Abstract: An adjustment device for adjusting a level difference between rollers of a roller belt sander includes a base, an eccentric shaft and a restricting knob. The base is fixed on an interior wall edge of a main body corresponding to two ends of a roller. The eccentric shaft inserted pivotally in a penetrating opening of the base has a rear end portion, and a front-end engaging portion formed eccentrically to engage with the roller pivotally. The restricting knob is engaged in a threaded hole of the base to fix the eccentric shaft. Therefore, the adjustment device can be turned to enable the roller positioned at a level for preferable grinding.

Abstract: A grinding machine having a universal joint bearing comprises a movable-mount module, a universal-joint module, a mount control module, a grinding-wheel module and a milling-stone module. The movable-mount module further comprises a plurality of movable mounts. The universal-joint module consists of a plurality of servo-motors, each being provided with a universal-joint bearing. The mount control module is coupled with an S movable mount. The grinding-wheel module further comprises a grinder main-shaft motor, a high-speed shaft mount, a grinder belt and a disk-grinder unit. The milling-stone module is connected to one lateral side of the mount control module.

Abstract: An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one workstation with a disc transfer mechanism. The method also comprises reconditioning each of the digital discs transferred to the workstation with at least one worktool operable to remove a portion of the protective coating of each of the digital discs without removal of the data underlying the protective coating. The method further comprises transferring each of the digital discs from the workstation to an unload area with the disc transfer mechanism, and then holding the digital discs in the unload area for manual retrieval. Advantageously, the digital discs may be automatically reconditioned within the reconditioning apparatus without manual manipulation of the digital discs during the reconditioning process.

Abstract: Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpiece against the polishing pad after determining the status of the characteristic of the microfeature workpiece. The carrier head also carries a plurality of piezoelectric members. The method further includes applying pressure against a back side of the microfeature workpiece in response to the determined status of the characteristic by energizing at least one of the plurality of piezoelectric members. In another embodiment, a system includes a workpiece carrier assembly, a plurality of piezoelectric members, a polishing pad, a metrology tool for determining a status of the characteristic, and a controller. The controller can have a computer-readable medium containing instructions to perform the above-mentioned method.

Abstract: In accordance with one embodiment of the invention, a load cup mechanism is provided for loading and unloading apparatus such as a CMP apparatus. The load cup mechanism, configured to load a work piece into and to unload a work piece from the apparatus, comprises a load cup arm configured to pivot about an axis between a load position aligned with the apparatus and an off-load position. A work piece platform is coupled to an end of the load cup arm and a plurality of lift fingers and a plurality of guide fingers, configured to support and center a work piece, are spaced about the work piece platform. A plurality of guide posts are spaced apart about the periphery of the work piece platform and are configured to align the work piece platform, in the load position, to the processing apparatus.

Abstract: A ballbar is used to assess the accuracy of relative motion between an arbor and a table 4—of a machine tool. Mounting components are secured respectively to the arbor and the table-4. Each mounting component comprises a block that has provision on three orthogonal surfaces for receiving support means for a ballbar. By appropriate selection of the mounting faces, it is possible to set up the ballbar to check motion in all three of the operating planes of the machine. The mounting component comprises a ring for fitting over the arbor of the grinding machine, and the mounting block is connected to the ring by a rod.

Abstract: A sanding or polishing or grinding machine includes one or more sanding wheels supported on a machine base and movable up and down relative to the machine base for grinding the work pieces of different heights or thicknesses. A driving device may be used for driving the sanding wheels to move horizontally relative to the machine base for allowing the work pieces to be suitably sanded or ground by the sanding wheels. The sanding wheels are preferably disposed at different angular position relative to the machine base, for suitably sanding or grinding the work pieces in different angular positions.

Abstract: The invention provides a cutting method and a cutting apparatus that cuts without chipping a composite material consisting of laminated layers of crystal material and amorphous material, in which the amorphous material is cut with an ultrasonically vibrated cutting blade and the crystal material is cut with a cutting blade that does not ultrasonically vibrate. With such a method and apparatus, the crystal material portion and the amorphous material portion of the composite material can be cut cleanly without chipping.

Abstract: A processing cell of automatic machining system configured in that it is easy to decide or change the number of steps and to design, and to reduce the installation cost. The control unit of the processing cell comprises an operation data storing means for storing every position necessary data for operation at each position of the processing cell installed in the machining section of the automatic machining system, and a position designating means for designating the after-installation position. The control unit reads necessary data for operation out of the operation data storing means in accordance with the position designated by the position designating means. Thus, the operation of each cell can be switched in accordance with the position, and the processing cells can be easily changed in position and adjusted in quantity.

