Abstract: A memory integrated circuit comprises first and second memory arrays and first and second interfaces. The first interface receives a signal for accessing a memory location in one of the first and the second memory arrays during a first time interval. The second interface receives a signal for accessing a memory location in one of the first and the second memory arrays during the first time interval. The first interface receives signals for accessing memory locations in the first and the second memory arrays, and the second interface is disabled from accessing the first and the second memory arrays during the second time interval. A signaling rate of a signal received by the second interface, a supply voltage of the second interface, an on-chip termination impedance of the second interface, or a voltage amplitude of a signal received by the second interface is adjusted during the second time interval.

Abstract: According to one embodiment, there is provided a semiconductor memory device including a memory cell array, a plurality of signal lines, and a plurality of signal-line-lead-out portions. In the memory cell array, a plurality of memory cells are arranged. The plurality of signal lines connected to the plurality of memory cells. The plurality of signal-line-lead-out portions are arranged in a periphery of the memory cell array and are connected to the plurality of signal lines. Each of the plurality of signal-line-lead-out portions includes a plug as an electrode whose upper surface and side surface are covered with a passivation film.

Abstract: A dual function memory device architecture compatible with asynchronous operation and synchronous serial operation. The dual function memory device architecture includes one set of physical ports having two different functional assignments. Coupled between the physical ports and core circuits of the memory device are asynchronous and synchronous input and output signal paths or circuits. The signal paths include shared or dedicated buffers coupled to the ports, asynchronous and synchronous command decoders, a network of switches, and a mode detector. The mode detector determines the operating mode of the dual function memory device from a port, and provides the appropriate switch selection signal. The network of switches routes the input or output signals through the asynchronous or synchronous circuits in response to the switch selection signal. The appropriate command decoder interprets the input signals and provides common control logic with the necessary signals for initiating the corresponding operation.

Abstract: The initial command generation device includes a first flag signal generation unit configured to generate a reset flag signal setting a reset period in response to a reset command, an initial pulse signal generation unit configured to generate a first initial pulse signal and a second initial pulse signal in response to the reset flag signal, a second flag signal generation unit configured to generate a device auto initialization flag signal setting a device auto initialization period in response to the first initial pulse signal and an internal command generation unit configured to generate an internal refresh command enabled within the device auto initialization period in response to the second initial pulse signal.

Abstract: A memory module comprises a plurality of main memories; a buffer RAM configured to temporarily store data being provided to or read from the main memories and to perform a buffer function between an external device and the main memories; and a NAND flash memory configured to store data of the buffer RAM during an interruption of power being supplied to the buffer RAM.

Abstract: Embodiments are provided that include a method including providing a first pulsed gate signal to a selected memory cell, wherein the pulsed gate signal alternates between a first voltage level and a second voltage level during a time period and sensing a data line response to determine data stored on the selected memory of cells. Further embodiments provide a system including a memory device, having a regulator circuit coupled to a plurality of access lines of a NAND memory cell, and a switching circuit configured to sequentially bias at least one of the plurality of the access lines between a first voltage level and a second voltage level based on an input signal.

Abstract: The present description relates to non-volatile memory arrays and the operation thereof In at least one embodiment, the non-volatile memory array may include a plurality of memory modules coupled in a daisy chain with enable in/out signals, and a single chip enable signal coupled in parallel to each memory module.

Abstract: Subject matter disclosed herein relates to memory devices and, more particularly, to programming a memory cell.

Abstract: A system is provided with clock skew measurement and correction technology. A first circuit or memory controller 4 includes measuring circuits to measure relative timing or phase offsets of multiple clock signals of a second circuit or memory 6. One measuring circuit is configured for incremental changing of the phase of a transmitted test data sequence to measure and correct timing of a memory receiver circuit's quadrature clocks based on results of a data comparison of transmitted and received test data. Another measuring circuit is configured to scan a received test data sequence for data transitions to measure and correct timing of a memory transmitter circuit's quadrature clocks based on spacing or timing between detected transitions. Individual memory clock generators 30 are controlled with adjustable delay circuits 47 for changing phase of different clock signals of the memory to set the clock signals based on the measurements of the controller.

Abstract: A semiconductor memory is provided which includes: a first pad; a second pad disposed adjacent to the first pad; a first output buffer coupled to the first pad; and a second output buffer coupled to the second pad. The first pad is coupled to the second pad by metal.

Abstract: Various embodiments of a semiconductor memory apparatus are disclosed.

