Abstract: Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a fluid with magnetic elements in the chamber. The magnetic field source has a first member that induces a magnetic field in the head. The fluid and/or the magnetic elements move within the chamber under the influence of the magnetic field source to exert a force against a portion of the micro-device workpiece. In a further aspect of this embodiment, the carrier assembly includes a flexible member in the chamber. The magnetic field source can be any device that induces a magnetic field, such as a permanent magnet, an electromagnet, or an electrically conductive coil.

Abstract: A centerless grinder for grinding an elongated workpiece includes a grinding wheel having a working surface with a plurality of raised areas extending circumferentially around at least a portion of the working surface. A platform is provided having an elongated top surface for supporting the workpiece substantially adjacent to the working surface of the grinding wheel and a front surface with a plurality of lateral grooves for receiving the raised areas on the working surface of the grinding wheel such that movement of the platform toward the working surface into a working area adjacent to the grinding wheel enables the raised areas to pass into the lateral grooves and grind the workpiece.

Abstract: Barrel polishing is effected while causing a mass (M) consisting of work and media (polishing material) to rotation-flow by rotating a rotary disk installed in the bottom of a polishing tank by a drive motor. A load on the drive motor for the rotary disk is preset as by a load current value, and the flow of the mass (M) in the polishing tank is controlled, thereby effecting polishing while maintaining the load on the drive motor within the preset range.

Abstract: A machine for machining bandsaw blades. A machining device, a feed device, a workpiece-fixing device and a workpiece guiding device are mounted to a common central machine block. The machining device has a rotatably driven positionable adjustable grinding wheel with the workpiece-guiding device supporting the bandsaw blade and the workpiece-fixing device clamping the blade in position.

Abstract: The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures distance from the senor to the upper surface of carrier with holes for the work pieces being inserted respectively. The measured distance is successively monitored and polishing is stopped when the distance has become a predetermined value corresponding to target amount of material removal from the work piece.

Abstract: The invention relates to a grinding machine for the edges of spectacles lenses, comprising at least one grindstone and one driven shaft for holding the spectacles lenses, said shaft being able to move radially and axially relatively to the grindstone. The inventive grinding machine comprises at least one operational support which is placed in such a way that it can rotate coaxially on a spindle designed for a shaft of the grinding machine or on at least one pivoting lever which is placed in a non-aligned position on a spindle designed for a shaft of the grinding machine, said operational support being free to pivot in the space between the grindstone and the shaft holding the spectacles glasses.

Abstract: A food product slicer with a rotatable slicer knife includes a knife sharpener and an associated knife guard assembly with a guard member positioned for protecting the edge of the knife when the sharpener is positioned in its standby, or non-sharpening state.

Abstract: An automatic razor blade sharpener simultaneously sharpens and sanitizes multiple edges of a spring-loaded disposable razor blade cartridge without edge overheating by lubricated gentle contact of the blade edges with a moving rubber or polymeric compliant belt that is motor driven. The disposable razor blade handle is set in a cradle aperture, which is spring loaded against the moving belt. A sanitizing and lubricating liquid is dispersed from a container between the razor blade edges and the moving belt forms a thin liquid layer on the belt surface. The liquid layer is illuminated by transversely located light illuminator and the reflected light is received by a transversely located sensor. Deep grooves in the blade cutting edge reduce this reflection, indicating an overly worn blade. The absence of reflection actuates an LED, informing the user that the thin liquid film has evaporated or spilled out, or that the container lacks a sufficient quantity of sanitizing and lubricating liquid.

Abstract: A grinding machine (1) for glass slabs (2) comprising a grinding head (77) that comprises a supporting structure (9), grinding wheels (20, 28) for grinding and polishing the edge of the slab (2), and grinding wheels (24, 26) for grinding and polishing the threads of the slabs (2), where the grinding wheels (20, 28) for grinding and polishing the edges rotate independently one from another around an axis that is perpendicular to the rotation axis of the grinding wheels (24, 26) for grinding and polishing the threads, and where the grinding wheels (20, 24, 26, 28) for grinding and polishing the edges and polishing the threads are configured to perform, during operation, axial movements that can be actuated independently from each other along the slab (2).

Abstract: Disclosed is a grinding table apparatus for a liquid crystal display panel and a grinder using the adapt to various sizes of unit liquid crystal display panels for grinding edges of the corresponding liquid crystal display panel by adjusting a variable moving distance of the grinding tables instead of replacing the previous grinding table. The present invention includes at least two grinding tables displaced in a direction making the grinding tables get farther from or closer to each other to adapt to the size of the unit liquid crystal display panel to grind edges of the unit liquid crystal display panel.