Abstract: A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of the work station is set up as a honing station for performing at least one honing operation on a workpiece. The honing installation also comprises a conveyor system for conveying workpieces to and from work stations. There is also a control device for controlling the honing installation. Each of the work stations is directly connected to the conveyor system. This configuration allows a flexible control of the honing process.

Abstract: A gear grinding machine, a method for dressing a threaded grinding wheel, and a method for grinding a work are disclosed. A dressing tool is rotated in a vertical plane, with its position being fixed. The position of a threaded grinding wheel is NC-controlled, whereby the dressing tool is brought into contact with the starting point of the thread of the threaded grinding wheel at a somewhat lower surface of the circumferential surface of the threaded grinding wheel and, in accordance with the rotation of the threaded grinding wheel, the position of contact of the dressing tool with the threaded grinding wheel is moved along the circumferential surface of the threaded grinding wheel.

Abstract: Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular temperature or in response to a particular shear force. In this example, the change in color of the process indicator may be correlated with an ongoing operating condition of the planarizing machine, such as excessive downforce, or correlated with an endpoint of the planarizing operation. Incorporating the process indicator in the planarizing medium, as proposed for select applications, can enable relatively simple, real-time collection of information which can be used to control a planarizing operation.

Abstract: The invention relates to a grinding machine for the edges of spectacles lenses, comprising at least one grindstone and one driven shaft for holding the spectacles lenses, said shaft being able to move radially and axially relatively to the grindstone. The inventive grinding machine comprises at least one operational support which is placed in such a way that it can rotate coaxially on a spindle designed for a shaft of the grinding machine or on at least one pivoting lever which is placed in a non-aligned position on a spindle designed for a shaft of the grinding machine, said operational support being free to pivot in the space between the grindstone and the shaft holding the spectacles glasses.

Abstract: The invention relates to a method and an apparatus for producing optical glasses. The glasses are polished and marked, following a shaping process. The polishing and marking steps are carried out in a common processing cell which comprises a polishing station, a washing station, and a marking station.

Abstract: The present invention related to a loading device for a chemical mechanical polisher of semiconductor wafers comprising: a loading cup on wherein a cup plate is installed in a cup-shaped bath, a loading plate for receiving wafers sits on the cup plate, and a plurality of vertical damping devices lie between the cup plate and the loading plate so as for the loading plate to be damped in a vertical direction; a driving axis for a right and left pivot movement and an ascending and descending movement of the loading cup between a platen of the chemical mechanical polisher and a spindle; and an arm connecting the loading cup to the driving axis; wherein a plurality of horizontal damping devices are positioned with a constant angle in a radial direction along a bottom surface of the loading plate from its center in order for a polishing carrier head mounted on the spindle and the loading plate to be detachable after being calibrated to a normal position by shaking the loading plate finely in a horizontal direction

Abstract: An eyeglass lens processing apparatus includes: a controller that controls a second driver for rotating lens chucks for chucking an eyeglass lens and a third driver for changing an axis-to-axis distance between an axis of a processing tool and an axis of the lens chucks so that a processing load falls below an allowable value; and a processing mode selector that selects one of a first processing mode in which the allowable value is set to be high, and a second processing mode in which the allowable value is set to be low so as to suppress axis deviation when the lens having a surface slipping readily is processed. The controller controls the first driver so that a second chucking pressure of the lens chucks when the second processing mode is selected is smaller than a first chucking pressure of the lens chucks when the first processing mode is selected.

Abstract: An apparatus and method for polishing semiconductor wafers uses multiple polishing surfaces, multiple polishing heads and multiple wafer stations to sequentially polish the semiconductor wafers. The wafer stations includes at least one wafer load-unload station to transfer the semiconductor wafers between the wafer load-unload station and the polishing heads.

Abstract: An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, defective unit liquid crystal display panels are kept and discarded not to proceed with a follow-up process. Thus, a material waste is restrained and a yield can be improved. Meanwhile, in case of the multi-mode that liquid crystal display panels are fabricated with difference sizes on a large glass substrate, sub-models are kept, and then after completing the process for the main models, a follow-up process if performed on the sub-models. Thus use efficiency of the glass substrate can be maximized to improve a productivity and a unit cost of the product can be reduced.

