Abstract: A memory device is provided comprising an array of memory cells. During a read operation, voltage on a read bit line will transition towards a second voltage level if a data value stored in that activated memory cell has a first value, and sense amplifier circuitry will then detect this situation. If that situation is not detected, the sense amplifier circuitry determines that the activated memory cell stores a second value. Bit line keeper circuitry is coupled to each read bit line and is responsive to an asserted keeper pulse signal to pull the voltage on each read bit line towards the first voltage level. Keeper pulse signal generation circuitry asserts the keeper pulse signal at a selected time. The selected time is such that the voltage on the associated read bit line will have transitioned to the trip voltage level before the keeper pulse signal is asserted.

Abstract: A semiconductor memory includes a memory array having at least one bit line, a tracking bit line, and a global tracking circuit. The tracking bit line is configured to emulate a voltage transition of the at least one bit line. The global tracking circuit is configured to generate a timing signal for generating a negative voltage with respect to ground on the at least one bit line of the memory array.

Abstract: Each of a plurality of memories includes a terminating resistor for preventing signal reflection, and a memory control circuit includes an ODT control circuit for driving the terminating resistor of each memory, and a selector for selecting, from memories except for a memory to be accessed, at least one memory for which driving of the terminating resistor is to be suppressed, in accordance with the memory to be accessed.

Abstract: The present invention discloses a reference cell circuit which is applied to a non-volatile memory. The reference cell circuit includes a reference cell array, a first current mirror circuit, and a second current mirror circuit. The reference cell array includes at least one row of floating gate transistors. The first current mirror circuit is arranged to generate a mirror current according to a reference current generated by the reference cell array. The second current mirror circuit is arranged to receive the mirror current and generate an adjusted reference current according to the mirror current and a selected one of a plurality of enable signals, wherein the plurality of enable signals correspond to a plurality operations of the non-volatile memory and the adjusted reference current is arranged to determine logical state of a plurality of memory cells of the non-volatile memory.

Abstract: Semiconductor chips are provided. The semiconductor chip includes a selection phase clock generator and a data input/output portion. The selection phase clock generator is configured to receive an external clock signal and an inversed external clock signal to generate phase clock signals, configured to receive a first external test clock signal and a second external test clock signal to generate test phase clock signals, and configured to output the phase clock signals or the test phase clock signals as selection phase clock signals in response to a test mode signal.

Abstract: A semiconductor device includes an interface chip including: an internal data terminal, and a timing data storage circuit configured to output a plurality of timing set signals, and a plurality of core chips stacked with one another, each of the core chips including a plurality of memory cells, an output control circuit coupled to the timing data storage circuit of the interface chip, the output control circuit being configured to receive a corresponding one of the timing set signals and to output an output timing signal in response to the corresponding one of the timing set signals, and a data output circuit coupled to the internal data terminal of the interface chip, the data output circuit being configured to output data in response to the output timing signal, the data being derived from a corresponding one of the memory cells.

Abstract: A semiconductor device along with circuits including the same and methods of operating the same are described. The device comprises a memory cell consisting essentially of one transistor. The transistor comprises a gate, an electrically floating body region, and a source region and a drain region adjacent the body region. The device includes data sense circuitry coupled to the memory cell. The data sense circuitry comprises a word line coupled to the gate region and a bit output coupled to the source region or the drain region.

Abstract: Disclosed are various embodiments related to stacked memory devices, such as DRAMs, SRAMs, EEPROMs, ReRAMs, and CAMs. For example, stack position identifiers (SPIDs) are assigned or otherwise determined, and are used by each memory device to make a number of adjustments. In one embodiment, a self-refresh rate of a DRAM is adjusted based on the SPID of that device. In another embodiment, a latency of a DRAM or SRAM is adjusted based on the SPID. In another embodiment, internal regulation signals are shared with other devices via TSVs. In another embodiment, adjustments to internally regulated signals are made based on the SPID of a particular device. In another embodiment, serially connected signals can be controlled based on a chip SPID (e.g., an even or odd stack position), and whether the signal is an upstream or a downstream type of signal.

Abstract: A memory array assembly and a method for performing a write operation without disturbing data stored in other SRAM cells are provided. The memory array assembly comprises a plurality of SRAM cells, a plurality of avoid-disturb cells, a plurality of sense amplifiers and a plurality of write drivers. The SRAM cells are arranged in rows and columns, wherein each column is coupled to an avoid-disturb cell, a sense amplifier, and a write driver. The avoid-disturb cell receives a select signal capable of assuming first or second states. An output of the sense amplifier is coupled to an input of the write driver when the select signal is in the first state. A data-in bus is coupled to the input of the write driver if the select signal is in the second state. The write driver then sends the output signal to the SRAM cell.

