Abstract: To prevent a blowout nozzle from colliding with a workpiece due to a trouble of a backpressure sensor so as to avoid damage to the workpiece in a processing apparatus provided with a backpressure sensor, the backpressure sensor is formed capable of being freely moved at the blowout nozzle thereof in the air blowout direction and in the direction opposite thereto, and provided with a free-movement detecting sensor adapted to detect an actual free-movement of the blowout nozzle.

Abstract: A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.

Abstract: A device for the simultaneous double-side grinding of workpiece wafers has two collinear grinding wheels and two hydropads oppositely positioned for hydrostatic bearing of the workpiece, each having at least one hydrostatic bearing and at least one dynamic pressure tube for measuring the spacing between the workpiece and the hydrdopads. The surfaces of the hydropads which face the workpiece are of nonplanar configuration, contoured in such a manner that the spacing between the surface and the workpiece adopts a minimum value near the edge of the hydropads proximate the grinding wheels, this spacing increasing at increasing distance from the grinding wheels. In a further embodiment, at least one bore, through which liquid and abraded material can be discharged from the vicinity of the dynamic pressure tube, is proximate each dynamic pressure tube.

Abstract: The present invention relates to a lapping apparatus and a lapping method that may effect further machining in response to each element on a ceramic bar to the ceramic bar that is largely locally lapped and may reduce a cost needed for machining without any jig for holding the ceramic bar. The ceramic bar is held by a surface of an elastic member made of rubber or the like. A plurality of actuators are arranged on a back surface of this elastic member. When the ceramic bar is depressed against the lapping surface, a specific portion of the ceramic bar is deformed or strongly deformed through the elastic member by these actuators to thereby make it possible to perform the lapping in response to each element.

Abstract: A grinding system for grinding feedstock includes a transport apparatus, a grinding apparatus, and a controller. The transport apparatus continuously transports feedstock of an arbitrarily long length at a desired feed rate, and the grinding apparatus grinds the feedstock transported by the transport apparatus. The controller controls a grinding position of the grinding apparatus and a longitudinal position of the feedstock during grinding to be coordinated with each other.

Abstract: An apparatus for use in a chemical mechanical planarization (CMP) system is provided. The apparatus includes a platen capable of introducing fluid beneath a polishing pad and a platen support cover configured to surround the platen. The platen is disposed at a first level and the platen support cover is disposed at a second level, the first level being lower relative to the second level. Both the platen and the platen support cover are configured to be disposed below the polishing pad such that the polishing pad is closer to the second level than the first level. The platen support cover has a width at the second level that is substantially equal around the platen. An apparatus and method for controlling pressure beneath a polishing pad is also provided.

Abstract: Disclosed herein are positioning devices and related methods of positioning a tool in a desired location. In one exemplary embodiment, a positioning device includes a base having a length extending along a first horizontal axis. In addition, the positioning device includes a first arm coupled to the base and extending therefrom along a second horizontal axis perpendicular to the first horizontal axis. The first arm is configured for linear movement across the base along the first horizontal axis. The positioning device also includes a second arm coupled to the first arm carriage and extending therefrom along a vertical axis, where the second arm is configured for linear movement along the second horizontal axis. Moreover, in this embodiment, the second arm is also configured to pivot about a first rotational axis parallel to the first horizontal axis.

Abstract: A centerless grinding apparatus (10) includes an outer diameter surface grinding wheel (11) for grinding the outer diameter surface of a work (1) of a substantially cylindrical shape, a regulating wheel (12) for supporting the outer diameter surface of the work (1) in conjunction with the outer diameter surface grinding wheel (11) and an end surface grinding wheel (21) for grinding the end surface of the work (1). The end surface grinding wheel (21) grinds the end surface of the work (1) while the outer diameter surface grinding wheel (11) grinds the outer diameter surface of the work (1) in a state that the work (1) is disposed between the outer diameter surface grinding wheel (11) and the regulating wheel (12).