Abstract: Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpiece against the polishing pad after determining the status of the characteristic of the microfeature workpiece. The carrier head also carries a plurality of piezoelectric members. The method further includes applying pressure against a back side of the microfeature workpiece in response to the determined status of the characteristic by energizing at least one of the plurality of piezoelectric members. In another embodiment, a system includes a workpiece carrier assembly, a plurality of piezoelectric members, a polishing pad, a metrology tool for determining a status of the characteristic, and a controller. The controller can have a computer-readable medium containing instructions to perform the above-mentioned method.

Abstract: An apparatus for abrading a workpiece comprises a first plate assembly having a first surface for supporting a workpiece and a second plate assembly having a second surface for engaging the workpiece to abrade a portion thereof. A displacement shaft is mounted for movement with respect to the upper and lower plate assemblies and has a first end configured to engage the upper plate assembly. A feedback assembly is coupled to the displacement shaft for moving the displacement shaft to substantially maintain a predetermined load exerted on the displacement shaft by the upper plate assembly.

Abstract: A dual position sharpening device can be set up so that the abrasive wheel is either vertical or horizontal. A guard retains cooling water in either position.

Abstract: In a workpiece grinding method, a grinding allowance of a predetermined width (T) at at least an end surface portion 21 of a workpiece W is removed with a grinding wheel 10 (or 32) by rotating the workpiece W having a cylindrical portion 20 and the end surface portion 21 perpendicular thereto, by rotating the grinding wheel 10 (or 32) supported rotatably about an axis extending in parallel with the axis of the workpiece 10 (or 32), and by moving the grinding wheel 10 (or 32) relatively to the workpiece W.

Abstract: Methods and apparatus for end effectors for performing surface lapping using a robotic system are provided. In one embodiment, a lapping system includes a robotic arm and a pneumatic end effector unit. The pneumatic end effector unit includes a first base attached to the robotic arm, a second base, a lapping pad attachable to the second base, and a pneumatic piston system coupled between the first and second bases. An abrasive pad is attached to the lapping pad with a layer of pitch. The pneumatic piston system includes a piston chamber, a piston being slideably received within the piston chamber, and a component for controlling air pressure within the piston chamber. A slurry system introduces a slurry compound into one of the second base or the lapping pad.

Abstract: In a grinding machine, a generally cylindrical workpiece having at least first and second grinding areas is ground by use of a grinding wheel supported by a wheel head. The first grinding area is first ground such that power consumed by the grinding machine is maintained at a first level. After completion of grinding for the first grinding area, the grinding wheel is indexed to the second grinding area by moving the wheel head such that the power consumed by the grinding machine is maintained at a second level higher than the first level. After completion of the indexing operation, the second grinding area is ground in the same manner as the first grinding area.

Abstract: A lapping system for eliminating crowning in a surface to be lapped includes a first lapping carrier adapted to carry a first workpiece and a second lapping carrier adapted to carry a second workpiece. A stabilizer assembly interconnects the first and second lapping carriers in a mutually stabilizing arrangement that stabilizes the first and second workpieces against rotation. The stabilizer assembly includes first and second stabilizer arms extending between the first lapping carrier and the second lapping carrier. Each lapping carrier and an associated stabilizer arm collectively defines a fixture having a carrier portion and a stabilizer portion, and which may be generally T-shaped. One end of each stabilizer arm is cantilevered from its associated lapping carrier, while the free end of each stabilizer arm is pivotally mounted to the opposite lapping carrier. Downward lapping forces are applied independently to each lapping carrier.

Abstract: A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating motion device rotates the polishing head around the axial line of the rotary shaft and moves it reciprocatingly along its axial line. A moving device undergoes a reciprocating motion perpendicularly to the object surface while supporting the object. When in use, the polishing head is rotated while the pad causes the polishing tape to protrude from it while the object is rotated.

Abstract: The invention relates to a method for removing material from a semiconductor wafer by machining, in which a semiconductor wafer held on a wafer holder and a grinding wheel lying opposite it are rotated independently of one another, the grinding wheel being arranged laterally offset with respect to the semiconductor wafer and being positioned in such a way that an axial center of the semiconductor wafer passes into a working range of the grinding wheel, the grinding wheel being moved in the direction of the semiconductor wafer at an infeed rate, with the result that grinding wheel and semiconductor wafer are advanced toward one another while the semiconductor wafer and grinding wheel are rotating about parallel axes, so that a surface of the semiconductor wafer is ground, with the grinding wheel being moved back at a return rate after a defined amount of material has been removed, wherein the grinding wheel and semiconductor wafer are advanced toward one another by a distance of 0.03–0.