Abstract: Embodiments disclosed include a memory array having a plurality of bit lines and a plurality of source lines disposed in columns. A plurality of word lines is disposed in rows. A plurality of storage elements have a first subset of storage elements electrically decoupled from the memory array and a second subset of storage elements coupled to the memory array. The memory array further includes a plurality of bit cells, each including one storage element from the second subset of storage elements coupled to at least two transistors. The bit cells are coupled to the plurality of bit lines and the plurality source lines. Each transistor is coupled to one word line. The memory array can further include logic to select a high performance mode and a high density mode.

Abstract: A memory cell is provided at an intersection of a word line and a bit line, and a dummy cell is provided at an intersection of a dummy word line and a dummy bit line. A delay circuit delays a signal read into the dummy bit line to generate a sense amplifier activating signal. A sense amplifier circuit starts an operation based on a change in the sense amplifier activating signal, and detects/amplifies a signal read out from the memory cell into the bit line. The delay circuit is configured having a first logical gate circuit and a second logical gate circuit alternately cascade-connected. A second delay time is longer than a first delay time, the second delay time being a time required for an output signal of the second logical gate circuit to switch from a first logical state to a second logical state, and a first delay time being a time required for an output signal of the first logical gate circuit to switch from a first logical state to a second logical state.

Abstract: A power-up signal generation circuit includes a first driving section configured to generate a pre-power-up signal by driving a first node to a first pull-up drivability or driving the first node to a first pull-down drivability in response to an internal voltage when not in an active mode, and a second driving section configured to generate the pre-power-up signal by driving the first node to a second pull-up drivability or driving the first node to a second pull-down drivability in response to the internal voltage in the active mode. The first pull-up drivability is larger than the second pull-up drivability, and the first pull-down drivability is smaller than the second pull-down drivability.

Abstract: A circuit includes a first circuit configured to sense a leakage of a first bit line and output a first signal in response, and a second circuit configured to receive the first signal output from the first circuit and in response supply current to a second bit line for maintaining a voltage level of the second bit line.

Abstract: A semiconductor memory device includes a memory block configured to store a data inputted/outputted through a data transfer line, a data output block configured to output the data loaded on the data transfer line in response to a source clock, wherein the data output block is controlled to be coupled with the data transfer line in response to a write operation signal, a write operation signal generation block configured to generate the write operation signal in response to an operation selection signal and a reference clock lagging behind the source clock by a set time, and a data input block configured to load the data on the data transfer line in response to the write operation signal.

Abstract: A switching circuit comprises a control and bias stage configured for receiving a first input voltage signal, a second input voltage signal and a selection signal and for generating therefrom a first bulk bias signal substantially equal to the first input voltage signal or to the second input voltage signal depending on the selection signal. The switching circuit further comprises a switching stage connected to the control and bias stage, including a transistor having a bulk terminal, and configured for receiving the bulk bias signal and generating an output signal having the first input voltage signal when the selection signal indicates the selection of the first input voltage signal or having the second input voltage signal when the selection signal indicates the selection of the second input voltage signal. The bulk bias signal is electrically coupled to the bulk terminal of the transistor.

Abstract: A memory controller having a time-staggered request signal output. A first timing signal is generated while a second timing signal is generated having a first phase difference relative to the first timing signal. An address value is transmitted in response to the first timing signal and a control value is transmitted in response to the second timing signal, the address value and control value constituting portions of a first memory access request.

Abstract: A row decoder is disposed on a side of a memory cell array in a column direction and supplies one of word lines with a first drive signal for selecting one of memory cells. A dummy word line is formed extending in the column direction. A dummy bit line is formed extending in a row direction. At least one of the dummy word line and the dummy bit line is disposed outside of the memory cell array. The row decoder outputs a second drive signal toward a sense amplifier circuit via the dummy bit line and the dummy word line.

Abstract: A memory component has a signaling interface, data input/output (I/O) circuitry, command/address (CA) circuitry and clock generation circuitry. The signaling interface includes an on-die terminated data I/O and an unterminated CA input. The data I/O circuitry is dedicated to sampling write data bits at the data I/O timed by a strobe signal and to transmitting read data bits timed by a first clock signal, each of the write and read data bits being valid for a bit time at the data I/O. The CA circuitry samples CA signals at the CA input timed by a second clock signal, the CA signals indicating read and write operations to be performed within the memory component. The clock generation circuitry generates the first clock signal with a phase that establishes alignment between a leading edge of the bit time for each read data bit and a respective transition of the second clock signal.

