Abstract: A dynamic wordline assist circuit for improving performance of an SRAM. An SRAM is disclosed that includes a plurality of memory cells, wherein each memory cell is coupled to a wordline and a pair of bitlines; and a wordline assist circuit coupled to the wordline, wherein the wordline assist circuit includes a first input for activating the wordline assist circuit during a read or write cycle and includes a second input for deactivating the wordline assist circuit during the read or write cycle after a delay.

Abstract: In a digital memory with an array of bit cells coupled to word lines and bit lines, each bit cell having cross coupled inverters isolated from bit lines by passing gate transistors until addressed, some or all of the bit cells are switchable between a sleep mode and a standby mode in response to a control signal. A bit line bias circuit controls the voltage at which the bit lines are caused to float when in the sleep mode. A pull-up transistor for each bit line BL or BLB in a complementary pair has a conductive channel coupled to a positive supply voltage and a gate coupled to the other bit line in the pair, BLB or BL, respectively. A connecting transistor also can be coupled between the bit lines of the complementary pair, bringing the floating bit lines to the supply voltage less a difference voltage ?V.

Abstract: An integrated circuit chip includes an internal circuit configured to generate output data, an inversion determination unit configured to activate/deactivate an inversion signal according to state information regarding a state of the integrate circuit chip, and a signal output circuit configured to invert or not to invert the output data in response to the inversion signal and output the inverted or non-inverted output data.

Abstract: A memory macro includes a tracking circuit and a plurality of memory cells. The tracking circuit has tracking transistors configured to receive a tracking voltage value. Each memory cell of the plurality of memory cells has memory transistors configured to receive a cell voltage value different from the tracking voltage value. The tracking circuit is configured to generate a tracking signal based on which a reading signal of a memory cell of the plurality of memory cells is generated.

Abstract: A semiconductor memory includes a word line driver and a negative voltage generator. The word line driver includes a first inverter configured to drive a word line at one of a first voltage supplied by a first voltage source and a second voltage supplied by a second voltage source. The negative voltage generator is configured to provide a negative voltage with respect to the second voltage to an input of the first inverter in response to a control signal for performing at least one of a read or a write operation of a memory bit cell coupled to the word line.

Abstract: A precharge control circuit includes a precharge voltage supply unit for generating a precharge voltage according to a voltage level of a precharge control signal, a voltage generator for generating an operating voltage for controlling the voltage level of the precharge control signal in response to a first enable signal and a voltage control signal, and a signal generator for fixing the precharge control signal to a specific voltage level in response to a second enable signal and for linearly changing the voltage level of the precharge control signal according to a slope, determined by a level of the operating voltage, when the second enable signal is disabled.

Abstract: A data output control circuit controls a data output in a read operation. A data output control method includes a count shifting mode and a delay mode and can be used in low and high frequency operations, so that a data output can be stably controlled in a broad frequency range. The data output control circuit includes: a low frequency mode controller a high frequency mode controller and a selector selecting any one of first and second command signals through CAS latency information to be output as a data output control signal.

Abstract: A semiconductor device comprises a bit line transmitting a signal to be sensed, a single-ended sense amplifier sensing and amplifying the signal transmitted from the bit line to the input node, and a reference voltage supplying circuit outputting a reference voltage. The sense amplifier includes a first transistor for charge transfer between the bit line and an input node, and the voltage value of the reference voltage is controlled in association with a threshold voltage of the first transistor. The reference voltage is set to a first logical value of the transfer control signal which controlled to be first and second logical values.

Abstract: In a circuit that reduces power consumption in an array system of memory cells accessible in parallel, a local evaluation circuit is connected to a memory cell and a global bit line of the array system of memory cells. A selection circuitry splits the global bit line into an upper part and a lower part of the global bit line. The selection circuitry is adapted to receive an early set prediction signal and to connect the upper part of the global bit line to the lower part of the global bit line based on the early set prediction signal. The early set prediction signal indicates whether a set of memory cells, which include the memory cell, is being read. The circuit also includes a N:1 multiplexer connected to the lower part of the global bit line to receive the lower part of the global bit line as input.

Abstract: A multi-bit test circuit for a semiconductor memory is configured to cause an active command to activate active signals. At least two active signals are respectively inputted to a plurality of banks at different timings in a multi-bit test mode.