Abstract: A ferrule polishing control machine has a ferrule type input part for selecting one type of ferrule from various ferrule types stored in a computer. A ferrule end face shape input part selects one type of ferrule end face shape from various types of ferrule end face shapes stored in the computer. A connector type input part selects one type of connector from various connector types stored in the computer. A ferrule polishing number input part selects from ferrule polishing numbers stored in the computer a number of ferrules to be mounted on a polishing jig for a polishing operation. A transmitting part selects polishing pressure information stored in the computer in accordance with polishing information inputted from the ferrule type input part, the ferrule end face shape input part, the connector type input part, and the ferrule polishing number input part, and transmits the polishing pressure information to a ferrule polishing machine.

Abstract: There is provided a chemical mechanical polishing apparatus, which may include a polishing table rotated by a polishing table motor and having a pad thereon, a carrier head located above the polishing table to be rotatable by the driving of a carrier head motor and having a wafer located under the bottom thereof, a slurry supplier for supplying a slurry to the upper portion of the polishing table, a first polishing end point detector for detecting a polishing end point through the temperature change of the temperature sensor, at least one temperature sensor for detecting the temperature of a polishing region (the wafer, the pad, and the slurry), and a second polishing end point detector for detecting a polishing end point from the changes of load current, voltage, and resistance of the carrier head motor.

Abstract: A method and control system for detecting harmonic oscillation in a chemical mechanical polishing process and reacting thereto, such as by taking steps to at least one of: 1) reduce or eliminate the harmonic oscillation; and 2) counter the noise which is associated with the harmonic oscillation. By reducing or eliminating harmonic oscillation, films with reduced structure strengths including low k dielectric films can be used. By countering the noise, the quality of the work environment is improved.

Abstract: An automatic processing unit comprising a conveyor (1) extending through the automated processing unit and having a longitudinal direction and a transversal direction; and at least one working station located above the conveyor (1) for processing a workpiece (2). The working station is configured such that it can be displaced in an oblique angle in relation to both the longitudinal direction and the transversal direction of the conveyor (1).

Abstract: A grinding machine, in particular a centerless cylindrical grinding machine, comprising: a supporting table, at least one wheel disposed on at least one wheel carriage, a device for holding a workpiece to be machined, the wheel carriage being movable in each case in a controlled way toward the holding device for the workpiece to be machined and away therefrom, and at least one dressing device. For dressing, the respective dressing device and the corresponding wheel are adjusted relative to one another in a controlled way. The dressing device is disposed on a carriage which is movable along a first axis aligned substantially parallel to the rotational axis of the respective wheel. During the moving of the dressing device along the first axis, a stationary guide way determines a reference position of the dressing device with respect to the wheel to be dressed in orthogonal direction to the first axis.

Abstract: A pad conditioning system for conditioning a polishing pad in conjunction with polishing of a workpiece includes a pad conditioning head coupled with a positioning unit. The pad conditioning head includes a conditioning surface that is configured to be moved into contact with a polishing pad to condition the polishing pad. The pad conditioning system also includes a polishing liquid supply port disposed in the conditioning surface. The polishing liquid supply port is configured to selectively discharge polishing liquid during the conditioning operation. The discharged polishing liquid is worked into the polishing pad by the pad conditioning head during the conditioning operation. A workpiece, such as a semiconductor wafer, that is also moved into contact with the polishing pad is polished using the discharged polishing liquid.

Abstract: A vehicle wheel rim polisher may include: a spindle including a mounting end for accepting a vehicle wheel rim, the spindle being drivable to rotate the mounting end about an axis of rotation, a polishing head support and movement mechanism including a polishing head connector for accepting a polishing head and the polishing head support and movement mechanism being moveable to move the polishing head connector at least substantially radially relative to, and substantially parallel with, the axis of rotation and an automation system including a function for accepting a radial inner position of the polishing head connector, a function for accepting a radial outer position for the polishing head connector and a position control system to maintain the polishing head connector in a selected position with reference to the surface over which polishing is occurring such that the polishing head connector maintains an operating force within a desired range, the force being that generated between any polishing head on

Abstract: Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a fluid with magnetic elements in the chamber. The magnetic field source has a first member that induces a magnetic field in the head. The fluid and/or the magnetic elements move within the chamber under the influence of the magnetic field source to exert a force against a portion of the micro-device workpiece. In a further aspect of this embodiment, the carrier assembly includes a flexible member in the chamber. The magnetic field source can be any device that induces a magnetic field, such as a permanent magnet, an electromagnet, or an electrically conductive coil.