Abstract: A monolithic three dimensional array of non-volatile storage elements is arranged in blocks. The non-volatile storage elements are connected to bit lines and word lines. The bit lines for each block are grouped into columns of bit lines. The columns of bit lines include top columns of bit lines that are connected to selection circuits on a top side of a respective block and bottom columns of bit lines that are connected to selection circuits on a bottom side of the respective block. Programming of data is pipelined between two or more columns of bit lines in order to increase programming speed.

Abstract: A synchronous semiconductor memory device includes a data alignment reference pulse generation unit configured to generate a data alignment reference pulse in response to a data strobe signal, a data alignment suspension signal generation unit configured to generate a data alignment suspension signal in response to the data alignment reference pulse, a data strobe termination signal, and a write pulse, and a data alignment unit configured to align input data in response to the data alignment reference pulse and stop aligning the input data in response to the data alignment suspension signal.

Abstract: A self-refresh test circuit includes a test clock generation unit, a pulse generation unit, a period signal selection unit, and a self-refresh pulse control unit. The test clock generation unit divides a clock signal to generate a plurality of divided clock signals having different periods when a test enable signal is enabled, and outputs one of the plurality of divided clock signals as a selected clock signal. The pulse generation unit generates a test period signal in response to the selected clock signal. The period signal selection unit outputs one of the test period signal and a self-refresh period signal as a selected period signal. The self-refresh pulse control unit generates a self-refresh pulse in response to a self-refresh exit signal and the selected period signal.

Abstract: Embodiments disclosed include a memory array having a plurality of bit lines and a plurality of source lines disposed in columns. A plurality of word lines is disposed in rows. A plurality of storage elements have a first subset of storage elements electrically decoupled from the memory array and a second subset of storage elements coupled to the memory array. The memory array further includes a plurality of bit cells, each including one storage element from the second subset of storage elements coupled to at least two transistors. The bit cells are coupled to the plurality of bit lines and the plurality source lines. Each transistor is coupled to one word line. The memory array can further include logic to select a high performance mode and a high density mode.

Abstract: A microelectronic assembly can include first and second microelectronic packages mounted to opposed surfaces of a circuit panel. Each package can include a substrate having first, second, and third apertures extending therethrough, first, second, and third microelectronic elements each having a surface facing the first surface of the substrate and a plurality of contacts aligned with at least one of the apertures, a plurality of terminals exposed at the second surface in a central region thereof, and leads connected between the contacts of each microelectronic element and the terminals. The apertures of each substrate can have first, second, and third axes extending in directions of their lengths. The first and second axes can be parallel to one another. The third axis can be transverse to the first and second axes. The terminals of each package can be configured to carry all of the address signals transferred to the respective package.

Abstract: A system, method, and computer program product are provided for driving a memory circuit. In one embodiment, the memory circuit is driven utilizing a first resistance value in a first mode of operation. Further, in a second mode of operation, the memory circuit is driven utilizing a second resistance value. In another embodiment, a device is provided for driving a memory circuit without active termination utilizing a resistor.

Abstract: At a succeeding stage of a sense amplifier, a first data latch is provided which has the same bit number as the page length and is controlled to invariably hold the same data as that of the sense amplifier. When a column address strobe (CAS) access begins, data is transferred from the first data latch to an error checking and correcting circuit, and error correction and parity generation are performed in a pipeline process. As a result, the CAS access time and the CAS cycle time are reduced.

Abstract: A memory component having a first and second interface. The first interface is provided to sample address information in response to a first clock signal. The first interface includes inputs to sample at least two bits of the address information in succession during a clock cycle of the first clock signal. The second interface is provided to sample data in response to a second clock signal, having a frequency that is at least twice the frequency of the first clock signal. The second interface includes inputs to sample at least two bits of data in succession during a clock cycle of the second clock signal.

Abstract: A semiconductor memory device and a method of generating an internal voltage in the semiconductor memory device are provided. The semiconductor memory device includes a controller configured to activate a sensing enable signal when an active command is applied from outside, inactivate the sensing enable signal when a precharge command is applied, and output the sensing enable signal, and an array internal voltage generator configured to output an active array power supply voltage as an array power supply voltage when the sensing enable signal is activated, output an external array power supply voltage and a standby array power supply voltage as the array power supply voltage when the sensing enable signal is inactivated, and output the standby array power supply voltage alone as the array power supply voltage when the sensing enable signal is inactivated for at least a specific period.

Abstract: A circuit arrangement includes a programmable logic device. The programmable logic device includes configuration logic circuitry. The programmable logic device also includes configurable interconnects. The circuit arrangement further includes a storage device configured to provide data to the programmable logic device. The storage device communicates with the programmable logic device via a bi-directional interface.