Abstract: A semiconductor device, including a plurality of control signal generation units each generating a control signal that is enabled when a column enable signal and a row enable signal are enabled, and a plurality of local sense amplifiers each sensing and amplifying data transmitted via a pair of local input/output (I/O) lines and then outputting the amplified data via a pair of global I/O lines, in response to a read or write signal and a corresponding control signal.

Abstract: A tracking edge of a tracking signal is activated. A buffer is turned off and a latching circuit is turned on, based on the tracking edge of the tracking signal. A buffer output of the buffer is coupled to a latch output of the latching circuit at a node. The buffer receives a data line of a memory macro.

Abstract: One or more timing signals used to time data and command transmission over high-speed data and command signaling links are paused or otherwise disabled when a memory system enters a low-power state, and require substantial time to be re-established at appropriate frequency and/or phase as the system returns to an active operating state. Instead of waiting for the high-speed timing signals to be re-established before beginning memory access operations, an alternative, lower-frequency timing source is used to time transfer of one or more memory-access commands over a combination of data and command signaling links while the high-speed timing signals are being restored, thereby hastening transmission of memory-access commands to memory devices and reducing the incremental latency required to exit the low-power state.

Abstract: The present invention relates to a memory cell having a reduced circuit area, which comprises a first transistor, a second transistor, a third transistor, and a fourth transistor. The first transistor is coupled to a readline and controlled by a wordline. The second transistor is coupled between the first transistor and a low-voltage power supply. The third transistor is coupled to the second transistor and controlled by a bitline. The third transistor controls turn-on and cutoff of the second transistor. Besides, the fourth transistor is coupled to the third transistor and a writeline, and is controlled by the wordline. Thereby, according to the present invention, four transistors form a memory cell, and the objective of saving circuit area can be achieved.

Abstract: A memory device includes a command decoder and control interface logic. One or more external inputs, such as row and column address strobes, communicate with the command decoder through the control interface logic. A control signal is also in communication with the control interface logic. During operation of a drowsy mode in the memory device, a self-refresh signal causes the control signal to disable the external inputs. With the external inputs disabled, command hazards are reduced when exiting drowsy mode.

Abstract: A semiconductor device includes a plurality of bank groups including at least two banks, respectively, and a plurality of address counters corresponding to the plurality of bank groups in a one-to-one manner. A refresh operation of a selected bank group is performed in response to a bank group refresh command.

Abstract: An arrangement of memory devices and a controller is based on an interface with a reduced pin count relative to a known memory device and controller arrangement. Facilitating the reduced pin count interface the reduction of multiple strobe signal to a single strobe signal. In addition, a packet header transmitted on the data bus followed by a payload, includes an encoded indication of the type of the payload. Aspects of the present application relate to providing a traditional memory device with external logic devices, where the logic devices handle the single strobe and the packet header, thereby permitting single strobe operation.

Abstract: A semiconductor storage device in accordance with the present invention includes a first SRAM cell that stores data, and a word line circuit that outputs a first control signal used to activate the first SRAM cell. The word line control circuit gradually raises the voltage level of the first control signal from a substrate potential to a first power supply potential in a first activation period, maintains the voltage level of the first control signal at the first power supply potential in a second activation period subsequent to the first activation period, and raises the voltage level of the first control signal from the first power supply potential to a second power supply potential in a third activation period subsequent to the second activation period.

Abstract: A memory system includes a memory controller that writes data to and reads data from a memory device. A write data strobe accompanying the write data indicates to the memory device when the write data is valid, whereas a read strobe accompanying data from the memory device indicates to the memory controller when the read data is valid. The memory controller adaptively controls the phase of the write data strobe to compensate for timing drift at the memory device. The memory controller uses read signals as a measure of the drift.

Abstract: A semiconductor memory device includes a source signal generation unit configured to generate a source pulse signal having a pulse width which is determined depending on an interval between an input of an active signal and an input of a column command signal, which is inputted after an active command, and a column decoding unit configured to generate a column select signal in response to an address and the source pulse signal.

Abstract: A skew signal generator is provided which comprises a fuse signal generating unit for generating a plurality of fuse signals, and an encoder for generating skew signals including skew information of a wafer by encoding the fuse signals.