Abstract: A first clock is received by a memory macro. In response to a first clock transition of the first clock, a first transition of a second clock and of a third clock is generated. A tracking transition of a tracking signal is caused by the second clock. Based on a later transition of a second clock transition of the first clock and the tracking transition of the tracking signal, a second transition of the third clock is generated. The third clock is for use by an input-output of the memory macro.

Abstract: A memory system is provided with a processor, a main memory, and a flash memory. Performance of the memory system is improved through achievement of speed-up and high data reliability. The memory system includes a nonvolatile memory device and a controller configured to drive a control program to control the nonvolatile memory device. The control program executes a second access operation for the nonvolatile memory device even before a first access operation to the nonvolatile memory device is completed.

Abstract: Embodiments are provided that include a method including providing a first pulsed gate signal to a selected memory cell, wherein the pulsed gate signal alternates between a first voltage level and a second voltage level during a time period and sensing a data line response to determine data stored on the selected memory of cells. Further embodiments provide a system including a memory device, having a regulator circuit coupled to a plurality of access lines of a NAND memory cell, and a switching circuit configured to sequentially bias at least one of the plurality of the access lines between a first voltage level and a second voltage level based on an input signal.

Abstract: A semiconductor memory device includes a plurality of memory chips each including a chip identification (ID) generation circuit. The chip ID generation circuits of the respective memory chips are operatively connected together in a cascade configuration, and the chip ID generation circuits are activated in response to application of a power supply voltage the memory device to sequentially generate respective chip ID numbers of the plurality of device chips.

Abstract: Semiconductor modules are provided. The semiconductor module includes a first semiconductor chip configured for storing an information signal that is set in response to a command/address signal and which determines reception of an on-die termination (ODT) signal in a power down mode in response to the information signal to control activation of a first ODT circuit; and a second semiconductor chip configured for sharing and utilizing the first ODT circuit included in the first semiconductor chip.

Abstract: Power management of an embedded dynamic random access memory (eDRAM) using collected performance counter statistics to generating a set of one or more eDRAM effectiveness predictions. Using a set of one or more eDRAM effectiveness thresholds, each corresponding to one of the set of eDRAM effectiveness predictions, to determine whether at least one eDRAM effectiveness prediction has crossed over threshold. In the case that at least one eDRAM effectiveness prediction has crossed over its threshold, transitioning the eDRAM to a new power state. Power management is achieved by transitioning to a power-off state or self-refresh state and reducing the amount of power consumed by the eDRAM as compared to a power-on state.

Abstract: A memory device, includes a recording medium; a probe to write a plurality of the signals; a first driving portion to vibratory drive the recording medium; a detecting unit which, when the first driving portion changes a frequency to vibratory drive the recording medium, detects a change in an amplitude of the resonance drive, detects the frequency at which the amplitude becomes maximum as a resonance frequency; and a calculating unit which calculates a timing when the probe writes a plurality of the signals using the resonance frequency; wherein, the first driving portion vibratory drives the recording medium and the probe writes a plurality of the signals.

Abstract: A semiconductor memory apparatus includes a program pulse generation block configured to generate write control signals and a program completion signal in response to a programming enable signal; a successive program control circuit configured to generate a successive programming enable signal in response to received program addresses and data count signals as a buffered program command or a buffered overwrite command; and a controller configured to generate the programming enable signal in response to the successive programming enable signal.

Abstract: Power-on-reset (POR) circuits for resetting memory devices, and related circuits, systems, and methods are disclosed. In one embodiment, a POR circuit is provided. The POR circuit is configured to receive as input, a plurality of decoded address outputs from at least one memory decoding device. The POR circuit is further configured to generate a POR reset if any of the plurality of decoded address outputs are active. As a result, memory decoding device latches can be reset to a known, default condition to avoid causing an unintentional word line selection in the memory during power-on state before an external reset is available. Because the POR circuit can generate the POR reset without need of an external reset, the memory decoding devices can be reset quickly to allow for quicker availability of memory after a power-on condition.

Abstract: A semiconductor memory device includes a cell array including one or more bank groups, where each of the one or more bank groups includes a plurality of banks and each of the plurality of banks includes a plurality of spin transfer torque magneto resistive random access memory (STT-MRAM) cells. The semiconductor memory device further includes a source voltage generating unit for applying a voltage to a source line connected to the each of the plurality of STT-MRAM cells, and a command decoder for decoding a command from an external source in order to perform read and write operations on the plurality of STT-MRAM cells.