Abstract: A sense amplifier includes a first PMOS transistor, a second PMOS transistor, a third PMOS transistor, a fourth PMOS transistor, a first NMOS transistor, a second NMOS transistor, a third NMOS transistor, and a fourth NMOS transistor. The first PMOS transistor, the second PMOS transistor, the first NMOS transistor, and the second NMOS transistor form cross coupled sensing pairs. The third PMOS and the fourth PMOS transistors serve as compensation transistors. The third NMOS and the fourth NMOS transistors serve as sensing enabling transistors.

Abstract: A semiconductor memory apparatus includes: a data output signal transmitter configured to receive a data signal and a data mask signal and transmit a data output signal through a global data line, the data output signal being outputted by determining whether the data signal is masked or not; and a write driver configured to receive the data output signal through the global data line and input the received data output signal to a local data line corresponding to the data output signal.

Abstract: According to one embodiment, a combination is comprised of a plurality of sense amps, each having an input for receiving a clock signal. A data bus is for receiving data from the plurality of sense amps in response to a clock signal being input to the plurality of sense amps. A tracking circuit is responsive to the clock signal for producing a control signal. A plurality of latches is responsive to the control signal for latching data from the bus. The control signal has a delay that is equal to the time needed for a last data bit to arrive at the plurality of latches. That delay may be equal to a delay associated with inputting the clock signal to a last one of the plurality of sense amps, plus a delay of the last sense amp, plus a delay of the data bus. That amount of delay may be achieved in a number of ways which combines electrical delay with delay inherently associated with the tracking circuit's location.

Abstract: A processor-based system includes a processor coupled to core logic through a processor bus. This includes a dynamic random access memory (“DRAM”) memory buffer controller. The DRAM memory buffer controller is coupled through a memory bus to a plurality of a dynamic random access memory (“DRAM”) modules and a flash memory module, which are at the same hierarchical level from the processor. Each of the DRAM modules includes a memory buffer to the memory bus and to a plurality of dynamic random access memory devices. The flash memory module includes a flash memory buffer coupled to the memory bus and to at least one flash memory device. The flash memory buffer includes a DRAM-to-flash memory converter operable to convert the DRAM memory requests to flash memory requests, which are then applied to the flash memory device.

Abstract: A configurable memory map interface coupled to a circuit element having input/output ports is disclosed. The configurable memory map interface comprises an input coupled to receive an address enabling reading from or writing to the circuit element; a memory storing enable signal parameters, the enable signal parameters controlling timing of enable signals for the reading from or the writing to the circuit element; and an enable signal generator generating the enable signals enabling the reading from or the writing to the circuit element based upon the enable signal parameters stored in the memory. A method of implementing a configurable memory map interface is also disclosed.

Abstract: A memory has a tracking circuit for a read tracking operation. The memory includes a memory bit cell array, a tracking column, a tracking row, a sense amplifier row coupled to the memory bit cell array and the tracking row, and a sense amplifier enable logic. The memory further includes a tracking bit line coupled to the tracking column and the sense amplifier enable logic, and a tracking word line coupled to the tracking row and the sense amplifier enable logic. The tracking circuit is configured to track a column time delay along the tracking column before a row time delay along the tracking row.

Abstract: A semiconductor memory device allows a read command to be inputted thereto after a passage of a relatively short time period from a point in time where a write command has been inputted thereto. A method of operating the semiconductor memory device includes inputting a write command, inputting a read command in a preset period of time after the write command has been inputted, loading read data of a memory cell onto a data bus in response to the read command; and loading write data from outside of the semiconductor memory device onto the data bus in response to the write command.

Abstract: A memory circuit system and method are provided in the context of various embodiments. In one embodiment, an interface circuit remains in communication with a plurality of memory circuits and a system. The interface circuit is operable to interface the memory circuits and the system for performing various functionality (e.g. power management, simulation/emulation, etc.).

Abstract: Asynchronous behavior of a circuit is modeled by modifying latches in a netlist to add an extra port to the latches, e.g., a single-port latch is transformed into a dual-port latch. Each input port has an enable line and a data input. The data input in the added port is a feedback line from the latch output, and the enable line in the added port is the logical NOR of all of the original enable lines. By adding this extra latch port in the higher-level model, it becomes possible to introduce assertion logic to ensure that one and only one latch port for a given latch is ever active during the same simulation cycle. The model can then be tested earlier in the design methodology prior to the availability of the post-synthesis netlist. The model can also be used in both simulation and formal or semi-formal verification.

