Abstract: A memory device for sensing memory cell in a memory array includes at least one first memory cell, a first sensing amplifier, a first multiplexer circuit, a plurality of first reference cells, and a controller. The first sensing amplifier is coupled to the at least one first memory cell. An output terminal of the first multiplexer circuit is coupled to the reference terminal of the first sensing amplifier. Each of the first reference cells is coupled to each input node of the first multiplexer circuit. The controller is coupled to a control terminal of the first multiplexer circuit. The first sensing amplifier comprises an output terminal and a reference terminal. The controller controls the first multiplexer circuit to select one of the first reference cells as a selected reference cell to couple to the reference terminal of the first sensing amplifier when each read operation to the at least one first memory cell is performed.

Abstract: A resistance measuring device includes an amplifying unit including an amplifier, a first and a second current supply unit, a voltage detection unit, and a controller. The controller controls the voltage detection unit to detect a first output voltage of an output terminal of the amplifier in a state where the current of the first current source flows in a forward direction to a measurement target resistor by controlling the first current supply unit, controls the voltage detection unit to detect a second output voltage of the output terminal of the amplifier in a state where the current of the second current source flows in a reverse direction to the measurement target resistor by controlling the second current supply unit, and calculates a resistance value of the measurement target resistor based on the detected first output voltage and the detected second output voltage.

Abstract: A circuit device includes: a first physical layer circuit to which a first bus compliant with a USB standard is connected; a second physical layer circuit to which a second bus compliant with the USB standard is connected; a processing circuit that performs transfer processing in which a packet received from the first bus via the first physical layer circuit is transferred to the second bus via the second physical layer circuit, and a packet received from the second bus via the second physical layer circuit is transferred to the first bus via the first physical layer circuit; a bus monitor circuit that performs a monitor operation with respect to the first and second buses; and a bus switch circuit that switches on or off a connection between the first bus and the second bus based on a monitor result from the bus monitor circuit.

Abstract: The present disclosure provides a method for manufacturing a semiconductor structure. The method includes receiving layout data representing information for manufacturing the semiconductor structure having a metal layer over a substrate. A first parasitic capacitance and a second parasitic capacitance are formed between the metal layer and the substrate. The method further includes determining a parasitic capacitance difference between a first region and a second region. The method further includes forming a dummy capacitor to minimize the parasitic capacitance difference. A system for manufacturing a semiconductor device is also provided.

Abstract: The present techniques disclose a logic gate for an adaptive voltage scaling monitor, the logic gate comprising an inverting output and further comprising an imbalance between the drive strength of an NMOS component and a PMOS component thereof, and wherein the imbalance is operable to cause a switching delay of the gate to be primarily dependent on one of the NMOS component or the PMOS component.

Abstract: An optical sensor and a method having a high linearity digital controlling mechanism are provided. An optoelectronic component converts a light energy into a photocurrent. Then, the photocurrent flows to a current mirror and is amplified by a gain to form a charging current by the current mirror to charge a capacitor. A comparator compares a voltage of the capacitor with a reference voltage multiple times to generate a comparison signal. A counter determines a digital value capturing range according to the gain, and counts bit values that fall within the digital value capturing range from the comparison signal to output a counted signal. A noise cancellation processor reduces the digital value capturing range according to the gain, and removes one or more of the bit values that do not fall within the digital value capturing range from the counted signal to output a sensed signal.

Abstract: A circuit includes a first operational amplifier having an inverting input and a non-inverting input, and a negative resistance circuit connected to the inverting input of the operational amplifier. The negative resistance circuit includes a second operational amplifier, a current source controlled by the second operational amplifier, and a cross-coupled transistor circuit having at least one transistor biased by a current produced by the current source.