Abstract: The present invention relates to a modified radial motion method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears, which is capable of modifying a locus of a cutter center into a curve, without changing a head cutter's geometry, by providing modified radial motion of the head cutter cooperating with rotation of a cradle. The modified radial motion method in accordance with the present invention completely solves the contradictions caused by the existing lengthwise curvature modification methods, which is able to increase the adjustability of the gear set without reducing the tooth contact.

Abstract: A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The different positions include multiple polishing positions and one or more loading/unloading positions. In some embodiments, the CMP apparatus is configured such that a semiconductor wafer is polished at a loading/unloading position. The CMP apparatus may also be configured to continuously polish one or more semiconductor wafers while the wafer carriers are being transferred to different positions. Thus, the CMP apparatus can continuously process the semiconductor wafers without significant idle periods. Consequently, in these embodiments, the efficiency of the CMP apparatus is significantly increased.

Abstract: A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a second function that associates measurements from the series with positions on the substrate. For each measurement in a series from the in-situ monitoring system, the second function can be used to determine a position on the substrate where the measurement was taken. In addition, a measurement of the position of the carrier head, a time when the measurement of the substrate property is made, and a phase correction representing lag resulting from a processing delay in generating the measurement of the position of the carrier head can be used in determining a position on the substrate where a measurement of a substrate property was taken.

Abstract: A CNC apparatus has a memory configured to compensate for offsets in a pivot point. The machine tool has a head, a pivot point, a spindle, a table, and at least four axes including an X-axis, a Y-axis, a Z-axis, and a C-axis. A method for calibrating the CNC apparatus for controlling the machine tool includes placing an artifact of known height on the table, placing a plug having a known diameter on the spindle and touching the plug to the artifact in a plurality of orientations of the plug and in a plurality of locations of the plug and the artifact to determine uncalibrated X and Y pivot point locations at a plurality of orientations of the spindle. The uncalibrated X and Y pivot point locations are used to determine and store values in the memory of the CNC apparatus to compensate for offsets in the pivot point.

Abstract: Both a grinder system and a corresponding grinding method are based on a module, embodied preferably as a program or program segment, which, preferably automatically, defines the geometry of the corner cutting edge and the corner cutting face of a metal-cutting tool on the basis of predetermined peripheral conditions. The axial rake angle of the face-end cutting edge and the axial rake angle of the circumferential cutting edge as well as a desired effective profile can serve as the predetermined peripheral conditions. Further peripheral conditions may be a smooth transition of the cutting faces between the face-end chip cutting face, corner cutting face and circumferential cutting face. Tools are obtained that have a long service life and with which at the same time good machining quality can be achieved.

Abstract: A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the substrate. A plurality of portions of the substrate are monitored during polishing with an in-situ monitoring system. If the difference in thickness between two portions of the substrate exceeds a predetermined threshold, a plurality of adjusted pressures are calculated in a closed-loop control system, and the plurality of adjusted pressures are applied to the plurality of regions of the substrate. The predetermined threshold includes an initial threshold for the start of the polishing process and a second threshold for a period of polishing after the start of the polishing process.

Abstract: Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a magnetic fluid in the chamber. The magnetic field source is configured to generate a magnetic field in the head. The magnetic fluid changes viscosity within the chamber under the influence of the magnetic field to exert a force against at least a portion of the micro-device workpiece. The magnetic fluid can be a magnetorheological fluid. The magnetic field source can include an electrically conductive coil and/or a magnet, such as an electromagnet. The carrier assembly can also include a fluid cell with a cavity to receive the magnetic fluid.

Abstract: The invention provides an apparatus that holds and tilts a tool over a tilt range and substantially about a vertex. The apparatus includes a base having pivots defining a base line and a base pivot distance. The apparatus also includes first and second pivot arms coupled to the base pivots, and a tool holder having pivots coupled to the first and second pivot arms. The tool holder pivots defining a tool holder line having a pivot distance different than the base pivot distance. The tool holder is arranged for holding the machine tool. An intersection of the base line and a selected pivot arm defines a control angle, such that changing the control angle changes a tilt of the tool holder with respect to the base line, and correspondingly tilts a longitudinal axis of the tool substantially about a vertex.

