention relate to an electronic device which employs a flexible display and, even when a housing is changed in size or shape, can keep an antenna at the same characteristic.

Abstract: A device that includes a board, a package and a patch substrate. The board includes a cavity. The package is coupled to a first side of the board. The package includes a substrate and an integrated device coupled to the substrate. The integrated device is located at least partially in the cavity of the board. The patch substrate is coupled to a second side of the board. The patch substrate is located over the cavity of the board. The patch substrate is configured as an electromagnetic interference (EMI) shield for the package.

Abstract: A sensor component includes: a sensor part having a sensor body and a connection terminal extending from the sensor body; and a holder part for holding the sensor part, the connection terminal being resin-sealed by an exterior part that is connected to a conductor of a wire, wherein a melt part that melts during the molding of the exterior part is provided on an outer surface of the holder part that is arranged inside of the exterior part, and the melt part is arranged in a position separating the sensor body and a connection part where the connection terminal is connected to the conductor.

Abstract: A cooling system comprises one or more hyperbaric fans and an electromagnetic interference (EMI) shield protecting selected components in a sealed chassis. The EMI shield comprises vents configured to allow airflow through the shield but prevent direct transmission of electromagnetic energy through the EMI shield. Airflow generated by a hyperbaric fan in the sealed chassis is able to flow through the vents to cool components surrounded by the EMI shield and the EMI shield prevents electromagnetic energy generated by some components from interfering with other components.

Abstract: A display device is disclosed. The display device includes a flexible display panel, a panel roller, a first pipe extending in a longitudinal direction of the panel roller, wherein the first pipe is located adjacent to the panel roller, a second pipe extending in the longitudinal direction of the panel roller and located adjacent to the panel roller, a third pipe extending in the longitudinal direction of the panel roller and located adjacent to the panel roller, the first pipe and the second pipe, a guide roller extending in the longitudinal direction of the panel roller and located opposite to the third pipe with respect to the panel roller, and a correction unit located at the first pipe and comprising a correction roller rotatable on the first pipe and a roll plate curved that is perpendicular to a longitudinal direction of the panel roller.

Abstract: An optical apparatus may include a housing having an opened front face, an optical unit freely movable into and out of an internal space of the housing through the front face, and a positioning portion disposed on a back side of the optical unit in the internal space. A base plate of the optical unit may include first and second convex portions disposed on a base end face of the base plate. The second convex portion may be disposed at a position different from the first convex portion in a width direction of the base plate. The positioning portion may include a V block having a V groove shape at a part contacting the first convex portion, and a flat block having a flat surface shape at a part contacting the second convex portion. The optical unit may be positioned in the internal space through the contact.

Abstract: A back cover ejection structure is applied in an electronic device. The electronic device includes a back cover and a middle frame, the back cover ejection structure can eject the back cover from the middle frame. The back cover ejection structure includes a housing, a moving plate, and a rotating cover. The moving plate is received in the housing and can move in a first direction. The moving plate includes a plate body and a first groove defined in the plate body. The first groove includes a first section, the first section inclined with the first direction. The rotating cover is rotatably connected to the housing. The rotating cover includes a sliding rod slidably received in the first section. The sliding rod can push the rotating cover to rotate when sliding in the first section, causing the rotating cover to eject the back cover from the middle frame.

Abstract: A modular I/O device includes a terminal base with a terminal block that includes a plurality of wiring connectors. An auxiliary wiring device includes a plurality of auxiliary wiring connectors and is selectively physically connectable to the terminal base in an operative position and selectively physically removable from the terminal base. The terminal block and auxiliary wiring connector can be coupled to an I/O module. One or more of the I/O module terminal block and auxiliary wiring connector can include electrical or electronic components included converters, fuses, switches, etc.

Abstract: A radio frequency signal repeater includes, a first communication printed circuit board, a second communication printed circuit board, at least one embedded radio frequency module printed circuit board disposed between and communicably coupled to both the first communication printed circuit board and the second communication printed circuit board. The at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are stacked one board on top of the others, and adjacent boards of the at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are electrically coupled by a respective interconnection join layer so as to form an integrated printed circuit board module, where the adjacent boards are electrically coupled to each other through vias that extend through the interconnection join layer.

Abstract: According to one embodiment, in a memory system, a printed circuit board a first end portion and a second end portion. The second end portion is a portion arranged in an opposite side of the first end portion. Both of a semiconductor memory and a controller are disposed on the first surface. A edge connector is connectable to a host device and is disposed in the first end portion. Plural through-hole portions are disposed in the second end portion. Each of the plural through-hole portions penetrates from the first surface to the second surface. Each of the plural through-hole portions has an inner surface covered with an electrically-conductive film. Plural pad electrodes are disposed on the second surface in the second end portion. At least some of the plural through-hole portions are electrically connected to the controller. At least some of the plural pad electrodes are electrically connected to the controller.

Abstract: An LED lighting module has a main body section on which LED lights are mounted and informational wiring data and electrical power wiring which extends through the module. The module has first and second cavities, each cavity having two prongs located therein, the two prongs in the first cavity being electrically connected to the electrical power wiring and the two prongs in the second cavity being connected to the informational data wiring. Female connection members having informational data and electrical power wiring are inserted into the two cavities and plugged into the prongs to provide informational data and establish electrical power into the module. Multiple LED modules can be connected in one system having a single electrical power source and a single informational data processor by attaching the female connectors between multiple LED modules.

