Abstract: According to one embodiment, a semiconductor storage device includes a first memory cell capable of storing n-bit data (n is a natural number not less than 4). When receiving first data, including first and second bits of the n-bit data, from a controller, the semiconductor storage device writes the received first data to the first memory cell. After receiving the first data, when the semiconductor storage device receives second data including third and fourth bits of the n-bit data, the semiconductor storage device reads the first and second bits from the first memory cell and writes the n-bit data to the first memory cell based on the read first and second bits and the received second data.

Abstract: A memory device includes a memory cell array having a plurality of memory strings and includes a voltage generating circuit configured to generate and apply a plurality of drain select line voltages, a plurality of source select line voltages, and a read voltage to the memory cell array during a read operation. The memory device also includes control logic configured to control the voltage generating circuit to generate a first drain select line voltage applied to a first unselected memory string among unselected memory strings among the plurality of memory strings and a second drain select line voltage applied to second unselected memory strings among the unselected memory strings during the read operation, wherein the second drain select line voltage is different from the first drain select line voltage.

Abstract: A memory device and a programming method thereof are provided. The memory device includes a memory array, a plurality of word lines and a voltage generator. During a programming procedure, one of the word lines is at a selected state and others of the word lines are at a deselected state. Some of the word lines, which are at the deselected state, are classified into a first group and a second group. The first group and the second group are respectively located at two sides of the word line, which is at the selected state. The voltage generator provides a programming voltage to the word line, which is at the select state, during a programming duration. The voltage generator provides a first two-stage voltage waveform to the word lines in the first group and provides a second two-stage voltage waveform to the word lines in the second group.

Abstract: A charge pump includes: a charging unit including a first n-type transistor connected between an input terminal configured to receive an input voltage and a first node, a second n-type transistor connected between the input terminal and a second node, a first gate control element configured to control the first n-type transistor based on a first clock signal and a second gate control element configured to control the second n-type transistor based on a second clock signal having a phase opposite to the first clock signal; a first pumping capacitor including one end connected to the first node and an other end configured to receive the first clock signal; a second pumping capacitor including one end connected to the second node and an other end configured to receive the second clock signal; and an output unit.

Abstract: Method of controlling initialization of nonvolatile memory device, where nonvolatile memory device includes memory cell region including first metal pad and peripheral circuit region including second metal pad and vertically connected to memory cell region by first and second metal pads, includes performing first sensing operation to sense write setting data stored in first memory cells in memory cell region of first memory plane and store first read setting data in first page buffer circuit in peripheral circuit region of first memory plane, performing second sensing operation to sense write setting data stored in second memory cells in memory cell region of second memory plane and store second read setting data in second page buffer circuit in peripheral circuit region of second memory plane and performing dump-down operation to store restored setting data in buffer based on first read setting data and second read setting data.

Abstract: A nonvolatile memory device includes a memory cell region, a peripheral circuit region, a memory block in the memory cell region, a row decoder in the peripheral circuit region, and a control circuit in the peripheral circuit region. The memory cell region includes a first metal pad. The peripheral circuit region includes a second metal pad and is vertically connected to the memory cell region by the first metal pad and the second metal pad. The memory block includes memory cells stacked in a direction intersecting a substrate, and is divided into a plurality of sub-blocks configured to be erased independently. The row decoder selects the memory block by units of a sub-block.

Abstract: A memory device having improved read reliability includes: first blocks coupled to a first global line group and second blocks coupled to a second global line group; a voltage generator configured to generate an operating voltage for an operation performed on the first blocks and the second blocks; a block decoder configured to generate a block select signal for selecting a memory block on which a main operation is to be performed from among the first blocks as a selected block; and a block voltage controller configured to control the block decoder and the voltage generator to: perform a channel initializing operation of discharging channel regions of the selected block and a shared block which is selected from among the second blocks according to the block select signal; and perform a word line floating operation on the selected block and the shared block after the channel initializing operation.

Abstract: Circuits and methods for protecting a device are provided. A first device to be protected includes a gate dielectric of a first thickness. A second device includes a gate dielectric of a second thickness that is less than the first thickness. A gate is shared by the first device and the second device.