Abstract: A surface treatment apparatus for abrading a workpiece surface includes a motion generating device configured to move an abrasive disc, a stabilizer, and a force control device. The stabilizer and the force control device work cooperatively to prevent a force of contact between the abrasive disc and the workpiece surface from exceeding a set level. In one embodiment, the force control device has a maximum force control level, and the set level is less than the maximum force control level. In one embodiment, the stabilizer has a fixed portion and a movable portion.

Abstract: The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof.

Abstract: An apparatus is provided for use in preparing the inner surface of a tire for the application of a patch so that, for example, the tire may be equipped with various electronic devices. The apparatus facilitates improved operation of a grinder or buffer so that the grinding depth and surface area prepared for patch application can be more precisely controlled. Adjustment for different tires sizes and models is provided.

Abstract: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.

Abstract: Edge modifying apparatuses that include a disc chuck, a disc edge modifying unit having an abrasive article support, and a uniform velocity linear oscillation driver coupled to at least one of the disc chuck and the abrasive article support are described. The uniform velocity linear oscillation driver provides a substantially constant velocity for at least 80% of each half-cycle of oscillation. Methods of modifying the edge of disc using such apparatuses are also described.

Abstract: Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals onto the surface of a polishing pad during a CMP process. Reflected ultrasonic signals are collected and analyzed to monitor polishing pad properties in real-time. This allows CMP process adjustments to be made during the CMP process.

Abstract: The present invention generally relates to a substrate transferring system having an alignment mechanism of a surface and to two points. One embodiment of the present invention provides a load cup for transferring a substrate. The load cup comprises a cup having a substrate supporting surface configured to support the substrate thereon, and two alignment pins protruding from the cup outside the substrate supporting surface, wherein the two alignment pins are both positioned at a first distance away from a center of the substrate supporting surface, and the cup is pivotable about a pivoting point positioned at a second distance away from the center.

Abstract: The profile grinding machine includes: a base; a work unit disposed on one side on the base and including a work table for gripping a work; and a stone unit disposed on the other side on the base and including a stone rotating mechanism for holding and rotating a grinding stone on its axis. The work unit includes first to third moving device for supporting and moving the work table in an X-direction and a Y-direction perpendicular to each other in a horizontal plane, and in a Z-direction normal to the horizontal plane, respectively. The stone unit includes turning mechanism for turning the grinding stone about a vertical axis substantially coinciding with the leading end portion of the grinding stone.

Abstract: The workpiece centering apparatus is capable of highly reducing damage of a workpiece. The workpiece centering apparatus comprises: a guide plate being provided in a tray and covering a water inlet so as to horizontally introduce water into the tray; and at least three overflow outlets for overflowing the water from the tray, the overflow outlets being formed in a peripheral wall of the tray and arranged in the circumferential direction at regular intervals. The workpiece, which is horizontally fed on a surface of the water stored in the tray, is received and floated by surface tension of the water. Then, the workpiece is centered in the tray by water flows radially overflowing from the tray via the overflow outlets.

Abstract: A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated with each translational and rotational degree of freedom and an actuator operates the gripper. A controller is linked to the gantry and gimbal unit motors, the gripper unit actuator, and actuators associated with a series of work stations for carrying out processing operations such as lapping and grinding. The controller controls movement of the gripper unit from a start position to pick up a workpiece and move it along a programmed path between the processing stations, and controls operation of actuators at each processing station to process workpieces according to stored program instructions. A user input device provides optional operator control of the movement and processing for system training purposes.

Abstract: A drilling-head-grinding positioning device comprises a clamper for clamping a drilling head having a rectangular sliding rod and a sleeve clamping seat installed at a front end of the sliding rod, a cylindrical clamping device received in the sleeve clamping seat and a nut screwed at a front end of the sleeve clamping seat; and an adjustable seat; and a top of the adjustable seat having a V shape sliding recess corresponding to the periphery of the sliding rod; a bottom of the sliding recess being formed with a receiving trench for receiving a threaded rod; one side of the sliding recess being formed with a communicating groove communicated to the receiving trench; a hook rod being slidably installed in the receiving trench; and a front end of the hook rod being extended upwards with a plate corresponding to a front end of the sliding rod.