Abstract: A display apparatus includes a display panel, a first gate driver, a second gate driver, a third gate driver, and a data driver. The display apparatus is operable in a low frequency driving mode, and the low frequency driving mode includes a writing frame and a holding frame. At least one of gate power voltages used to generate a first gate signal, a second gate signal, and an emission signal has a first voltage level in the writing frame of the low frequency driving mode and a second voltage level in the holding frame of the low frequency driving mode. The data voltage is applied to the pixel in the writing frame of the low frequency driving mode. The data voltage applied to the pixel in the writing frame of the low frequency driving mode is maintained in the holding frame of the low frequency driving mode.

Abstract: An example of an apparatus includes a plurality of memory cells arranged in a plurality of NAND strings that are connected to a source line and a control circuit connected to the source line. The control circuit is configured to provide a first current to the source line to pre-charge the source line to a target voltage for sensing data states of the plurality of memory cells and provide a second current to the source line to return the source line to the target voltage in a recovery period between sensing data states. The control circuit is configured to provide the second current at any one of a plurality of current levels.

Abstract: Memory devices and methods of operating memory devices in which refresh management operations can be scheduled on an as-needed basis for those memory portions where activity (e.g., activations in excess of a predetermined threshold) warrants a refresh management operation are disclosed. In one embodiment, an apparatus comprises a memory including a memory location, and circuitry configured to determine a count corresponding to a number of activations at the memory location, to schedule a refresh management operation for the memory location in response to the count exceeding a first predetermined threshold, and to decrease the count by an amount corresponding to the first predetermined threshold in response to executing the scheduled refresh management operation. The circuitry may be further configured to disallow, in response to determining that the count has reached a maximum permitted value, further activations at the memory location until after the count has been decreased.

Abstract: An improved method and apparatus for programming advanced nanometer flash memory cells is disclosed. In one embodiment, a programming circuit comprises a switch configured to couple a current source to a capacitor during a first mode and to uncouple the current source from the capacitor during the second mode, wherein during the second mode the capacitor is coupled to the gate of a transistor used to program a memory cell.

Abstract: Various implementations described herein refer to a method. The method may include providing a metal layout for an integrated circuit, wherein the metal layout includes multiple lines associated with bitlines. The method may include inserting at least one additional line between the multiple lines and the bitlines. The method may include arranging the at least one additional line with respect to the multiple lines and the bitlines so as to reduce capacitance associated with the bitlines.

Abstract: A time-multiplexed group of MAC circuits for a machine learning application is provided in which at least one MAC circuit in the time-multiplexed group also functions as a capacitive-digital-to-analog converter (CDAC) within a successive approximation analog-to-digital converter (ADC). A comparator in the ADC is shared by the time-multiplexed group of MAC circuits.

Abstract: In memory devices where a memory cell includes a thin film cell select transistor, selection between layers of such memory cells may further comprise another thin film select transistor. Bitline and wordline encoding suitable for a memory device having a single layer of memory cells may be scaled up to a 3D memory device having two or more memory cell layers. In a DRAM device one layer of (1TFT-1C) cells may include a 2D array of metal-insulator-metal capacitors over an array of TFTs. Additional layers of such 1TFT-1C cells may be stacked monolithically to form a 3D array. Memory cells in each layer may be accessed through a wordline and local bitline. A local bitline of one cell layer may be coupled to global bitline applicable to all cell layers through a layer-selected TFT according to a voltage applied to a layer-select gate voltage.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for accessing ferroelectric memory. An example method includes increasing a voltage of a first cell plate of a capacitor to change the voltage of a second cell plate of the capacitor, a second digit line, and a second sense node. The voltage of the second cell plate and the second digit line is decreased to change the voltage of the first cell plate, a first digit line, and a first sense node. The first node is driven to a first voltage and the second node is driven to a second voltage responsive to the voltage of the first node being greater than the second node. The first node is driven to the second voltage and the second node is driven to the first voltage responsive to the voltage of the first node being less than the second node.