Abstract: An integrated circuit including a link or string of semiconductor memory cells, wherein each memory cell includes a floating body region for storing data. The link or string includes at least one contact configured to electrically connect the memory cells to at least one control line, and the number of contacts in the string or link is the same as or less than the number of memory cells in the string or link.

Abstract: Channel information and channel conditions determined by an Offline Tracking process are used to determine whether or not an adjustment to the read reference voltage can be avoided altogether without detrimentally affecting performance, or, alternatively, to determine a precision with which a read reference voltage adjustment should be made. If it is determined based on the channel conditions that a read reference voltage adjustment can be avoided altogether, read performance is improved by reducing the probability that a read reference voltage adjustment needs to be made during normal read operations. If it is determined based on the channel conditions that a read reference voltage adjustment needs to be made with a particular precision, the read reference voltage is so adjusted. This latter approach is advantageous in that relatively fewer adjustments will be made during normal read operations.

Abstract: A semiconductor memory device includes a memory cell, a word line connected to the memory cell, a source line connected to the memory cell, a bit line connected to the memory cell, and a control circuit configured to perform a read operation on the memory cell. During the read operation, the control circuit applies to the word line a first voltage, a second voltage greater than the first voltage after applying the first voltage, and a third voltage greater than the first voltage and smaller than the second voltage after applying the second voltage, and applies to the source line a fourth voltage according to a timing at which the second voltage is applied to the word line, a fifth voltage smaller than the fourth voltage after applying the fourth voltage, and a sixth voltage greater than the fifth voltage after applying the fifth voltage.

Abstract: In an example, a portion of a memory array may be selected to be wear leveled based on how often the portion is or is to be accessed. The portion may be wear leveled.

Abstract: A storage device includes a nonvolatile memory device including a memory block and a memory controller. The memory block includes a first memory region connected with a first word line and a second memory region connected with a second word line. The memory controller sets a read block voltage based on a first read voltage of the first memory region. The memory controller determines a second read voltage of the second memory region based on variation information and the read block voltage.

Abstract: A method includes performing a first sensing operation to sense write setting data stored in first memory cells of a first memory plane and store first read setting data in a first page buffer circuit of the first memory plane, performing a second sensing operation to sense the write setting data stored in second memory cells of a second memory plane and store second read setting data in a second page buffer circuit of the second memory plane and performing a dump-down operation to store restored setting data corresponding to the write setting data in a buffer based on the first read setting data and the second read setting data.

Abstract: A controller includes an interface and circuitry. The interface is coupled to multiple memory cells. The circuitry stores a code word in a group of the memory cells, reads the code word using different thresholds to produce first and second readouts, and checks whether approximating each of first and second numbers of readout errors based on syndrome weights is valid. In response to determining that only the approximation of the second number of errors is valid, the circuitry produces a combined readout by replacing a portion of the bits in the second readout with corresponding bits of the first readout, calculates an enhanced syndrome weight for the combined readout and estimates the first number of errors based on the enhanced syndrome weight. The circuitry improves readout performance from at least the group of the memory cells using at least one of the estimated first and second numbers of errors.

Abstract: In a method of reading initialization information from a non-volatile memory device, when power-up is detected, the non-volatile memory device divides a source voltage to generate a low read pass voltage which is to be provided to unselected word lines in an initialization information read operation. The low read pass voltage is set as at least one voltage between a ground voltage and the source voltage. The non-volatile memory device allows the source voltage not to be pumped in the initialization information read operation, based on the power-up. In the initialization information read operation, the non-volatile memory device provides the low read pass voltage to the unselected word lines and provides a read voltage to a selected word line to read initialization information stored in the memory cells.

Abstract: A non-volatile memory cell includes a storage transistor having a first terminal, a second terminal, and a gate terminal. During a program operation, the first terminal of the storage transistor receives a data voltage according to a weighting to be stored in the non-volatile memory cell, the second terminal of the storage transistor is floating, and the gate terminal of the storage transistor is coupled to a program voltage. The program voltage is greater than the data voltage.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a bit line, a word line crossing the bit line, and a memory cell coupled to and disposed between the bit line and the word line. In a read operation, when the word line, which is in a precharged state, is floated, the bit line is driven to increase a voltage level of the bit line, and stopped when the memory cell is turned on.