Abstract: A finishing wheel holding mechanism for a gear finishing apparatus using a finishing wheel having internal teeth, which permits simple and quick fitting or replacement of a finishing wheel is provided. The finishing wheel holding mechanism comprises a head frame 21 having at the center an opening portion for holding a finishing wheel, and an annular finishing wheel holder portion 22 for fitting finishing wheels A1 (A2), supported rotatablly within the opening portion of the head frame 21; and the finishing wheel holder comprises a support gear 50 having an open end portion 53 for finishing wheel insertion and an accepting portion 54 for fixing the finishing wheel, an annular shifting body 55 within the open end portion 53, a projection 57 contacting the finishing wheel to serve as a stopper, a pressing collar 58 inserted into the shifting body 55 to fix the finishing wheel by sliding the shifting body toward the finishing wheel, and an actuator 60 for driving the shifting body 55 toward the accepting portion.

Abstract: An apparatus includes a blade grinding machine, a measuring system and a control for providing a bar blade suitable for cutting work pieces. The blade grinding machine includes a clamping mechanism for mounting the bar blade and a grinding wheel for grinding the mounted bar blade. The measuring system also includes a clamping mechanism for mounting bar blade and at least one probe for three-dimensional sampling of the bar blade mounted on the measuring system. The control enables a data exchange between the blade grinding machine and the measuring system in order to grind and sample the bar blade in an alternating fashion. The apparatus is a closed system in which data exchange is automated.

Abstract: Current position data is determined of a first machining tool in a machining space having a second machining tool, the second tool having known position data with regard to the position data of the first tool which are to be determined, the first tool and the second tool being movable toward and away from one another, the first tool to be determined in its position comes into contact with a machining surface, known in its position, of the second machining tool, the rotary speed of a drive motor for the second tool being set to a starting rotary speed which is so low that the rotary speed of the second tool is measurably reduced when the tool comes into contact.

Abstract: Methods and apparatus are provided for conditioning of polishing surfaces utilized during CMP processing. The method comprises contacting the polishing surface and a conditioning surface with a first force, one of the surfaces coupled to a support member that has an axis. The polishing surface and/or the conditioning surface is moved at a constant velocity. Torque exerted by the support member about the axis to effect a relative position between the conditioning surface and the polishing surface is measured and used to obtain a process variable. The process variable is compared to a setpoint value for the relative position of the conditioning surface and the polishing surface. A second force is calculated and the polishing surface and the conditioning surface then are contacted with the second force, if the process variable differs from the setpoint value by more than an allowed tolerance.

Abstract: A polishing method particularly suitable for mirror-polishing the concave surface of a lens and a polishing device, the method characterized by including the step of polishing work surfaces (50a, 50b) while allowing parts of the dome-shaped parts of elastic polishing objects (10a, 10b) matching the curved shapes of the concaved work surfaces of the works (50a, 50b) selected from among the plurality of the elastic polishing bodies having the dome-shaped parts (11a, 11b) different in curvature and larger in area than the concaved work surfaces of the works (50a, 50b) to come into contact with the generally entire surfaces of the work surfaces, wherein the curvature centers (40) of the dome-shaped parts are generally aligned with the swing centers (41) of the works, whereby the concaved work surfaces can be rapidly and uniformly polished.

Abstract: The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

Abstract: A method of predicting the lapping property of a charged lapping plate uses samples with a known lap surface. The samples are lapped on the plate and a non-invasive sensor is used to determine the lapping rate under a fixed load and rotation speed. The total frictional force of the samples is measured during the lapping to calculate the friction and Preston coefficients of the plate. The samples are held in place while the plate rotates and the sensor measures the distance to the plate. The plate rotates for a specific time so that adequate removal of the pad material has occurred. The lapping rate is determined from a change in the gap distance over a time interval. The lapping rate and friction are then assessed to determine if the plate is lapping worthy.