Abstract: A test apparatus and method tests a pad conditioner of a chemical mechanical polishing apparatus. The pad conditioner test apparatus includes a main body having a conditioner mounting section that supports the pad conditioner, a conditioner head raising/lowering system that raises and lowers the head of the pad conditioner while the pad conditioner is supported on the test apparatus, and a discrimination section that detects the ability of the head to be raised/lowered in accordance with a program so that the condition of the head can be determined. The test apparatus can prevent various problems that otherwise would occur if a new pad conditioner were directly installed in the chemical mechanical polishing apparatus.

Abstract: An adaptive work table-reciprocation control system and method that can reduce a grinding time. The system uses a vibration sensor head installed on a chuck surface in the vicinity of the workpiece to detect a vibration signal emitted from the contact zone between the grinding wheel and the workpiece. When the value of the vibration signals falls below a trigger level, a work table direction of motion is reversed.

Abstract: A cutting tool with a sensor according to the present invention includes an electrically conductive substrate, an insulation film provided on a surface of the electrically conductive substrate, and a sensor circuit of an electrically conductive film provided on the insulation film. The insulation film includes two consecutive insulation layers. Even if the plural insulation layers each have defects such as cracks and pinholes which possibly impair the insulation property impair the insulation film, the defects present in the plural layers are unlikely to be continuous. Therefore, the insulation film has an improved insulation reliability, thereby ensuring proper function of the sensor circuit in the cutting tool.

Abstract: A rotation axis of a work spindle and a rotation axis of a spindle primary-axis portion are rotated relative to each other and feeding of a work-piece to a tool is accordingly adjusted, whereby warpage of the tool in accordance with a change in machining condition is corrected. A revolution volume of the relative rotation is compared and calculated in process based on data entered in advance, a result of measurement by a displacement sensor and information such as a machining position, and controlled in real time until the end of machining. The relative rotation is driven by an actuator such as a piezoelectric element, at a resolution even as fine as in seconds. The data entered in advance can be sequentially updated in accordance with monitoring of a processed product.

Abstract: A chopping control process, for controlling a machine tool during chopping, i.e., shaping or cutting a workpiece, is allowed without adding an extra axis dedicated just to the chopping, i.e., a chopping dedicated axis. To correct a chopping operation (i.e., an operation of shaping or cutting a workpiece), for a movement error in the contour control (i.e., control of contour along which the workpiece is cut) with a positioning axis or rotation axis, an interpolation processing part 12 and an axis control processing part 13 are provided with a function of generating the movement data for performing the chopping operation by controlling two or more axes at the same time and a function of correcting the chopping operation.

Abstract: A method for preventing de-lamination of semiconductor wafer film stacks during a linear belt-type chemical mechanical planarization (CMP) process is provided. The method implements a pulsed polishing head rotation during a CMP process to maintain a slurry distribution across the width of a belt pad. The slurry distribution is maintained in a manner that prevents de-lamination of a wafer film having weak adhesion characteristics. Thus, the pulsed polishing head rotation implemented by the method reduces de-lamination of low-K material film layers during the CMP process.

Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.

Abstract: The invention relates an electric sharpener, comprises a main frame, a main shaft, a motor, a transmission wheel, a grinding stone, and an electric control circuit. The motor is mounted on an angular frame which in turn is mounted on the main frame. The transmission wheel is fixed to an end of the main shaft, and the output shaft of the motor is tightly pressed against the periphery of the transmission wheel so as to drive it. A tool rest is fixed onto the main frame in a vertical or horizontal mounting orientation. A water vessel is fixed to the main frame, and the lower portion of the grinding stone dips into the water contained in the water vessel. Special clamps and attachments for grinding different tools are provided. The electric sharpener can be used for grinding various woodworking or household tools.

Abstract: Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a magnetic fluid in the chamber. The magnetic field source is configured to generate a magnetic field in the head. The magnetic fluid changes viscosity within the chamber under the influence of the magnetic field to exert a force against at least a portion of the micro-device workpieces. The magnetic fluid can be a magnetorheological fluid. The magnetic field source can include an electrically conductive coil and/or a magnet, such as an electromagnet. The carrier assembly can also include a fluid cell with a cavity to receive the magnetic fluid.

Abstract: Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing pad and determining a status of the characteristic based on a measurement of the ultrasonic energy applied to the polishing pad. In one aspect of this embodiment, applying ultrasonic energy includes applying ultrasonic energy from a transducer. The transducer can be carried by a conditioner, a fluid arm, a micro-device workpiece carrier, or a table. In another aspect of this embodiment, determining the status of the characteristic includes determining a thickness, density, surface contour, roughness, or texture of the polishing pad.