Abstract: A semiconductor device includes first and second voltage control lines for a first memory block and third and fourth voltage control lines for a second memory block, for driving gate lines for memory transistors; a first decoder driving the first and third voltage control lines; a second decoder driving the second and fourth voltage control lines; and a control circuit controlling a voltage for the first and second decoders. The control circuit supplies a first voltage and a second voltage lower than the first voltage to the first decoder and a third voltage between the first and second voltages, and the second voltage to the second decoder, before writing operation; and supplies the first voltage and the third voltage to the first decoder and a fourth voltage between the third and second voltages, and a fifth voltage lower than the second voltage to the second decoder, in the writing operation.

Abstract: A memory device stores data in non-volatile memory. The memory device includes a non-volatile memory array. The memory array includes tiers for accessing data stored in blocks of the memory array, including a block having a left block portion and a right block portion. A first staircase is positioned between the left block portion and the right block portion, and a bottom portion of the first staircase includes steps corresponding to first tiers of the left block portion. A second staircase is positioned between the left block portion and the right block portion, and a top portion of the second staircase includes steps corresponding to second tiers of the right block portion. The steps of the first staircase and the steps of the second staircase descend in opposite directions.

Abstract: A read window budget (RWB) corresponding a group of memory cells is determined. The determined RWB and a target RWB is compared. In response to the determined RWB being different than the target RWB, one or more program step characteristics are adjusted to adjust the determined RWB toward the target RWB.

Abstract: A data sensing device and a data sensing method are provided. The data sensing device includes a current adjuster and a sensing amplifier. The current adjuster corresponds to a memory string of a memory array, generates a shift current according to an amount of a plurality of input signals of the memory string, and generates an adjusted read-out current by adjusting a read-out current of the memory string according to the shift current. The sensing amplifier receives the adjusted read-out current and a plurality of reference currents, and generates a read-out data by comparing the adjusted read-out current and the plurality of reference currents.

Abstract: A memory controller performs a reference read on a plurality of memory cells using reference read voltages, generates a histogram indicating the number of memory cells in different threshold voltage bins based on results of the reference read, estimates actual read voltages based on the histogram and a first estimation function, and reads data using the actual read voltages. When reading of the data with the actual read voltages estimated using the first estimation function fails, the memory controller estimates actual read voltages using a second estimation function different from the first estimation function and reads the data with the actual read voltages estimated using the second estimation function.

Abstract: A semiconductor memory device according to an embodiment includes: a row decoder and a memory cell array including a first block. The first block includes: a first region, a second region adjacent to the first region in the first direction, and a third region configured to connect the first region and the second region. The memory cell array further includes: a first insulating layer buried in a first trench between the first region and the second region and in contact with the third region; a first contact plug provided in the first insulating layer and electrically connected to the row decoder; and a first interconnect configured to connect a selection gate line and the first contact plug.

Abstract: An integrated circuit device includes a terminal, a switch circuit, an amplifier circuit, a voltage boosting circuit, and a control circuit. The terminal is connected to a driving signal line of a driving circuit that drives an actuator of a liquid droplet ejection head. One end of the switch circuit is connected to the terminal. The amplifier circuit receives an output signal from the other end of the switch circuit, and amplifies an induced voltage of the actuator after the actuator having been driven. The voltage boosting circuit generates a boosted voltage for level-shifting a switching signal of the switch circuit based on the step-up clock signal.

Abstract: Apparatus and methods utilize a replica circuit to generate a voltage for programming of a memory cell, such as a memory cell of a phase-change memory (PCM). Current passing through a circuit including the memory cell to be programmed is mirrored in a scaled or unscaled manner, and provided as an input to the replica circuit. The replica circuit represents voltage drops that should be encountered when programming the memory cell. An input voltage is also provided to the replica circuit, which affects the voltage drop within the replica circuit that represents the voltage drop of the cell. The voltage drop across the replica circuit can then be mirrored and provided to bias the circuit including the memory cell.