Abstract: An apparatus includes a terminal, a first plurality of driver lines, and a first phase mixer. The driver lines drive the terminal to a first logic state responsive to a first enable signal. The first phase mixer is coupled to a first one of the first plurality of driver lines. The first phase mixer is operable to receive the first enable signal and a first delayed enable signal derived from the first enable signal and generate a first signal on the first driver line having a first configurable delay with respect to the first enable signal by mixing the first enable signal and the first delayed enable signal.

Abstract: An in-memory processor includes a memory array which stores data and an activation unit to activate at least two cells in a column of the memory array at generally the same time thereby to generate a Boolean function output of the data of the at least two cells. Another embodiment shows a content addressable memory (CAM) unit without any in-cell comparator circuitry.

Abstract: A test mode signal generation device includes a pulse address generation unit configured to convert test address signals into pulse signals and generate pulse address signals, a pulse address split unit configured to generate converted test address signals in response to the pulse address signals, and a test mode signal generation unit configured to generate a test mode signal in response to the converted test address signals.

Abstract: A semiconductor memory device includes a memory core circuit having memory cells for storing data, a circuit configured to refresh the memory core circuit at a refresh interval, a temperature detecting unit configured to detect temperature, and a control circuit configured to shorten the refresh interval immediately in response to detection of a predetermined temperature rise by the temperature detecting unit and to elongate the refresh interval after refreshing every one of the memory cells at least once in response to detection of a temperature drop by the temperature detecting unit.

Abstract: A method for a read-before-write functionality for a memory within a programmable logic device (PLD) is provided. The method begins when a read operation and a write operation are initiated through two different ports of a memory simultaneously to access the same address in the memory. In order to prevent the write operation from proceeding prior to the read operation, a read-before-write control logic is provided to the control block of the port that supports the write operation. Thus, the write operation is paused until the control block of the port that supports the write operation receives a signal from a read sense amplifier indicating that the read operation is complete. The read sense amplifier is capable of detecting the completion of a read operation by monitoring the voltage difference of the read bitline. When this voltage difference reaches a threshold value, the read sense amplifier triggers a write wordline signal.

Abstract: A semiconductor memory device includes a main word line signal generator configured to generate a main word line signal having a first swing width, a sub-word line signal generator configured to generate a first sub-word line signal and a second sub-word line signal having a second swing width and a third swing width, respectively, a first sub-word line driver configured to drive a corresponding sub-word line with the first sub-word line signal or a negative word line voltage in response to the main word line signal, and a second sub-word line driver configured to drive the corresponding sub-word line with the negative word line voltage in response to the second sub-word line signal.

Abstract: A semiconductor integrated circuit includes a first pad allocated to receive a row address, a second pad allocated to discriminate a first input/output mode and a second input/output mode, a detector configured to generate a detection signal in response to logic levels of the first and second pads, and a column address controller configured to deassert a column address to a logic low level in response to a deasserted detection signal. The semiconductor integrated circuit may selectively support one of first and second memory capacities and one of the first and second input/output modes using the logic levels of the first and second pads.

Abstract: A multi-bit test control circuit includes an operation unit, a delay unit, and a generation unit. The operation unit is configured to combine a single source signal inputted to each bank with a delay signal generated by delaying the source signal by a certain time to generate a first pulse signal. The delay unit is configured to delay the first pulse signal by a certain time. The generation unit is configured to combine an output signal of the operation unit with an output signal of the delay unit to generate a second pulse signal for a bank interleaving multi-bit test.

Abstract: Memory controllers, memory devices and methods are provided in which test data is transmitted and signal parameters are varied. The transmitted test data is read, and based on a comparison between transmitted test data and read test data a transmitter impedance is adjusted.

Abstract: A memory module may include a circuit board connectable to a system memory bus through a plurality of contacts disposed along one edge of the circuit board, the system memory bus having three positions for connecting memory modules. A plurality of memory chips may be mounted on the circuit board. The circuit board may include a plurality of D/Q traces to couple a corresponding plurality of D/Q signals from respective contacts to the plurality of memory chips or to one or more buffer chips that isolate the system memory bus from the memory chips. Each of the plurality of D/Q traces may have a predetermined trace impedance selected to provide a predetermined D/Q signal quality level when the memory module is installed in any of the three positions on the system memory bus and equivalent memory modules are installed in the other two positions.