Abstract: In certain preferred embodiments, the present invention provides a grinding machine for creating depression patterns in a surface such as asphalt or concrete. The depression pattern may be a rumble strip for alerting drivers who drift off a driving lane, or may be for other uses. Use of a depression pattern (instead of protrusions) eliminates interference with snowplow operation in areas where plows are used. In the present invention, the grinding machine is based on a trolley which moves at a uniform height along a surface, and includes a forward “gauge” wheel which controls the relative grinding drum depth based on the wheel position and rotation. In a preferred embodiment, the grinding assembly is raised and lowered relative to the trolley in correspondence with the advancement of the trolley.

Abstract: A jig is structured to guide a grinder along the inner surface of the base or cover of a combustion turbine. The jig includes a base having a bottom surface with a plurality of rollers arranged in substantially the same radius as the portion of the casing being repaired. Side rollers locate the base horizontally during movement. A top platform may restrain the base vertically by supporting a pivot block that bears against the rotor of the turbine. The grinder may be moved vertically or horizontally with respect to the base upon which it is secured.

Abstract: A face grinder assembly is disclosed for removing irregularities from tire. The face grinder assembly includes an outer frame and a slide frame slidably attached to the outer frame. The slide frame is capable of vertical movement relative to the outer frame between a working position and a non-working position. A sub-assembly carried by the slide frame includes a grinding stone. The sub-assembly is configured to define a clearance for the tire in the non-working position of the slide frame.

Abstract: Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.

Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes an air bearing support member configured to pivot about an axis of rotation with zero frictional resistance opposing said pivotal movement. A grinding unit is coupled to the air bearing support member. The grinding unit is configured to apply a predetermined force normal to the at least one edge to remove a predetermined amount of material from the at least one edge. The predetermined force is directly proportional to the predetermined amount of material and less than a normal force resulting in glass substrate breakage.

Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).

Abstract: A grinder designed to provide an automatic grinding operation for the manufacture of a semiconductor device wafer. The grinder includes a base, a rotatable index table mounted to the base, and a grinding wheel assembly including a grinding wheel for grinding a flat surface on the wafer. The index table includes a wafer holder for receiving and holding the wafer and a dressing element for dressing the grinding wheel. The index table is selectively rotatable between a grinding position where the wafer is ground by the grinding wheel and a dressing position where the grinding wheel is dressed by the dressing element.

Abstract: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.

Abstract: In a machine (10) for machining long workpieces (32) provided with cutting teeth (60), particularly for grinding endless saw blades, having a machine base (40) and a machining device (12) which has a rotatably drivable tool (16), particularly a grinding wheel, for machining the workpiece (62), the machining device (12) being displaceable relative to the machine base (40) and the workpiece (32), it is provided for the machining device (12) to be mounted by means of a pivot bearing arrangement (34) which permits a pivotal movement of the machining device (12) relative to the machine base (40), which results in the tool (16) moving linearly relative to the machine base (40) and the workpiece (32).

Abstract: A grinding method for a vertical type of double disk surface grinding machine comprising a pair of rotating grinding wheels vertically opposed to each other and vertically movable and a moving table for moving a work having a work holding jig, wherein vertical positions of the upper and the lower surfaces of the work to be ground prior to the grinding operation are measured by means of a pre-grinding dimension measuring instrument disposed in a vicinity of the work attaching/detaching position and the standby positions of the grinding wheels are set based on the measured values in a step, the work is moved to the grinding position and the grinding wheels are moved at a high feeding speed from the set standby positions to grinding start positions in contact with the work or positions immediately before making the contact in a subsequent step, and the work is ground at a grinding speed lower than the feeding speed in a further subsequent step.

Abstract: Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a fluid with magnetic elements in the chamber. The magnetic field source has a first member that induces a magnetic field in the head. The fluid and/or the magnetic elements move within the chamber under the influence of the magnetic field source to exert a force against a portion of the micro-device workpiece. In a further aspect of this embodiment, the carrier assembly includes a flexible member in the chamber. The magnetic field source can be any device that induces a magnetic field, such as a permanent magnet, an electromagnet, or an electrically conductive coil.

Abstract: A one-time feedback CMP process control method which contributes to uniformity in the quantity of material removed from wafers in a lot during semiconductor processing and is suitable for complex processes such as STI (shallow trench isolation) fabrication procedures, is disclosed. The method includes providing a plurality of wafers having a set of pilot wafers and a set of remaining wafers, polishing each of the pilot wafers according to an original process time, determining a compensation time for the pilot wafers, determining an update time by adding the compensation time to the original process time and polishing the set of remaining wafers according to the update time.

Abstract: A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.