Abstract: The depth of cut and the headstock velocity of a grinding machine are controlled during the last rotation of finish grinding to maintain a substantially constant load on the grinding wheel spindle drive motor. The depth of cut is kept constant and the component speed of rotation is altered in order to maintain the constant power requirement. If the component profile alters the spindle loading during a single revolution, the component speed is altered from one point to another during each revolution so as to maintain the constant load. Headstock acceleration, deceleration, and velocity are controlled to take into account any variation in contact length between the wheel and component during the rotation of the latter, so that although the metal removal rate may vary slightly around the circumference of the component the power demand on the spindle motor is maintained substantially constant during the whole of the grinding of the component.

Abstract: A method for dressing an essentially cylindrical grinding worm on a machine suitable for continuous generation grinding in the diagonal method. The dressing tool is an essentially cylindrical gear wheel, having an abrasive coating on the surface that effects the dressing, which is brought into engagement with the grinding worm to move relative to the grinding worm in axial direction of the same to profile the flanks of the grinding worm. A periodically alternating movement in axial direction of the dressing gear wheel is superimposed on the relative movement of the dressing gear wheel, with the wavelength of the oscillating relative movement being the same or smaller than the usable width of the grinding worm in its axial direction.

Abstract: Various embodiments of the present invention pertain to enabling location specific burnishing of a disk. According to one embodiment, the smoothness of a disk is evaluated by gliding over a disk to determine if there is an asperity on the disk. If there is an asperity on the disk, a location of the asperity is stored to enable location specific burnishing of the disk.

Abstract: A processing method for wafers includes: a preparing step for preparing a wafer having an active device region and a reinforcing rib region. The active device region having plural devices is formed on a surface of the wafer, and the reinforcing rib region is at an outer circumferential edge of the wafer. The processing method further includes: a first grinding step for holding the surface of the wafer on a chuck table of a grinding apparatus and grinding an entire rear surface of the wafer by using a first grinding stone; and a second grinding process for grinding the entire rear surface of the wafer by using a second grinding stone which has an abrasive grain diameter smaller than that of the first grinding stone.

Abstract: An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced in longitudinal alignment between the two conveyor tables with a longitudinal edge first. Two other of the conveyor tables are configured such that panels are sequentially displaced in lateral alignment between the two other conveyor tables with a lateral edge first. A first tool is positioned between the two conveyor tables. A second tool is positioned between the two other conveyor tables.

Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polishing head direct access to two polishing stations. The polishing system of the present invention provides flexibility and improves throughput.

Abstract: A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring (20), a bracket (28) vertically movable together with the top ring (20), a stopper (32) adjustable in vertical position to prevent downward movement of the bracket (28), and a sensor (36) for detecting a distance between the stopper (32) and the bracket (28).

Abstract: Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the polishing pad with a linearly variable amount of force. A first force is produced with the actuator. The first force is scaled by a linearly variable amount to a second force that is applied to the polishing pad by a conditioning disk. Numerous other aspects are disclosed.

Abstract: A ballbar is used to assess the accuracy of relative motion between an arbor 2 and a table 4 of a machine tool. Mounting components 8, 10 are secured respectively to the arbor 2 and the table 4. Each mounting component comprises a block 26, 52 which has provision on three orthogonal surfaces for receiving support means 50, 66 for a ballbar 74. By appropriate selection of the mounting faces, it is possible to set up the ballbar 74 to check motion in all three of the operating planes of the machine. The mounting component 8 comprises a ring 12 for fitting over the arbor 2 of the grinding machine, the mounting block 26 being connected to the ring 12 by a rod 24.

Abstract: Apparatus for polishing are provided. An apparatus comprises a fluid controller, a polishing apparatus and a fluid interface membrane. The fluid controller is fluidly coupled to the polishing apparatus by way of at least one conduit. The fluid interface membrane is disposed within at least one of the fluid controller, the conduit and the polishing apparatus to separate a first fluid and a second fluid and to transfer pressure from the first fluid to the second fluid.

Abstract: The present invention concerns a process for monitoring the correct setting of the coolant nozzle (9) of a grinding machine, in particular of a machine for grinding the tooth flanks of workpieces with premachined teeth. In an automatic test cycle after setting the machine, with the grinding wheel (2) at defined positions relative to the workpiece (3), the alterations in power consumption of the grinding spindle drive when switching on the coolant supply are measured, compared with the desired value ranges specified in the machine control system, and the machining process blocked in the event of measurements being below or above the desired value ranges.