Abstract: A design tool can implement phase algebra based design evaluation to evaluate a circuit design with a compact representation of numerous waveforms without simulating the individual waveforms. The design tool can determine an input sequence of signal transition representations associated with an input net of a component in RTL circuit design, where each signal transition representation represents a nondeterministic transition from a previous signal state to possible signal state(s). Determining the input sequence of signal transition representations includes determining that the input sequence of signal transition representations indicates an input gated clock waveform. The design tool also can determine, based on the indicated component and on the input gated clock waveform, an output sequence of signal transition representations derived from the input sequence of signal transition.

Abstract: A random access memory is provided including a plane structure comprising a plurality of sense amplifiers, each including a local data latch, a pair of local busses connected to each of the data latches, a differential data bus, and a pair of redrivers connected between the pair of local busses and the differential data bus.

Abstract: An integrated circuit including at least one circuit node, multiple duplicate circuit blocks integrated on the integrated circuit in close proximity with each other, each including at least one device that is susceptible to random telegraph noise (RTN), and a switch circuit that swaps electrical coupling of the duplicate circuit blocks, one at a time, to the at least one circuit node in sequential cycles of a clock signal. The duplicate circuit blocks may be large functional blocks, such as an oscillator or a comparator or the like, or limited to circuits including RTN susceptible devices, such as differential pairs or the like. Each duplicate circuit block may include any number of connections for coupling to corresponding circuit nodes. The swapping may further include chopping in which multiple inputs are swapped with each other while multiple outputs are swapped with each other in consecutive clock cycles.

Abstract: Included are a loop filter, a quantization circuit section, and a current steering digital-analog conversion section. The quantization circuit section converts a loop filter output into a digital value. The current steering digital-analog conversion section is provided in a feedback loop that feeds back the output of the quantization circuit section to the loop filter. Then, each of the analog-digital converters includes a first input signal current path, a second input signal current path, a first feedback current path, and a second feedback current path. The first input signal current path feeds a first input signal current to an input end of a first stage integrator of the loop filter. The second input signal current path feeds a second input signal current, a current opposite in sign to the first input signal current, to an input end of a second stage integrator of the loop filter.

Abstract: Some embodiments include an integrated assembly having a base with sense-amplifier-circuitry. A first deck is over the base, and includes a first array of first memory cells. A second deck over the first deck, and includes a second array of second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.

Abstract: Structures and methods for a multi-bit phase change memory are disclosed herein. A method includes establishing a write-reference voltage that incrementally ramps over a write period. The increments of the write-reference voltage correspond to discrete resistance states of a storage cell of the multi-bit phase change memory.

Abstract: Provided herein may be a memory device and a method of operating the same. The memory device may include a memory block including a plurality of pages, and peripheral circuits configured to sequentially program the pages. The memory device may include control logic configured to control the peripheral circuits such that a program voltage is applied to a word line coupled to a page selected from among the pages such that different pass voltages are applied to all or some word lines coupled to pages on which a program operation has been performed among unselected pages other than the selected page, and to word lines coupled to pages on which a program operation has not been performed among the unselected pages.

Abstract: A memory device of the non-volatile type including a memory array having a plurality of memory cells organized as sectors, each sector having a main word line associated with a plurality of local word lines, each local word line coupled to the main word line by a respective local word line driver circuit, each of the local word line driver circuits consisting of a first MOS transistor coupled between the respective main word line and a respective local word line and a second MOS transistor coupled between the respective local word line and a first biasing terminal.

Abstract: A storage device includes: a plurality of first magnetic tunnel junction (MTJ) cells disposed on a first portion of a substrate; and a plurality of second MTJ cells disposed on a second portion different from the first portion of the substrate; wherein each of the plurality of first MTJ cells has a first cross-sectional surface area viewing from a top of the substrate, each of the plurality of second MTJ cells has a second cross-sectional surface area viewing from the top of the substrate, and the second cross-sectional surface area is greater than the first cross-sectional surface area.