Abstract: Power supplied to a memory module is provided. A first voltage is supplied to a first power distribution pathway, the first voltage being from a voltage supplied to a printed circuit board on which the memory module resides. A second voltage is generated, the second voltage being generated by a voltage regulator. The second voltage is supplied to a second power distribution pathway.

Abstract: According to one embodiment, a device for synchronizing data output from two or more memory arrays that includes a plurality of sense circuits configured to be responsive to a clock signal. The device further includes a plurality of latches and a tracking circuit. The tracking circuit may be configured to produce a control signal responsive to the clock signal. The control signal may be operable to enable the plurality of latches. The tracking has an associated delay that is substantially the same as a delay associated with at least one of the plurality of sense circuits.

Abstract: Each of the core chips includes a data output circuit that outputs read data to the interface chip in response to a read command, and an output timing adjustment circuit that equalizes the periods of time required between the reception of the read command and the outputting of the read data from the data output circuit among the core chips. With this arrangement, a sufficient latch margin for read data to be input can be secured on the interface chip side. Furthermore, as the output timing is adjusted on each core chip side, there is no need to prepare the same number of latch timing control circuits as the number of core chips on the interface chip side.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A period signal generation circuit includes a first discharger configured to discharge first current from a control node which is driven in response to a first reference voltage, and a second discharger configured to discharge second current from the control node. The total current of the first and second currents is substantially constant when an internal temperature of the discharge controller is below a predetermined temperature, and the total current of the first and second currents varies as the internal temperature increases over the predetermined temperature.

Abstract: A period signal generation circuit includes a first discharger configured to discharge first current having a constant value from a control node in response to a temperature signal; and a second discharger configured to discharge second current varying according to an internal temperature thereof from the control node in response to the temperature signal.

Abstract: A period signal generation circuit includes a period signal generator configured to alternately charge and discharge a control node according to a level of the control node to generate a period signal, a discharge controller configured to discharge a first current having a constant value from the control node in response to a temperature signal and discharge a second current varying according to an internal temperature thereof from the control node in response to the temperature signal, and a tester configured to control a charging speed and a discharging speed of the control node.

Abstract: A semiconductor device includes a plurality of core chips to which chip identification information different from each other is allocated and an interface chip are layered, the plurality of core chips are commonly connected to the interface chip through a first current path including at least a through silicon via, the interface chip serially supplies an enable signal to the plurality of core chips through the first current path, and the plurality of core chips are activated based on a logic level of a bit corresponding to the chip identification information among a plurality of bits configuring the enable signal. The present invention can reduce the number of through silicon vias required to supply an enable signal.

Abstract: Embodiments may be directed to a method of operating a semiconductor device, the method including receiving a first write training command, receiving a first write data responsive to the first write training command through a first data line, and transmitting the first write data through a second data line. Transmitting the first write data is performed without an additional training command.

Abstract: A semiconductor memory device includes an internal signal generation block configured to generate a control signal which is enabled from a generation time of an internal active signal enabled if it is determined that a combination of external commands in synchronization with a rising edge of an external clock inputted from an outside is a preset combination, to a disable time an internal idle signal; and an internal command signal generation block configured to generate an internal write signal if it is determined that a combination of counting signals counted during an enable period of the control signal is a first combination and generate an internal precharge signal if it is determined that the combination of the counting signals is a second combination.

Abstract: A system is provided with clock skew measurement and correction technology. A first circuit or memory controller 4 includes measuring circuits to measure relative timing or phase offsets of multiple clock signals of a second circuit or memory 6. One measuring circuit is configured for incremental changing of the phase of a transmitted test data sequence to measure and correct timing of a memory receiver circuit's quadrature clocks based on results of a data comparison of transmitted and received test data. Another measuring circuit is configured to scan a received test data sequence for data transitions to measure and correct timing of a memory transmitter circuit's quadrature clocks based on spacing or timing between detected transitions. Individual memory clock generators 30 are controlled with adjustable delay circuits 47 for changing phase of different clock signals of the memory to set the clock signals based on the measurements of the controller.

Abstract: A non-volatile semiconductor device and a method for controlling the same are disclosed, which can increase a read efficiency of the non-volatile semiconductor device using the Low Power Double Data Rate (LPDDR) 2 specifications. The non-volatile semiconductor device includes a decoder configured to output a plurality of active control signals by decoding an active address and an active signal, and a plurality of active controls configured to be controlled by the plurality of active control signals and a plurality of active reset signals so as to generate a plurality of active enable signals that are independently activated.