Abstract: A construction and configuration for the receiving function of a high speed optical communication system with reduced manufacturing cost and improved performance. In an aspect, mounting the cover and lens provides a self-alignment behaviour that advantageously positions the cover and the lens to be in the optimum position for the photodiode. An assembly of electronic components receives data using an optical fibre. In one aspect, the assembly includes a photodiode, an amplifier coupled to the photodiode, and a printed circuit board on which the photodiode and amplifier are physically mounted, The printed circuit board has areas of a first material to which components may be attached using a fixing agent, and areas of a second material to which components will not attach using the fixing agent. Conductive bond wires are configured to directly couple the amplifier and the photodiode to conductive traces on an opposite side of the printed circuit board.

Abstract: A high-frequency module (1a) includes a multilayer wiring substrate (2), a plurality of components (3a, 3b) mounted on an upper surface (20a) of the multilayer wiring substrate (2), a sealing resin layer (4) laminated on the upper surface (20a) of the multilayer wiring substrate (2) and sealing the plurality of components (3a, 3b), and a shield (5). The shield (5) is composed of shield walls (5a, 5b) arranged in grooves (12) and (13), respectively, formed between the first component (3a) and the second component (3b) in the sealing resin layer (4) and a connecting conductor (11) coupling both the shield walls (5a, 5b). A first region (40a) and a second region (40b) in the sealing resin layer (4) split by the shield (5) are contiguous at the location of the connecting conductor (11) as seen from a direction perpendicular to the upper surface (20a) of the multilayer wiring substrate (2).

Abstract: A shunt resistor having sufficient bonding strength includes a resistor, a pair of bases which are integrally formed with the resistor so as to sandwich the resistor, recessed holes which are respectively formed in the bases, and measurement terminals which are inserted into the recessed holes and are affixed to the bases. Each measurement terminal has a shaft part and a flange part that protrudes outwardly in the circumferential direction of the shaft part. Each recessed hole is formed to have a diameter smaller than the diameter of the flange part, and the shaft parts are respectively inserted into the recessed holes.

Abstract: Disclosed is an electronic device that realizes improved, reliable waterproof performance by sealing the perimeter of an electronic component disposed simultaneously over both a black mask (BM) region and a display region of the electronic device, thereby securing the continuity of a waterproof loop around the electronic device.

Abstract: A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer.

Abstract: In accordance with the embodiments of the present disclosure, a rack comprising a frame having first vertical posts on a first side and second vertical posts on a second side, between which a plurality of RF amplifier modules are mounted, is provided. The RF power outputs of the RF amplifier modules are connected to inputs of an RF power combiner to deliver a combined RF power output. The RF power combiner is arranged at least partially in at least one of a first volume between the first vertical posts of the frame or a second volume between the second vertical posts of the frame, thereby reducing a footprint of the rack.

Abstract: An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.

Abstract: The present specification describes a replaceable connection module. The replaceable connection module includes a port to receive signals and power from a controller and at least one receptacle to provide received signals and power to a connected electronic device. The module also includes a plurality of conductors connecting the port with at least one receptacle. Control of the signals and power at the at least one receptacle is performed by the controller.

Abstract: A vehicular camera module includes a main circuit board electrically connected with an imager circuit board via a flexible ribbon cable, an imager disposed on the imager circuit board, a housing, and a lens barrel accommodating at least one lens. Image data captured by the imager is provided via the flexible ribbon cable to circuitry disposed at a main PCB of the main circuit board. The main circuit board is accommodated within front and rear portions of the housing, while the imager is disposed within the rear portion and is not accommodated within the front portion. The lens barrel, as disposed at the camera module, is tilted at an acute angle upward relative to the plane of the main PCB of the main circuit board. The electronic circuitry disposed at the main PCB includes an electrical socket connector for electrical connection to a plug connector of a vehicular wire harness.

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.

Abstract: Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation layer disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a magnetic pulverized material and an insulation material.

Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.

Abstract: A processing method for dividing a plate-shaped workpiece into a plurality of individual packages along a plurality of crossing division lines, in which the workpiece has terminals on the back side, includes the steps of attaching a protective member to the back side of the workpiece so as to cover the terminals to thereby unite the protective member with the workpiece, dividing the workpiece with the protective member along each division line to obtain the individual packages in a condition where the protective member is attached to each package, forming a conductive shield layer on the outer surface of each package, and peeling the protective member from each package.

Abstract: A semiconductor device includes a single lead frame, a semiconductor element, and a mold material. The semiconductor element is joined onto one main surface of the lead frame. The lead frame includes a die-attach portion, a signal terminal portion, and a ground terminal portion. The die-attach portion, the signal terminal portion, and the ground terminal portion are disposed directly below the mold material so as to be arranged in a direction along one main surface. A groove portion is provided by partially removing the lead frame so as to allow the groove portion to pass therethrough, the groove portion being provided between the die-attach portion and the ground terminal portion adjacent to each other in the lead frame and between the signal terminal portion and the ground terminal portion adjacent to each other in the lead frame.

Abstract: A semiconductor includes a semiconductor element, a connecting terminal electrically connected to the semiconductor element, and a case including an opening space for housing the semiconductor element, a frame which surrounds the opening space and in which the connecting terminal is partially embedded, and a terminal arrangement portion protruding from the frame towards the opening space. The connecting terminal includes an internal terminal portion that extends towards the opening space with respect to the frame, the internal terminal portion having a front surface that is electrically connected to the semiconductor element and exposed to the opening space, and a rear surface that is fixed to the terminal arrangement portion.

Abstract: This invention is directed to a corrosion resistant permanent magnet, to a method for producing a corrosion resistant permanent magnet, and to an intravascular blood pump comprising the magnet. The magnet is corrosion resistant due to a composite coating comprising a metal layer, optionally a metal oxide layer, a layer formed from poly(2-chloro-p-xylylene), and a linker layer between the metal oxide layer and the poly(2-chloro-p-xylylene) layer.