Abstract: In some embodiments, the present application provides a memory device. The memory device includes a first current mirror transistor, a first pull-up read-enable transistor, an MTJ memory cell, a first pull-down read-enable transistor, and a first non-linear resistance device. The MTJ memory cell includes an MTJ memory element and a first access transistor. The first non-linear resistance device is coupled in series and between the first pull-up read-enable transistor and the first current mirror transistor. The first non-linear resistance device is configured to provide a first resistance when conducting a first current and a second resistance greater than the first resistance when conducting a second current smaller than the first current.

Abstract: An analog content addressable memory cell includes a high side and a low side. The high side encodes a high bound on a range of values and includes a first voltage divider formed of a first programmable resistor and a first electronically controlled variable resistor. The low side encodes a low bound on the range of values and includes a second voltage divider formed of a second programmable resistor and a second electronically controlled variable resistor.

Abstract: A circuit device includes first and second physical layer circuits, a bus switch circuit that switches connection between a first bus and a second bus that comply with a USB standard on in a first period and off in a second period, and a processing circuit that performs, in the second period, packet transfer processing on a transfer route that includes the first bus, the first and second physical layer circuits, the second bus. The bus switch circuit includes a first switch circuit, a second switch circuit, and a signal line connected between the first switch circuit and the second switch circuit.

Abstract: A memory cell within an integrated-circuit memory component receives a first control signal that transitions between supply voltage levels of a first voltage domain and a second control signal that transitions between supply voltage levels of a second voltage domain different from the first voltage domain. In response to the transitions of the first and second control signal, output-enable circuitry within the memory cell transitions an output-enable signal between one of the supply voltage levels of the first voltage domain and one of the supply voltage levels of the second voltage domain to enable output signal generation on an output signal line coupled to the memory cell.

Abstract: The present disclosure provides a method for manufacturing a semiconductor device. The method includes receiving layout data representing mask information for manufacturing a semiconductive substrate with a conductor over the semiconductive substrate. A first capacitor is formed between the conductor and the semiconductive substrate. The method further includes determining a capacitance difference between capacitances of the first capacitor and a neighboring capacitor. The method further includes forming a dummy capacitor to minimize the capacitance difference. A system for manufacturing a semiconductor device is also provided.

Abstract: A sense amplifier circuit for sensing a data state of a data cell during a read cycle is described. The circuit includes a first stage with first circuitry to output a reference voltage and a data voltage relating to the data state of the data cell. The circuit further includes a second stage with circuitry to amplify a difference between the reference voltage and the data voltage. This circuitry includes a plurality of inverters and a plurality of capacitors. The read cycle includes a compensation phase. During the compensation phase the circuitry stores, at the capacitors, a voltage difference caused by a device mismatch of the inverters. After the compensation phase the circuitry amplifies the difference between the reference voltage and the data voltage, and compensates for the device mismatch using the stored voltage difference at the capacitors.

Abstract: A nonvolatile memory device includes a plurality of memory cells coupled to a single bit line, wherein each of the plurality of memory cells is coupled to a different word line from a plurality of word lines. The nonvolatile memory device includes a decoder configured to sequentially apply a read voltage of a first level to target word lines among the word lines, based on a multi-read command. The nonvolatile memory device includes a read circuit configured to obtain first sensing values of target memory cells coupled to the target word lines, by sensing the bit line each time the read voltage of the first level is applied to each of the target word lines.

Abstract: A sense amplifier includes a first sample and hold circuit, a second sample and hold circuit, a latch-type amplifier. The first sample and hold circuit is coupled to a bit line and configured to sample and hold memory cell data during a pre-charge phase of a sensing operation. The second sample and hold circuit is coupled to a reference bit line and configured to sample and hold data of a reference memory cell data during the pre-charge phase of the sensing operation. The latch-type amplifier, coupled to the first sample and hold circuit and the second sample and hold circuit, and configured to compare the memory cell data and the reference cell data during an evaluation phase of the sensing operation to output a sensing signal. The sense amplifier is isolated from the bit line and the reference bit line during the evaluation phase of the sensing operation. A sensing method adapted to a sense amplifier and a non-volatile memory include a sense amplifier are also introduced.