Abstract: A memory component having a first and second interface. The first interface is provided to sample address information in response to a first clock signal. The first interface includes inputs to sample at least two bits of the address information in succession during a clock cycle of the first clock signal. The second interface is provided to sample data in response to a second clock signal, having a frequency that is at least twice the frequency of the first clock signal. The second interface includes inputs to sample at least two bits of data in succession during a clock cycle of the second clock signal.

Abstract: A semiconductor memory device includes a memory cell array, an output driver having a pseudo-open drain (POD) structure and providing read data from the memory cell array in a de-emphasis mode, and control logic controlling the output driver in response to a read command to activate the de-emphasis mode. The control logic activates the de-emphasis mode only during an output period during which the read data is output by the output driver.

Abstract: A module having first and second memory devices and a termination component. A first signal line is coupled to the first memory device to provide first data thereto, the first data to be stored in a memory array of the first memory device during a write operation. A second signal line is coupled to the second memory device to provide thereto, the second data to be stored in a memory array of the second memory device during the write operation. A control signal path is coupled to the first memory device, the second memory device and the termination component such that a write command propagating on the control signal path propagates past the first memory device and the second memory device before reaching the first termination component, wherein the write command specifies the write operation.

Abstract: A circuit for generating a write signal includes a pre-emphasis signal generator that receives location information of a to-be-programmed memory cell and generates a pre-emphasis signal depending on the location information of the to-be-programmed memory cell, and a write driver that generates a program signal corresponding to data to be programmed in the to-be-programmed memory cell. A write signal is generated by combining the program signal with the pre-emphasis signal supplied from the pre-emphasis signal generator, and the write signal output to the to-be-programmed memory cell.

Abstract: A semiconductor apparatus includes a normal data line, an auxiliary data line and a data line selection unit. The normal data line is connected with a data selection unit. The auxiliary data line is connected with the data selection unit. The data line selection unit outputs data to one of the normal data line and the auxiliary data line in response to a command signal.

Abstract: The propagation delay of a signal through multiple load devices coupled sequentially along a conductor is improved by separating a subset of the load devices that is more distant from the signal source, and coupling the more distant subset to the signal through a fly-over conductor that bypasses the subset that is nearer to the signal source. The technique is applicable to subsets of bit cells in a random access memory (SRAM) coupled to a given word line, or to word line decoder gates coupled sequentially to a strobe signal, as well as other circuits wherein load devices selectable as a group can be divided into subsets by proximity to the signal source. In an SRAM layout with multiple levels, different metal deposition layers carry the conductor legs between the load devices versus the fly-over conductor bypassing the nearer subset.

Abstract: A method for training an electronic memory may include receiving a first delay value and a second delay value. The first delay value and the second delay value may be associated with a first data strobe indicating when to sample data on a first memory lane of the electronic memory. The method may also include determining a difference between the first delay value and the second delay value. The method may further include receiving a third delay value associated with a second data strobe indicating when to sample data on a second memory lane of the electronic memory. The method may also include determining a fourth delay value for the second memory lane of the electronic memory utilizing the third delay value and the determined difference between the first delay value and the second delay value.

Abstract: A semiconductor memory apparatus includes: a read/write control unit configured to generate a write control signal and a read control signal using internal signals generated through separate signal paths in response to a write command and a read command respectively; and a plurality of ranks configured to perform a write operation or read operation according to the write control signal or the read control signal.

Abstract: Example subject matter disclosed herein relates to apparatuses and/or devices, and/or various methods for use therein, in which an application of an electric potential to a circuit may be initiated and subsequently changed in response to a determination that a snapback event has occurred in a circuit. For example, a circuit may comprise a memory cell that may experience a snapback event as a result of an applied electric potential. In certain example implementations, a sense circuit may be provided which is responsive to a snapback event occurring in a memory cell to generate a feed back signal to initiate a change in an electric potential applied to the memory cell.

Abstract: Some embodiments include apparatus and methods having a memory cell included in a device, a control line configured to receive a control signal to access the memory cell, and a first line configured to transfer information to and from the memory cell. The control signal has a first level during a first time interval and a second level during a second time interval of a memory operation. The apparatus and methods also include a module configured to reduce difference between a value of a voltage on the second line and a value of a voltage on a node of the device during a first time portion of the second time interval. Additional apparatus and methods are disclosed.