Abstract: A storage device configured to provide an improved data recovery rate includes a memory device including a plurality of memory cells and a memory controller. The memory controller includes a read operation controller for controlling the memory device to perform a read operation by applying a default read voltage or optimal read voltage to a selected word line coupled to selected memory cells among the plurality of memory cells; and an optimal read voltage operating component for determining the optimal read voltage when the read operation using the default read voltage fails, based on an average threshold voltage and cell number information which are information on a memory cell number for each of first and second distributions which are adjacent threshold voltage distributions among threshold voltage distributions that the threshold voltages of the selected memory cells form.

Abstract: A memory system includes a memory device and a controller. The controller performs a test read operation on a read data set of the memory device, using multiple read threshold entries and determines which are good read threshold entries based on results of the read operation. The controller selects a best read threshold entry among the multiple read threshold entries based on a result of the test read operation, partitions the read data set into a good data set decodable by the best read threshold entry and a bad data set undecodable by the best read threshold entry, and sets the bad data set as a new read data set.

Abstract: A memory device includes a memory cell array, a write/read circuit, a control circuit and an anti-fuse array. The memory cell array includes a plurality of nonvolatile memory cells. The write/read circuit performs a write operation to write write data in a target page of the memory cell array, verifies the write operation by comparing read data read from the target page with the write data and outputs a pass/fail signal indicating one of a pass or a fail of the write operation based on a result of the comparing. The control circuit controls the write/read circuit and selectively outputs an access address of the target page as a fail address in response to the pass/fail signal. The anti-fuse array in which the fail address is programmed, outputs a repair address that replaces the fail address.

Abstract: Provided herein may be a memory device including a voltage generating circuit. The memory device may include a memory block including a channel layer formed between junctions included in a well, and a source select line, word lines, and drain select lines that are sequentially stacked on the well while enclosing the channel layer, a first voltage source configured to generate a first operating voltage to be applied to the well during a program operation or an erase operation, and a second voltage source configured to generate a second operating voltage to be applied to source lines that are coupled to the junctions during the program operation or the erase operation.

Abstract: A semiconductor memory device that can reduce power consumption and precisely perform a power-down operation while a testing operation is underway is provided. A flash memory of the invention has a low-power voltage-detection circuit, a high-precision voltage-detection circuit, and a controller. The low-power voltage-detection circuit detects the supply voltage falling to a constant voltage. The high-precision voltage-detection circuit detects the supply voltage falling to the constant voltage. The controller selects the high-precision voltage-detection circuit when the internal circuit is being tested, and it selects the low-power voltage-detection circuit when the internal circuit is not undergoing a test. The controller responds to the detection result from the low-power voltage-detection circuit or the high-precision voltage-detection circuit by performing a power-down operation.

Abstract: A three-dimensional stacked integrated circuit (3D SIC) for implementing an artificial neural network (ANN) having a memory die having an array of memory partitions. Each partition of the array of memory partitions is configured to store parameters of a set of neurons. The 3D SIC also has a processing logic die having an array of processing logic partitions. Each partition of the array of processing logic partitions is configured to: receive input data, and process the input data according to the set of neurons to generate output data.

Abstract: A semiconductor memory array includes a first nonvolatile memory cell having a first charge storage layer and a first gate electrode and a second nonvolatile memory cell, adjacent to the first memory cell in a first direction, having a second charge storage layer and a second gate electrode. The first and second electrodes extend in a second direction perpendicular to the first direction, the first electrode has a first contact section extending toward the second electrode in the first direction, and the second electrode has a second contact section extending toward the first electrode in the first direction. The first and second contact positions are shifted in the second direction, respectively, and the first electrode and the first contact section are electrically separated from the second electrode and the second contact section.