Abstract: A resistive memory device according to an example embodiment of the inventive concepts includes: a cell array including a first section and a second section; a first column switch circuit connected to a memory cell and a reference cell of the first section through first bit lines; a second column switch circuit connected to a memory cell and a reference cell of the second section through second bit lines; and a column decoder configured to control the first and second column switch circuits such that one of the first bit lines connected to the memory cell and one of the second bit lines connected to the reference cell are selected according to a first column address, and one of the first bit lines connected to the reference cell and one of the second bit lines connected to the memory cell are selected according to a second column address.

Abstract: A controller for granting a user input device control of a controllable device including a receiver arranged for receiving a first sound signal recorded within a first time frame by a first sound sensor and receiving a second sound signal recorded within a second time frame by a second sound sensor located at the user input device. The controller further includes a processor arranged for determining a level of similarity between the first sound signal and the second sound signal. The processor is further arranged for granting the user input device control of the controllable device if a sufficient level of similarity has been determined. This enables the controller to determine if the user input device is in the same space as the first sound sensor, and it allows the creation of a control space of the controllable device based on the characteristics of the first sound sensor.

Abstract: A latching current sensing amplifier circuit for memory arrays and a current sensing technique using the latching current sensing amplifier circuit are provided. The current sense-amplifier circuit includes a first and second pair of series connected transistors configured with a common gate node for a sense operation and reconfigurable as a cross-coupled pair for a latching operation.

Abstract: This present invention comprises the multiple power sections and a multi-input operational amplifier, wherein the pilot device places at the different location of the main power MOSFET form multiple individual power section, the multi-input operational amplifier drives a transistor to detect the overall current of each power section furthermore report the overall current to system.

Abstract: A read-only memory (ROM) device includes a memory cell that is electrically coupled to a bitline (BL) or to a BL which represents a complement of the BL. The ROM device precharges the BL and the BL to a first logical value. The ROM device activates the memory cell which discharges the BL when the memory cell is coupled to the BL or discharges the BL when the memory cell is coupled to the BL. The ROM device reads the first logical value as being stored within the memory cell when the BL is less than the BL. Otherwise, the ROM device reads the second logical value as being stored within the memory cell when the BL is greater than the BL.

Abstract: A ternary content addressable memory (TCAM) device includes a memory cell. The memory cell includes a data storage circuit, a limiter circuit, and a discharge circuit. The data storage circuit includes a first resistor and a second resistor connected in series to divide a voltage corresponding to search data, and configured to store cell data. The limiter circuit is configured to receive the divided voltage through an input terminal and transmit an output voltage through an output terminal based on a level of the divided voltage. The discharge circuit discharges a matching line indicating whether the stored cell data matches with the search data, based on the output voltage of the limiter circuit.

Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.

Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for accessing ferroelectric memory. An example method includes increasing a voltage of a first cell plate of a capacitor to change the voltage of a second cell plate of the capacitor, a second digit line, and a second sense node. The voltage of the second cell plate and the second digit line is decreased to change the voltage of the first cell plate, a first digit line, and a first sense node. The first node is driven to a first voltage and the second node is driven to a second voltage responsive to the voltage of the first node being greater than the second node. The first node is driven to the second voltage and the second node is driven to the first voltage responsive to the voltage of the first node being less than the second node.

Abstract: A memory cell within an integrated-circuit memory component receives a first control signal that transitions between supply voltage levels of a first voltage domain and a second control signal that transitions between supply voltage levels of a second voltage domain different from the first voltage domain. In response to the transitions of the first and second control signal, output-enable circuitry within the memory cell transitions an output-enable signal between one of the supply voltage levels of the first voltage domain and one of the supply voltage levels of the second voltage domain to enable output signal generation on an output signal line coupled to the memory cell.

Abstract: A metal oxide semiconductor field effect transistors (MOSFET) memory array, including a complementary metal oxide semiconductor (CMOS) cell including an n-type MOSFET having a modified gate dielectric; and an n-type or p-type MOSFET having an unmodified gate dielectric layer, where the modified gate dielectric layer incorporates an oxygen scavenging species.