Abstract: A static random access memory (SRAM) circuit includes a pair of complementary global bit-lines, and a pair of complementary local bit-lines. A global read/write circuit is coupled to, and configured to write a small-swing signal to, the pair of global bit-lines in a write operation. The SRAM circuit further includes a first multiplexer and a second multiplexer, each having a first input and a second input. The first input of the first multiplexer and the first input of the second multiplexer are coupled to different one of the pair of global bit-lines. A sense amplifier includes a first input coupled to an output of the first multiplexer, and a second input coupled to an output of the second multiplexer. The sense amplifier is configured to amplify the small-swing signal to a full-swing signal, and outputs the full-swing signal to the pair of local bit-lines in the write operation.

Abstract: A memory module may have a redrive circuit having a plurality of redrive paths, a memory device, and a deskew circuit. The deskew circuit may be separate from the plurality of redrive paths. The deskew circuit may be coupled between the plurality of redrive paths and the memory device to selectively deskew data received in the redrive circuit.

Abstract: Embodiments of a data capture system and method may be used in a variety of devices, such as in memory controllers and memory devices. The data capture system and method may generate a first set of periodic signals and a second set of periodic signals that differs from the first set. Either the first set of periodic signals or the second set of periodic signals may be selected and used to generate a set of data capture signals. The selection of either the first set or the second set may be made on the basis of the number of serial data digits in a previously captured burst of data. The data capture signals may then be used to capture a burst of serial data digits.

Abstract: Provided is a delay adjustment device that contributes to downsizing the circuit that adjusts a flight time. The delay adjustment device is connected to a memory, and adjusts a timing to retrieve data with a data signal and a data strobe signal output from the memory. The delay adjustment device includes a data retrieve unit that receives the data signal and the data strobe signal, and outputs a data value of the data signal in accordance with the data strobe signal; and a control unit that issues a read command to the memory, calculates a flight time, and controls a valid period of the data strobe signal based on the flight time.

Abstract: A semiconductor memory apparatus is provided. The semiconductor memory apparatus includes: an address pad; an address pad buffer section configured to selectively receive a signal of the address pad; a data input buffer section configured to selectively receive the signal of the address pad; and a signal control section configured to selectively provide a path of the signal of the address pad to the address buffer section and the data input buffer section.

Abstract: A system controller communicates with devices in a serial interconnection. The system controller sends a read command, a device address identifying a target device in the serial interconnection and a memory location. The target device responds to the read command to read data in the location identified by the memory location. Read data is provided as an output signal that is transmitted from a last device in the serial interconnection to a data receiver of the controller. The data receiver establishes acquisition instants relating to clocks in consideration of a total flow-through latency in the serial interconnection. Where each device has a clock synchronizer, a propagated clock signal through the serial interconnection is used for establishing the acquisition instants. The read data is latched in response to the established acquisition instants in consideration of the flow-through latency, valid data is latched in the data receiver.

Abstract: A memory device using error correcting code and a system including the same are provided. The memory device includes a memory cell array including a plurality of bit lines and a plurality of memory cells; an access block for accessing the memory cell array; and a controller block for receiving a first operation command signal, dividing the first operation command signal into at least two paths pulse signals corresponding to at least two paths, based on a pre-determined criterion, and then supplying the at least two path pulse signals to the access block. The access block operates based on an output signal of the controller block.

Abstract: A resistive memory device includes a resistive memory cell array, an output circuit and an input circuit. The resistive memory cell array includes a plurality of memory cells that are coupled to bitlines. The output circuit generates a sensing output signal during a write operation by sensing a bitline voltage, and generates output data during a read operation by sensing the bitline voltage. The input circuit controls the bitline voltage based on input data for the write operation, and limits the bitline voltage in response to the sensing output signal during the write operation. The memory cells are protected by effectually limiting bitline voltage.

Abstract: A memory cell (100) includes a read circuit (30) whose output wiring is a read bit line (RBIT) and which has a switching transistor (31), a reset transistor (32), and an output wiring driving transistor (33). The switching transistor (31) connects a data holding node (MD) of a storage circuit (10) and a control line (DR) in accordance with a control signal on a read word line (/RWL0). The reset transistor (32) resets the control line (DR) in accordance with a reset control signal (RST). The output wiring driving transistor (33) has a gate connected to the control line (DR), a drain connected to the read bit line (RBIT), and a source connected to a ground power supply.

Abstract: A semiconductor memory apparatus includes one or more semiconductor chips configured to have predetermined capacity and structure; and a signal level control unit configured to control levels of external signals, which are input to the one or more semiconductor chips, in order to realize various capacities and structures using the one or more semiconductor chips.