Abstract: A reliable, inexpensive “back side” thinning process and apparatus therefor, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed. The thickness of the die is measured at at least five locations on the die. The lapping machine grinds the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy. Based on the thickness data collected, appropriate machine operating parameters for further grinding and polishing of the exposed surface are determined. Further grinding and polishing are performed. These steps are repeated until the target thickness is reached.

Abstract: A fluid bearing polishing apparatus for carrying a polishing member for chemical mechanical polishing includes a fluid supply and a fluid dispensing structure to support the polishing member. A method of polishing a workpiece includes supporting a polishing member on a fluid bearing between a first end of the polishing member and a second end of the polishing member and moving the polishing member to polish the workpiece. The fluid bearing has a curved portion at which plane of travel of the polishing member changes from a first plane to a second plane. Advantages of the invention include smooth belt motion in all desired directions of movement.

Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Abstract: A fixture includes a fixing member attached to a grinding machine (10), a guiding shaft (37) attached to the fixing member and a clamp (38). The clamp defines a pair of holes (381, 382) in opposite ends thereof, for movably receiving the guiding shaft and an indicator (20) therein respectively. When the shaft and indicator are loosened from the holes of the clamp respectively, the clamp is rotated about the guiding shaft toward a workpiece (19) on the grinding machine, and the indicator is adjusted with respect to the workpiece, for measuring of the workpiece.

Abstract: A DMHC (dual mode hybrid control) system and method which facilitates enhanced control in the delivery of polishing slurry to a CMP (chemical mechanical polishing) apparatus. The DMHC comprises a linear table and a PID (proportional integrated differential) controller operably connected to a slurry pump provided in a slurry flow conduit which delivers the polishing slurry to the CMP apparatus. A bubble trap and a flowmeter provided in the slurry flow conduit downstream of the slurry pump are operably connected to the PID controller, and the CMP apparatus is located downstream of the flowmeter.

Abstract: A CMP apparatus is provided for polishing wafers that are substrates to be polished by CMP. The CMP apparatus comprises a stage that is structured to be rotatable and holds a wafer to be polished, a polishing head holding section that holds a polishing head equipped with a polishing pad over the stage, a polishing head storage section that stores replacement polishing heads equipped with polishing pads; and a polishing head replacement mechanism that replaces the polishing head held by the polishing head holding section with the replacement polishing heads stored in the polishing head storage section.

Abstract: A fiber optic polishing apparatus including a support system, a polishing sub-assembly coupled to the support system including a plurality of pads, and a fixture to hold a plurality of fiber optic connectors. The fixture is positioned adjacent to the plurality of pads so that an end surface of each of the plurality of fiber optic connectors is held in contact with a corresponding pad. A drive mechanism is coupled to the support system to move the fixture to polish the end surface of each of the plurality of fiber optic connectors. Each of the plurality of pads may travel independently in a vertical direction. The polishing sub-assembly may further include a web polishing film, a fluid injection module configured to direct water onto the film, and a rinsing module to rub against a face of each of the plurality of fiber optic connectors to remove debris.

Abstract: A device for predicting the lapping property of a charged lapping plate uses samples with a known lap surface. The samples are lapped on the plate and a non-invasive sensor is used to determine the lapping rate under a fixed load and rotation speed. The total frictional force of the samples is measured during the lapping to calculate the friction and Preston coefficients of the plate. The samples are held in place while the plate rotates and the sensor measures the distance to the plate. The plate rotates for a specific time so that adequate removal of the pad material has occurred. The lapping rate is determined from a change in the gap distance over a time interval. The lapping rate and friction are then assessed to determine if the plate is lapping worthy.

Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.

Abstract: A lens processing system (1) includes a lens stocking device (400a; 400b) capable of stocking a plurality of lenses (LE); and a lens grinding device (100a; 100b); and a lens conveying device (200) which conveys one of the plurality of lenses between the lens stocking device and the lens grinding device.

Abstract: A dummy process and a polishing-pad conditioning process suitable for a chemical mechanical polishing (CMP) is provided. The CMP apparatus includes a polishing head, a polishing table, and a polishing pad. The polishing head includes a protective hood, a base, a retaining ring and a wafer supporting assembly. The wafer is attached to an attaching surface in the wafer receiving recess. Next, the wafer supporting assembly is moved to make the bottom surface of the retaining ring more protrusive than the bottom surface of the wafer such that the wafer does not contact the surface of the polishing pad. Accordingly, the need for a large number of dummy wafers can be effectively avoided.