Abstract: According to one embodiment, the array chip includes a three-dimensionally disposed plurality of memory cells and a memory-side interconnection layer connected to the memory cells. The circuit chip includes a substrate, a control circuit provided on the substrate, and a circuit-side interconnection layer provided on the control circuit and connected to the control circuit. The circuit chip is stuck to the array chip with the circuit-side interconnection layer facing to the memory-side interconnection layer. The bonding metal is provided between the memory-side interconnection layer and the circuit-side interconnection layer. The bonding metal is bonded to the memory-side interconnection layer and the circuit-side interconnection layer.

Abstract: A method of operating a semiconductor memory device includes dummy-programming selected memory cells representing all the memory cells to be programmed for a programming operation. The method also includes determining as a first group of memory cells those selected memory cells having threshold voltages less than or equal to a reference threshold voltage and determining as a second group of memory cells those selected memory cells having threshold voltages greater than the reference threshold voltage. The method further includes programming the selected memory cells by applying a first bit line voltage to the memory cells of the first group, applying a second bit line voltage different from the first bit line voltage to the memory cells of the second group, and applying a same program pulse to the memory cells of the first and second groups.

Abstract: A plurality of semiconductor layers have longitudinally a first direction, have a peripheral area surrounded by the plurality of control gate electrodes, and are arranged in a plurality of rows within the laminated body. A controller controls a voltage applied to the control gate electrodes and bit lines. The controller, during a writing operation, applies a first voltage to a first bit line connected to the semiconductor layer positioned in a first row closer to the insulation separating layer, and applies a second voltage larger than the first voltage to a second bit line connected to the semiconductor layer positioned in a second row positioned further from the insulation separating layer with respect to the first row, among the plurality of rows.

Abstract: One illustrative MPT device disclosed herein includes an active region and an inactive region, isolation material positioned between the active region and the inactive region, the isolation material electrically isolating the active region from the inactive region, and an FG MTP cell formed in the active region. In this example, the FG MTP cell includes a floating gate, wherein first, second and third portions of the floating gate are positioned above the active region, the inactive region and the isolation material, respectively, and a control gate positioned above at least a portion of the inactive region, wherein the control gate is positioned above an upper surface and adjacent opposing sidewall surfaces of at least a part of the second portion of the floating gate.

Abstract: A memory device comprising a semiconductor substrate in which a memory cell region and a peripheral circuitry region are defined, wherein the memory cell region has a plurality of non-volatile memory cells arranged in one or more arrays and the peripheral circuitry region has at least one sense amplifier region comprised of at least one low voltage transistor. Further, a deep N-well region is formed in the substrate, wherein the memory cell region and the peripheral circuitry region are placed on the deep N-well region such that, in the event that a high erase voltage (VERA) is applied to the memory cell region during an erase operation, the high erase voltage is applied to all terminals of the at least one low voltage resistor, thereby protecting the low voltage transistor by preventing it from experiencing a large voltage difference between its terminals.

Abstract: A nonvolatile memory device includes a first memory stack including first memory cells vertically stacked on each other, a second memory stack including memory cells vertically stacked on each other, and a control logic configured to set a voltage level of a second voltage applied for a second memory operation to one of the second memory cells in the second memory stack based on a first voltage applied to one of the first memory cells in the first memory stack in a first memory operation. The second memory stack is vertically stacked on the first memory stack. Cell characteristics of the one of the first memory cells is determined using the first voltage.

Abstract: Methods, systems, and devices for source line configurations for a memory device are described. In some cases, a memory cell of the memory device may include a first transistor having a floating gate for storing a logic state of the memory cell and a second transistor coupled with the floating gate of the first transistor. The memory cell may be coupled with a word line, a digit line, and a source line. During a write operation, the source line may be clamped to the digit line using one or more memory cells in the memory device. During a read operation, the source line may be grounded using one or more memory cells in the memory device.

Abstract: A voltage generation system might include a resistive voltage divider having a first resistance connected between its output and a first feedback node and a second resistance connected between the first feedback node and a first voltage node, a capacitive voltage divider having a first capacitance connected between its output and a second feedback node and a second capacitance connected between the second feedback node and the first voltage node, a comparator having an input connected to the second feedback node, and a voltage generation circuit configured to generate a voltage level at its output responsive to an output of the comparator and to a clock signal, wherein the first feedback node is selectively connected to the second feedback node and selectively connected to a second voltage node, wherein the first resistance is selectively connected to the first feedback node, and wherein the second resistance is selectively connected to the first voltage node.