Abstract: A memory controller takes in the first to (N?1)th pieces of data respectively in synchronization with the second to Nth return read clocks. The memory controller takes in the Nth piece of data from stop of output of the Nth read clock and before a first predetermined time. The memory controller sets an output period of the Nth read clock to be longer than an output period of each of the first to (N?1)th read clocks.

Abstract: A command decoder includes a snoop read control signal generation unit that generates a snoop read control signal from a internal chip select signal according to a level of a transmission mode control signal, and an internal snoop read command generation unit that generates an internal snoop read command by driving a first node in response to an internal command and the snoop read control signal.

Abstract: A monolithic three dimensional array of non-volatile storage elements is arranged in blocks. The non-volatile storage elements are connected to bit lines and word lines. The bit lines for each block are grouped into columns of bit lines. The columns of bit lines include top columns of bit lines that are connected to selection circuits on a top side of a respective block and bottom columns of bit lines that are connected to selection circuits on a bottom side of the respective block. Programming of data is pipelined between two or more columns of bit lines in order to increase programming speed.

Abstract: A semiconductor IC device includes a command decoder that provides internal read and internal write command signals in response to external command signals, and a delay control unit that is connected with the command decoder and provides an internal read command delay signal by controlling an activation timing of the internal read command signal in response to a test mode signal in a read mode.

Abstract: A memory controller has a communication path which is coupled to an external, wired electrical path. The memory controller includes at least two alternative interface circuits to communicate with the external, wired electrical path using signals having one of two different formats. Each of the alternative interface circuits is electrically coupled to a corresponding signal connector, and only one of these signal connectors, in turn, is electrically coupled to the external path via an I/O pin or printed-circuit board connection (depending upon implementation). The remaining signal connector may be left electrically uncoupled from the external, wired electrical path, and, if desired, the corresponding remaining interface circuit may be left unused during operation of the memory controller.

Abstract: Memory devices and methods of operation are provided. A memory device includes first and second cross-coupled inverters and first and second access transistors coupled to an input node of the second inverter. The memory device also includes a control circuit for providing a first reference voltage at a first ground node of the first inverter and a second reference voltage at a second ground node of the second inverter. The first access transistor is configured to conduct current from a first bit line to the input node and to provide substantially no current conduction from the input node to the first bit line. The second access transistor is configured to conduct current from the input node to one of the first bit line and a second bit line and to provide substantially no current conduction from the input node to the one of first and second bit lines.

Abstract: A circuit comprises a first voltage source, a second voltage source, a first switch, firsts transistors, and a control circuitry. The first switch is configured to selectively couple the first voltage source or the second voltage source to a first signal line. The first transistors are in an IO circuitry and have first bulks configured to receive the first signal line. The control circuitry is configured to receive a clock and a command signal on a command signal line, and generate a first control signal on a first control signal line to control the first switch based on the clock and the command signal.

Abstract: Disclosed is a memory module which includes a memory chip; an external input/output terminal having an electrical signal input/output terminal and an optical signal input/output terminal; an optical signal processor configured to convert a first optical signal input through the optical signal input/output terminal into a first internal electrical signal and to convert a second internal electrical signal into a second optical signal; and a controller configured to provide a first data signal to the memory chip in response to a first external electrical signal input through the electrical signal input/output terminal or the first internal electrical signal and to transfer the second internal electrical signal to the optical signal processor or to output a second external electrical signal to the electrical signal input/output terminal in response to a second data signal output from the memory chip.

Abstract: A bridge device architecture for connecting discrete memory devices. The bridge device is used in conjunction with a composite memory device including at least one discrete memory device. The bridge device includes a local control interface for connecting to the at least one discrete memory device, a local input/output interface for connecting to the at least one discrete memory device, and a global input/output interface. The global input/output interface receives and provides global memory control signals and also receives and provides write data to and read data from the at least one discrete memory device.

Abstract: A memory controller outputs address bits and a first timing signal to a DRAM, each address bit being associated with an edge of the first timing signal and the first timing signal requiring a first propagation delay time to propagate to the DRAM. The memory controller further outputs write data bits and a second timing signal to the DRAM in association with the address bits, each of the write data bits being associated with an edge of the second timing signal and the second timing signal requiring a second propagation delay time to propagate to the DRAM. The memory controller includes a plurality of series-coupled delay elements to provide respective, differently-delayed internal delayed timing signals and a multiplexer to select one of the delayed timing signals to be output as the second timing signal based on a difference between the first propagation delay time and the second propagation delay time.