Abstract: The polishing machine processes a workpiece put on table of body by four-directional control and is provided with a pair of columns. It comprises: first carrying unit having both ends fixed to pair of columns and having carrying part mounted on upper side; a second carrying unit being fixed to the carrying part in the direction orthogonal to the first carrying unit; third carrying unit being fixed to one end of the second carrying unit in the direction orthogonal to the second carrying unit; a tool head unit being mounted to lower side of the third carrying unit to be inclinable at predetermined angle by a tilting unit rotating at a constant angle and having driving means for rotating a polishing tool mounted at one side; and automatic constant pressure regulating means providing a predetermined virtual pressure with respect to the polishing tool mounted on the tool head unit.

Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.

Abstract: A method for establishing different parameters of a surface of a work piece during machining of the surface using a spindle supporting a tool and displacement sensors for measuring displacement to which the spindle is subjected during machining. The method involves machining work pieces with different back off times to create sets of sensor signals representing spindle deflections. The machined work pieces are measured and then the stored sensor signals are compared with the measurement results of the same work pieces. Transfer constants are calculated representing the influence of the total deflection of the machine stiffness on the sensor signals. Displacement sensor signals obtained upon machining subsequent work pieces are processed with the transfer constants to give a series of sensor signals representing the true total deflection of the loaded and running machine stiffness chain to permit calculation of different parameters of the subsequently machined work pieces.

Abstract: The invention relates to an installation for the machining of the edges of spectacle lenses, comprising at least one CNC-controlled processing machine (1) for machining a spectacle lens, at least one device (3, 4) for determining the optical values, the optical focus, the axis position of a cylindrical or prismatic polish, the position of the near portion and/or the position of a progression channel of a spectacle lens (6) that is configured as a continuous vision lens. The installation also comprises at least one handling device (9) for removing blanks (6) from a conveyer device (8), for inserting a blank into the device, for removing said blank from said device, for introducing a blank into a respective processing machine, for removing a finished machined spectacle lens from the respective processing machine (1) and for replacing said lens on the conveyer device (8).

Abstract: Apparatus and methods are disclosed that promote greater polishing uniformity in linear CMP systems by introducing a relative lateral motion between a CMP belt and a rotating polish head securing a wafer. A belt polish module comprises a linear CMP belt forming a loop around an idle roller and a drive roller, first and second pistons engaging, respectively, first and second ends of the idle roller, and a controller configured to vary the forces applied by the first and second pistons to the ends of the idle roller in order to laterally translate the linear CMP belt. A method for linear CMP comprises rotating a wafer about a vertical axis, contacting the rotating wafer against a linear CMP belt moving in a longitudinal direction, and causing a relative lateral motion between the rotating wafer and the linear CMP belt.

Abstract: Light is incident on a semiconductor wafer polish surface and an adjacent reference surface (80). The reflected light from each surface is detected by a detector (35) positioned beneath the surfaces. The signals derived from each source of reflected light is analyzed in a electronic system (37) and an endpoint for a chemical mechanical polish process is determined as a function of both signals.

Abstract: Apparatus for removing material from a workpiece is described, in which the apparatus comprises means for advancing an abrasive tool towards the workpiece to bring an abrasive surface of the tool into contact with the surface of the workpiece, means for moving the abrasive surface relative to the workpiece to remove material from the workpiece, means for detecting a load applied to the tool by the workpiece, and means for controlling the rate of advancement of the abrasive tool towards the workpiece depending on the magnitude of the detected load.

Abstract: A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.

Abstract: The invention provides a method of reducing thermal distortion in grinding machines. Such machines each comprise a machine base (60) and a grinding wheel (50) for grinding components in the machine (10). The method includes the steps of: (a) sensing a first temperature at an upper surface of the base (60) substantially below a position (110) in the machine (10) whereat component grinding using the wheel (50) occurs; (b) sensing a second temperature of an underside surface of the base (60) substantially below the position (110) whereat component grinding occurs; (c) determining a relationship between component size drift and changes in a difference between the first and second temperatures; and thereafter (d) correcting a positional offset applied to the wheel (50) during grinding in accordance with the determined relationship, thereby reducing the component size drift.