Abstract: A semiconductor memory cell includes a memory cell, a word line and a source line both connected to the memory cell, and a control circuit. During a read operation on the memory cell, the control circuit applies a first voltage to the word line, applies a second voltage greater than the first voltage to the word line, and then applies a third voltage which is greater than the first voltage and smaller than the second voltage to the word line. During the read operation on the memory cell, the control circuit also applies a fourth voltage to the source line according to a timing at which the second voltage is applied to the word line, and then applies a fifth voltage smaller than the fourth voltage to the source line.

Abstract: A non-volatile memory cell and array structure is disclosed situated within a high voltage region of an integrated circuit. The cell utilizes capacitive coupling based on an overlap between a gate and a drift region to impart a programming voltage. Programming is effectuated using a drain extension which can act to inject hot electrons. The cell can be operated as a one-time programmable (OTP) or multiple-time programmable (MTP) device. The fabrication of the cell relies on processing steps associated with high voltage devices, thus avoiding the need for additional masks, manufacturing steps, etc.

Abstract: According to one embodiment, a semiconductor memory device includes: a first interconnecting layer; a first signal line; a first memory cell that stores first information between the first interconnecting layer and the first signal line; second to fourth interconnecting layers provided above the first interconnecting layer; fifth to seventh interconnecting layers disposed apart from the second to fourth interconnecting layers; a second signal line coupled to the first signal line; a third signal line coupled to the first and second signal lines and the sixth interconnecting layer; and, first to fifth transistors.

Abstract: A semiconductor memory device includes first and second memory cell transistors between first and second select transistors, third and fourth memory cell transistors between third and fourth select transistors, a first word line for first and third memory cell transistors, a second word line for second and fourth memory cell transistors, first to fourth selection gate lines respectively for first through fourth select transistors, a bit line, and a source line. During a read operation, while a voltage applied to the second word line is boosted, voltages applied to the first word line and the third and fourth selection gate line are also boosted, after which the voltage applied to the first word line is lowered, and the third and fourth selection gate lines are discharged. After the time the third and fourth selection gate lines are discharged, voltages applied to the bit line and the source line are boosted.

Abstract: Apparatuses and methods related to a memory system including a controller and an array of memory cells. An example apparatus can include a controller configured to receive operational characteristics of an array of memory cells based on prior operations performed by the array of memory cells, determine a set of trim settings for the array of memory cells based on the operational characteristics of the array of memory cells, wherein the set of trim settings are associated with desired operational characteristics for the array of memory cells, and send the set of trim settings to the array of memory cells.

Abstract: A memory device includes an erase operation controller for performing an erase operation on a memory block; an erase suspend count manager for managing an erase suspend count representing a number of times the erase operation is suspended until the erase operation on the memory block is completed; and a program parameter value determiner for determining a parameter value to be used for a program operation on the memory block, based on the erase suspend count.

Abstract: A semiconductor memory cell comprising an electrically floating body having two stable states is disclosed. A method of operating the memory cell is disclosed.

Abstract: A semiconductor device includes strings each having a plurality of memory cells. The strings are coupled between a common source line and a bit line. A method of operating the semiconductor device includes applying a pre-program voltage to a selected word line coupled to a selected memory cell and to an unselected word line coupled to an unselected memory cell adjacent to the selected memory cell among the plurality of memory cells. The method further includes applying a first program voltage to the selected word line.

Abstract: Roughly described, the invention involves a device including a memory chip having a memory array, bit lines in communication with data carrying nodes of the memory array, and word lines in communication with certain gate control nodes of the memory array. The memory chip has bonding pads formed on an interconnect surface at respective memory chip interconnect locations. Each of the bit lines and each of the word lines of the memory array includes a respective landing pad in a conductive layer of the chip, and these landing pads connected via redistribution conductors to respective ones of the set of memory chip bonding pads. The redistribution conductors for the bit lines have a positive average lateral signal travel distance which is less than that of the redistribution conductors for the word lines.