Abstract: A method of polishing an object is disclosed. In one embodiment, the method comprises the steps of creating a polishing zone within a magnetorheological fluid; determining the characteristics of the contact between the object and the polishing zone necessary to polish the object; controlling the consistency of the fluid in the polishing zone; bringing the object into contact with the polishing zone of the fluid; and moving at least one of said object and said fluid with respect to the other. Also disclosed is a polishing device.

Abstract: During centerless cylindrical grinding, attention must be paid to the fact that the workpiece (3) is placed in a very specific position between the grinding wheel (1), the regulating wheel (2) and the support guide (4). The optimal position of the workpiece (3) initially set cannot be maintained as a result of the progression of the grinding process and the changes caused by said process in the diameter and contour of the workpiece (3). The invention provides a solution to said problem, whereby height adjustment and/or the oblique position of the support guide (4) are automatically modified in accordance with the progression of the grinding process and during said grinding process with the purpose of achieving operationally optimal readjustment. The progression of the grinding process can be detected using measuring techniques, e.g. by measuring the diameter of the workpiece (3) or its deviation from roundness and using said measurement as output variable for adjusting the support guide (4).

Abstract: A device or tool setter has the purpose of setting the position of a support bar, adjustably connected to a grinding machine, in relation to a rotatable grindstone of the machine for obtaining a desired edge angle of a tool supported for grinding by the support bar. The device is provided with discs for defining two contact points with the grindstone and a hole for connection to the support bar.

Abstract: The invention relates to a method and an apparatus for producing optical glasses. The glasses are polished and marked, following a shaping process. The polishing and marking steps are carried out in a common processing cell which comprises a polishing station, a washing station, and a marking station.

Abstract: Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a magnetic fluid in the chamber. The magnetic field source is configured to generate a magnetic field in the head. The magnetic fluid changes viscosity within the chamber under the influence of the magnetic field to exert a force against at least a portion of the micro-device workpiece. The magnetic fluid can be a magnetorheological fluid. The magnetic field source can include an electrically conductive coil and/or a magnet, such as an electromagnet. The carrier assembly can also include a fluid cell with a cavity to receive the magnetic fluid.

Abstract: In one embodiment, a method of sharpening reel blades on a lawnmower reel includes positioning a grinding wheel in contact with the reel, rotating the grinding wheel about an axis of rotation, linearly translating the grinding wheel along a longitudinal path. and rotating the reel about its longitudinal axis. The axis of rotation of the grinding wheel is transverse to a longitudinal axis of the reel.

Abstract: Provided are a grinding mount holder assembly and an apparatus and method for manufacturing a sample using the grinding mount holder assembly. In an embodiment, the grinding mount holder assembly includes a mount in which a sample is fitted, a holder in which the mount is inserted, and a base on which the holder is installed so that it is capable of rotating. The base has a pressing member for pressing down the mount inserted in the holder. First one surface of the sample is exposed to one or more grinding wheels for grinding and polishing. Then the sample is flipped to expose the other side to the grinding wheels by rotating the holder 180 degrees within the base, and pressing the now-flipped sample downward through the holder until it is forced against the grinding wheel.

Abstract: A device and method for sharpening a mower blade are provided, in which a mounting device for mounting a rotary blade having two opposite cutting edges to be sharpened, wherein the mounting device is capable of positioning the blade in a first fixed state and a second, axially pivoting state. One or more grinding head assemblies are each positioned on an opposite end of the blade, wherein the grinding head assemblies respectively grind the two opposite cutting edges to be sharpened. A control system controls movement of the two grinding head assemblies.

Abstract: This invention is related to contact lenses. In particular, the present invention is related to methods for improving mold flow by polishing optical and non-optical tools used to create molds for contact lenses.

Abstract: The invention describes a machining apparatus for skis (5) having a binding (16), comprising a roller table (6) for the skis (5) resting with the running surface on the rollers (9) of the roller table, tools (2) provided between the rollers (9) of the roller table for machining the running surface and the edges of the skis (5), and a feed device for the skis (5) which presses the skis (5) against the rollers (9) of the roller table. In order to provide advantageous constructional conditions it is proposed that the feed device comprises at least one guide (10) for a drivable carriage (11), which guide is provided above the roller table (6) and extends parallel to the same, and which carriage carries holding-down devices (13) for the ski which are distributed over the length of the ski.