Abstract: Various embodiments of a semiconductor processing fluid delivery system and a method delivering a semiconductor processing fluid are provided. In aspect, a system for delivering a liquid for performing a process is provided that includes a first flow controller that has a first fluid input coupled to a first source of fluid and a second flow controller that has a second fluid input coupled to a second source of fluid. A controller is provided for generating an output signal to and thereby controlling discharges from the first and second flow controllers. A variable resistor is coupled between an output of the controller and an input of the second flow controller whereby the output signal of the controller and the resistance of the variable resistor may be selected to selectively control discharge of fluid from the first and second flow controllers.

Abstract: A method of forming a traction drive rolling element including: forming a preform having a working surface with an arcuate profile in section taken along a central axis; supporting the preform to be rotatable about the central axis; allowing a relative movement between the preform and a grooving tool for moving the grooving tool along the arcuate profile, simultaneously with rotating the preform about the central axis, to form microscopic recesses and projections alternately arranged in a direction perpendicular to the central axis along the arcuate profile; pressing a grindstone having a contact surface area of 25 mm2 or less, on the working surface; and allowing a relative movement between the preform and the grindstone for moving the grindstone along the arcuate profile simultaneously with rotating the preform while keeping pressing the grindstone on the working surface until a height of the microscopic projections becomes 3 ?m or less.

Abstract: This invention pertains to methods and apparatus for polishing and planarization of workpieces, such as fiber optics connectors, metallographic samples, semiconductor wafers, microelectronic substrate, optical devices and the like. The polishing pattern is a hypotrochoid generated by a spur gear rotating inside of an internal gear. The hypotrochoid is a superior polishing pattern because it not only provides a pattern similar to a figure eight pattern for producing optimal polishing conditions, but it also appears to precess around the center of the polishing space and maximize the utilization of the polishing pad or film.

Abstract: A method of chemical mechanical polishing a metal layer on a substrate in which the substrate is polished at a first polishing rate. Polishing is monitored with an eddy current monitoring system, and the polishing rate is reduced to a second polishing rate when the eddy current monitoring system indicates that a predetermined thickness of the metal layer remains on the substrate. Then polishing is monitored with an optical monitoring system, and polishing is halted when the optical monitoring system indicates that an underlying layer is at least partially exposed.

Abstract: A lens blocking device is disclosed that includes a frame, a light source mounted on the frame, a carriage having a first end and a second end mounted on the frame for sliding movement between first and second positions, a first mirror mounted on the carriage first end and a lens block holder mounted on the carriage second end and shiftable between third and fourth positions with respect to the carriage, a stage disposed between the light source and the carriage, and including an opening, for supporting an object, an at least partially translucent screen generating a display image operably connected to the support frame, at least one second mirror arranged to reflect an image of an object on the stage from the first mirror, when the carriage is in the first position, onto the screen, and an actuator operably connected to the carriage.

Abstract: A head is fabricated using photolithography, and the head is purposely powered up during a material removal process, such as lapping, so that the head's expansion (that would be formed on being powered up during normal usage in a drive) is planarized. Specifically, the head is energized in a manner identical (or similar) to energization of circuitry in the head during normal operation in a drive, even though fabrication of the head has not yet been completed. When energized, a shape that the head would have during normal operation is replicated (or approximated). Therefore, the head's shape includes a expansion of the pole tip region, although the head is only partially fabricated. Thereafter, a portion of the head in the expansion is partially or completely removed, by lapping while energized. The depth of material removal from the head is monitored e.g.

Abstract: An actuator assembly (432) for positioning a pad (48) includes a first actuator assembly (440), a second actuator subassembly (442) and a control system (524). In one embodiment, the first actuator subassembly (440) includes a first core (502), and a conductor (504) secured to the first core (502), and the second actuator subassembly (442) includes a second core (506) spaced apart a component gap (444) from the first core (502). Further, the control system (524) directs current to the conductor (504) to attract the second core (506) to the first core (502). In one embodiment, the amount of current directed to the conductor (504) is calculated without measuring the component gap (444).