Abstract: A semiconductor memory device includes a signal processing unit configured to generate a control signal corresponding to burst length information and an output controlling unit configured to control an output of a data strobe signal in response to the control signal.

Abstract: A memory device using error correcting code and a system including the same are provided. The memory device includes a memory cell array including a plurality of bit lines and a plurality of memory cells; an access block for accessing the memory cell array; and a controller block for receiving a first operation command signal, dividing the first operation command signal into at least two paths pulse signals corresponding to at least two paths, based on a pre-determined criterion, and then supplying the at least two path pulse signals to the access block. The access block operates based on an output signal of the controller block.

Abstract: A data input device for use in a memory device to avoid false data being written due to a postamble ringing phenomenon in a write operation is provided. The data input device comprises a buffer, a combinational logic circuit and a flip-flop unit. The buffer receives the data and outputs internal data to the flip-flop unit. The combinational logic circuit receives an external data strobe signal to generate a first data strobe signal and a second data strobe signal. The flip-flop unit stores the data in synchronization with the first data strobe signal and outputs the stored data in synchronization with the second data strobe signal. A last rising edge of the second data strobe signal is generated prior to onset of the postamble ringing on the external data strobe signal, so that a data transferred path in the flip-flop unit is closed prior to onset of the postamble ringing.

Abstract: Command signal management methods and circuits in memory devices are disclosed. Command signals are selectively passed and blocked to enforce safe operating characteristics within a memory device. In at least one embodiment, a command signal management circuit is configured to selectively block a command signal while a memory device operation is being performed. In at least one other embodiment, one or more command blocking circuits are configured to selectively pass and block one or more command signals generated by a memory access device coupled to the memory device while a memory device operation is being performed in the memory device.

Abstract: A dual function memory device architecture compatible with asynchronous operation and synchronous serial operation. The dual function memory device architecture includes one set of physical ports having two different functional assignments. Coupled between the physical ports and core circuits of the memory device are asynchronous and synchronous input and output signal paths or circuits. The signal paths include shared or dedicated buffers coupled to the ports, asynchronous and synchronous command decoders, a network of switches, and a mode detector. The mode detector determines the operating mode of the dual function memory device from a port, and provides the appropriate switch selection signal. The network of switches routes the input or output signals through the asynchronous or synchronous circuits in response to the switch selection signal. The appropriate command decoder interprets the input signals and provides common control logic with the necessary signals for initiating the corresponding operation.

Abstract: Embodiments of a memory are disclosed that may allow for the detection and compensation of weak data storage cells. The memory may include data storage cells, a selection circuit, a sense amplifier, and a timing and control block. The timing and control block may be operable to controllably select differing time periods between the activation of the selection circuit and the activation of the sense amplifier.

Abstract: A non-volatile memory device includes a set pulse generator configured to generate a set pulse, a reset pulse generator configured to generate a reset pulse based on the set pulse, and a write driver block configured to write second data to a second non-volatile memory cell using the reset pulse, while writing first data to a first non-volatile memory cell using the set pulse.

Abstract: A memory system includes a memory controller that writes data to and reads data from a memory device. A write data strobe accompanying the write data indicates to the memory device when the write data is valid, whereas a read strobe accompanying data from the memory device indicates to the memory controller when the read data is valid. The memory controller adaptively controls the phase of the write data strobe to compensate for timing drift at the memory device. The memory controller uses read signals as a measure of the drift.

Abstract: A memory assist apparatus includes a detection circuit and a compensation circuit. The detection circuit is configured to provide a detection signal indicating whether a bit line configured to provide read access to a data bit stored at a memory bit cell has a voltage below a predetermined threshold. The compensation circuit is configured to pull down the voltage of the bit line if the detection signal indicates that the voltage of the bit line is below the predetermined threshold.

Abstract: A semiconductor device includes a sense amplifier circuit. The sense amplifier circuit includes a cross-coupled first transistor and second transistor that perform amplification. The sources of the cross-coupled transistors are respectively connected in series with a third transistor and a fourth transistor, and electrical current supply capability of the third and fourth transistors is controlled by a control voltage given to control electrodes of the third and fourth transistors. In a data retaining period, a minimum sub-threshold current necessary for retaining the data is flowed to the third and fourth transistors according to the control voltage, and bit line potential is maintained.