Abstract: A semiconductor device includes a sub word line driver. A first sub word line and a second sub word line transmit an operation signal to a memory cell. A main word line optionally sends the operation signal to the first sub word line and the second sub word line. A switching transistor is disposed between the first sub word line and the second sub word line. A gate of the switching transistor is connected the main word line.

Abstract: A semiconductor device receives a command corresponding to a memory access operation and performs the memory access operation after an additive latency period. The additive latency period begins when the command is received. The semiconductor device comprises a phase controller for controlling a phase of a clock signal and outputting a phase-controlled clock signal, and a controller for generating and outputting a control signal for enabling the phase controller that is disabled, at a predetermined time in the additive latency period.

Abstract: A storage system includes a three-dimensional memory array that has multiple layers of non-volatile storage elements grouped into blocks. The blocks are grouped into bays. The storage system includes array lines of a first type in communication with storage elements, array lines of a second type in communication with storage elements, and sense amplifiers. Each block is geographically associated with two sense amplifiers and all blocks of a particular bay share a group of sense amplifiers associated with the blocks of the particular bay. The system includes multiple sets of local data lines in one or more routing metal layers below the three-dimensional memory array and multiple sets of global data lines in one or more top metal layers above the three-dimensional memory array. Each set of one or more blocks include one set of the local data lines. Each bay includes one set of global data lines that connect to the group of sense amplifiers associated with the blocks of the respective bay.

Abstract: A circuit includes a first circuit configured to sense a leakage of a first bit line and output a first signal in response, and a second circuit configured to receive the first signal output from the first circuit and in response supply current to a second bit line for maintaining a voltage level of the second bit line.

Abstract: A method includes preparing a chip-stack structure in which a first memory chip is stacked over a first main surface of a second memory chip, data electrodes of the first and second memory chips being electrically connected and a data signal outputted from the data electrode of the first memory chip being conveyed on a side of the second main surface of the second memory chip, accessing the first memory chip so that the data signal is outputted from the first memory chip and appears on the side of the second main surface of the second memory chip in first access time, accessing the second memory chip so that a data signal is outputted and appears on the side of the second main surface of the second memory chip in second access time, and setting output timing adjustment information into at least one of the first and second memory chips.

Abstract: A semiconductor memory apparatus includes a data input enable signal generation block configured to sequentially delay a data strobe signal to generate a first delayed data strobe signal, a second delayed data strobe signal, a third delayed data strobe signal and a fourth delayed data strobe signal, and generate a data strobe enable signal in response to a CAS write signal, a CAS write latency signal and the first to fourth delayed data strobe signals, a latch control signal generation block configured to output the data strobe signal as a latch control signal during an enable period of the data strobe enable signal, and a data latch block configured to latch data in response to the latch control signal and output latched data.

Abstract: A common standard may be used for both dynamic random access memories and non volatile memories, despite the fact that the non-volatile memory generally needs bidirectional communications to coordinate writing with a memory controller. In one embodiment, a package connector on the non-volatile memory may be used for one function that does not involve communications with the memory controller during reading and may be used for communications with the memory controller during writing. Particularly, those communications during writing may be to indicate to the memory controller when the memory is ready for writing and when the memory is busy so that a write must be deferred until the memory is ready to be written to.

Abstract: Embodiments of the present disclosure describe memory module bus termination voltage (VTT) regulation and management techniques and configurations. A method includes receiving, by a register, a signal that is driven over a bus to a memory device comprising a plurality of memory cells and setting, within the register, a termination voltage (VTT) for the bus based on the signal. Other embodiments may be described and/or claimed.

Abstract: A memory with disabling circuit includes a memory matrix and a disabling circuit. The memory matrix includes a data input/output end and an output enable end. The disabling circuit includes a fuse and an output end. When the fuse is not blown, the disabling circuit transmits the signal of the data input/output end to the output end according to the signal of the output enable end. When the fuse is blown, the disabling circuit generates a tri-state to the output end. Therefore, external circuits cannot perform actions of reading or writing to access the memory matrix.