Abstract: Apparatuses and methods for controlling word lines and sense amplifiers in a semiconductor device are described. An example apparatus includes: a plurality of sense amplifier control circuits coupled to a plurality of corresponding sense amplifiers, wherein each sense amplifier control circuit of the plurality of sense amplifier control circuits provides one or more control signals to a corresponding sense amplifier of a plurality of sense amplifiers; and a driver that provides a selection signal to a plurality of word drivers responsive, at least in part, to a first control signal that is responsive to the one or more control signals from the plurality of sense amplifier control circuits.

Abstract: In accordance with an embodiment, a memory includes: a memory element, a sense amplifier circuit configured to sense a difference during a sense operation between a sense current passing through the memory element and a reference current, and a margin current branch coupled in parallel with the memory element and configured to selectively add a margin current to the sense current.

Abstract: Apparatuses and methods for comparing a sense current representative of a number of failing memory cells of a group of memory cells and a reference current representative of a reference number of failing memory cells is provided. One such apparatus includes a comparator configured to receive the sense current and to receive the reference current. The comparator includes a sense current buffer configured to buffer the sense current and the comparator is further configured to provide an output signal having a logic level indicative of a result of the comparison.

Abstract: Apparatuses and methods for calibrating sense amplifiers in a semiconductor memory are disclosed. An example apparatus includes an amplifier circuit and a calibration circuit. The amplifier circuit is configured to be coupled to a supply voltage and a reference voltage, and when activated the amplifier circuit is configured to provide an output signal at an output that is complementary to an input signal provided to an input. When activated by a calibration signal, the calibration circuit is configured to provide a calibration voltage to the output of the amplifier circuit, wherein the calibration voltage is an equilibration voltage between the supply voltage and the reference voltage provided to the amplifier circuit.

Abstract: A virtual ground sensing circuit includes a sense circuit configured to compare a reference voltage potential to a sense node voltage potential, and virtual ground circuitry operably coupled to the sense circuit. The virtual ground circuitry is configured to provide a virtual ground at a first bias voltage potential to a conductive line operably coupled to a selected ferroelectric memory cell, and discharge the conductive line to the sense node responsive to the selected ferroelectric memory cell changing from a first polarization state to a second polarization state. A method includes applying a second bias voltage potential to another conductive line operably coupled to the selected ferroelectric memory cell, and comparing a sense node voltage potential to a reference voltage potential. Electrical systems and computing devices include virtual ground sensing circuits.

Abstract: A memory device includes at least one reference cell and multiple memory cells. A method of operating the memory device may include detecting a temperature of the memory device and controlling a level of a first read signal applied to the at least one reference cell in accordance with a result of the detecting of the temperature. The method may also include comparing a first sensing value sensed by applying the first read signal to the at least one reference cell with a second sensing value sensed by applying a second read signal to a selected memory cell among the multiple memory cells.

Abstract: A metal oxide semiconductor field effect transistors (MOSFET) memory array, including a complementary metal oxide semiconductor (CMOS) cell including an n-type MOSFET having a modified gate dielectric; and an n-type or p-type MOSFET having an unmodified gate dielectric layer, where the modified gate dielectric layer incorporates an oxygen scavenging species.

Abstract: Apparatuses and methods related to memory arrays with separate global read and write lines and/or sense amplifier region column select lines are disclosed. An example apparatus includes first and second memory sections, and further includes a sense amplifier region. A memory section includes a word line extending in a first direction and a digit line extending in a second direction, and the sense amplifier region is disposed between the first and second memory sections. The sense amplifier region includes a sense amplifier coupled to the digit line, a local input/output (LIO) line, a column select circuit coupled to the sense amplifier, and a column select line. The column select line extends in the first direction and is configured to provide a column select signal to the column select circuit. Capacitance of a LIO line may be reduced by coupling fewer sense amplifiers of a group to the LIO line.